CN1885804B - 无线局域网通信模块和集成芯片封装 - Google Patents

无线局域网通信模块和集成芯片封装 Download PDF

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Publication number
CN1885804B
CN1885804B CN2006100835054A CN200610083505A CN1885804B CN 1885804 B CN1885804 B CN 1885804B CN 2006100835054 A CN2006100835054 A CN 2006100835054A CN 200610083505 A CN200610083505 A CN 200610083505A CN 1885804 B CN1885804 B CN 1885804B
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CN
China
Prior art keywords
integrated circuit
signal
antenna
package
digital data
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100835054A
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English (en)
Chinese (zh)
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CN1885804A (zh
Inventor
埃里克·B·加诺夫斯盖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marvell World Trade Ltd
Mawier International Trade Co Ltd
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Mawier International Trade Co Ltd
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Publication date
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Publication of CN1885804A publication Critical patent/CN1885804A/zh
Application granted granted Critical
Publication of CN1885804B publication Critical patent/CN1885804B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
CN2006100835054A 2005-06-21 2006-05-30 无线局域网通信模块和集成芯片封装 Expired - Fee Related CN1885804B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/157,286 US20060285480A1 (en) 2005-06-21 2005-06-21 Wireless local area network communications module and integrated chip package
US11/157,286 2005-06-21

Publications (2)

Publication Number Publication Date
CN1885804A CN1885804A (zh) 2006-12-27
CN1885804B true CN1885804B (zh) 2013-01-23

Family

ID=36649116

Family Applications (4)

Application Number Title Priority Date Filing Date
CN2006100835054A Expired - Fee Related CN1885804B (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成芯片封装
CNA2006100835035A Pending CN1885847A (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成芯片封装
CN2006100835020A Expired - Fee Related CN1885850B (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成电路封装体
CNA200610083504XA Pending CN1885851A (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成芯片封装

Family Applications After (3)

Application Number Title Priority Date Filing Date
CNA2006100835035A Pending CN1885847A (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成芯片封装
CN2006100835020A Expired - Fee Related CN1885850B (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成电路封装体
CNA200610083504XA Pending CN1885851A (zh) 2005-06-21 2006-05-30 无线局域网通信模块和集成芯片封装

Country Status (6)

Country Link
US (1) US20060285480A1 (https=)
EP (4) EP1737065B1 (https=)
JP (4) JP4732959B2 (https=)
CN (4) CN1885804B (https=)
SG (4) SG128568A1 (https=)
TW (4) TWI438873B (https=)

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FR2917895B1 (fr) * 2007-06-21 2010-04-09 Commissariat Energie Atomique Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
CN101286505B (zh) * 2008-05-26 2012-06-13 日月光半导体制造股份有限公司 具有天线的半导体封装结构
US9287914B2 (en) 2008-06-26 2016-03-15 Thomson Licensing Frontal block with intergrated antenna
US8125061B2 (en) * 2009-09-03 2012-02-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
CN102104557A (zh) * 2009-12-18 2011-06-22 上海贝尔股份有限公司 基带电路及其应用方法
US8570224B2 (en) * 2010-05-12 2013-10-29 Qualcomm Incorporated Apparatus providing thermal management for radio frequency devices
US20110316139A1 (en) * 2010-06-23 2011-12-29 Broadcom Corporation Package for a wireless enabled integrated circuit
US20120086114A1 (en) * 2010-10-07 2012-04-12 Broadcom Corporation Millimeter devices on an integrated circuit
US8901945B2 (en) * 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
CN102800923A (zh) * 2012-08-10 2012-11-28 上海华勤通讯技术有限公司 移动终端内置天线及其移动终端
CN103066370A (zh) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 一种栅格阵列封装模块及设备
KR20150002200A (ko) * 2013-06-28 2015-01-07 삼성전기주식회사 프론트엔드 모듈 및 그를 이용한 무선 통신 장치
US10404656B2 (en) 2014-09-25 2019-09-03 Nec Corporation Antenna system
US9584231B2 (en) * 2014-10-30 2017-02-28 Samsung Electronics Co., Ltd. Integrated two dimensional active antenna array communication system
KR101609642B1 (ko) * 2015-07-10 2016-04-08 주식회사 아모그린텍 Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기
TWI633420B (zh) * 2015-08-25 2018-08-21 莫仕有限公司 Communication node
US9966653B2 (en) 2015-08-28 2018-05-08 Apple Inc. Antennas for electronic device with heat spreader
US11109120B2 (en) 2016-03-01 2021-08-31 Molex, Llc Communication node
US20170347490A1 (en) * 2016-05-24 2017-11-30 Texas Instruments Incorporated High-frequency antenna structure with high thermal conductivity and high surface area
CN106356341A (zh) * 2016-08-31 2017-01-25 华为技术有限公司 一种半导体装置及制造方法
EP3637623B1 (en) * 2017-04-20 2022-03-16 Fujikura Ltd. Funkkommunikationsvorrichtung
US20200036081A1 (en) * 2018-07-30 2020-01-30 Innolux Corporation Package structure and antenna device using the same
CN112986918B (zh) * 2021-03-10 2025-08-01 浙江大华技术股份有限公司 一种雷达天线系统及一种信号处理方法

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WO2003075472A2 (en) * 2002-03-01 2003-09-12 Ipr Licensing, Inc. Intelligent interface for adaptive antenna array
CN1627562A (zh) * 2003-12-09 2005-06-15 国际商业机器公司 使用基片中的通路作为辐射元件而构造天线的设备和方法

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US5023624A (en) * 1988-10-26 1991-06-11 Harris Corporation Microwave chip carrier package having cover-mounted antenna element
WO2003075472A2 (en) * 2002-03-01 2003-09-12 Ipr Licensing, Inc. Intelligent interface for adaptive antenna array
CN1627562A (zh) * 2003-12-09 2005-06-15 国际商业机器公司 使用基片中的通路作为辐射元件而构造天线的设备和方法

Also Published As

Publication number Publication date
EP1737067A1 (en) 2006-12-27
EP1737068A1 (en) 2006-12-27
EP1737069A1 (en) 2006-12-27
EP1737069B1 (en) 2017-01-11
SG128569A1 (en) 2007-01-30
EP1737068B1 (en) 2018-03-21
JP2007037101A (ja) 2007-02-08
JP2007006471A (ja) 2007-01-11
CN1885850A (zh) 2006-12-27
CN1885851A (zh) 2006-12-27
TW200701431A (en) 2007-01-01
SG128568A1 (en) 2007-01-30
US20060285480A1 (en) 2006-12-21
TWI438873B (zh) 2014-05-21
JP2007028591A (ja) 2007-02-01
JP2007037100A (ja) 2007-02-08
TWI495278B (zh) 2015-08-01
SG128566A1 (en) 2007-01-30
JP4704961B2 (ja) 2011-06-22
TWI446517B (zh) 2014-07-21
EP1737065B1 (en) 2017-11-01
JP4728172B2 (ja) 2011-07-20
CN1885847A (zh) 2006-12-27
JP4660428B2 (ja) 2011-03-30
TWI430592B (zh) 2014-03-11
CN1885850B (zh) 2013-08-28
EP1737067B1 (en) 2016-12-28
CN1885804A (zh) 2006-12-27
TW200701417A (en) 2007-01-01
SG128565A1 (en) 2007-01-30
EP1737065A1 (en) 2006-12-27
TW200707929A (en) 2007-02-16
JP4732959B2 (ja) 2011-07-27
TW200727601A (en) 2007-07-16

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