CN1795223A - 用于环氧树脂的聚膦酸酯阻燃固化剂 - Google Patents
用于环氧树脂的聚膦酸酯阻燃固化剂 Download PDFInfo
- Publication number
- CN1795223A CN1795223A CNA2004800140798A CN200480014079A CN1795223A CN 1795223 A CN1795223 A CN 1795223A CN A2004800140798 A CNA2004800140798 A CN A2004800140798A CN 200480014079 A CN200480014079 A CN 200480014079A CN 1795223 A CN1795223 A CN 1795223A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- epoxy
- polyphosphonate
- composition
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title description 7
- 239000003063 flame retardant Substances 0.000 title description 7
- 239000000203 mixture Substances 0.000 claims abstract description 39
- 125000000732 arylene group Chemical group 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 21
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 14
- 239000000047 product Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- -1 poly(m-phenylene cyclohexyl phosphonate Chemical compound 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000009830 intercalation Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 230000002687 intercalation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- VONWDASPFIQPDY-UHFFFAOYSA-N dimethyl methylphosphonate Chemical compound COP(C)(=O)OC VONWDASPFIQPDY-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910019440 Mg(OH) Inorganic materials 0.000 description 1
- KPMMESISHWWXNM-ROUUACIJSA-N N-acetyl-L-phenylalanyl-4-[difluoro(phosphono)methyl]-L-phenylalaninamide Chemical compound C([C@H](NC(=O)C)C(=O)N[C@@H](CC=1C=CC(=CC=1)C(F)(F)P(O)(O)=O)C(N)=O)C1=CC=CC=C1 KPMMESISHWWXNM-ROUUACIJSA-N 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HPUPGAFDTWIMBR-UHFFFAOYSA-N [methyl(phenoxy)phosphoryl]oxybenzene Chemical compound C=1C=CC=CC=1OP(=O)(C)OC1=CC=CC=C1 HPUPGAFDTWIMBR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005600 alkyl phosphonate group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-L methylphosphonate(2-) Chemical compound CP([O-])([O-])=O YACKEPLHDIMKIO-UHFFFAOYSA-L 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000012758 reinforcing additive Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47265403P | 2003-05-22 | 2003-05-22 | |
| US60/472,654 | 2003-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1795223A true CN1795223A (zh) | 2006-06-28 |
Family
ID=33539043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004800140798A Pending CN1795223A (zh) | 2003-05-22 | 2004-05-19 | 用于环氧树脂的聚膦酸酯阻燃固化剂 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1625171A1 (enExample) |
| JP (1) | JP2007502904A (enExample) |
| KR (1) | KR20060019547A (enExample) |
| CN (1) | CN1795223A (enExample) |
| CA (1) | CA2525856A1 (enExample) |
| WO (1) | WO2004113411A1 (enExample) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102203176A (zh) * | 2008-10-29 | 2011-09-28 | Icl-Ip美国公司 | 含磷阻燃环氧树脂组合物、其预浸料和层压板 |
| CN104024338A (zh) * | 2011-06-03 | 2014-09-03 | Frx聚合物股份有限公司 | 阻燃性树脂组合物、使用所述树脂组合物的挠性印刷线路板用金属箔基层压板、覆盖层、挠性印刷线路板用粘合片、以及挠性印刷线路板 |
| TWI475052B (zh) * | 2011-12-22 | 2015-03-01 | Frx Polymers Inc | 寡聚膦酸酯及包含該寡聚膦酸酯之組成物 |
| CN105330824A (zh) * | 2015-12-09 | 2016-02-17 | 西安元创化工科技股份有限公司 | 一种用于环氧树脂的阻燃固化剂及其制备方法 |
| WO2016107067A1 (zh) * | 2014-12-29 | 2016-07-07 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
| WO2016107066A1 (zh) * | 2014-12-29 | 2016-07-07 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 |
| CN107722240A (zh) * | 2016-08-10 | 2018-02-23 | 台燿科技股份有限公司 | 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板 |
| CN107778456A (zh) * | 2017-11-22 | 2018-03-09 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大丝束碳纤维环氧复合传动轴中的应用 |
| CN107903383A (zh) * | 2017-11-22 | 2018-04-13 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大小丝束碳纤维环氧复合传动轴中的应用 |
| CN108794978A (zh) * | 2017-04-27 | 2018-11-13 | 台燿科技股份有限公司 | 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板 |
| CN109705530A (zh) * | 2018-12-29 | 2019-05-03 | 广东生益科技股份有限公司 | 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板 |
| CN111094422A (zh) * | 2017-09-13 | 2020-05-01 | 瀚森公司 | 环氧树脂体系 |
| CN112480373A (zh) * | 2019-09-11 | 2021-03-12 | 广东广山新材料股份有限公司 | 一种阻燃性环氧树脂组合物及其制备方法和应用 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7541415B2 (en) * | 2004-08-31 | 2009-06-02 | Supresta Llc | Process for preparing diaryl alkylphosphonates and oligomeric/polymeric derivatives thereof |
| CN101679675B (zh) * | 2007-06-14 | 2013-06-05 | 巴斯夫欧洲公司 | 阻燃组合物 |
| US20110132646A1 (en) * | 2009-06-12 | 2011-06-09 | Icl-Ip America Inc. | Flame retardant epoxy resin composition, prepreg and laminate thereof |
| ES2625289T3 (es) * | 2010-12-22 | 2017-07-19 | Frx Polymers, Inc. | Fosfonatos oligoméricos hiper-ramificados y composiciones que incluyen los mismos |
| KR101469270B1 (ko) * | 2011-12-30 | 2014-12-08 | 제일모직주식회사 | 폴리포스포네이트 공중합체, 그 제조 방법 및 이를 포함하는 난연성 열가소성 수지 조성물 |
| JP2016510355A (ja) | 2013-01-22 | 2016-04-07 | エフアールエックス ポリマーズ、インク． | リン含有エポキシ化合物およびそれからなる組成物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
| JP4353589B2 (ja) * | 1999-07-09 | 2009-10-28 | 株式会社Ａｄｅｋａ | 難燃性エポキシ樹脂組成物 |
| JP2002363259A (ja) * | 2001-06-04 | 2002-12-18 | Mitsubishi Gas Chem Co Inc | 難燃性樹脂組成物 |
| EP2166013B1 (en) * | 2001-10-04 | 2018-01-24 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
| EP1570000B1 (en) * | 2002-11-08 | 2006-09-20 | Akzo Nobel N.V. | Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| DE10300462A1 (de) * | 2003-01-07 | 2004-07-15 | Bakelite Ag | Phosphormodifiziertes Epoxidharz |
-
2004
- 2004-05-19 CA CA002525856A patent/CA2525856A1/en not_active Abandoned
- 2004-05-19 WO PCT/US2004/016459 patent/WO2004113411A1/en not_active Ceased
- 2004-05-19 EP EP04776110A patent/EP1625171A1/en not_active Withdrawn
- 2004-05-19 CN CNA2004800140798A patent/CN1795223A/zh active Pending
- 2004-05-19 KR KR1020057022045A patent/KR20060019547A/ko not_active Ceased
- 2004-05-19 JP JP2006533410A patent/JP2007502904A/ja active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102203176A (zh) * | 2008-10-29 | 2011-09-28 | Icl-Ip美国公司 | 含磷阻燃环氧树脂组合物、其预浸料和层压板 |
| CN104024338A (zh) * | 2011-06-03 | 2014-09-03 | Frx聚合物股份有限公司 | 阻燃性树脂组合物、使用所述树脂组合物的挠性印刷线路板用金属箔基层压板、覆盖层、挠性印刷线路板用粘合片、以及挠性印刷线路板 |
| TWI475052B (zh) * | 2011-12-22 | 2015-03-01 | Frx Polymers Inc | 寡聚膦酸酯及包含該寡聚膦酸酯之組成物 |
| US9752028B2 (en) | 2014-12-29 | 2017-09-05 | Shengyi Technology Co., Ltd. | Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same |
| WO2016107067A1 (zh) * | 2014-12-29 | 2016-07-07 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
| WO2016107066A1 (zh) * | 2014-12-29 | 2016-07-07 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 |
| CN105330824A (zh) * | 2015-12-09 | 2016-02-17 | 西安元创化工科技股份有限公司 | 一种用于环氧树脂的阻燃固化剂及其制备方法 |
| CN107722240A (zh) * | 2016-08-10 | 2018-02-23 | 台燿科技股份有限公司 | 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板 |
| CN108794978A (zh) * | 2017-04-27 | 2018-11-13 | 台燿科技股份有限公司 | 树脂组成物、及使用该树脂组成物所制得的预浸渍片、金属箔积层板及印刷电路板 |
| CN111094422A (zh) * | 2017-09-13 | 2020-05-01 | 瀚森公司 | 环氧树脂体系 |
| CN107778456A (zh) * | 2017-11-22 | 2018-03-09 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大丝束碳纤维环氧复合传动轴中的应用 |
| CN107903383A (zh) * | 2017-11-22 | 2018-04-13 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大小丝束碳纤维环氧复合传动轴中的应用 |
| CN109705530A (zh) * | 2018-12-29 | 2019-05-03 | 广东生益科技股份有限公司 | 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板 |
| CN109705530B (zh) * | 2018-12-29 | 2021-06-04 | 广东生益科技股份有限公司 | 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板 |
| CN112480373A (zh) * | 2019-09-11 | 2021-03-12 | 广东广山新材料股份有限公司 | 一种阻燃性环氧树脂组合物及其制备方法和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007502904A (ja) | 2007-02-15 |
| WO2004113411A1 (en) | 2004-12-29 |
| CA2525856A1 (en) | 2004-12-29 |
| EP1625171A1 (en) | 2006-02-15 |
| KR20060019547A (ko) | 2006-03-03 |
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