TW200715065A - Exposure apparatus and exposure method, and method of manufacturing electrical wiring board - Google Patents

Exposure apparatus and exposure method, and method of manufacturing electrical wiring board

Info

Publication number
TW200715065A
TW200715065A TW095125496A TW95125496A TW200715065A TW 200715065 A TW200715065 A TW 200715065A TW 095125496 A TW095125496 A TW 095125496A TW 95125496 A TW95125496 A TW 95125496A TW 200715065 A TW200715065 A TW 200715065A
Authority
TW
Taiwan
Prior art keywords
exposure
pattern
exposure apparatus
wiring board
electrical wiring
Prior art date
Application number
TW095125496A
Other languages
English (en)
Inventor
Yoshihide Yamaguchi
Masakazu Kishi
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200715065A publication Critical patent/TW200715065A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/54—Lamp housings; Illuminating means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW095125496A 2005-07-27 2006-07-12 Exposure apparatus and exposure method, and method of manufacturing electrical wiring board TW200715065A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005217330A JP2007033882A (ja) 2005-07-27 2005-07-27 露光装置及び露光方法並びに配線基板の製造方法

Publications (1)

Publication Number Publication Date
TW200715065A true TW200715065A (en) 2007-04-16

Family

ID=37674028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125496A TW200715065A (en) 2005-07-27 2006-07-12 Exposure apparatus and exposure method, and method of manufacturing electrical wiring board

Country Status (5)

Country Link
US (1) US7839484B2 (zh)
JP (1) JP2007033882A (zh)
KR (1) KR20070014068A (zh)
CN (1) CN1904741B (zh)
TW (1) TW200715065A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381253B (zh) * 2007-07-30 2013-01-01 Hitachi High Tech Corp 曝光裝置、曝光方法以及顯示用面板基板的製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844652A (en) * 2006-11-15 2008-11-16 Taiyo Ink Mfg Co Ltd Process for forming solder resist film and photosensitive composition
JP2008197472A (ja) * 2007-02-14 2008-08-28 Shinko Electric Ind Co Ltd 回路基板の製造方法
KR100868242B1 (ko) * 2007-05-14 2008-11-12 아엠텐 주식회사 마스크리스 리소그래피를 위한 인라인 가상마스킹 방법
KR101458208B1 (ko) * 2008-03-06 2014-11-04 엘지전자 주식회사 마스크리스 패턴 형성장치 및 패턴을 형성하는 방법
CN102126082B (zh) * 2010-12-24 2013-08-21 陈乃奇 激光曝光刀具及基于激光的立体直接曝光成像方法
US10149390B2 (en) 2012-08-27 2018-12-04 Mycronic AB Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs
US9618848B2 (en) * 2014-02-24 2017-04-11 Tokyo Electron Limited Methods and techniques to use with photosensitized chemically amplified resist chemicals and processes
JP6623847B2 (ja) * 2016-03-07 2019-12-25 ウシオ電機株式会社 光源装置及びこれを備えた露光装置
JP6523194B2 (ja) * 2016-03-14 2019-05-29 東京エレクトロン株式会社 補助露光装置
CN109313394B (zh) * 2016-05-13 2021-07-02 东京毅力科创株式会社 使用光敏化学品或光敏化学放大抗蚀剂的临界尺寸控制
US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
JP7111348B2 (ja) * 2018-06-15 2022-08-02 ミタニマイクロニクス株式会社 スクリーンマスクの製造方法

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JPH02108053A (ja) * 1988-10-18 1990-04-19 Nippon Telegr & Teleph Corp <Ntt> パターン形成材料及びパターン形成方法
JPH03142918A (ja) * 1989-10-30 1991-06-18 Matsushita Electron Corp レジストパターン形成方法
DE4011023A1 (de) * 1990-04-05 1991-10-10 Hoechst Ag Nachbehandlungsgeraet fuer druckplatten
US5229872A (en) * 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
JPH11162844A (ja) * 1997-09-25 1999-06-18 Toshiba Corp パターン形成方法
TW405062B (en) * 1999-02-18 2000-09-11 Asm Lithography Bv Lithographic projection apparatus
US6437348B1 (en) * 1999-10-21 2002-08-20 Advanced Micro Devices, Inc. Simultaneous heating and exposure of reticle with pattern placement correction
JP2002182157A (ja) 2000-12-12 2002-06-26 Fuji Photo Film Co Ltd 照明光学系及びこれを用いたプロジェクター装置、露光装置、光造形装置、画像形成装置
JP2003015077A (ja) 2001-07-04 2003-01-15 Fuji Photo Film Co Ltd 画像露光装置
US6841340B2 (en) * 2001-07-13 2005-01-11 Fuji Photo Film Co., Ltd. Optical fabricating method and apparatus
US6707534B2 (en) * 2002-05-10 2004-03-16 Anvik Corporation Maskless conformable lithography
JP4546019B2 (ja) 2002-07-03 2010-09-15 株式会社日立製作所 露光装置
JP2004085728A (ja) 2002-08-23 2004-03-18 Mitsubishi Chemicals Corp 赤外線感光性樹脂を用いた画像形成方法
EP1573366B1 (en) * 2002-08-24 2016-11-09 Chime Ball Technology Co., Ltd. Continuous direct-write optical lithography
JP2004157219A (ja) 2002-11-05 2004-06-03 Fuji Photo Film Co Ltd 露光ヘッドおよび露光装置
JP2005158799A (ja) * 2003-11-20 2005-06-16 Shinko Electric Ind Co Ltd 直接露光装置、直接露光方法および配線基板
JP2005189365A (ja) * 2003-12-25 2005-07-14 Fuji Photo Film Co Ltd 吸着固定装置、画像形成装置
JP5080009B2 (ja) * 2005-03-22 2012-11-21 日立ビアメカニクス株式会社 露光方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381253B (zh) * 2007-07-30 2013-01-01 Hitachi High Tech Corp 曝光裝置、曝光方法以及顯示用面板基板的製造方法

Also Published As

Publication number Publication date
CN1904741A (zh) 2007-01-31
KR20070014068A (ko) 2007-01-31
US7839484B2 (en) 2010-11-23
JP2007033882A (ja) 2007-02-08
CN1904741B (zh) 2010-12-15
US20070024838A1 (en) 2007-02-01

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