CN1739186A - 芯片传送方法与设备 - Google Patents
芯片传送方法与设备 Download PDFInfo
- Publication number
- CN1739186A CN1739186A CNA2003801089046A CN200380108904A CN1739186A CN 1739186 A CN1739186 A CN 1739186A CN A2003801089046 A CNA2003801089046 A CN A2003801089046A CN 200380108904 A CN200380108904 A CN 200380108904A CN 1739186 A CN1739186 A CN 1739186A
- Authority
- CN
- China
- Prior art keywords
- chip
- plane
- head
- chuck
- pick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims description 36
- 230000005540 biological transmission Effects 0.000 claims description 60
- 230000033001 locomotion Effects 0.000 claims description 20
- 230000008093 supporting effect Effects 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000007246 mechanism Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 17
- 238000013459 approach Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 210000004907 gland Anatomy 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03100077 | 2003-01-16 | ||
EP03100077.1 | 2003-01-16 | ||
PCT/IB2003/006050 WO2004064124A1 (en) | 2003-01-16 | 2003-12-11 | Chip transfer method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1739186A true CN1739186A (zh) | 2006-02-22 |
CN1739186B CN1739186B (zh) | 2010-10-13 |
Family
ID=32695655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2003801089046A Expired - Lifetime CN1739186B (zh) | 2003-01-16 | 2003-12-11 | 芯片传送方法与设备 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7726011B2 (zh) |
EP (1) | EP1588402B1 (zh) |
JP (1) | JP2006513565A (zh) |
KR (1) | KR20050092765A (zh) |
CN (1) | CN1739186B (zh) |
AT (1) | ATE522925T1 (zh) |
AU (1) | AU2003303704A1 (zh) |
TW (1) | TW200501200A (zh) |
WO (1) | WO2004064124A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194710A (zh) * | 2010-03-04 | 2011-09-21 | 沈亚容 | 旋转式芯片结合设备及其方法 |
CN103975425A (zh) * | 2012-12-04 | 2014-08-06 | 上野精机株式会社 | 粘片机装置 |
CN109699167A (zh) * | 2017-10-20 | 2019-04-30 | 先进装配系统有限责任两合公司 | 用于具有取出工具和翻转工具的芯片-传递装置的补充工具 |
CN109950188A (zh) * | 2017-12-20 | 2019-06-28 | 安世有限公司 | 设备和系统 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7303111B2 (en) * | 2005-10-14 | 2007-12-04 | Asm Technology Singapore Pte. Ltd. | Lightweight bondhead assembly |
US7569932B2 (en) | 2005-11-18 | 2009-08-04 | Checkpoint Systems, Inc. | Rotary chip attach |
WO2007091196A2 (en) * | 2006-02-10 | 2007-08-16 | Nxp B.V. | A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object |
JP2008098320A (ja) * | 2006-10-11 | 2008-04-24 | Nidec Tosok Corp | ボンディング装置 |
KR100787627B1 (ko) * | 2007-02-01 | 2007-12-26 | (주)큐엠씨 | 반도체 칩 분류장치 |
JP5074788B2 (ja) * | 2007-03-06 | 2012-11-14 | 株式会社日立ハイテクインスツルメンツ | チップ部品装着装置 |
JP2009105357A (ja) * | 2007-10-23 | 2009-05-14 | M Tec Kk | チップの搬送方法及び装置 |
WO2013171863A1 (ja) * | 2012-05-16 | 2013-11-21 | 上野精機株式会社 | ダイボンダー装置 |
KR102231293B1 (ko) | 2014-02-10 | 2021-03-23 | 삼성전자주식회사 | 다이 본딩 장치 |
US10199254B2 (en) * | 2015-05-12 | 2019-02-05 | Nexperia B.V. | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
US9994407B2 (en) | 2015-11-06 | 2018-06-12 | Nxp B.V. | System and method for processing a flexible substrate |
US10104784B2 (en) | 2015-11-06 | 2018-10-16 | Nxp B.V. | Method for making an electronic product with flexible substrate |
KR102180449B1 (ko) * | 2016-05-13 | 2020-11-19 | 에이에스엠엘 네델란즈 비.브이. | 구성요소 스태킹 및/또는 픽-앤드-플레이스 공정을 위한 다수 미니어처 픽업 요소들 |
US10192773B2 (en) | 2016-06-20 | 2019-01-29 | Nexperia B.V. | Semiconductor device positioning system and method for semiconductor device positioning |
KR101785388B1 (ko) | 2016-07-11 | 2017-10-16 | (주)쏠라딘 | 칩 이송 장치 및 이를 이용한 칩 이송 시스템 |
JP6889614B2 (ja) * | 2017-05-31 | 2021-06-18 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
EP3672040A1 (en) * | 2018-12-17 | 2020-06-24 | Nexperia B.V. | Device for enabling a rotating and translating movement by means of a single motor; apparatus and system comprising such a device |
KR102172744B1 (ko) * | 2019-01-28 | 2020-11-02 | 세메스 주식회사 | 다이 본딩 장치 |
EP3734649A1 (en) | 2019-05-03 | 2020-11-04 | Nexperia B.V. | Electronic component transfer apparatus |
DE102019125134A1 (de) | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
DE102019125127A1 (de) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
JP6842732B1 (ja) * | 2020-09-24 | 2021-03-17 | 上野精機株式会社 | 電子部品の処理装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4461610A (en) * | 1980-06-02 | 1984-07-24 | Tdk Corporation | Apparatus for mounting chip type circuit elements on printed circuit boards |
JPS6012799A (ja) * | 1983-07-01 | 1985-01-23 | 三洋電機株式会社 | チップ状電子部品の自動装着装置 |
CN1007692B (zh) * | 1985-05-20 | 1990-04-18 | Tdk株式会社 | 在印刷电路板上安装芯片型电路元件的方法及其所用装置 |
US4914808A (en) * | 1987-10-16 | 1990-04-10 | Sanyo Electric Co., Ltd | Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences |
CA1320005C (en) * | 1988-06-16 | 1993-07-06 | Kotaro Harigane | Electronic component mounting apparatus |
JPH0267739A (ja) * | 1988-09-01 | 1990-03-07 | Mitsubishi Electric Corp | ダイボンディング方法とその装置 |
WO1997032460A1 (de) * | 1996-02-29 | 1997-09-04 | Alphasem Ag | Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen |
JP4027042B2 (ja) * | 1999-05-06 | 2007-12-26 | 松下電器産業株式会社 | 部品搭載装置及びその方法 |
KR100779771B1 (ko) * | 2000-09-13 | 2007-11-27 | 언액시스 인터내셔널 트레이딩 엘티디 | 반도체 칩을 장착하는 장치 |
-
2003
- 2003-12-11 AT AT03815128T patent/ATE522925T1/de not_active IP Right Cessation
- 2003-12-11 CN CN2003801089046A patent/CN1739186B/zh not_active Expired - Lifetime
- 2003-12-11 JP JP2004566187A patent/JP2006513565A/ja active Pending
- 2003-12-11 EP EP03815128A patent/EP1588402B1/en not_active Expired - Lifetime
- 2003-12-11 US US10/561,397 patent/US7726011B2/en active Active
- 2003-12-11 WO PCT/IB2003/006050 patent/WO2004064124A1/en active Application Filing
- 2003-12-11 KR KR1020057013196A patent/KR20050092765A/ko not_active Application Discontinuation
- 2003-12-11 AU AU2003303704A patent/AU2003303704A1/en not_active Abandoned
-
2004
- 2004-01-13 TW TW093100807A patent/TW200501200A/zh unknown
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194710A (zh) * | 2010-03-04 | 2011-09-21 | 沈亚容 | 旋转式芯片结合设备及其方法 |
CN103975425A (zh) * | 2012-12-04 | 2014-08-06 | 上野精机株式会社 | 粘片机装置 |
CN103975425B (zh) * | 2012-12-04 | 2017-11-14 | 上野精机株式会社 | 粘片机装置 |
CN109699167A (zh) * | 2017-10-20 | 2019-04-30 | 先进装配系统有限责任两合公司 | 用于具有取出工具和翻转工具的芯片-传递装置的补充工具 |
CN109699167B (zh) * | 2017-10-20 | 2020-11-06 | 先进装配系统有限责任两合公司 | 用于具有取出工具和翻转工具的芯片-传递装置的补充工具 |
CN109950188A (zh) * | 2017-12-20 | 2019-06-28 | 安世有限公司 | 设备和系统 |
Also Published As
Publication number | Publication date |
---|---|
US7726011B2 (en) | 2010-06-01 |
AU2003303704A1 (en) | 2004-08-10 |
WO2004064124A1 (en) | 2004-07-29 |
TW200501200A (en) | 2005-01-01 |
KR20050092765A (ko) | 2005-09-22 |
EP1588402B1 (en) | 2011-08-31 |
ATE522925T1 (de) | 2011-09-15 |
CN1739186B (zh) | 2010-10-13 |
JP2006513565A (ja) | 2006-04-20 |
EP1588402A1 (en) | 2005-10-26 |
US20070137031A1 (en) | 2007-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1739186A (zh) | 芯片传送方法与设备 | |
CN1131831C (zh) | 芯片元件传递装置 | |
CN1479667A (zh) | 具有缓冲性能的边缘夹持校准器 | |
US6234738B1 (en) | Thin substrate transferring apparatus | |
US4441853A (en) | Disc orienting device | |
KR20010049569A (ko) | 화학-기계적 연마기용 웨이퍼 전달 스테이션 | |
JP6371641B2 (ja) | 整列装置および整列方法 | |
CN106115260A (zh) | 器件高速取放装置 | |
CN113307025B (zh) | 基于cob自动组装的料件拾取装置 | |
CN102024735A (zh) | 高速基片对齐器设备 | |
MY162660A (en) | System and method for flexible high speed transfer of semiconductor components | |
CN109950190A (zh) | 一种芯片柔性定位座 | |
CN110534810B (zh) | 一种圆柱形电池的极耳找正机构 | |
TW201938469A (zh) | 晶片取放裝置及晶片取放與檢測系統 | |
CN1171302C (zh) | 基片装卸装置 | |
JPS6395631A (ja) | ダイボンデイング装置 | |
CN1264735C (zh) | 适合于输送环形产品的输送设备 | |
JPH1167879A (ja) | 半導体実装方法及びその装置 | |
US20030102681A1 (en) | High speed pickhead | |
KR20010089784A (ko) | 수송 장치 | |
CN216835960U (zh) | 一种端子载台移送机构 | |
JP3342210B2 (ja) | ペレット移送装置 | |
CN218908968U (zh) | 一种转臂机械手及物料传输装置 | |
CN220604621U (zh) | 一种芯片分拣机 | |
CN218955699U (zh) | 应用于晶圆片厚度分选装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20071109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071109 Address after: Holland Ian Deho Finn Applicant after: NXP B.V. Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160912 Address after: Holland Ian Deho Finn Patentee after: Nexperia B.V. Address before: Holland Ian Deho Finn Patentee before: NXP B.V. |
|
CP03 | Change of name, title or address |
Address after: Nijmegen Patentee after: NEXPERIA B.V. Address before: Holland Ian Deho Finn Patentee before: Nexperia B.V. |
|
CP03 | Change of name, title or address | ||
CX01 | Expiry of patent term |
Granted publication date: 20101013 |
|
CX01 | Expiry of patent term |