DE602004010717D1 - Härtbare harzzusammensetzung - Google Patents

Härtbare harzzusammensetzung

Info

Publication number
DE602004010717D1
DE602004010717D1 DE602004010717T DE602004010717T DE602004010717D1 DE 602004010717 D1 DE602004010717 D1 DE 602004010717D1 DE 602004010717 T DE602004010717 T DE 602004010717T DE 602004010717 T DE602004010717 T DE 602004010717T DE 602004010717 D1 DE602004010717 D1 DE 602004010717D1
Authority
DE
Germany
Prior art keywords
resin composition
hardenable resin
hardenable
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004010717T
Other languages
English (en)
Other versions
DE602004010717T2 (de
Inventor
Kazuhiro Oshima
Yoichi Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of DE602004010717D1 publication Critical patent/DE602004010717D1/de
Application granted granted Critical
Publication of DE602004010717T2 publication Critical patent/DE602004010717T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE602004010717T 2003-12-22 2004-12-21 Härtbare harzzusammensetzung Active DE602004010717T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003424175 2003-12-22
JP2003424175 2003-12-22
PCT/JP2004/019118 WO2005061615A1 (ja) 2003-12-22 2004-12-21 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
DE602004010717D1 true DE602004010717D1 (de) 2008-01-24
DE602004010717T2 DE602004010717T2 (de) 2008-04-30

Family

ID=34708777

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004010717T Active DE602004010717T2 (de) 2003-12-22 2004-12-21 Härtbare harzzusammensetzung

Country Status (7)

Country Link
US (1) US7612127B2 (de)
EP (1) EP1698664B1 (de)
JP (1) JP5077907B2 (de)
KR (1) KR100995256B1 (de)
CN (1) CN100412128C (de)
DE (1) DE602004010717T2 (de)
WO (1) WO2005061615A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889190B2 (ja) * 2003-04-16 2012-03-07 スリーエム イノベイティブ プロパティズ カンパニー アクリル系熱伝導性組成物及び熱伝導性シート
WO2007004620A1 (ja) * 2005-07-04 2007-01-11 Denki Kagaku Kogyo Kabushiki Kaisha 硬化性組成物及びそれを用いる部材の仮固定方法
US7820750B2 (en) 2006-03-17 2010-10-26 Denki Kagaku Kogyo Kabushiki Kaisha Silica powder and use thereof
JP5014658B2 (ja) * 2006-03-29 2012-08-29 シチズンホールディングス株式会社 遮光性接着組成物
TWI412506B (zh) 2006-05-12 2013-10-21 Denki Kagaku Kogyo Kk 陶瓷粉末及其用途
DE102006041121A1 (de) * 2006-09-01 2008-03-13 Hobum Oleochemicals Gmbh Verfahren zur Herstellung von kaltgehärteten Biopolymeren
JP2008297399A (ja) * 2007-05-30 2008-12-11 Polymatech Co Ltd 熱伝導性接着剤組成物及び接着方法
WO2009041248A1 (ja) * 2007-09-26 2009-04-02 Denki Kagaku Kogyo Kabushiki Kaisha 接着剤組成物及び接合方法
JP5319957B2 (ja) * 2008-05-14 2013-10-16 電気化学工業株式会社 樹脂組成物
KR101729795B1 (ko) * 2009-05-13 2017-04-24 제이에스알 가부시끼가이샤 전선 지수재용 키트, 전선 지수재, 지수 부재, 지수 처리된 전선 및 지수 처리 방법
US9067398B2 (en) 2010-09-01 2015-06-30 Denki Kagaku Kogyo Kabushiki Kaisha Method for disassembling bonded body, and adhesive
JP2012051856A (ja) * 2010-09-03 2012-03-15 Gc Corp 重合性組成物
CN102504707B (zh) * 2011-11-01 2014-03-26 特艾弗新材料科技（上海）有限公司 一种快速固化导热胶及其制备方法
KR101282125B1 (ko) * 2012-01-18 2013-07-04 주식회사 지앤씨에스 백라이트 어셈블리 및 그를 포함하는 표시 장치
WO2014083874A1 (ja) * 2012-11-30 2014-06-05 リンテック株式会社 保護膜形成用組成物、保護膜形成用シート、及び硬化保護膜付きチップ
CN102977802A (zh) * 2012-12-29 2013-03-20 湘潭电机股份有限公司 一种不腐蚀铜的丙烯酸酯结构胶粘剂
KR101687394B1 (ko) * 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
CN104380196B (zh) * 2013-06-17 2018-09-25 株式会社Lg化学 光固化和热固性树脂组合物、由其制备的阻焊干膜及包含所述阻焊干膜的电路板
EP2957604A1 (de) * 2014-06-18 2015-12-23 HILTI Aktiengesellschaft Brandschutz-Zusammensetzung und deren Verwendung
WO2016094161A1 (en) * 2014-12-09 2016-06-16 Arkema Inc. Compositions and methods for crosslinking polymers in the presence of atmospheric oxygen
WO2017002890A1 (ja) * 2015-07-02 2017-01-05 株式会社カネカ 熱伝導性樹脂組成物
CN108350105B (zh) * 2015-11-26 2020-10-13 三键有限公司 热固化性组合物及使用其的导电性粘接剂
EP3736300A1 (de) 2019-05-06 2020-11-11 3M Innovative Properties Company Härtbarer vorläufer einer thermisch leitfähigen klebstoffzusammensetzung
WO2021039749A1 (ja) * 2019-08-30 2021-03-04 株式会社日本触媒 放熱材用二液型樹脂組成物
WO2022241748A1 (en) 2021-05-21 2022-11-24 3M Innovative Properties Company Curable precursor of an adhesive composition

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428178A (en) 1977-08-04 1979-03-02 Seiko Epson Corp Electronic watch
US4560712A (en) * 1984-12-27 1985-12-24 Mobil Oil Company Polypropylene compositions containing bimodal calcium carbonate and a polysiloxane
JP2811784B2 (ja) * 1988-09-09 1998-10-15 三菱化学株式会社 樹脂組成物
US5370921A (en) * 1991-07-11 1994-12-06 The Dexter Corporation Lightning strike composite and process
JP2931850B2 (ja) 1992-12-09 1999-08-09 ヘキスト・ダイヤフォイル・ゲーエムベーハー コンデンサ誘電体用途又は熱伝導リボン用途のための二軸配向コポリエステルフィルム
JP3154208B2 (ja) * 1995-10-24 2001-04-09 信越化学工業株式会社 シリコーンゴム組成物
DE19921876A1 (de) 1998-12-24 2000-06-29 Ispo Gmbh Form- oder Beschichtungsmaterial und dessen Verwendung
JP3474839B2 (ja) 1999-09-01 2003-12-08 北川工業株式会社 熱伝導シート及びその製造方法
US6916863B2 (en) * 2000-11-14 2005-07-12 Boral Material Technologies, Inc. Filler comprising fly ash for use in polymer composites
JP4832658B2 (ja) * 2001-04-11 2011-12-07 電気化学工業株式会社 粘着性の柔軟なアクリル系樹脂
JP2003342021A (ja) 2002-05-28 2003-12-03 Polymatech Co Ltd 酸化アルミニウム粉末組成物及びそれを含有する熱伝導性成形体

Also Published As

Publication number Publication date
CN1882655A (zh) 2006-12-20
DE602004010717T2 (de) 2008-04-30
JP5077907B2 (ja) 2012-11-21
CN100412128C (zh) 2008-08-20
US7612127B2 (en) 2009-11-03
KR100995256B1 (ko) 2010-11-19
EP1698664B1 (de) 2007-12-12
EP1698664A1 (de) 2006-09-06
WO2005061615A1 (ja) 2005-07-07
US20070142528A1 (en) 2007-06-21
EP1698664A4 (de) 2007-04-25
KR20060123230A (ko) 2006-12-01
JPWO2005061615A1 (ja) 2007-12-13

Similar Documents

Publication Publication Date Title
DE60336980D1 (de) Harzzusammensetzung
DE602004010717D1 (de) Härtbare harzzusammensetzung
DE60222293D1 (de) Härtbare harzzusammensetzung
DE602004008136D1 (de) Härtbare Zusammensetzung
DE602004007143D1 (de) Härtbare perfluorelastomerzusammensetzungen
DE60334165D1 (de) Härtbare Zusammensetzung
FR2862654B1 (fr) Composition amylacee filmogene
DE60209252D1 (de) Stabilisierte polymerzusammensetzung
DE60317282D1 (de) Polyesterharzzusammensetzung
DE602005026303D1 (de) Harzzusammensetzung
DE10393374D2 (de) Zusammensetzung
EP1630186A4 (de) Härtende zusammensetzung
DE60335716D1 (de) Beschleuniger-zusammensetzung
EP1621562A4 (de) Härtende harzzusammensetzung
SE0500163L (sv) Sammansättning
DE60321307D1 (de) Wässrige harzzusammensetzung
DE602005002680D1 (de) Härtbare Organopolysiloxanzusammensetzung
DE602004014280D1 (de) Flammgeschützte thermoplastische harzzusammensetzung
DK1561472T3 (da) Faststofsammensætning
FR2863890B1 (fr) Composition immunostimulante
DE602004019930D1 (de) Flammgeschützte thermoplastische harzzusammensetzung
DE602004018936D1 (de) Härtbare zusammensetzung
EP1672028A4 (de) Harzzusammensetzung
DE602004008597D1 (de) Härtbare dichtungsmasse
EP1640391A4 (de) Härtende zusammensetzung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition