CN1938785A - 使用由栅极引起的接面泄漏电流的快闪存储器编程 - Google Patents

使用由栅极引起的接面泄漏电流的快闪存储器编程 Download PDF

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Publication number
CN1938785A
CN1938785A CNA2004800365359A CN200480036535A CN1938785A CN 1938785 A CN1938785 A CN 1938785A CN A2004800365359 A CNA2004800365359 A CN A2004800365359A CN 200480036535 A CN200480036535 A CN 200480036535A CN 1938785 A CN1938785 A CN 1938785A
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China
Prior art keywords
gate
substrate
bias
applying
region
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Pending
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CNA2004800365359A
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English (en)
Chinese (zh)
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杰弗里·W·卢策
庞产绥
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SanDisk Corp
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SanDisk Corp
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Publication of CN1938785A publication Critical patent/CN1938785A/zh
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/10Programming or data input circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0425Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/30Power supply circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
CNA2004800365359A 2003-11-07 2004-11-04 使用由栅极引起的接面泄漏电流的快闪存储器编程 Pending CN1938785A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/703,717 US7057931B2 (en) 2003-11-07 2003-11-07 Flash memory programming using gate induced junction leakage current
US10/703,717 2003-11-07

Publications (1)

Publication Number Publication Date
CN1938785A true CN1938785A (zh) 2007-03-28

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CNA2004800365359A Pending CN1938785A (zh) 2003-11-07 2004-11-04 使用由栅极引起的接面泄漏电流的快闪存储器编程

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Country Link
US (1) US7057931B2 (https=)
EP (1) EP1687826A2 (https=)
JP (1) JP2007511076A (https=)
KR (1) KR20060120078A (https=)
CN (1) CN1938785A (https=)
TW (1) TWI274348B (https=)
WO (1) WO2005048269A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024494A (zh) * 2009-09-11 2011-04-20 中芯国际集成电路制造(上海)有限公司 绿色晶体管、电阻随机存储器及其驱动方法
CN104637537A (zh) * 2014-11-17 2015-05-20 上海华力微电子有限公司 一种闪存器件及其编程方法
TWI824233B (zh) * 2020-02-12 2023-12-01 美商新思科技股份有限公司 具有漏電流中的統計變化之動態隨機存取記憶體通路電晶體的設計

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7247907B2 (en) * 2005-05-20 2007-07-24 Silicon Storage Technology, Inc. Bidirectional split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing
US7242051B2 (en) 2005-05-20 2007-07-10 Silicon Storage Technology, Inc. Split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing
US7307882B2 (en) * 2005-06-29 2007-12-11 Macronix International Co., Ltd. Non-volatile memory
JP4545056B2 (ja) * 2005-06-30 2010-09-15 シャープ株式会社 不揮発性半導体記憶装置
JP4902972B2 (ja) * 2005-07-15 2012-03-21 ルネサスエレクトロニクス株式会社 不揮発性記憶素子の制御方法
KR100702029B1 (ko) * 2005-09-22 2007-03-30 삼성전자주식회사 플로팅된 드레인측 보조 게이트를 갖는 고전압 모스트랜지스터를 구비하는 비휘발성 메모리 소자들 및 그제조방법들
JP5250182B2 (ja) * 2005-10-28 2013-07-31 シャープ株式会社 不揮発性メモリ装置およびその駆動方法
KR100706789B1 (ko) 2005-11-17 2007-04-12 삼성전자주식회사 비휘발성 메모리 소자
US7939861B2 (en) * 2007-02-02 2011-05-10 Synopsys, Inc. Non-volatile memory devices having floating-gates FETs with different source-gate and drain-gate border lengths
US7499336B2 (en) * 2007-05-14 2009-03-03 Skymedi Corporation Method of programming a nonvolatile memory cell and related memory array
KR20080111963A (ko) * 2007-06-20 2008-12-24 삼성전자주식회사 비휘발성 메모리 소자 및 그 형성방법
US8320191B2 (en) 2007-08-30 2012-11-27 Infineon Technologies Ag Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
US7894263B2 (en) * 2007-09-28 2011-02-22 Sandisk Corporation High voltage generation and control in source-side injection programming of non-volatile memory
US8355278B2 (en) * 2007-10-05 2013-01-15 Micron Technology, Inc. Reducing effects of program disturb in a memory device
US7619933B2 (en) * 2007-10-05 2009-11-17 Micron Technology, Inc. Reducing effects of program disturb in a memory device
WO2009107241A1 (ja) * 2008-02-29 2009-09-03 株式会社 東芝 マルチドットフラッシュメモリ
KR101503875B1 (ko) * 2008-03-17 2015-03-25 삼성전자주식회사 단채널 효과를 억제할 수 있는 반도체 장치 및 그 제조방법
KR101569894B1 (ko) * 2008-11-12 2015-11-17 삼성전자주식회사 불 휘발성 메모리 장치의 프로그램 방법
CN102742003B (zh) * 2010-01-15 2015-01-28 株式会社半导体能源研究所 半导体器件
JP2012069186A (ja) 2010-09-22 2012-04-05 Toshiba Corp 不揮発性半導体記憶装置
US8384147B2 (en) * 2011-04-29 2013-02-26 Silicon Storage Technology, Inc. High endurance non-volatile memory cell and array
US8711636B2 (en) * 2011-05-13 2014-04-29 Silicon Storage Technology, Inc. Method of operating a split gate flash memory cell with coupling gate
US8670277B2 (en) 2011-07-27 2014-03-11 Infineon Technologies Ag Memory and method for programming memory cells
US8976594B2 (en) 2012-05-15 2015-03-10 Micron Technology, Inc. Memory read apparatus and methods
US9064551B2 (en) 2012-05-15 2015-06-23 Micron Technology, Inc. Apparatuses and methods for coupling load current to a common source
US9064577B2 (en) 2012-12-06 2015-06-23 Micron Technology, Inc. Apparatuses and methods to control body potential in memory operations
US8995188B2 (en) 2013-04-17 2015-03-31 Micron Technology, Inc. Sharing support circuitry in a memory
JP6739327B2 (ja) * 2016-12-27 2020-08-12 ルネサスエレクトロニクス株式会社 半導体装置
US10176880B1 (en) 2017-07-01 2019-01-08 Intel Corporation Selective body reset operation for three dimensional (3D) NAND memory
CN114695370B (zh) * 2022-05-31 2023-03-24 广州粤芯半导体技术有限公司 半导体结构及其制备方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409723A (en) * 1980-04-07 1983-10-18 Eliyahou Harari Method of forming non-volatile EPROM and EEPROM with increased efficiency
US5268319A (en) * 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
JPH04359476A (ja) * 1991-06-05 1992-12-11 Oki Electric Ind Co Ltd 不揮発性半導体メモリの書き換え方法
JPH0582798A (ja) * 1991-09-20 1993-04-02 Fujitsu Ltd 半導体記憶装置及びその製造方法
US5712180A (en) * 1992-01-14 1998-01-27 Sundisk Corporation EEPROM with split gate source side injection
JPH06120515A (ja) * 1992-10-09 1994-04-28 Oki Electric Ind Co Ltd 半導体不揮発性メモリのデータ書き込み及びデータ消去方法
US5467306A (en) * 1993-10-04 1995-11-14 Texas Instruments Incorporated Method of using source bias to increase threshold voltages and/or to correct for over-erasure of flash eproms
JP2713115B2 (ja) * 1993-10-06 1998-02-16 日本電気株式会社 不揮発性半導体記憶装置の製造方法
JP3999822B2 (ja) * 1993-12-28 2007-10-31 株式会社東芝 記憶システム
US5408115A (en) * 1994-04-04 1995-04-18 Motorola Inc. Self-aligned, split-gate EEPROM device
US5455792A (en) * 1994-09-09 1995-10-03 Yi; Yong-Wan Flash EEPROM devices employing mid channel injection
KR0172441B1 (ko) * 1995-09-19 1999-03-30 김광호 불휘발성 반도체 메모리의 프로그램 방법
KR100217900B1 (ko) * 1996-04-01 1999-09-01 김영환 플래쉬 메모리 셀의 프로그램 방법
US5793079A (en) * 1996-07-22 1998-08-11 Catalyst Semiconductor, Inc. Single transistor non-volatile electrically alterable semiconductor memory device
US5867425A (en) * 1997-04-11 1999-02-02 Wong; Ting-Wah Nonvolatile memory capable of using substrate hot electron injection
US6091634A (en) * 1997-04-11 2000-07-18 Programmable Silicon Solutions Compact nonvolatile memory using substrate hot carrier injection
JP3517081B2 (ja) * 1997-05-22 2004-04-05 株式会社東芝 多値不揮発性半導体記憶装置
US5867429A (en) * 1997-11-19 1999-02-02 Sandisk Corporation High density non-volatile flash memory without adverse effects of electric field coupling between adjacent floating gates
KR100297602B1 (ko) * 1997-12-31 2001-08-07 윤종용 비휘발성메모리장치의프로그램방법
JP2000040382A (ja) * 1998-07-23 2000-02-08 Sony Corp 不揮発性半導体記憶装置およびそのデータ書き込み方法
US5991202A (en) * 1998-09-24 1999-11-23 Advanced Micro Devices, Inc. Method for reducing program disturb during self-boosting in a NAND flash memory
US6490200B2 (en) * 2000-03-27 2002-12-03 Sandisk Corporation Non-volatile memory with improved sensing and method therefor
US6151248A (en) * 1999-06-30 2000-11-21 Sandisk Corporation Dual floating gate EEPROM cell array with steering gates shared by adjacent cells
KR100385226B1 (ko) * 2000-11-22 2003-05-27 삼성전자주식회사 프로그램 디스터브를 방지할 수 있는 플래시 메모리 장치및 그것을 프로그램하는 방법
JP3631463B2 (ja) * 2001-12-27 2005-03-23 株式会社東芝 不揮発性半導体記憶装置
US6738289B2 (en) * 2001-02-26 2004-05-18 Sandisk Corporation Non-volatile memory with improved programming and method therefor
JP3873679B2 (ja) * 2001-07-23 2007-01-24 セイコーエプソン株式会社 半導体容量装置、昇圧回路および不揮発性半導体記憶装置
US6456528B1 (en) * 2001-09-17 2002-09-24 Sandisk Corporation Selective operation of a multi-state non-volatile memory system in a binary mode
US6897522B2 (en) * 2001-10-31 2005-05-24 Sandisk Corporation Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
US6529412B1 (en) * 2002-01-16 2003-03-04 Advanced Micro Devices, Inc. Source side sensing scheme for virtual ground read of flash eprom array with adjacent bit precharge
JP3993438B2 (ja) * 2002-01-25 2007-10-17 株式会社ルネサステクノロジ 半導体装置
US6894339B2 (en) 2003-01-02 2005-05-17 Actrans System Inc. Flash memory with trench select gate and fabrication process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024494A (zh) * 2009-09-11 2011-04-20 中芯国际集成电路制造(上海)有限公司 绿色晶体管、电阻随机存储器及其驱动方法
CN102024494B (zh) * 2009-09-11 2014-01-08 中芯国际集成电路制造(上海)有限公司 绿色晶体管、电阻随机存储器及其驱动方法
CN104637537A (zh) * 2014-11-17 2015-05-20 上海华力微电子有限公司 一种闪存器件及其编程方法
CN104637537B (zh) * 2014-11-17 2019-02-19 上海华力微电子有限公司 一种闪存器件及其编程方法
TWI824233B (zh) * 2020-02-12 2023-12-01 美商新思科技股份有限公司 具有漏電流中的統計變化之動態隨機存取記憶體通路電晶體的設計

Also Published As

Publication number Publication date
EP1687826A2 (en) 2006-08-09
US20050099849A1 (en) 2005-05-12
WO2005048269A2 (en) 2005-05-26
WO2005048269A3 (en) 2005-07-28
TW200537504A (en) 2005-11-16
TWI274348B (en) 2007-02-21
US7057931B2 (en) 2006-06-06
JP2007511076A (ja) 2007-04-26
KR20060120078A (ko) 2006-11-24

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