CN1835946B - 环氧化合物和固化环氧树脂产品 - Google Patents
环氧化合物和固化环氧树脂产品 Download PDFInfo
- Publication number
- CN1835946B CN1835946B CN2004800232751A CN200480023275A CN1835946B CN 1835946 B CN1835946 B CN 1835946B CN 2004800232751 A CN2004800232751 A CN 2004800232751A CN 200480023275 A CN200480023275 A CN 200480023275A CN 1835946 B CN1835946 B CN 1835946B
- Authority
- CN
- China
- Prior art keywords
- epoxy
- compound
- group
- reaction
- phenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Compounds (AREA)
- Epoxy Resins (AREA)
- Plural Heterocyclic Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP174545/2003 | 2003-06-19 | ||
JP2003174545 | 2003-06-19 | ||
PCT/JP2004/008934 WO2004113327A1 (en) | 2003-06-19 | 2004-06-18 | Epoxy compound and cured epoxy resin product |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1835946A CN1835946A (zh) | 2006-09-20 |
CN1835946B true CN1835946B (zh) | 2010-06-16 |
Family
ID=33534794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800232751A Expired - Fee Related CN1835946B (zh) | 2003-06-19 | 2004-06-18 | 环氧化合物和固化环氧树脂产品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7279574B2 (zh) |
EP (1) | EP1636209B1 (zh) |
KR (1) | KR101117063B1 (zh) |
CN (1) | CN1835946B (zh) |
DE (1) | DE602004028614D1 (zh) |
TW (1) | TWI337613B (zh) |
WO (1) | WO2004113327A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI354002B (en) | 2003-12-24 | 2011-12-11 | Sumitomo Chemical Co | Epoxy compounds and cured epoxy resin obtained by |
JP4285491B2 (ja) | 2006-02-28 | 2009-06-24 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、及び半導体封止材料 |
WO2007142262A1 (ja) * | 2006-06-07 | 2007-12-13 | Sumitomo Chemical Company, Limited | エポキシ樹脂組成物およびエポキシ樹脂硬化物 |
JP6221634B2 (ja) * | 2013-10-30 | 2017-11-01 | Tdk株式会社 | 樹脂組成物、樹脂シート、樹脂硬化物および基板 |
SG10202006580TA (en) | 2016-04-20 | 2020-08-28 | Jsr Corp | Polymer, composition, molded article, cured product, and laminate |
JPWO2019013299A1 (ja) * | 2017-07-14 | 2020-06-18 | 富士フイルム株式会社 | 熱伝導材料、熱伝導層付きデバイス、熱伝導材料形成用組成物、液晶性円盤状化合物 |
CN111108816A (zh) * | 2017-09-15 | 2020-05-05 | Jsr株式会社 | 电路基板 |
WO2019054334A1 (ja) | 2017-09-15 | 2019-03-21 | Jsr株式会社 | 高周波回路用積層体及びその製造方法、並びにbステージシート |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1125218A (zh) * | 1994-08-30 | 1996-06-26 | 住友化学工业株式会社 | 新的芳酯化合物及其制法,用该化合物的环氧树脂组合物及其覆铜层合体 |
CN1138058A (zh) * | 1995-06-02 | 1996-12-18 | 住友化学工业株式会社 | 环氧树脂及其制备方法 |
CN1145353A (zh) * | 1995-04-27 | 1997-03-19 | 住友化学工业株式会社 | 环氧树脂、树脂组合物、以及树脂封装的半导体器件 |
CN1236378A (zh) * | 1997-07-02 | 1999-11-24 | 住友电木株式会社 | 半导体密封用的环氧树脂组合物和半导体器件 |
GB2338240A (en) * | 1998-05-22 | 1999-12-15 | Merck Patent Gmbh | Polymerisable composition comprising epoxy compounds |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS636015A (ja) * | 1986-06-26 | 1988-01-12 | Shin Kobe Electric Mach Co Ltd | 積層板用難燃性樹脂組成物の製造法 |
LU88405A1 (de) * | 1993-09-08 | 1995-04-05 | Europ Communities | Anisotrope Polymere sowie ein Verfahren zu deren Herstellung |
EP0731084B1 (de) * | 1995-03-03 | 2002-09-25 | Rolic AG | Photovernetzbare Naphthylderivate |
US5811504A (en) * | 1995-08-03 | 1998-09-22 | Cornell Research Foundation, Inc. | Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins |
US5904984A (en) * | 1996-10-17 | 1999-05-18 | Siemens Westinghouse Power Corporation | Electrical insulation using liquid crystal thermoset epoxy resins |
-
2004
- 2004-06-18 EP EP20040746403 patent/EP1636209B1/en not_active Expired - Lifetime
- 2004-06-18 DE DE200460028614 patent/DE602004028614D1/de not_active Expired - Lifetime
- 2004-06-18 CN CN2004800232751A patent/CN1835946B/zh not_active Expired - Fee Related
- 2004-06-18 TW TW93117633A patent/TWI337613B/zh not_active IP Right Cessation
- 2004-06-18 US US10/560,891 patent/US7279574B2/en not_active Expired - Fee Related
- 2004-06-18 WO PCT/JP2004/008934 patent/WO2004113327A1/en active Search and Examination
- 2004-06-18 KR KR1020057024163A patent/KR101117063B1/ko not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1125218A (zh) * | 1994-08-30 | 1996-06-26 | 住友化学工业株式会社 | 新的芳酯化合物及其制法,用该化合物的环氧树脂组合物及其覆铜层合体 |
CN1145353A (zh) * | 1995-04-27 | 1997-03-19 | 住友化学工业株式会社 | 环氧树脂、树脂组合物、以及树脂封装的半导体器件 |
CN1138058A (zh) * | 1995-06-02 | 1996-12-18 | 住友化学工业株式会社 | 环氧树脂及其制备方法 |
CN1236378A (zh) * | 1997-07-02 | 1999-11-24 | 住友电木株式会社 | 半导体密封用的环氧树脂组合物和半导体器件 |
GB2338240A (en) * | 1998-05-22 | 1999-12-15 | Merck Patent Gmbh | Polymerisable composition comprising epoxy compounds |
Also Published As
Publication number | Publication date |
---|---|
CN1835946A (zh) | 2006-09-20 |
KR101117063B1 (ko) | 2012-04-16 |
TW200504139A (en) | 2005-02-01 |
DE602004028614D1 (de) | 2010-09-23 |
US7279574B2 (en) | 2007-10-09 |
KR20060020683A (ko) | 2006-03-06 |
TWI337613B (en) | 2011-02-21 |
EP1636209A1 (en) | 2006-03-22 |
WO2004113327A1 (en) | 2004-12-29 |
EP1636209B1 (en) | 2010-08-11 |
US20060159929A1 (en) | 2006-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI,LTD. Free format text: FORMER OWNER: SUMITOMO CHEMICAL CO., LTD. Effective date: 20130619 Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130619 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130619 Address after: Tokyo, Japan, Japan Patentee after: Hitachi Ltd. Address before: Tokyo, Japan, Japan Patentee before: Sumitomo Chemical Co., Ltd. Patentee before: Hitachi Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20160618 |