TWI438873B - 無線區域網路通信模組與積體式晶片封裝（三） - Google Patents

無線區域網路通信模組與積體式晶片封裝（三） Download PDF

Info

Publication number
TWI438873B
TWI438873B TW095120028A TW95120028A TWI438873B TW I438873 B TWI438873 B TW I438873B TW 095120028 A TW095120028 A TW 095120028A TW 95120028 A TW95120028 A TW 95120028A TW I438873 B TWI438873 B TW I438873B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
package
antenna
circuit
substrate
Prior art date
Application number
TW095120028A
Other languages
English (en)
Chinese (zh)
Other versions
TW200701417A (en
Inventor
傑諾夫斯基 艾力克Ｂ.
Original Assignee
邁威爾世界貿易有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 邁威爾世界貿易有限公司 filed Critical 邁威爾世界貿易有限公司
Publication of TW200701417A publication Critical patent/TW200701417A/zh
Application granted granted Critical
Publication of TWI438873B publication Critical patent/TWI438873B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
TW095120028A 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（三） TWI438873B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/157,286 US20060285480A1 (en) 2005-06-21 2005-06-21 Wireless local area network communications module and integrated chip package

Publications (2)

Publication Number Publication Date
TW200701417A TW200701417A (en) 2007-01-01
TWI438873B true TWI438873B (zh) 2014-05-21

Family

ID=36649116

Family Applications (4)

Application Number Title Priority Date Filing Date
TW095120028A TWI438873B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（三）
TW095120026A TWI495278B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（二）
TW095120024A TWI446517B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（一）
TW095120031A TWI430592B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（四）

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW095120026A TWI495278B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（二）
TW095120024A TWI446517B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（一）
TW095120031A TWI430592B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（四）

Country Status (6)

Country Link
US (1) US20060285480A1 (https=)
EP (4) EP1737065B1 (https=)
JP (4) JP4732959B2 (https=)
CN (4) CN1885804B (https=)
SG (4) SG128568A1 (https=)
TW (4) TWI438873B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10571984B2 (en) 2015-08-25 2020-02-25 Molex, Llc Communication node with digital plane interface
US11109120B2 (en) 2016-03-01 2021-08-31 Molex, Llc Communication node

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164167B2 (en) * 2007-03-09 2012-04-24 Nanyang Technological University Integrated circuit structure and a method of forming the same
FR2917895B1 (fr) * 2007-06-21 2010-04-09 Commissariat Energie Atomique Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
CN101286505B (zh) * 2008-05-26 2012-06-13 日月光半导体制造股份有限公司 具有天线的半导体封装结构
US9287914B2 (en) 2008-06-26 2016-03-15 Thomson Licensing Frontal block with intergrated antenna
US8125061B2 (en) * 2009-09-03 2012-02-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
CN102104557A (zh) * 2009-12-18 2011-06-22 上海贝尔股份有限公司 基带电路及其应用方法
US8570224B2 (en) * 2010-05-12 2013-10-29 Qualcomm Incorporated Apparatus providing thermal management for radio frequency devices
US20110316139A1 (en) * 2010-06-23 2011-12-29 Broadcom Corporation Package for a wireless enabled integrated circuit
US20120086114A1 (en) * 2010-10-07 2012-04-12 Broadcom Corporation Millimeter devices on an integrated circuit
US8901945B2 (en) * 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
CN102800923A (zh) * 2012-08-10 2012-11-28 上海华勤通讯技术有限公司 移动终端内置天线及其移动终端
CN103066370A (zh) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 一种栅格阵列封装模块及设备
KR20150002200A (ko) * 2013-06-28 2015-01-07 삼성전기주식회사 프론트엔드 모듈 및 그를 이용한 무선 통신 장치
US10404656B2 (en) 2014-09-25 2019-09-03 Nec Corporation Antenna system
US9584231B2 (en) * 2014-10-30 2017-02-28 Samsung Electronics Co., Ltd. Integrated two dimensional active antenna array communication system
KR101609642B1 (ko) * 2015-07-10 2016-04-08 주식회사 아모그린텍 Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기
US9966653B2 (en) 2015-08-28 2018-05-08 Apple Inc. Antennas for electronic device with heat spreader
US20170347490A1 (en) * 2016-05-24 2017-11-30 Texas Instruments Incorporated High-frequency antenna structure with high thermal conductivity and high surface area
CN106356341A (zh) * 2016-08-31 2017-01-25 华为技术有限公司 一种半导体装置及制造方法
EP3637623B1 (en) * 2017-04-20 2022-03-16 Fujikura Ltd. Funkkommunikationsvorrichtung
US20200036081A1 (en) * 2018-07-30 2020-01-30 Innolux Corporation Package structure and antenna device using the same
CN112986918B (zh) * 2021-03-10 2025-08-01 浙江大华技术股份有限公司 一种雷达天线系统及一种信号处理方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5023624A (en) * 1988-10-26 1991-06-11 Harris Corporation Microwave chip carrier package having cover-mounted antenna element
JPH0879813A (ja) * 1994-08-30 1996-03-22 Kokusai Electric Co Ltd Ｐｃｍｃｉａ対応ページャ受信機
US6239752B1 (en) * 1995-02-28 2001-05-29 Stmicroelectronics, Inc. Semiconductor chip package that is also an antenna
US6768460B2 (en) * 2000-03-29 2004-07-27 Matsushita Electric Industrial Co., Ltd. Diversity wireless device and wireless terminal unit
US6582979B2 (en) * 2000-11-15 2003-06-24 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless chip carrier with embedded antenna
US20040217472A1 (en) * 2001-02-16 2004-11-04 Integral Technologies, Inc. Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
US6599779B2 (en) * 2001-09-24 2003-07-29 St Assembly Test Service Ltd. PBGA substrate for anchoring heat sink
JP2003188620A (ja) * 2001-12-19 2003-07-04 Murata Mfg Co Ltd モジュール一体型アンテナ
EP1488613A4 (en) * 2002-03-01 2005-04-27 Ipr Licensing Inc INTELLIGENT INTERFACE FOR ADAPTIVE ANTENNA NETWORK
AU2003248649A1 (en) * 2002-06-10 2003-12-22 University Of Florida High gain integrated antenna and devices therefrom
US6731246B2 (en) * 2002-06-27 2004-05-04 Harris Corporation Efficient loop antenna of reduced diameter
WO2005004047A1 (ja) * 2003-07-03 2005-01-13 Renesas Technology Corp. マルチファンクションカードデバイス
TWI224846B (en) * 2003-08-12 2004-12-01 Siliconware Precision Industries Co Ltd Semiconductor package with heat dissipating structure
JP2005064581A (ja) * 2003-08-12 2005-03-10 Fujitsu Ten Ltd ダイバーシティ受信回路
US7286516B2 (en) * 2003-09-12 2007-10-23 Tekelec Methods and systems for wireless local area network (WLAN)-based signaling network monitoring
US7688766B2 (en) * 2003-09-17 2010-03-30 Intel Corporation Modulation scheme for orthogonal frequency division multiplexing systems or the like
US7075906B2 (en) * 2003-09-30 2006-07-11 Cisco Technology, Inc. Method and apparatus for cell identification in wireless data networks
US6891726B1 (en) * 2003-10-30 2005-05-10 Intel Corporation Heat sink and antenna
US20050119025A1 (en) * 2003-12-02 2005-06-02 Rishi Mohindra Serial digital interface for wireless network radios and baseband integrated circuits
US7444734B2 (en) * 2003-12-09 2008-11-04 International Business Machines Corporation Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
US7181187B2 (en) * 2004-01-15 2007-02-20 Broadcom Corporation RF transmitter having improved out of band attenuation
US7643848B2 (en) * 2004-04-13 2010-01-05 Qualcomm, Incorporated Multi-antenna transceiver system
US8797926B2 (en) * 2004-06-04 2014-08-05 Apple Inc. Networked media station
US7505450B2 (en) * 2005-03-23 2009-03-17 Cisco Technology, Inc. Configuration of failure and acquire timeouts to facilitate recovery from failures in hierarchical mesh networks

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10571984B2 (en) 2015-08-25 2020-02-25 Molex, Llc Communication node with digital plane interface
TWI693511B (zh) * 2015-08-25 2020-05-11 美商莫仕有限公司 通信節點
US11109120B2 (en) 2016-03-01 2021-08-31 Molex, Llc Communication node
US11533547B2 (en) 2016-03-01 2022-12-20 Molex, Llc Communication node

Also Published As

Publication number Publication date
EP1737067A1 (en) 2006-12-27
EP1737068A1 (en) 2006-12-27
EP1737069A1 (en) 2006-12-27
EP1737069B1 (en) 2017-01-11
SG128569A1 (en) 2007-01-30
EP1737068B1 (en) 2018-03-21
JP2007037101A (ja) 2007-02-08
JP2007006471A (ja) 2007-01-11
CN1885850A (zh) 2006-12-27
CN1885851A (zh) 2006-12-27
TW200701431A (en) 2007-01-01
SG128568A1 (en) 2007-01-30
US20060285480A1 (en) 2006-12-21
JP2007028591A (ja) 2007-02-01
JP2007037100A (ja) 2007-02-08
TWI495278B (zh) 2015-08-01
CN1885804B (zh) 2013-01-23
SG128566A1 (en) 2007-01-30
JP4704961B2 (ja) 2011-06-22
TWI446517B (zh) 2014-07-21
EP1737065B1 (en) 2017-11-01
JP4728172B2 (ja) 2011-07-20
CN1885847A (zh) 2006-12-27
JP4660428B2 (ja) 2011-03-30
TWI430592B (zh) 2014-03-11
CN1885850B (zh) 2013-08-28
EP1737067B1 (en) 2016-12-28
CN1885804A (zh) 2006-12-27
TW200701417A (en) 2007-01-01
SG128565A1 (en) 2007-01-30
EP1737065A1 (en) 2006-12-27
TW200707929A (en) 2007-02-16
JP4732959B2 (ja) 2011-07-27
TW200727601A (en) 2007-07-16

Similar Documents

Publication Publication Date Title
TWI438873B (zh) 無線區域網路通信模組與積體式晶片封裝（三）
JP2914342B2 (ja) 集積回路装置の冷却構造
US8319298B2 (en) Integrated circuit module
US6008536A (en) Grid array device package including advanced heat transfer mechanisms
US5710459A (en) Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability
TW462121B (en) Heat sink type ball grid array package
US6111313A (en) Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit
US7202561B2 (en) Semiconductor package with heat dissipating structure and method of manufacturing the same
JP2007037101A5 (https=)
JP2007028591A5 (https=)
US7180166B2 (en) Stacked multi-chip package
US20020050378A1 (en) Double-layered multiple chip module package
KR20080085441A (ko) 스택 패키지 및 그 제조방법
HK1099436A (en) Wireless local area network communications module and integrated chip package
HK1099439A (en) Wireless local area network communications module and integrated chip package
HK1099438A (en) Wireless local area network communications module and integrated chip package
HK1099437A (en) Wireless local area network communications module and integrated chip package

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees