MY162660A - System and method for flexible high speed transfer of semiconductor components - Google Patents

System and method for flexible high speed transfer of semiconductor components

Info

Publication number
MY162660A
MY162660A MYPI2010005163A MYPI2010005163A MY162660A MY 162660 A MY162660 A MY 162660A MY PI2010005163 A MYPI2010005163 A MY PI2010005163A MY PI2010005163 A MYPI2010005163 A MY PI2010005163A MY 162660 A MY162660 A MY 162660A
Authority
MY
Malaysia
Prior art keywords
semiconductor components
components
carrier
turret
gang
Prior art date
Application number
MYPI2010005163A
Inventor
Jianping Jin
Lee Kwang Heng
Original Assignee
Semiconductor Tech & Instr Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech & Instr Pte Ltd filed Critical Semiconductor Tech & Instr Pte Ltd
Publication of MY162660A publication Critical patent/MY162660A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
    • B65B35/30—Arranging and feeding articles in groups
    • B65B35/36—Arranging and feeding articles in groups by grippers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

A SYSTEM (100) FOR TRANSFERRING SEMICONDUCTOR COMPONENTS COMPRISES A ROTARY TURRET STRUCTURE (12), A FIRST CARRIER (14), A SECOND CARRIER (16) AND A GANG PICK AND PLACE MECHANISM (18).THE TURRET (14) COMPRISES A CENTRAL SHAFT AND A NUMBER OF PICKUP HEADS (26) ROTATABLE ABOUT THE SHAFT.THE PICKUP HEADS (26) ARE ROTATABLY DISPLACED TO TRANSFER SEMICONDUCTOR COMPONENTS BETWEEN PROCESSING MODULES (P1,P2) TO PROCESSES THE COMPONENTS.THE SEMICONDUCTOR COMPONENTS ARE TRANSFERRED IN SERIES FROM THE PICKUP HEADS (26) TO THE FIRST CARRIER (14) AND THE SECOND CARRIER (18).THE GANG PICK AND PLACE MECHANISM (18) TRANSFERS SEMICONDUCTOR COMPONENTS COLLECTIVELY FROM THE FIRST AND SECOND CARRIERS (14,16) ONTO PACKAGING MEDIA (20,22).ON-THE FLY UP-DOWN MOVEMENT OF THE TURRET HEADS (26) BETWEEN PROCESSING STATIONS (P1,P2) DUAL CARRIERS (14,16) WHICH OPERATE IN CYCLICAL MOTION WITH EACH OTHER FOR TRANSFERRING THE COMPONENTS FROM THE TURRET (12) TO A SORTING POSITION, AND A GANG PICK AND PLACE MECHANISM (18) TO GANG SORT THE COMPONENTS FROM THE DUAL CARRIERS (14,16) INTO A OUTPUT TRAY (32) ENHANCES SYSTEM UPH.
MYPI2010005163A 2009-11-02 2010-11-02 System and method for flexible high speed transfer of semiconductor components MY162660A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200907281-0A SG170645A1 (en) 2009-11-02 2009-11-02 System and method for flexible high speed transfer of semiconductor components

Publications (1)

Publication Number Publication Date
MY162660A true MY162660A (en) 2017-06-30

Family

ID=43958916

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010005163A MY162660A (en) 2009-11-02 2010-11-02 System and method for flexible high speed transfer of semiconductor components

Country Status (6)

Country Link
KR (1) KR101812677B1 (en)
CN (1) CN102054726B (en)
HK (1) HK1157502A1 (en)
MY (1) MY162660A (en)
SG (1) SG170645A1 (en)
TW (1) TWI545680B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103094165A (en) * 2011-10-28 2013-05-08 无锡华润安盛科技有限公司 Jacking component used for chip transferring equipment and corresponding chip transferring equipment
SG194255A1 (en) * 2012-04-25 2013-11-29 Ust Technology Pte Ltd A packaging apparatus and method for transferring integrated circuits to a packaging
CN103247562B (en) * 2013-05-17 2015-11-25 嘉兴景焱智能装备技术有限公司 Crystal grain rotary type tower fetching device
KR102181218B1 (en) * 2013-11-11 2020-11-23 라스코 게엠베하 Integrated testing and handling mechanism
CN106115260A (en) * 2016-08-17 2016-11-16 华天科技（昆山）电子有限公司 Device high speed fetching device
TWI765578B (en) * 2020-05-20 2022-05-21 馬來西亞商正齊科技有限公司 An apparatus for semiconductor dies bonding and method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996039619A1 (en) * 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
JP4587592B2 (en) * 2001-03-30 2010-11-24 芝浦メカトロニクス株式会社 Electronic component conveying apparatus, electronic component conveying method, electronic component mounting apparatus, and electronic component mounting method
KR20080004118A (en) * 2006-07-04 2008-01-09 피에스케이 주식회사 Substrate transfer equipment and substrate processing system using the same

Also Published As

Publication number Publication date
KR20110048478A (en) 2011-05-11
TW201133684A (en) 2011-10-01
KR101812677B1 (en) 2017-12-27
TWI545680B (en) 2016-08-11
HK1157502A1 (en) 2012-06-29
CN102054726B (en) 2015-07-22
CN102054726A (en) 2011-05-11
SG170645A1 (en) 2011-05-30

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