CN1910224B - 发泡树脂组合物以及使用其的发泡体和同轴绝缘电缆 - Google Patents

发泡树脂组合物以及使用其的发泡体和同轴绝缘电缆 Download PDF

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CN1910224B
CN1910224B CN2005800030985A CN200580003098A CN1910224B CN 1910224 B CN1910224 B CN 1910224B CN 2005800030985 A CN2005800030985 A CN 2005800030985A CN 200580003098 A CN200580003098 A CN 200580003098A CN 1910224 B CN1910224 B CN 1910224B
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大野隆义
山田晋哉
四谷昌人
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Abstract

本发明制成了在发泡性组合物中含有氟树脂以及电绝缘性须晶的发泡性组合物，通过在该发泡性组合物中混合发泡剂使其发泡，可以提供发泡的气泡的直径小的氟树脂组合物，可以减小发泡所得的发泡体的气泡径，还可以提供在中心导体的周围配置有由该发泡体形成的绝缘体层的同轴绝缘电缆。

Description

发泡树脂组合物以及使用其的发泡体和同轴绝缘电缆
技术领域
发泡含有氟树脂的组合物所得的发泡体作为以同轴绝缘电缆的导体的绝缘层为代表的绝缘体层、缓冲体层来使用。如果将同轴绝缘电缆作为示例，则由于与没有形成发泡体的情况相比，在中心导体的周围设有含有氟树脂的发泡体作为绝缘层的情况具有小的介电常数，因此可以完成信号的高速转送，可以得到电信号衰减小、特性优良的电缆。
背景技术
发泡体层的形成是通过在将氟树脂等的组合物熔融成形的同时使其发泡来形成的，在含有氟树脂的组合物的发泡中，作为发泡剂使用氮等气体，作为发泡成核剂使用氮化硼。由于发泡体层的介电常数受发泡体层的气孔率左右，因此希望得到增大气孔率、介电常数小的发泡体层。
由于作为发泡成核剂使用的氮化硼，是没有吸湿性，且对电特性不造成不良影响的化合物，因此作为在形成同轴绝缘电缆的绝缘用发泡体层时使用的发泡成核剂是合适的成分，但是它形成的气泡大，特别是对于中心导体的线径小、绝缘层的厚度薄的同轴绝缘电缆所要求的微细的气泡的形成，不能满足要求，因此希望出现可形成更微细的气孔的发泡组合物以及发泡体。
发明的揭示
本发明的课题是在含有氟树脂的发泡体中提供大气孔率、可形成微细气泡的发泡用组合物，发泡体以及同轴绝缘电缆。
本发明的课题可通过发泡性组合物中的含有氟树脂以及电绝缘性须晶的发泡性组合物来解决。
电绝缘性须晶是选自硼酸铝、硼酸镁、钛酸钾、氮化硅的至少一种的上述发泡性组合物。
另外，在合成树脂发泡体的方面，是将含有氟树脂和电绝缘性须晶的组合物与发泡剂混合使之发泡的发泡体。
另外，在同轴绝缘电缆的方面，是在中心导体的周围具有由发泡体形成的绝缘体层的同轴绝缘电缆，该发泡体是使含有氟树脂以及电绝缘性须晶的组合物发泡所得的发泡体。
本发明的发泡性组合物是使用须晶作为发泡成核剂对含有氟树脂的发泡性组合物进行发泡的组合物，形成的发泡体具有微细的气泡，即使在发泡体层的厚度薄的情况下也可以得到机械、电气均具有稳定性能的发泡体层，因此可以提供作为要求高可靠性的同轴绝缘电缆用绝缘体的有用的发泡体。
附图的简单说明
图1是说明本发明的实施例的显微镜照片。
图2是说明本发明的比较例的显微镜照片。
图3是说明本发明的比较例的显微镜照片。
实施发明的最佳方式
以下说明本发明的实施方式。
本申请的发明是依据如下发现而完成的，该发现是：与使用氮化硼颗粒作为发泡成核剂发泡成核剂相比，使用电绝缘性须晶作为发泡成核剂发泡成核剂可以得到具有微细的独立气泡的发泡体。
即，目前作为发泡成核剂使用的氮化硼为颗粒状和鳞片状颗粒，但是却意外发现，使用须状的绝缘性的须晶可以发泡率大、且形成微细的气泡。
在本发明中，作为可能作为发泡成核剂使用的须晶，可以使用对电特性没有影响的绝缘性的陶瓷系的须晶。
具体地讲，可例举如选自硼酸铝须晶、硼酸镁须晶、钛酸钾须晶、氮化硅须晶的须晶，可使用这些须晶中的一种，或将多种混合使用。例如作为硼酸铝须晶可例举如四国化成制的アルボレツクスY(算数平均径为0.5～15μm，算数平均长度为10～30μm)。另外，作为钛酸钾须晶，可例举如大塚化学制的テイスモD(算数平均径为0.2至0.5μm，算数平均长度为10～20μm)。
另外，发泡组合物中的绝缘性须晶，较好在发泡组合物中占0.1至5质量％的比例，更好为0.1至1质量％。
当绝缘性须晶的量小于0.1质量％时，由于发泡率降低，因此不适宜，如大于5质量％时，则气泡增大造成电特性降低，因此不适宜。
另外，本发明中使用的电绝缘性须晶，较好为长宽比为10～100左右、直径为0.1μm～1μm，比这更大的须晶不能形成微细的气泡。
另外，作为本发明的发泡用组合物以及发泡体中使用的氟树脂，可例举如四氟乙烯-六氟丙烯共聚物、四氟乙烯-全氟丙基乙烯基醚共聚物等四氟乙烯-烷基乙烯基醚共聚物、乙烯-四氟乙烯-全氟丁基乙烯共聚物、乙烯-氯三氟乙烯共聚物、聚偏氟乙烯等热塑性氟树脂。
另外，本发明的发泡体的发泡，可也如下进行，即向熔融的组合物中注入作为发泡剂的氮等气体，或者将通过加热进行热分解产生气体的发泡性物质等混合在发泡树脂组合物中。
实施例
以下示例实施例和比较例来说明本发明。
实施例1
将含有四氟乙烯-氟烷基乙烯共聚物(三井·デユポンフロロケミカル制FEP5100J)99.5质量％、硼酸铝须晶(四国化成制アルボレツクスY)0.5质量％的组合物，用挤出机在模温为380℃的条件下挤压成形，注入0.52MPa的氮，将直径为0.511mm的镀银软铜线在安装于挤出机上的机头(head)上移动，上该镀银软铜线发泡成形，形成外径为1.44mm的发泡体层，在同轴绝缘电缆用的中心导体的周围形成由发泡体层构成的包覆体。测定所得发泡体层的静电容量，通过下式1求得介电常数ε，根据所得的介电常数求得气孔率V(％)。
式1ε＝(C×log(D/d))/24.16
其中，C：每1m的静电容量(pF)
D：外径(mm)
d：导体的直径(mm)
式2V＝(1-logε/logεf)×100
其中，εf：构成发泡体层的组合物在发泡前的介电常数。
每单位长度的静电容量为75.2pF/m，介电常数ε为1.400，气孔率为54.6％。
另外，沿着与其轴垂直的面切断所得中心导体的包覆体，用显微镜观察断面，在图1中显示了显微镜照片。
任意抽出的50个气泡的平均直径为24.2μm。
比较例1
除了将实施例1中使用的发泡用组合物换成以氮化硼颗粒作为发泡剂混合的氟树脂组合物(デユポン制FR5030)之外，其它与实施例1同样操作，制造具有发泡体层的中心导体的包覆体，与实施例1同样操作测定静电容量。结果，静电容量为77pF/m，介电常数ε为1.434，气孔率为51.4％。
另外，沿着与其轴垂直的面切断所得中心导体的包覆体，用显微镜观察断面，在图2中显示了显微镜照片。
任意抽出的50个气泡的平均直径为41.7μm。
比较例2
除了将实施例1中使用的硼酸铝须晶变换成硼酸铝颗粒(四国化成制アルボライト03T算数平均粒径为3μm)之外，其它与实施例1同样操作，制造具有发泡体层的中心导体的包覆体，与实施例1同样操作测定静电容量。结果，静电容量为78.5pF/m，介电常数为1.462，气孔率为48.8％。
另外，沿着与其轴垂直的面切断所得中心导体的包覆体，用显微镜观测断面，在图3中显示了显微镜照片。
如以上的实施例和比较例所示，以本发明的须晶作为发泡成核剂形成的发泡体层的介电常数低，与使用氮化硼等颗粒的情况相比，可以形成气孔径小的发泡体。
产业利用的可能性
本发明的发泡性组合物是在含有氟树脂的发泡性组合物中含有作为发泡成核剂的须晶，使其发泡所得的发泡体具有微细的气泡的组合物，即使在发泡体层的厚度薄的情况下，也可以得到机械、电气上均具有稳定性能的发泡体层，因此可适宜作为要求高可靠性、并且线径细的同轴绝缘电缆用绝缘体层。

Claims (4)

1.发泡性组合物，其特征在于，在所述发泡性组合物中含有氟树脂以及电绝缘性须晶，所述的电绝缘性须晶的直径为0.1μm～1μm，并且发泡组合物中的绝缘性须晶的含量为0.1至1质量％。
2.如权利要求1所述的发泡性组合物，其特征在于，电绝缘性须晶为选自硼酸铝、硼酸镁、钛酸钾、氮化硅的至少一种。
3.发泡体，它是合成树脂发泡体，其特征在于，将权利要求1所述的含有氟树脂和电绝缘性须晶的组合物与发泡剂混合，使其发泡。
4.同轴绝缘电缆，其特征在于，所述同轴绝缘电缆中，在中心导体的周围具有由发泡体形成的绝缘体层，该发泡体通过使权利要求1所述的含有氟树脂以及电绝缘性须晶的组合物发泡而得。
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