CN1795223A - 用于环氧树脂的聚膦酸酯阻燃固化剂 - Google Patents

用于环氧树脂的聚膦酸酯阻燃固化剂 Download PDF

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Publication number
CN1795223A
CN1795223A CNA2004800140798A CN200480014079A CN1795223A CN 1795223 A CN1795223 A CN 1795223A CN A2004800140798 A CNA2004800140798 A CN A2004800140798A CN 200480014079 A CN200480014079 A CN 200480014079A CN 1795223 A CN1795223 A CN 1795223A
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CN
China
Prior art keywords
epoxy resin
epoxy
polyphosphonate
composition
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800140798A
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English (en)
Chinese (zh)
Inventor
塞格尔·列夫奇克
安德鲁·M·彼得罗夫斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ICL IP America Inc
Original Assignee
Supresta LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Supresta LLC filed Critical Supresta LLC
Publication of CN1795223A publication Critical patent/CN1795223A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNA2004800140798A 2003-05-22 2004-05-19 用于环氧树脂的聚膦酸酯阻燃固化剂 Pending CN1795223A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47265403P 2003-05-22 2003-05-22
US60/472,654 2003-05-22

Publications (1)

Publication Number Publication Date
CN1795223A true CN1795223A (zh) 2006-06-28

Family

ID=33539043

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800140798A Pending CN1795223A (zh) 2003-05-22 2004-05-19 用于环氧树脂的聚膦酸酯阻燃固化剂

Country Status (6)

Country Link
EP (1) EP1625171A1 (enExample)
JP (1) JP2007502904A (enExample)
KR (1) KR20060019547A (enExample)
CN (1) CN1795223A (enExample)
CA (1) CA2525856A1 (enExample)
WO (1) WO2004113411A1 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102203176A (zh) * 2008-10-29 2011-09-28 Icl-Ip美国公司 含磷阻燃环氧树脂组合物、其预浸料和层压板
CN104024338A (zh) * 2011-06-03 2014-09-03 Frx聚合物股份有限公司 阻燃性树脂组合物、使用所述树脂组合物的挠性印刷线路板用金属箔基层压板、覆盖层、挠性印刷线路板用粘合片、以及挠性印刷线路板
TWI475052B (zh) * 2011-12-22 2015-03-01 Frx Polymers Inc 寡聚膦酸酯及包含該寡聚膦酸酯之組成物
CN105330824A (zh) * 2015-12-09 2016-02-17 西安元创化工科技股份有限公司 一种用于环氧树脂的阻燃固化剂及其制备方法
WO2016107066A1 (zh) * 2014-12-29 2016-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板
WO2016107067A1 (zh) * 2014-12-29 2016-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
CN107722240A (zh) * 2016-08-10 2018-02-23 台燿科技股份有限公司 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板
CN107778456A (zh) * 2017-11-22 2018-03-09 吉林省高性能复合材料制造业创新中心有限公司 中低温固化环氧树脂及其制备方法与在大丝束碳纤维环氧复合传动轴中的应用
CN107903383A (zh) * 2017-11-22 2018-04-13 吉林省高性能复合材料制造业创新中心有限公司 中低温固化环氧树脂及其制备方法与在大小丝束碳纤维环氧复合传动轴中的应用
CN108794978A (zh) * 2017-04-27 2018-11-13 台燿科技股份有限公司 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板
CN109705530A (zh) * 2018-12-29 2019-05-03 广东生益科技股份有限公司 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板
CN111094422A (zh) * 2017-09-13 2020-05-01 瀚森公司 环氧树脂体系
CN112480373A (zh) * 2019-09-11 2021-03-12 广东广山新材料股份有限公司 一种阻燃性环氧树脂组合物及其制备方法和应用

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031578B (zh) * 2004-08-31 2012-05-30 苏普雷斯塔有限责任公司 制备烷基膦酸二芳基酯及其低聚/多聚衍生物的方法
WO2008151986A1 (en) * 2007-06-14 2008-12-18 Basf Se Flame retardant compositions
US20110132646A1 (en) * 2009-06-12 2011-06-09 Icl-Ip America Inc. Flame retardant epoxy resin composition, prepreg and laminate thereof
US8563638B2 (en) * 2010-12-22 2013-10-22 Frx Polymers, Inc. Oligomeric phosphonates and compositions including the same
KR101469270B1 (ko) * 2011-12-30 2014-12-08 제일모직주식회사 폴리포스포네이트 공중합체, 그 제조 방법 및 이를 포함하는 난연성 열가소성 수지 조성물
TW201439222A (zh) 2013-01-22 2014-10-16 Frx Polymers Inc 含磷環氧化合物及源自其之組成物

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JPH1180178A (ja) * 1997-09-12 1999-03-26 Hitachi Chem Co Ltd リン含有フェノール末端オリゴマー及びその製造法
JP4353589B2 (ja) * 1999-07-09 2009-10-28 株式会社Ａｄｅｋａ 難燃性エポキシ樹脂組成物
JP2002363259A (ja) * 2001-06-04 2002-12-18 Mitsubishi Gas Chem Co Inc 難燃性樹脂組成物
JP4518538B2 (ja) * 2001-10-04 2010-08-04 サプレスタ エルエルシー ヒドロキシ末端化されたオリゴマー状ホスホネートを含む熱硬化性樹脂組成物
ATE494329T1 (de) * 2002-11-08 2011-01-15 Akzo Nobel Nv Vernetzungsverfahren für eine epoxidharzzusammensetzung enthaltend reaktives phosphonat
DE10300462A1 (de) * 2003-01-07 2004-07-15 Bakelite Ag Phosphormodifiziertes Epoxidharz

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102203176A (zh) * 2008-10-29 2011-09-28 Icl-Ip美国公司 含磷阻燃环氧树脂组合物、其预浸料和层压板
CN104024338A (zh) * 2011-06-03 2014-09-03 Frx聚合物股份有限公司 阻燃性树脂组合物、使用所述树脂组合物的挠性印刷线路板用金属箔基层压板、覆盖层、挠性印刷线路板用粘合片、以及挠性印刷线路板
TWI475052B (zh) * 2011-12-22 2015-03-01 Frx Polymers Inc 寡聚膦酸酯及包含該寡聚膦酸酯之組成物
US9752028B2 (en) 2014-12-29 2017-09-05 Shengyi Technology Co., Ltd. Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same
WO2016107066A1 (zh) * 2014-12-29 2016-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板
WO2016107067A1 (zh) * 2014-12-29 2016-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
CN105330824A (zh) * 2015-12-09 2016-02-17 西安元创化工科技股份有限公司 一种用于环氧树脂的阻燃固化剂及其制备方法
CN107722240A (zh) * 2016-08-10 2018-02-23 台燿科技股份有限公司 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板
CN108794978A (zh) * 2017-04-27 2018-11-13 台燿科技股份有限公司 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板
CN111094422A (zh) * 2017-09-13 2020-05-01 瀚森公司 环氧树脂体系
CN107778456A (zh) * 2017-11-22 2018-03-09 吉林省高性能复合材料制造业创新中心有限公司 中低温固化环氧树脂及其制备方法与在大丝束碳纤维环氧复合传动轴中的应用
CN107903383A (zh) * 2017-11-22 2018-04-13 吉林省高性能复合材料制造业创新中心有限公司 中低温固化环氧树脂及其制备方法与在大小丝束碳纤维环氧复合传动轴中的应用
CN109705530A (zh) * 2018-12-29 2019-05-03 广东生益科技股份有限公司 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板
CN109705530B (zh) * 2018-12-29 2021-06-04 广东生益科技股份有限公司 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板
CN112480373A (zh) * 2019-09-11 2021-03-12 广东广山新材料股份有限公司 一种阻燃性环氧树脂组合物及其制备方法和应用

Also Published As

Publication number Publication date
KR20060019547A (ko) 2006-03-03
WO2004113411A1 (en) 2004-12-29
EP1625171A1 (en) 2006-02-15
CA2525856A1 (en) 2004-12-29
JP2007502904A (ja) 2007-02-15

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Open date: 20060628