CN1904741B - 无掩膜曝光方法 - Google Patents
无掩膜曝光方法 Download PDFInfo
- Publication number
- CN1904741B CN1904741B CN200610107848XA CN200610107848A CN1904741B CN 1904741 B CN1904741 B CN 1904741B CN 200610107848X A CN200610107848X A CN 200610107848XA CN 200610107848 A CN200610107848 A CN 200610107848A CN 1904741 B CN1904741 B CN 1904741B
- Authority
- CN
- China
- Prior art keywords
- light
- exposure
- radiation source
- thing
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/54—Lamp housings; Illuminating means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (1)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-217330 | 2005-07-27 | ||
JP2005217330 | 2005-07-27 | ||
JP2005217330A JP2007033882A (ja) | 2005-07-27 | 2005-07-27 | 露光装置及び露光方法並びに配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1904741A CN1904741A (zh) | 2007-01-31 |
CN1904741B true CN1904741B (zh) | 2010-12-15 |
Family
ID=37674028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610107848XA Expired - Fee Related CN1904741B (zh) | 2005-07-27 | 2006-07-26 | 无掩膜曝光方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7839484B2 (zh) |
JP (1) | JP2007033882A (zh) |
KR (1) | KR20070014068A (zh) |
CN (1) | CN1904741B (zh) |
TW (1) | TW200715065A (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200844652A (en) * | 2006-11-15 | 2008-11-16 | Taiyo Ink Mfg Co Ltd | Process for forming solder resist film and photosensitive composition |
JP2008197472A (ja) * | 2007-02-14 | 2008-08-28 | Shinko Electric Ind Co Ltd | 回路基板の製造方法 |
KR100868242B1 (ko) * | 2007-05-14 | 2008-11-12 | 아엠텐 주식회사 | 마스크리스 리소그래피를 위한 인라인 가상마스킹 방법 |
JP4863948B2 (ja) * | 2007-07-30 | 2012-01-25 | 株式会社日立ハイテクノロジーズ | 露光装置、露光方法、及び表示用パネル基板の製造方法 |
KR101458208B1 (ko) * | 2008-03-06 | 2014-11-04 | 엘지전자 주식회사 | 마스크리스 패턴 형성장치 및 패턴을 형성하는 방법 |
CN102126082B (zh) * | 2010-12-24 | 2013-08-21 | 陈乃奇 | 激光曝光刀具及基于激光的立体直接曝光成像方法 |
US10149390B2 (en) | 2012-08-27 | 2018-12-04 | Mycronic AB | Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs |
JP6758575B2 (ja) * | 2014-02-24 | 2020-09-23 | 東京エレクトロン株式会社 | 感光性化学増幅レジスト化学物質およびプロセスを使用する方法および技術 |
JP6623847B2 (ja) * | 2016-03-07 | 2019-12-25 | ウシオ電機株式会社 | 光源装置及びこれを備えた露光装置 |
JP6523194B2 (ja) * | 2016-03-14 | 2019-05-29 | 東京エレクトロン株式会社 | 補助露光装置 |
WO2017197279A1 (en) * | 2016-05-13 | 2017-11-16 | Tokyo Electron Limited | Critical dimension control by use of photo-sensitized chemicals or photo-sensitized chemically amplified resist |
US20180068047A1 (en) * | 2016-09-08 | 2018-03-08 | Mapper Lithography Ip B.V. | Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system |
JP7111348B2 (ja) * | 2018-06-15 | 2022-08-02 | ミタニマイクロニクス株式会社 | スクリーンマスクの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6437348B1 (en) * | 1999-10-21 | 2002-08-20 | Advanced Micro Devices, Inc. | Simultaneous heating and exposure of reticle with pattern placement correction |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02108053A (ja) * | 1988-10-18 | 1990-04-19 | Nippon Telegr & Teleph Corp <Ntt> | パターン形成材料及びパターン形成方法 |
JPH03142918A (ja) * | 1989-10-30 | 1991-06-18 | Matsushita Electron Corp | レジストパターン形成方法 |
DE4011023A1 (de) * | 1990-04-05 | 1991-10-10 | Hoechst Ag | Nachbehandlungsgeraet fuer druckplatten |
US5229872A (en) * | 1992-01-21 | 1993-07-20 | Hughes Aircraft Company | Exposure device including an electrically aligned electronic mask for micropatterning |
JPH11162844A (ja) * | 1997-09-25 | 1999-06-18 | Toshiba Corp | パターン形成方法 |
TW405062B (en) * | 1999-02-18 | 2000-09-11 | Asm Lithography Bv | Lithographic projection apparatus |
JP2002182157A (ja) | 2000-12-12 | 2002-06-26 | Fuji Photo Film Co Ltd | 照明光学系及びこれを用いたプロジェクター装置、露光装置、光造形装置、画像形成装置 |
JP2003015077A (ja) | 2001-07-04 | 2003-01-15 | Fuji Photo Film Co Ltd | 画像露光装置 |
US6841340B2 (en) * | 2001-07-13 | 2005-01-11 | Fuji Photo Film Co., Ltd. | Optical fabricating method and apparatus |
US6707534B2 (en) * | 2002-05-10 | 2004-03-16 | Anvik Corporation | Maskless conformable lithography |
JP4546019B2 (ja) | 2002-07-03 | 2010-09-15 | 株式会社日立製作所 | 露光装置 |
JP2004085728A (ja) | 2002-08-23 | 2004-03-18 | Mitsubishi Chemicals Corp | 赤外線感光性樹脂を用いた画像形成方法 |
KR101087930B1 (ko) * | 2002-08-24 | 2011-11-28 | 매스크리스 리소그래피 인코퍼레이티드 | 연속적인 직접-기록 광 리소그래피 장치 및 방법 |
JP2004157219A (ja) | 2002-11-05 | 2004-06-03 | Fuji Photo Film Co Ltd | 露光ヘッドおよび露光装置 |
JP2005158799A (ja) * | 2003-11-20 | 2005-06-16 | Shinko Electric Ind Co Ltd | 直接露光装置、直接露光方法および配線基板 |
JP2005189365A (ja) * | 2003-12-25 | 2005-07-14 | Fuji Photo Film Co Ltd | 吸着固定装置、画像形成装置 |
JP5080009B2 (ja) * | 2005-03-22 | 2012-11-21 | 日立ビアメカニクス株式会社 | 露光方法 |
-
2005
- 2005-07-27 JP JP2005217330A patent/JP2007033882A/ja active Pending
-
2006
- 2006-07-12 TW TW095125496A patent/TW200715065A/zh unknown
- 2006-07-26 KR KR1020060070134A patent/KR20070014068A/ko not_active Application Discontinuation
- 2006-07-26 CN CN200610107848XA patent/CN1904741B/zh not_active Expired - Fee Related
- 2006-07-26 US US11/492,790 patent/US7839484B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6437348B1 (en) * | 1999-10-21 | 2002-08-20 | Advanced Micro Devices, Inc. | Simultaneous heating and exposure of reticle with pattern placement correction |
Also Published As
Publication number | Publication date |
---|---|
TW200715065A (en) | 2007-04-16 |
US7839484B2 (en) | 2010-11-23 |
US20070024838A1 (en) | 2007-02-01 |
CN1904741A (zh) | 2007-01-31 |
KR20070014068A (ko) | 2007-01-31 |
JP2007033882A (ja) | 2007-02-08 |
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Address after: Kanagawa Patentee after: Via Mechanics Ltd. Address before: Kanagawa Patentee before: Hitachi Bia Macine Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20150726 |
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