CN201228949Y - 一种led灯散热灯体 - Google Patents

一种led灯散热灯体 Download PDF

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CN201228949Y
CN201228949Y CNU2007201216812U CN200720121681U CN201228949Y CN 201228949 Y CN201228949 Y CN 201228949Y CN U2007201216812 U CNU2007201216812 U CN U2007201216812U CN 200720121681 U CN200720121681 U CN 200720121681U CN 201228949 Y CN201228949 Y CN 201228949Y
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lamp body
heat radiation
radiation lamp
led
radiating
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胡凯
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED灯散热灯体，它主要解决现有铸造技术散热灯体的导热率及散热面积小等技术问题。本实用新型解决问题采取的技术方案是，将散热灯体基体上均部设置的散热翅片是由铝合金材料一次挤压成型，横截面为圆形太阳花或涡轮形状。横截面中心为空心，可在散热灯体基体空心内横向过盈塞入铝板或有电路铝基板作为空心端面封口，使封口铝板材料与散热灯体紧密结合形成整体的LED散热灯体，达到LED元件的热量被LED散热灯体快速吸收和散热目的。散热灯体的外观侧视形状根据实际需要，可加工成杯形、梯形、圆柱形等。本实用新型的有益效果是：散热面积大，吸收热量快、散热量高，制造成本低，外型美观等优点。

Description

一种LED灯散热灯体
所属技术领域
本实用新型涉及一种LED灯散热灯体制造技术，通过散热灯体基体散热的灯体结构、材质和制造工艺。
背景技术
随着环保节能LED灯的使用范围越广，亮度要求越高，体积越小，集成化程度不断提高，随之而来产生的热量也越来越大。如何将LED灯产生源源不断的热量快速导散开，使LED灯能在要求内的温度内正常工作，产品散热问题已经成为制约其性能体现和发展的重要障碍。现有技术使用的铸铝散热灯体已无法满足使用的要求，如铸造散热灯体的传输速度和散热面积不够。要满足散热量需增加散热灯体的体积，而散热灯体的体积又受到使用空间的限制。
实用新型内容
为克服现有技术中使用的铸造散热灯体散热量等不足的技术问题，本实用新型对散热灯体的结构、材质和制造工艺进行改进。
本实用新型解决其问题采用的技术方案是：按照半导体LED元件需要使用功耗，使用空间体积和工作环境要求，计算得出散热灯体的体积和散热翅片面积。综合上述数据计算得出铝挤压散热灯体的整体形状，通过一次铝挤端面成型的散热灯体结构，包括：散热灯体基体、散热灯体基体上均部设置的散热翅片、导线孔等，二次加工达到使用体积和外观要求。
本实用新型的有益效果是：散热面积大，散热灯体体积小，散热量高，制造成本低，外形美观，使用寿命长，本实用新型实施例经实验证明，在4W或7W以上LED灯上使用本实用新型的散热灯体，比使用同体积传统铸铝散热灯体LED灯核心温度可降低14度以上，LED灯工作效率可提高30％，寿命可提高40％。
附图说明
附图1为本实用新型散热灯体基体实施例1侧视结构结构示意图。
附图2为本实用新型散热灯体基体实施例2侧视结构结构示意图。
附图3为本实用新型散热灯体基体实施例1横截面结构结构示意图。
附图4为本实用新型散热灯体基体实施例2横截面结构结构示意图。
附图中，1、散热灯体基体，2、散热翅片，3、电路铝基板，4、灯罩连接卡槽，5、电源连接卡槽，6、导线孔，7、圆芯，8、LED灯电源，9、发光LED元件，10、LED灯聚光罩。
具体实施方式
参看附图1，LED灯一次端面成型散热灯体，包括：散热灯体基体1、散热灯体基体1上均部设置的散热翅片2、用于固定聚光保护罩的卡槽4和散热灯体基体1内设置的圆芯7，电源连接卡槽5和导线孔6。
散热灯体基体1和散热灯体基体1上均部设置的散热翅片2是由铝合金材料一次挤压成型，本实用新型采用上述结构及材料和制造工艺，提高了散热灯体的制造精度和散热灯体基体1的散热效果。以散热灯体基体1的中心呈扇形或涡轮形设置，散热灯体基体1二次加工后达到使用体积和外观要求，其侧视外观形状可根据需要加工成多种形状，如：杯形、圆柱形、梯形等。
散热灯体基体1圆芯7内横向过盈塞入底端封口电路铝基板3作为空心端面封口，使圆芯7形成盲孔，封口铝板或有电路铝基板3轴向面与散热灯体基体1圆芯7紧密结合形成整体的LED灯散热灯体。电路铝基板3接触LED元件9，达到LED元件9的热量被整体的LED灯散热灯体快速吸收和散热目的。
在散热灯体基体1上有固定聚光保护罩的卡槽4，用于连接固定LED灯聚光罩10。在散热灯体基体1顶端上有固定电源8的卡槽5，在散热灯体基体1内有导线孔6，用于LED元件9连接线通过和电源8接触。散热灯体基体1、LED电源8和LED灯聚光罩10，通过卡槽5、4紧固连接形成整体产品LED照明灯。
本实用新型LED灯散热灯体使用时，散热灯体基体1底端封口电路铝基板3面与LED元件9热源接触，热量迅速由散热灯体基体1内电路铝基板3吸收热量并传递给散热灯体基体1上散热翅片2的散热传导过程。
所述的散热灯体基体1底端电路铝基板3面与顶端之间有一导线孔6，用于LED元件9连接线通过和电源8接触。
本实用新型实施实例根据实际使用需要，散热灯体基体1上均部设置的散热翅片2，围绕散热灯体基体1的散热翅片2呈扇形设置或以散热灯体基体1的中心呈涡轮形设置。
本实用新型为便于散热灯体基体1的加工制造，散热灯体基体1中心圆芯7为空心，圆芯7可根据需要选择塞入底端封口铝板或电路铝基板3，电路铝基板3与LED元件9接触，将LED元件9连接线穿过导线孔6与LED电源8接触连接，电源8与散热灯体基体1通过散热灯体基体1上的卡槽5相固定连接。最后再将LED灯聚光罩10紧卡在散热灯体基体1的卡槽4内，达到整体紧固成型的产品效果。

Claims (4)

1、LED灯散热灯体，包括：散热灯体基体、散热灯体基体上均部设置的散热翅片和散热灯体基体空心设置材料，其特征在于：
A.所述的散热灯体基体(1)和散热灯体基体(1)上均部设置的散热翅片(2)是由铝合金材料一次挤压整体成型，横截面为圆形太阳花或涡轮形状，散热灯体的基体(1)圆芯(7)为空心；
B.所述的散热灯体基体(1)圆芯(7)空心处可横向过盈塞入铝板或有电路铝基板(3)作为空心端面封口，使圆芯(7)形成盲孔，封口铝板或有电路铝基板(3)轴向面与散热灯体基体(1)圆芯(7)紧密结合形成整体的LED灯散热灯体。
2.根据权利要求1所述的LED灯散热灯体，其特征在于：散热灯体基体(1)紧密结合的电路铝基板(3)接触LED元件(9)热源部分，使LED元件(9)的热量被整体的LED灯散热灯体吸收。
3.根据权利要求1或2所述的LED灯散热灯体，其特征在于：所述的散热灯体基体(1)上均部设置的散热翅片(2)，以散热灯体基体(1)的中心呈扇形或涡轮形设置，其侧视外观形状可以是：杯形、圆柱形、梯形。
4.根据权利要求2所述的LED灯散热灯体，其特征在于：所述的散热灯体基体(1)底端封口电路铝基板(3)与顶端电源之间有一导线孔(6)，用于LED元件(9)连接线通过与电源(8)接触，散热灯体基体(1)、LED电源(8)和LED灯聚光罩(10)，通过卡槽(5)、(4)紧固连接形成整体产品LED照明灯体。
CNU2007201216812U 2007-07-15 2007-07-18 一种led灯散热灯体 Expired - Fee Related CN201228949Y (zh)

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US11/872,818 US20090016063A1 (en) 2007-07-15 2007-10-16 Built-in Heat Diffusion Lamp Body for LED Lamp

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