SG170645A1 - System and method for flexible high speed transfer of semiconductor components - Google Patents
System and method for flexible high speed transfer of semiconductor componentsInfo
- Publication number
- SG170645A1 SG170645A1 SG200907281-0A SG2009072810A SG170645A1 SG 170645 A1 SG170645 A1 SG 170645A1 SG 2009072810 A SG2009072810 A SG 2009072810A SG 170645 A1 SG170645 A1 SG 170645A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor components
- components
- carrier
- turret
- gang
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 239000000969 carrier Substances 0.000 abstract 3
- 230000009977 dual effect Effects 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/30—Arranging and feeding articles in groups
- B65B35/36—Arranging and feeding articles in groups by grippers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Specific Conveyance Elements (AREA)
Abstract
A system for transferring semiconductor components comprises a rotary turret structure, a first carrier, a second carrier and a gang pick and place mechanism. The turret comprises a central shaft and a number of pickup heads rotatable about the shaft. The pickup heads are rotatably displaced to transfer semiconductor components between processing modules to processes the components. The semiconductor components are transferred in series from the pickup heads to the first carrier and the second carrier. The gang pick and place mechanism transfers semiconductor components collectively from the first and second carriers onto packaging media. On-the fly up-down movement of the turret heads between processing stations, dual carriers which operate in cyclical motion with each other for transferring the components from the turret to a sorting position, and a gang pick and place mechanism to gang sort the components from the dual carriers into a output tray enhances system UPH.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200907281-0A SG170645A1 (en) | 2009-11-02 | 2009-11-02 | System and method for flexible high speed transfer of semiconductor components |
TW099137556A TWI545680B (en) | 2009-11-02 | 2010-11-02 | System and method for flexible high speed transfer of semiconductor components |
MYPI2010005163A MY162660A (en) | 2009-11-02 | 2010-11-02 | System and method for flexible high speed transfer of semiconductor components |
CN201010528540.9A CN102054726B (en) | 2009-11-02 | 2010-11-02 | System and method of flexibly transmitting semiconductor component in high speed |
KR1020100108439A KR101812677B1 (en) | 2009-11-02 | 2010-11-02 | System and method for flexible high speed transfer of semiconductor components |
HK11111707.8A HK1157502A1 (en) | 2009-11-02 | 2011-10-31 | System and method for flexible high speed transfer of semiconductor components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200907281-0A SG170645A1 (en) | 2009-11-02 | 2009-11-02 | System and method for flexible high speed transfer of semiconductor components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG170645A1 true SG170645A1 (en) | 2011-05-30 |
Family
ID=43958916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200907281-0A SG170645A1 (en) | 2009-11-02 | 2009-11-02 | System and method for flexible high speed transfer of semiconductor components |
Country Status (6)
Country | Link |
---|---|
KR (1) | KR101812677B1 (en) |
CN (1) | CN102054726B (en) |
HK (1) | HK1157502A1 (en) |
MY (1) | MY162660A (en) |
SG (1) | SG170645A1 (en) |
TW (1) | TWI545680B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094165A (en) * | 2011-10-28 | 2013-05-08 | 无锡华润安盛科技有限公司 | Jacking component used for chip transferring equipment and corresponding chip transferring equipment |
SG194255A1 (en) * | 2012-04-25 | 2013-11-29 | Ust Technology Pte Ltd | A packaging apparatus and method for transferring integrated circuits to a packaging |
CN103247562B (en) * | 2013-05-17 | 2015-11-25 | 嘉兴景焱智能装备技术有限公司 | Crystal grain rotary type tower fetching device |
EP3115794A1 (en) * | 2013-11-11 | 2017-01-11 | Rasco GmbH | An assembly and method for handling components |
CN106115260A (en) * | 2016-08-17 | 2016-11-16 | 华天科技(昆山)电子有限公司 | Device high speed fetching device |
TWM626077U (en) * | 2020-05-20 | 2022-04-21 | 馬來西亞商正齊科技有限公司 | Apparatus for bonding semiconductor dies |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996039619A1 (en) * | 1995-06-06 | 1996-12-12 | Kla Instruments Corporation | Optical inspection of a specimen using multi-channel responses from the specimen |
JP4587592B2 (en) * | 2001-03-30 | 2010-11-24 | 芝浦メカトロニクス株式会社 | Electronic component conveying apparatus, electronic component conveying method, electronic component mounting apparatus, and electronic component mounting method |
KR20080004118A (en) * | 2006-07-04 | 2008-01-09 | 피에스케이 주식회사 | Substrate transfer equipment and substrate processing system using the same |
-
2009
- 2009-11-02 SG SG200907281-0A patent/SG170645A1/en unknown
-
2010
- 2010-11-02 MY MYPI2010005163A patent/MY162660A/en unknown
- 2010-11-02 KR KR1020100108439A patent/KR101812677B1/en active IP Right Grant
- 2010-11-02 CN CN201010528540.9A patent/CN102054726B/en active Active
- 2010-11-02 TW TW099137556A patent/TWI545680B/en active
-
2011
- 2011-10-31 HK HK11111707.8A patent/HK1157502A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20110048478A (en) | 2011-05-11 |
KR101812677B1 (en) | 2017-12-27 |
CN102054726A (en) | 2011-05-11 |
CN102054726B (en) | 2015-07-22 |
MY162660A (en) | 2017-06-30 |
TW201133684A (en) | 2011-10-01 |
HK1157502A1 (en) | 2012-06-29 |
TWI545680B (en) | 2016-08-11 |
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