SG128568A1 - Wireless local area network communications module and integrated chip package - Google Patents

Wireless local area network communications module and integrated chip package

Info

Publication number
SG128568A1
SG128568A1 SG200603684A SG200603684A SG128568A1 SG 128568 A1 SG128568 A1 SG 128568A1 SG 200603684 A SG200603684 A SG 200603684A SG 200603684 A SG200603684 A SG 200603684A SG 128568 A1 SG128568 A1 SG 128568A1
Authority
SG
Singapore
Prior art keywords
signals
area network
local area
wireless local
chip package
Prior art date
Application number
SG200603684A
Other languages
English (en)
Inventor
Eric B Janofsky
Original Assignee
Marvell World Trade Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvell World Trade Ltd filed Critical Marvell World Trade Ltd
Publication of SG128568A1 publication Critical patent/SG128568A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
SG200603684A 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package SG128568A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/157,286 US20060285480A1 (en) 2005-06-21 2005-06-21 Wireless local area network communications module and integrated chip package

Publications (1)

Publication Number Publication Date
SG128568A1 true SG128568A1 (en) 2007-01-30

Family

ID=36649116

Family Applications (4)

Application Number Title Priority Date Filing Date
SG200603684A SG128568A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603676A SG128566A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603675A SG128565A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603686A SG128569A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG200603676A SG128566A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603675A SG128565A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603686A SG128569A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package

Country Status (6)

Country Link
US (1) US20060285480A1 (https=)
EP (4) EP1737065B1 (https=)
JP (4) JP4732959B2 (https=)
CN (4) CN1885804B (https=)
SG (4) SG128568A1 (https=)
TW (4) TWI438873B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164167B2 (en) * 2007-03-09 2012-04-24 Nanyang Technological University Integrated circuit structure and a method of forming the same
FR2917895B1 (fr) * 2007-06-21 2010-04-09 Commissariat Energie Atomique Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
CN101286505B (zh) * 2008-05-26 2012-06-13 日月光半导体制造股份有限公司 具有天线的半导体封装结构
US9287914B2 (en) 2008-06-26 2016-03-15 Thomson Licensing Frontal block with intergrated antenna
US8125061B2 (en) * 2009-09-03 2012-02-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
CN102104557A (zh) * 2009-12-18 2011-06-22 上海贝尔股份有限公司 基带电路及其应用方法
US8570224B2 (en) * 2010-05-12 2013-10-29 Qualcomm Incorporated Apparatus providing thermal management for radio frequency devices
US20110316139A1 (en) * 2010-06-23 2011-12-29 Broadcom Corporation Package for a wireless enabled integrated circuit
US20120086114A1 (en) * 2010-10-07 2012-04-12 Broadcom Corporation Millimeter devices on an integrated circuit
US8901945B2 (en) * 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
CN102800923A (zh) * 2012-08-10 2012-11-28 上海华勤通讯技术有限公司 移动终端内置天线及其移动终端
CN103066370A (zh) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 一种栅格阵列封装模块及设备
KR20150002200A (ko) * 2013-06-28 2015-01-07 삼성전기주식회사 프론트엔드 모듈 및 그를 이용한 무선 통신 장치
US10404656B2 (en) 2014-09-25 2019-09-03 Nec Corporation Antenna system
US9584231B2 (en) * 2014-10-30 2017-02-28 Samsung Electronics Co., Ltd. Integrated two dimensional active antenna array communication system
KR101609642B1 (ko) * 2015-07-10 2016-04-08 주식회사 아모그린텍 Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기
TWI633420B (zh) * 2015-08-25 2018-08-21 莫仕有限公司 Communication node
US9966653B2 (en) 2015-08-28 2018-05-08 Apple Inc. Antennas for electronic device with heat spreader
US11109120B2 (en) 2016-03-01 2021-08-31 Molex, Llc Communication node
US20170347490A1 (en) * 2016-05-24 2017-11-30 Texas Instruments Incorporated High-frequency antenna structure with high thermal conductivity and high surface area
CN106356341A (zh) * 2016-08-31 2017-01-25 华为技术有限公司 一种半导体装置及制造方法
EP3637623B1 (en) * 2017-04-20 2022-03-16 Fujikura Ltd. Funkkommunikationsvorrichtung
US20200036081A1 (en) * 2018-07-30 2020-01-30 Innolux Corporation Package structure and antenna device using the same
CN112986918B (zh) * 2021-03-10 2025-08-01 浙江大华技术股份有限公司 一种雷达天线系统及一种信号处理方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5023624A (en) * 1988-10-26 1991-06-11 Harris Corporation Microwave chip carrier package having cover-mounted antenna element
JPH0879813A (ja) * 1994-08-30 1996-03-22 Kokusai Electric Co Ltd Ｐｃｍｃｉａ対応ページャ受信機
US6239752B1 (en) * 1995-02-28 2001-05-29 Stmicroelectronics, Inc. Semiconductor chip package that is also an antenna
US6768460B2 (en) * 2000-03-29 2004-07-27 Matsushita Electric Industrial Co., Ltd. Diversity wireless device and wireless terminal unit
US6582979B2 (en) * 2000-11-15 2003-06-24 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless chip carrier with embedded antenna
US20040217472A1 (en) * 2001-02-16 2004-11-04 Integral Technologies, Inc. Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
US6599779B2 (en) * 2001-09-24 2003-07-29 St Assembly Test Service Ltd. PBGA substrate for anchoring heat sink
JP2003188620A (ja) * 2001-12-19 2003-07-04 Murata Mfg Co Ltd モジュール一体型アンテナ
EP1488613A4 (en) * 2002-03-01 2005-04-27 Ipr Licensing Inc INTELLIGENT INTERFACE FOR ADAPTIVE ANTENNA NETWORK
AU2003248649A1 (en) * 2002-06-10 2003-12-22 University Of Florida High gain integrated antenna and devices therefrom
US6731246B2 (en) * 2002-06-27 2004-05-04 Harris Corporation Efficient loop antenna of reduced diameter
WO2005004047A1 (ja) * 2003-07-03 2005-01-13 Renesas Technology Corp. マルチファンクションカードデバイス
TWI224846B (en) * 2003-08-12 2004-12-01 Siliconware Precision Industries Co Ltd Semiconductor package with heat dissipating structure
JP2005064581A (ja) * 2003-08-12 2005-03-10 Fujitsu Ten Ltd ダイバーシティ受信回路
US7286516B2 (en) * 2003-09-12 2007-10-23 Tekelec Methods and systems for wireless local area network (WLAN)-based signaling network monitoring
US7688766B2 (en) * 2003-09-17 2010-03-30 Intel Corporation Modulation scheme for orthogonal frequency division multiplexing systems or the like
US7075906B2 (en) * 2003-09-30 2006-07-11 Cisco Technology, Inc. Method and apparatus for cell identification in wireless data networks
US6891726B1 (en) * 2003-10-30 2005-05-10 Intel Corporation Heat sink and antenna
US20050119025A1 (en) * 2003-12-02 2005-06-02 Rishi Mohindra Serial digital interface for wireless network radios and baseband integrated circuits
US7444734B2 (en) * 2003-12-09 2008-11-04 International Business Machines Corporation Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
US7181187B2 (en) * 2004-01-15 2007-02-20 Broadcom Corporation RF transmitter having improved out of band attenuation
US7643848B2 (en) * 2004-04-13 2010-01-05 Qualcomm, Incorporated Multi-antenna transceiver system
US8797926B2 (en) * 2004-06-04 2014-08-05 Apple Inc. Networked media station
US7505450B2 (en) * 2005-03-23 2009-03-17 Cisco Technology, Inc. Configuration of failure and acquire timeouts to facilitate recovery from failures in hierarchical mesh networks

Also Published As

Publication number Publication date
EP1737067A1 (en) 2006-12-27
EP1737068A1 (en) 2006-12-27
EP1737069A1 (en) 2006-12-27
EP1737069B1 (en) 2017-01-11
SG128569A1 (en) 2007-01-30
EP1737068B1 (en) 2018-03-21
JP2007037101A (ja) 2007-02-08
JP2007006471A (ja) 2007-01-11
CN1885850A (zh) 2006-12-27
CN1885851A (zh) 2006-12-27
TW200701431A (en) 2007-01-01
US20060285480A1 (en) 2006-12-21
TWI438873B (zh) 2014-05-21
JP2007028591A (ja) 2007-02-01
JP2007037100A (ja) 2007-02-08
TWI495278B (zh) 2015-08-01
CN1885804B (zh) 2013-01-23
SG128566A1 (en) 2007-01-30
JP4704961B2 (ja) 2011-06-22
TWI446517B (zh) 2014-07-21
EP1737065B1 (en) 2017-11-01
JP4728172B2 (ja) 2011-07-20
CN1885847A (zh) 2006-12-27
JP4660428B2 (ja) 2011-03-30
TWI430592B (zh) 2014-03-11
CN1885850B (zh) 2013-08-28
EP1737067B1 (en) 2016-12-28
CN1885804A (zh) 2006-12-27
TW200701417A (en) 2007-01-01
SG128565A1 (en) 2007-01-30
EP1737065A1 (en) 2006-12-27
TW200707929A (en) 2007-02-16
JP4732959B2 (ja) 2011-07-27
TW200727601A (en) 2007-07-16

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