CN1832212B - Led组件及构造led组件的方法 - Google Patents

Led组件及构造led组件的方法 Download PDF

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CN1832212B
CN1832212B CN2005101150717A CN200510115071A CN1832212B CN 1832212 B CN1832212 B CN 1832212B CN 2005101150717 A CN2005101150717 A CN 2005101150717A CN 200510115071 A CN200510115071 A CN 200510115071A CN 1832212 B CN1832212 B CN 1832212B
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assembly
pcb substrate
cooling pad
heat conduction
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CN1832212A (zh
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莫瑟林
谭思可
恩释文
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Annwa hi tech GeneralIP (Singapore) Pte. Ltd.
Intellectual Discovery Co Ltd
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Avago Technologies ECBU IP Singapore Pte Ltd
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Abstract

本发明公开了LED组件及构造LED组件的方法，其通过使用安装到LCD面板支撑结构的现有PCB封装从而排除了对金属核PCB的需求。在一个实施例中，一种LED组件包括：PCB衬底；散热垫，形成于所述PCB衬底的底部；连接到所述散热垫的导热接合材料；LED，所述LED通过所述导热接合材料安装到所述散热垫；在所述PCB衬底的顶表面上的导线接合垫，所述导线接合垫电连接到所述LED；带有开口的结构，所述结构位于所述PCB衬底之上，并具有用于与所述导线接合垫的至少一部分进行电接触的电触头，所述开口允许来自所述LED的光对观察者可见。

Description

LED组件及构造LED组件的方法
技术领域
本发明涉及用于提高LED显示器的热耗散的系统和方法。
背景技术
对于具有高功率(增强亮度)的LED的需求在增长。随着功率提高，对热耗散的需求也在增加，因为如果不有效地耗散由LED结产生的热，将减小LED的亮度。
目前，以安装到铝金属核PCB的表面安装LED封装的形式生产LED。金属核PCB用作将热从LED散走的直接散热器。由于用于金属核PCB的材料成本较高，所以使用金属核PCB相对昂贵。
发明内容
本发明公开了一种用于提高LED显示器的热耗散的系统和方法，其通过使用安装到LCD面板支撑结构的现有PCB封装从而排除了对金属核PCB的需求。在一个实施例中，使用具有热耗散垫的反向安装LED来优化到金属层的热传输，该金属层放置为与LCD支撑结构相接触。
本发明提供了一种LED组件，包括：PCB衬底；散热垫，形成于所述PCB衬底的底部；连接到所述散热垫的导热接合材料；LED，所述LED通过所述导热接合材料安装到所述散热垫；在所述PCB衬底的顶表面上的导线接合垫，所述导线接合垫电连接到所述LED带有开口的结构，所述结构位于所述PCB衬底之上，并具有用于与所述导线接合垫的至少一部分进行电接触的电触头，所述开口允许来自所述LED的光对观察者可见。
本发明还提供了一种构造LED组件的方法，所述方法包括：在PCB衬底中构造用于在其中安装LED的反射区域；将所述PCB衬底配合到散热垫，所述LED通过导热接合材料安装到所述散热垫；在所述PCB衬底的顶表面上构造导线接合垫，所述导线接合垫电连接到所述LED；提供带有开口的结构，所述结构位于所述PCB衬底之上，并具有用于与所述导线接合垫的至少一部分进行电接触的电触头，所述开口允许来自所述LED的光对观察者可见。
附图说明
为更全面地理解本发明，结合附图对以下说明进行参考，附图中：
图1示出了单个LED和顶罩封装的一个实施例的立体图；
图2示出了移除LED的图1的LED封装的一个实施例；
图3A和图3B示出了沿着图2的截面线3A-3A所取的图1的单个LED封装的侧视图的实施例；
图4和图5分别示出了多个LED封装的俯视图和侧视图；
图6和图7示出了使用根据本公开的教导构造的LED条的显示器；
图8示出了使用光源的器件的一个可选实施例；
图9A示出了在器件的顶部和底部处具有其电连接的竖直结构光源的视图；和
图9B示出了在器件的顶部处具有其两个电连接的水平结构光源的视图。
具体实施方式
图1示出了包括配合到散热垫25的PCB衬底22的单个LED封装10的一个实施例的立体图。通过模制或其他方法在表面11之上构造光学顶罩12，表面11接着配合到衬底22。接触条23和24构造在衬底22的表面上并被如下将更详细讨论地使用。
图2示出了移除LED和光学顶罩12的封装10。LED芯片(或其他发光源)将通过端导接合剂或通过其他紧固装置在反射杯21内物理地附装到散热垫25。LED将接着分别被导线接合连接到接触条23和24的垫23-1和24-1，其用于随后连接到外部电路。源自LED的热路径通过可以是例如铜的散热垫25。注意，源自LED的热路径是垫25并与电路分离以优化从管芯到支持结构的热耗散。使用导热(但不导电)粘接电介质将LED安装到垫25。因为垫具有更广的表面面积，所以热耗散优于现有技术中的金属核PCB。
反射杯21构造为具有用于将LED侧光反射到封装顶部的优化角。使用例如浅色不透明材料形成反射杯。一旦LED与垫25配合，围绕LED浇注透明材料以密封LED和接合导线来形成完整的LED封装10。
光学顶罩12(图1)构造为将来自LED源的光导向在所期望的方向上。简单地通过重新设计顶罩形状可以如所期望地对于应用改变LED的光输出。
图3A示出了沿着图2的截面线3A-3A所取的LED封装10的截面剖视侧视图，其具有诸如LED 31之类的通过接合材料302物理地接合到热耗散垫25的光源。接合导线32将LED 31的一个端子连接到接触条24的接触垫24-1(图1)。LED 31的第二电端子通过路径33连接到接触垫23-1。可以使用任何电接触系统将LED 31连接到顶罩12外部的各个触头。在所示的该实施例中，有两个这样的引线，但如果需要可以有三个或更多。
图3B以剖视图示出了外部电能如何经由触头52和53连接到接触区域23-2和24-2。图2中示出了接触区域23-1、23-2、24-1、和24-2的位置。注意，这些触头可以是沿着接触条23、24的任何位置，只要其不干扰到LED的导线结合。图4示出了具有多个LED封装10-1至10-N的显示器40，其LED封装每个分别具有LED 12-1至12-N。围绕每个LED封装的是开口，例如在结构42中形成的开口42-1至42-N来允许来自各个LED的光传递通过。
图5是沿着图4的线5-5所取的显示器40的横截面，其示出了安装到安装板61的三个LED 12-1、12-2、12-3。(将参考图6更完全地描述安装板61。)图5所示的是形成在结构41的表面之下用于将控制和电能提供给各个LED的目的的触头52和53。这因而允许接触表面为了更好的电和热分离而在LED器件的顶侧上并远离热垫25。
图6示出了具有安装到热耗散棒63的多个LED条40的系统60，其热耗散棒63又接着连接到支持安装板61。如果需要，可以添加封盖62。封盖62可以具有透明的区域用于允许从外部看见LED光。
图7示出了沿着图6的截面线7-7所取的结构60的横截面。在图7中示出用于使光漫射或者以其他方式控制光的光漫射器和其他元件72、73。如果需要，这种控制可以是在个别的基础上。
图8示出了使用光源92的器件的一个可选实施例80，光源92在光源顶部上具有两条接合导线。由于如图9B所示的光源92的水平结构，这是可能的。在此实施例中粘接剂(或其他接合剂)802可以是兼有导热性和导电性两者。这因而允许使用焊接剂作为接合剂，其在一些情况下可以比仅有导热性更有效。
图9A示出了在器件的顶部和底部处具有其电连接的竖直结构光源91的视图。
图9B示出了在器件的顶部处具有其两个电连接的水平结构光源92的视图。注意，虽然所示只有两个电连接，但如果需要，可以使用任何数量，且此处讨论的概念可以用来自器件侧部的导体来起作用。
虽然已经详细讨论了本发明及其优点，应该理解的是此处可以进行各种变化、置换和改造而不偏离由所附权利要求界定的本发明的精神和范围。此外，本应用的范围不意味着限制于说明书中描述的处理、机器、制造、物质成分、手段、方法和步骤的特定实施例。正如本领域的普通技术人员将容易地从本发明的公开了解到，根据本发明可以利用现存的或将开发的与此处描述的对应实施例执行基本相同功能或实现基本相同结果的处理、机器、制造、物质成分、手段、方法或步骤。因此，所附权利要求意图将这些处理、机器、制造、物质成分、手段、方法或步骤包括在其范围内。

Claims (16)

1.一种LED组件，包括：
PCB衬底；
散热垫，形成于所述PCB衬底的底部；
连接到所述散热垫的导热接合材料；
LED，所述LED通过所述导热接合材料安装到所述散热垫；
在所述PCB衬底的顶表面上的导线接合垫，所述导线接合垫电连接到所述LED；和
带有开口的结构，所述结构位于所述PCB衬底之上，并具有用于与所述导线接合垫的至少一部分进行电接触的电触头，所述开口允许来自所述LED的光对观察者可见。
2.如权利要求1所述的组件，还包括：
构造在所述PCB衬底内的反射杯，所述LED定位在所述反射杯内。
3.如权利要求2所述的组件，其中所述LED的通过所述导热接合材料而与所述散热垫接触的部分是设计为用于耗散来自所述LED的热的部分。
4.如权利要求2所述的组件，还包括：
覆盖所述LED和所述反射杯的光学顶罩。
5.如权利要求4所述的组件，其中所述光学顶罩是定位以覆盖所述顶表面的衬底的一部分。
6.如权利要求1所述的组件，还包括：
连接到所述散热垫的热耗散棒。
7.如权利要求6所述的组件，其中，所述PCB衬底包含全部通过所述导热接合材料而与所述散热垫接触的多个所述LED，且其中所述散热垫与所述热耗散棒接触。
8.如权利要求7所述的组件，其中所述带有开口的结构包括多个开口，用于允许来自所述多个LED的光对观察者可见。
9.如权利要求1所述的组件，其中所述散热垫是金属层。
10.如权利要求6所述的组件，其中所述热耗散棒是金属结构。
11.如权利要求6所述的组件，其中所述热耗散棒连接到LCD面板的安装板。
12.如权利要求1所述的组件，其中，所述导热接合材料具有导电性。
13.如权利要求1所述的组件，其中，所述导热接合材料是焊接剂。
14.一种构造LED组件的方法，所述方法包括：
在PCB衬底中构造用于在其中安装LED的反射区域；
将所述PCB衬底配合到散热垫，所述LED通过导热接合材料安装到所述散热垫；
在所述PCB衬底的顶表面上构造导线接合垫，所述导线接合垫电连接到所述LED；和
提供带有开口的结构，所述结构位于所述PCB衬底之上，并具有用于与所述导线接合垫的至少一部分进行电接触的电触头，所述开口允许来自所述LED的光对观察者可见。
15.如权利要求14所述的方法，还包括：
在所述反射区域之上定位光顶罩以散射来自安装的LED的光。
16.如权利要求15所述的方法，还包括：
构造所述PCB衬底的多个所述反射区域。
CN2005101150717A 2005-03-08 2005-11-25 Led组件及构造led组件的方法 Expired - Fee Related CN1832212B (zh)

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