DE602004028614D1 - Epoxidverbindung und gehärtetes epoxyharzprodukt - Google Patents

Epoxidverbindung und gehärtetes epoxyharzprodukt

Info

Publication number
DE602004028614D1
DE602004028614D1 DE200460028614 DE602004028614T DE602004028614D1 DE 602004028614 D1 DE602004028614 D1 DE 602004028614D1 DE 200460028614 DE200460028614 DE 200460028614 DE 602004028614 T DE602004028614 T DE 602004028614T DE 602004028614 D1 DE602004028614 D1 DE 602004028614D1
Authority
DE
Germany
Prior art keywords
resin product
epoxy resin
cured
epoxy
epoxy compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200460028614
Other languages
English (en)
Inventor
Shinya Tanaka
Yoshitaka Takezawa
Hiroyuki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Sumitomo Chemical Co Ltd
Original Assignee
Hitachi Ltd
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Sumitomo Chemical Co Ltd filed Critical Hitachi Ltd
Publication of DE602004028614D1 publication Critical patent/DE602004028614D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
DE200460028614 2003-06-19 2004-06-18 Epoxidverbindung und gehärtetes epoxyharzprodukt Active DE602004028614D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003174545 2003-06-19
PCT/JP2004/008934 WO2004113327A1 (en) 2003-06-19 2004-06-18 Epoxy compound and cured epoxy resin product

Publications (1)

Publication Number Publication Date
DE602004028614D1 true DE602004028614D1 (de) 2010-09-23

Family

ID=33534794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460028614 Active DE602004028614D1 (de) 2003-06-19 2004-06-18 Epoxidverbindung und gehärtetes epoxyharzprodukt

Country Status (7)

Country Link
US (1) US7279574B2 (de)
EP (1) EP1636209B1 (de)
KR (1) KR101117063B1 (de)
CN (1) CN1835946B (de)
DE (1) DE602004028614D1 (de)
TW (1) TWI337613B (de)
WO (1) WO2004113327A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI354002B (en) 2003-12-24 2011-12-11 Sumitomo Chemical Co Epoxy compounds and cured epoxy resin obtained by
JP4285491B2 (ja) 2006-02-28 2009-06-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、及び半導体封止材料
US20090105388A1 (en) * 2006-06-07 2009-04-23 Sumitomo Chemical Company, Limited Epoxy Resin Composition and Cured Epoxy Resin
JP6221634B2 (ja) * 2013-10-30 2017-11-01 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および基板
SG11201809285YA (en) 2016-04-20 2018-11-29 Jsr Corp Polymer, composition, molded article, cured product, and laminate
WO2019013299A1 (ja) * 2017-07-14 2019-01-17 富士フイルム株式会社 熱伝導材料、熱伝導層付きデバイス、熱伝導材料形成用組成物、液晶性円盤状化合物
CN111093975B (zh) 2017-09-15 2022-03-01 Jsr株式会社 高频电路用层叠体及其制造方法、其用途、以及b阶片
US11582860B2 (en) * 2017-09-15 2023-02-14 Jsr Corporation Circuit board

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS636015A (ja) * 1986-06-26 1988-01-12 Shin Kobe Electric Mach Co Ltd 積層板用難燃性樹脂組成物の製造法
LU88405A1 (de) 1993-09-08 1995-04-05 Europ Communities Anisotrope Polymere sowie ein Verfahren zu deren Herstellung
US5726257A (en) * 1994-08-30 1998-03-10 Sumitomo Chemical Company, Ltd. Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
DE59609705D1 (de) * 1995-03-03 2002-10-31 Rolic Ag Zug Photovernetzbare Naphthylderivate
DE69603531T2 (de) * 1995-04-27 1999-12-16 Sumitomo Chemical Co Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung
JPH08325354A (ja) * 1995-06-02 1996-12-10 Sumitomo Chem Co Ltd エポキシ樹脂およびその製造方法
US5811504A (en) * 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
US6190787B1 (en) * 1997-07-02 2001-02-20 Sumitomo Bakelite Company, Ltd. Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices
GB2338240B (en) * 1998-05-22 2002-08-14 Merck Patent Gmbh Polymerizable composition comprising epoxy compounds

Also Published As

Publication number Publication date
WO2004113327A1 (en) 2004-12-29
TW200504139A (en) 2005-02-01
KR101117063B1 (ko) 2012-04-16
CN1835946B (zh) 2010-06-16
TWI337613B (en) 2011-02-21
CN1835946A (zh) 2006-09-20
KR20060020683A (ko) 2006-03-06
EP1636209A1 (de) 2006-03-22
US20060159929A1 (en) 2006-07-20
EP1636209B1 (de) 2010-08-11
US7279574B2 (en) 2007-10-09

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