JP2013140930A - 回路基板 - Google Patents
回路基板 Download PDFInfo
- Publication number
- JP2013140930A JP2013140930A JP2012100742A JP2012100742A JP2013140930A JP 2013140930 A JP2013140930 A JP 2013140930A JP 2012100742 A JP2012100742 A JP 2012100742A JP 2012100742 A JP2012100742 A JP 2012100742A JP 2013140930 A JP2013140930 A JP 2013140930A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- circuit
- insulating material
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
- H05K2201/0792—Means against parasitic impedance; Means against eddy currents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】本発明の回路基板100は、絶縁材101と、絶縁材101の一面に形成され、少なくとも一つ以上の回路層111及び少なくとも一つ以上の絶縁層112からなるビルドアップ層110と、絶縁材101の他面に形成され、回路層111とは電気的に断絶された金属層120と、を含む。
【選択図】図1
Description
101 絶縁材
110 ビルドアップ層
111 回路層
111a 第1回路パターン
111b 第1ビア
111c 第2回路パターン
112 絶縁層
120 金属層
130a 第1ソルダレジスト層
130b 第2ソルダレジスト層
131 開口部
Claims (9)
- 絶縁材と、
前記絶縁材の一面に形成され、少なくとも一つ以上の回路層及び少なくとも一つ以上の絶縁層からなるビルドアップ層と、
前記絶縁材の他面に形成され、前記回路層とは電気的に断絶された金属層と、
を含む回路基板。 - 前記ビルドアップ層上に形成される第1ソルダレジスト層をさらに含む請求項1に記載の回路基板。
- 前記第1ソルダレジスト層は、前記ビルドアップ層に含まれた最外層の回路層の一部を露出させる開口部を有する請求項2に記載の回路基板。
- 前記開口部を介して露出した最外層の回路層上に形成された表面処理層をさらに含む請求項3に記載の回路基板。
- 前記金属層上に形成される第2ソルダレジスト層をさらに含む請求項1に記載の回路基板。
- 前記回路層は、銅(Cu)からなる請求項1に記載の回路基板。
- 前記金属層は、銅(Cu)、ニッケル(Ni)、銀(Ag)またはこれらの合金からなる群から選択される請求項1に記載の回路基板。
- 前記金属層は、複数の層からなる請求項1に記載の回路基板。
- 前記金属層の各層は、互いに異なる種類の金属からなる請求項8に記載の回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110146293A KR20130077537A (ko) | 2011-12-29 | 2011-12-29 | 회로기판 |
KR10-2011-0146293 | 2011-12-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013140930A true JP2013140930A (ja) | 2013-07-18 |
Family
ID=48693944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012100742A Pending JP2013140930A (ja) | 2011-12-29 | 2012-04-26 | 回路基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130168143A1 (ja) |
JP (1) | JP2013140930A (ja) |
KR (1) | KR20130077537A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102043733B1 (ko) * | 2012-05-10 | 2019-11-12 | 히타치가세이가부시끼가이샤 | 다층 배선 기판 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001119111A (ja) * | 1999-10-20 | 2001-04-27 | Nec Corp | プリント配線板及びその製造方法 |
JP2002100841A (ja) * | 2000-09-25 | 2002-04-05 | Taiyo Yuden Co Ltd | 多層回路基板 |
JP3432534B2 (ja) * | 1992-09-29 | 2003-08-04 | イビデン株式会社 | プリント配線板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5306670A (en) * | 1993-02-09 | 1994-04-26 | Texas Instruments Incorporated | Multi-chip integrated circuit module and method for fabrication thereof |
KR100371567B1 (ko) * | 2000-12-08 | 2003-02-07 | 삼성테크윈 주식회사 | Ag 선도금을 이용한 반도체 패키지용 리드프레임 |
US6977346B2 (en) * | 2002-06-10 | 2005-12-20 | Visteon Global Technologies, Inc. | Vented circuit board for cooling power components |
TWI229574B (en) * | 2002-11-05 | 2005-03-11 | Siliconware Precision Industries Co Ltd | Warpage-preventing circuit board and method for fabricating the same |
CN101233190B (zh) * | 2005-07-28 | 2011-12-07 | 日本电气株式会社 | 绝缘材料、布线板和半导体器件 |
JP4764731B2 (ja) * | 2006-01-30 | 2011-09-07 | 富士通株式会社 | 多層構造のプリント配線基板 |
JP4865453B2 (ja) * | 2006-08-30 | 2012-02-01 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
TWI334747B (en) * | 2006-12-22 | 2010-12-11 | Unimicron Technology Corp | Circuit board structure having embedded electronic components |
-
2011
- 2011-12-29 KR KR1020110146293A patent/KR20130077537A/ko not_active Application Discontinuation
-
2012
- 2012-04-24 US US13/454,680 patent/US20130168143A1/en not_active Abandoned
- 2012-04-26 JP JP2012100742A patent/JP2013140930A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3432534B2 (ja) * | 1992-09-29 | 2003-08-04 | イビデン株式会社 | プリント配線板 |
JP2001119111A (ja) * | 1999-10-20 | 2001-04-27 | Nec Corp | プリント配線板及びその製造方法 |
JP2002100841A (ja) * | 2000-09-25 | 2002-04-05 | Taiyo Yuden Co Ltd | 多層回路基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20130077537A (ko) | 2013-07-09 |
US20130168143A1 (en) | 2013-07-04 |
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