CN1790660A - 基板承载台 - Google Patents

基板承载台 Download PDF

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Publication number
CN1790660A
CN1790660A CNA2005101249756A CN200510124975A CN1790660A CN 1790660 A CN1790660 A CN 1790660A CN A2005101249756 A CNA2005101249756 A CN A2005101249756A CN 200510124975 A CN200510124975 A CN 200510124975A CN 1790660 A CN1790660 A CN 1790660A
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substrate
placing stage
pins
severing
pin
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CN100481371C (zh
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楫间淳生
高濑真治
山口和伸
山本夕记
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Ameco Technology Co ltd
Process Equipment Business Division Preparation Co ltd
Tazmo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

提供一种支持将多个基板截取为多个的大型基板时、使销与裁断预定线重叠的基板承载台。在支持板(2)上安装多个固定销(3)。在该固定销(3)的俯视位置，配置在与承载在该基板承载台上的大型基板W的有效区域外的外周缘L1相重叠的位置上，另外还配置在大型基板截取为2个时的裁断预定线L2相重叠的位置上。另一方面，在上述支持板(2)中形成的通孔(4)中插入可动销(5)，各个可动销(5)配置在与大型基板进行进一步截取的裁断预定线L3、L4相重叠的位置上。然后将横方向的可动销(5)共同地安装在支持板(2)下方的连结板(6)上，通过驱动压力缸组件(8)使横方向的可动销(5)同时升降。

Description

基板承载台
技术领域
本发明涉及一种对用于液晶显示面板的玻璃基板实施各种处理时承载玻璃基板的基板承载台。
背景技术
为了在把玻璃基板设置为水平状态下实施各种处理，到目前为止使用基板承载台。(专利文献1-3)
现有基板承载台均是在台面厚度方向形成多个贯通孔，在这些多个贯通孔中插入支持销，通过一个压力缸组件等，使多个支持销同时上升，支撑基板，在该状态下使该支持销下降从而将基板承载在台面上。
专利文献1日本专利申请公开号特开平6-97269
专利文献2日本专利申请公开号特开平11-111600
专利文献3日本专利申请公开号特开2001-53133
在上述基板承载台上，在降下支持销的状态下，使玻璃基板的下面直接接触台上面。为此，在台上面的温度和玻璃基板的温度不同的情况下，在玻璃基板表面上形成的涂膜中产生不均匀的恶劣影响。
为了解决上述问题，在基板承载台上装上销，在该销上承载有玻璃基板的状态下，进行各种处理例如减压干燥处理即可，但是由于销上端部碰到玻璃基板的下面，在该部分上就会残留销痕迹。
发明内容
为了提高液晶显示面板的生产效率，在大的玻璃基板上实施通用的处理后，按每个液晶显示面板的尺寸进行裁断，沿着此裁断部分的部分是不作为有效区域使用的无效区域。为了解决上述课题，利用这点从而做出了本发明。
本发明的基板承载台，是以承载于后工序中进行多次裁断的大尺寸玻璃基板等的大型基板为前提的基板承载台，结构如下：包括在承载台上面设置的多个固定销，和可插入形成在台上的厚度方向的通孔中的可升降移动的多个可动销，上述固定销配置在俯视时与承载的大型基板的有效区域之外的外周缘相重叠的位置上，上述可动销配置在俯视时与大型基板的裁断预定线相重叠的位置上。
利用这样的结构，就不会在玻璃基板等的有效区域中残留销的痕迹。
在此，将大型基板裁断为几个，因目标液晶面板等的大小的不同而不同，但是原始大型基板的尺寸是固定的。因此，首先利用固定销支持必须支持的外周缘(无效区域)，另一方面，裁断预定线因大型基板的截取数量或截取形状的不同而不同，所以对于该部分，仅在必要时使可动销上升，用可动销来进行支持。
通过以纵向或横向排列的多个可动销为一单元，每个单元用一个升降机构进行升降移动，由此简化机构。
此外，由于上述大型基板一定截取为2以上，所以一定存在截取2个的裁断预定线。因此，也可以在与截取2个的裁断预定线相重叠位置上配置固定销。
根据本发明，由于通过固定销或可动销仅支持玻璃基板等的基板外周缘和裁断预定线部分，所以即使在残留销痕迹的情况下也不会产生任何不利的影响。
另外，根据本发明，在因裁断的张数变化而改变裁断预定线的位置，从而可动销自裁断预定线偏离时，也可以简单地通过使该可动销后退、并使与新裁断预定线的位置相重叠的可动销突出来支持基板。
附图说明
图1是本发明基板承载台的俯视图。
图2是沿着图1的A-A线的主要部分的放大剖视图。
图3(a)到(c)是表示另一实施例的与图1相同的图。
[标记说明]
1底座
2支持板
3固定销
4通孔
5可动销
6连结板
7导杆
8压力缸组件
L1外周缘
L2将大型基板截取为2个的裁断预定线
L3-L14  进行两面截取以上时的裁断预定线
W大型基板
具体实施方式
下面，根据附图说明本发明的实施例。图1是本发明基板承载台的俯视图。图2是沿着图1的A-A线的主要部分的放大剖视图。
该基板承载台，例如是在对涂布于大型玻璃基板上的抗蚀剂液体等进行减压干燥的工序中使用的。
基板承载台是在底座1上安装有比较薄的基板承载台，在该支持板2上安装多个固定销3。该固定销3的俯视位置是配置在与承载在该基板承载台上的大型基板W的有效区域外的外周缘L1相重叠的位置上，另外，还配置在与将大型基板截取为2个的裁断预定线L2相重叠的位置上。
另一方面，在上述支持板2上沿厚度方向形成多个通孔4，各通孔4中插入可动销5。各可动销5配置在与对大型基板进行进一步截取的裁断预定线L3、L4相重叠的位置上。
在本实施例中，横方向的可动销5共同安装在支持板2下方的连接板6上，该连接板6安装在贯通底座1的导杆7上，通过驱动在底座1下面设有导杆7的压力缸组件8，使横方向的可动销5同时升降。
并且，可动销5在其上限位置与上述固定销3高度相同，以水平状态支持大型基板W，另一方面可动销5从上限位置稍微下降，由此该可动销5就与基板的支持无关。
图3(a)到(c)是表示另一实施例的与图1相同的图，(a)所示的实施例表示截取8个的例子，在该实施例中固定销3配置在原来的位置，可动销5配置在与大型基板进行进一步截取的裁断预定线L5、L6相重叠的位置上。
此外，(b)所示的实施例是截取12个的例子，虽然将可动销5配置在与裁断预定线L7、L8、L9相重叠的位置上，但是固定销3和可动销5的配置数量及其配置位置与(a)所示的例子相同。
另外，(c)所示的实施例是截取24个的例子，在与裁断预定线L10、L11、L12、L13、L14相重叠的位置上配置可动销5。

Claims (3)

1、一种基板承载台，其特征在于：
对在后工序中裁断为多个的大尺寸玻璃基板等的大型基板进行承载，其中，该基板承载台包括：在承载台上面设置的多个固定销，和插入形成在台上的厚度方向的通孔中的可升降移动的多个可动销，上述固定销配置在俯视时与承载的大型基板的有效区域之外的外周缘相重叠的位置上，上述可动销配置在俯视时与大型基板的裁断预定线相重叠的位置上。
2、根据权利要求1所述的基板承载台，其特征在于，上述多个可动销以纵向或者横向排列，这些纵向或者横向排列的多个可动销通过1个升降机构进行升降移动。
3、根据权利要求1或2所述的基板承载台，其特征在于，固定销还配置在与将上述大型基板截取为2个的裁断预定线相重叠的位置上。
CNB2005101249756A 2004-10-04 2005-10-04 基板承载台 Active CN100481371C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004290898A JP2006108265A (ja) 2004-10-04 2004-10-04 基板載置ステージ
JP2004290898 2004-10-04

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CN1790660A true CN1790660A (zh) 2006-06-21
CN100481371C CN100481371C (zh) 2009-04-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107526196A (zh) * 2017-09-27 2017-12-29 武汉华星光电技术有限公司 玻璃基板承载装置及检测设备
CN108447800A (zh) * 2018-01-31 2018-08-24 北京铂阳顶荣光伏科技有限公司 薄膜电池的制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011007616A1 (ja) * 2009-07-13 2011-01-20 シャープ株式会社 支持装置およびこの支持装置を備える乾燥装置
WO2012141082A1 (ja) * 2011-04-13 2012-10-18 シャープ株式会社 基板支持装置、及び乾燥装置
KR102399627B1 (ko) 2020-09-16 2022-05-19 양영제 스팀 실내 크리닝 전용장비

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107526196A (zh) * 2017-09-27 2017-12-29 武汉华星光电技术有限公司 玻璃基板承载装置及检测设备
CN108447800A (zh) * 2018-01-31 2018-08-24 北京铂阳顶荣光伏科技有限公司 薄膜电池的制造方法

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KR20060052002A (ko) 2006-05-19
TW200629459A (en) 2006-08-16
CN100481371C (zh) 2009-04-22
JP2006108265A (ja) 2006-04-20

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