KR20110048478A - High Speed Delivery System and Method of Semiconductor Components - Google Patents

Abstract

PURPOSE: A system and a method for a flexible high speed transfer of semiconductor components are provided to increase the amount of process of a system per hour by collectively transferring a plurality of semiconductor components to a predetermined packaging device. CONSTITUTION: In a system and a method for a flexible high speed transfer of semiconductor components, a component carrier(14) receive a plurality of semiconductor in order. A pick and place mechanism(18) collectively picks up the plural semiconductor component which is transferred to the component carrier. The pick and place mechanism transfers the semiconductor components from the component carrier to the packing device(22). A rotary semiconductor device unloads the semiconductor components from a loading position to an unloading position in order. A conveyor mechanism(11) transfers the semiconductor components to a turret(12) from a loading station.

Description

High speed transfer system and method for semiconductor components {SYSTEM AND METHOD FOR FLEXIBLE HIGH SPEED TRANSFER OF SEMICONDUCTOR COMPONENTS}

The present invention generally relates to systems and methods for handling semiconductor components. More specifically, the present invention relates to a system and method for transferring semiconductor components between different packaging means.

Semiconductor components, such as semiconductor wafers, dies, and integrated circuit (IC) chips, are typically suitable packaging means (which are moved during dispensing after manufacturing as well as being transferred between different processing stations within a manufacturing plant). Packaged or stored in a means (also called a means or conveying means). Packaging means for semiconductor components can generally be divided into loose packaging means and fixed packaging means. Loose packaging means used for the packaging of semiconductor components include, but are not limited to, JEDEC trays, TESEC trays, multichannel metal magazines and tubes. The stationary packaging means is for example tape means.

It is often necessary to transfer semiconductor components between different types of packaging means, for example from a multichannel metal magazine to a JEDEC tray. Transferring semiconductor components between different packaging means is generally a time consuming and iterative process and is typically not performed manually due to technical and / or efficient reasons (eg, ESD protection issues, or vent leads). increase the likelihood of formation of bent leads). Accordingly, robots or automation systems for transferring semiconductor components between packaging means have been devised and manufactured. As market competitiveness increases in the semiconductor component manufacturing and processing industry, there has been a continuing need to increase the speed and throughput of existing systems for transferring semiconductor components between different packaging means.

Inspection and testing of semiconductor components (collectively referred to as machining) is performed periodically during the entire semiconductor component manufacturing process. There are a number of conventional systems and methods for processing or testing semiconductor components and performing tests. However, as the demand for manufacturing high quality semiconductor components at high throughput increases, the corresponding demands on inspection and test (i.e. machining) systems that enable inspection and testing of semiconductor components with increased speed and accuracy have increased. have.

Pick and place mechanisms are used to unload the semiconductor component from the processing system towards the packaging means for the forward movement of the semiconductor component. However, the demand for increased manufacturing speed and throughput of semiconductor components has led to an increase in the need for faster and more accurate pick and place mechanisms.

During fabrication of semiconductor components, semiconductor components are generally transferred or moved between different processing stations or processing systems. As mentioned above, semiconductor components are generally packaged with transfer means or suitable packaging means to facilitate transfer between different processing stations. Semiconductor components introduced into processing systems are commonly referred to as input semiconductor components. After being processed by the processing system, the semiconductor component is then removed from the processing system and transferred to other packaging means. The semiconductor component removed from the processing system may be referred to as an output semiconductor component.

Packaging means for input semiconductor components and output semiconductor components are typically determined or selected based on consumer or application requirements. The most common systems for machining or checking and testing semiconductor components provide limited options for packaging or moving means for packaging the unloaded output semiconductor components from the system. In addition, the most common systems and methods of processing semiconductor components have undesirably limited speed and accuracy for processing semiconductor components. There is a need for systems and methods to overcome the aforementioned limitations of conventional systems.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system and method for transferring semiconductor components, and more particularly to a semiconductor component transfer system and method for suggesting solutions to problems and the like discussed or mentioned in the background of the invention.

According to a first aspect of embodiments of the present invention, a first exemplary semiconductor component transport system is disclosed that includes a component carrier capable of sequentially receiving a plurality of semiconductor components. The component carrier includes a plurality of receivers, each receiving one semiconductor component. The system of the present invention further includes a gang pick and place mechanism. The collective pick and place mechanism may be operable to collectively receive a plurality of semiconductor components from a component carrier and then collectively deliver the received plurality of semiconductor components to a predetermined packaging means. The use of this collective pick and place mechanism significantly increases the throughput (UPH) of the system.

According to a second aspect of an embodiment of the present invention, a second exemplary semiconductor component transport system is disclosed that includes a turret structure. The turret structure includes a plurality of pickup heads (turret heads), each of which is configured to rotate to transfer the semiconductor component from the first position to the second position in turn. The turret structure is also formed so that the pick-up head can move up and down on-the-fly (while the turret structure is rotating and indexing operation to find the transfer position). This structural feature can also significantly increase the hourly transfer throughput (UPH) of semiconductor components. In some embodiments, the entire set or assembly of pickup heads circumferentially mounted on the turret is designed such that the turret can move up and down in the vertical direction simultaneously with the rotational movement, which means that the turret can By using the up and down movement, it is possible, and as a result, the transfer processing time and control complexity is reduced. The system according to the present invention also provides a component carrier set capable of accommodating semiconductor components sequentially from a plurality of pickup heads, and a collective pick and place mechanism capable of collectively accommodating a plurality of semiconductor components from the component carrier set. And wherein the collective pick and place mechanism can also perform the task of transferring the plurality of contained semiconductor components to the packaging means and collectively delivering them to the packaging means.

According to a third aspect of an embodiment of the present invention, a third exemplary semiconductor component transfer system is disclosed that includes two component carriers. Each component carrier periodically with respect to each other between a first position (the position at which the parts are transported from the pickup head of the turret to the component carrier) and a second position (the position at which the parts are transported from the component carrier to the collective pick and place mechanism). I can move it. While the first component carrier receives the semiconductor component from the pick up head of the turret at the first position, the second component carrier operates to transport the semiconductor component to the collective pick and place mechanism at the second position near the output tray. . When the component conveying operation is completed, the second component carrier is located behind the first component carrier. Upon completion of loading of the part into the first part carrier, the first part carrier is moved towards the collective pick and place mechanism for unloading the part, in which step the second part carrier is positioned at the bottom of the turret. Move to the loading position. In other words, the second component carrier waits at the lower part of the first component carrier to be moved to the second position, which is the position at which the component is unloaded, and then moves as soon as the first component carrier moves from the position at which the component carrier is loaded. The component carrier moves upwards to prepare for receiving parts from the pickup head of the turret. By repeating the cycle operation by the two component carriers, the effect of significantly increasing the hourly throughput of the semiconductor component can be obtained.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a schematic diagram of an exemplary system for high speed delivery of semiconductor components in accordance with one embodiment of the present invention.
2A is a schematic diagram of a turret structure including a plurality of pickup heads configured for rotational movement and a plurality of carriers configured for rotational movement to enable high throughput unloading of the system of the present invention.
2B is a schematic top plan view illustrating exemplary positions of turret structures in a system for high speed delivery of semiconductor components in accordance with one embodiment of the present invention.
3 illustrates the operation of two carriers and a collective pick and place mechanism.
4 illustrates a collective pick and place mechanism for transferring semiconductor components to a tray carrier.
5 is a flow diagram illustrating the steps of an exemplary method for high speed delivery of semiconductor components in accordance with one embodiment of the present invention.

The manufacture of semiconductor components typically involves a plurality of processing steps, for example visual defect checking and electrical testing. Many processing systems have been designed for the processing of semiconductor components. The increasing demand for increased quality, speed, and throughput in semiconductor component manufacturing has led to the need for processing systems that can process semiconductor components at higher speeds and accuracy. The semiconductor component is unloaded from the processing system toward an output packaging means, also known as a moving means or a conveying means. The semiconductor component is packaged in or located on the packaging means while being moved between processing systems or stations, as well as being dispensed upon manufacture completion. Increasing competition in the semiconductor industry has made it increasingly important to provide consumers with more options regarding useful output packaging means for finishing semiconductor components. Embodiments of the present invention provide a system and method that solve at least one of the aforementioned problems.

For simplicity and accuracy, the description of the preferred embodiment of the present invention is limited to the following systems and methods for transferring semiconductor components. However, those skilled in the art will understand that this does not exclude from the present invention other applications in which various basic principles, such as operational, functional or performance features, are required.

A preferred system 10 for transferring semiconductor components as shown in FIG. 1 is provided as a first embodiment of the present invention. Preferred system 10 includes a turret structure (turret) or rotating structure 12, a first carrier 14, a second carrier 16, and a collective pick and place mechanism 18.

System 10 transfers semiconductor components from first device conveyance or packaging means 20 (also referred to as input packaging means) to second device conveyance or packaging means 22 (also referred to as output packaging means). The packaging means 20, 22 may also be referred to as moving means or conveying means. The semiconductor component is packaged or stored in the packaging means or located on the packaging means while being moved between processing systems or stations within the semiconductor component manufacturing plant, as well as being distributed upon manufacture completion.

The system 10 also facilitates processing of the semiconductor component during transfer of the semiconductor component from the first packaging means 20 to the second packaging means 22. Examples of semiconductor components carried by the system 10 include, but are not limited to, semiconductor wafers, dies, and integrated circuit (IC) chips.

The first packaging means 20 is for example a tray carrier or a metal magazine. The semiconductor component is disposed, arranged or packaged on or in the first packaging means 20 when transferred to the system 10. The semiconductor component packaged in the first packaging means 20 is then loaded or transferred from the first packaging means 20 to the system 10. Preferably, system 10 includes a loading station or loading module 24. The loading station 24 is shaped and sized to receive the first packaging means 20. Preferably, the semiconductor component is loaded or transferred from the first packaging means 20 to the system 10 at the loading station 24.

The system 10 additionally includes means, devices or mechanisms to facilitate loading or transport of semiconductor components from the first packaging means 20 to the system 10. For example, various types of pick and place mechanisms known in the art may be used to transfer semiconductor components from the first packaging means 20 to the system 10. Preferably, the semiconductor component is conveyed from the first packaging means 20 to the conveyor, conveyor system or conveyor mechanism 11.

The conveyor mechanism 11 can be for example a tape drive assembly or a belt drive assembly. Preferably, the conveyor mechanism 11 transfers the semiconductor component from the loading station 24 to the turret 12. More specifically, the conveyor mechanism 11 preferably continuously transfers semiconductor components from the loading station 24 to the turret 12. The semiconductor components located on the conveyor mechanism 11 are moved from the loading station 24 to the turret 12 by the conveyor mechanism 11. The moving speed of the semiconductor component by the conveyor mechanism 11 can be measured and adjusted as necessary. For example, the operation of the conveyor mechanism 11 can be controlled by software.

2A illustrates a turret structure or turret 12 in accordance with an embodiment of the present invention, and FIG. 2B illustrates a turret structure 12 and system disposed for flexible high speed transfer of semiconductor components in accordance with an embodiment of the present invention. It is a top view which shows exemplary spatial relationship between the other members of (10). Turret 12 is also referred to as a rotating semiconductor component handling mechanism. The turret 12 includes a fixed central shaft and a rotating portion connected to the central shaft. The central shaft is preferably the first axis or major axis (eg vertical axis or z-axis) in which the rotating part can rotate around.

The rotatable structure includes a plurality of pickup heads (or turret heads) 26 connected thereto. The number of pickup heads 26 is 24 to 36, for example. The number of pickup heads 26 may vary as needed (eg, 2 to 60, or more). The pickup heads 26 are arranged spatially in a predetermined arrangement. Preferably, the pickup head 26 is spatially arranged around the central shaft. In addition, the pickup heads 26 preferably have a predetermined distance interval with respect to each other. Rotation of the rotatable structure or portion thereof about the first axis results in a rotational movement about the first axis of the pickup head 26 correspondingly. In many embodiments, each pickup head 26 is disposed at a radial or radial distance r from the first axis.

System 10 preferably includes a motor (not shown). The motor is operated to drive the rotary part and the corresponding pickup head 26 around the first axis. The motor is preferably connected to the central shaft. The operation of the motor is preferably controlled by software. Operation of the motor results in rotational movement of the pickup head 26 around the first axis along a predetermined travel profile or travel path. It will be appreciated that the predetermined movement profile of the pickup head 26 around the first axis can be changed as needed using techniques known to those skilled in the art.

Each pickup head 26 carries or receives one semiconductor component from the conveyor system or mechanism 11 at the pickup position (also known as the first position). That is, the semiconductor component is continuously transferred from the conveyor system to the pickup head 26 of the turret 12 at the pickup position.

The pickup head 26 includes a part holding or holding mechanism. Preferably, the pickup head 26 uses vacuum suction to pick up the part from the conveyor and to safely hold the part while the rotating turret 12 is in motion. It will be appreciated by those skilled in the art that alternative means or mechanisms may be used to pick up the semiconductor component from the conveyor mechanism 11 and to secure the semiconductor component during rotational movement along a predetermined movement profile.

Rotational movement of the pickup head 26 moves the semiconductor component along the circumferential path defined by the turret 12 from the pickup position to the unloading position (also known as the second position). The semiconductor component attached to the pickup head is preferably transferred to the first carrier 14 or the second carrier 16 when the pickup head 26 is in the unloading position.

As will be described in more detail below, the pickup head 26 is additionally set for on-the-fly z-axis / up and down motion with respect to its circumferential movement around the first axis. In one embodiment, the particular pickup head 26 may be moved vertically during rotational translation about the first axis or the main axis, where the vertical pickup head movement may be defined relative to the pickup head 26 itself. , Along the second or longitudinal axis parallel to the first axis in the manner shown in FIG. 2A. In another embodiment, the entire assembly (e.g., rotatable structure of the turret) moving the plurality of pickup heads 26 is perpendicular along or parallel to the first axis (i.e. +/- z-axis direction). Can be moved to provide on-the-fly up and down pick-up head motion, which minimizes system complexity, simplifies the system's control overhead, increases system output and increases system reliability To improve.

System 10 also includes a number of processing stations or modules (eg, in the manner shown in FIG. 2B) that are operated to process semiconductor components handled or transported by system 10. More specifically, when the semiconductor component is moved from the pick up position toward the unloading position, the machining module facilitates the machining of the semiconductor component. Processing modules include, but are not limited to, visual inspection modules such as image capture devices and functional test modules such as electrical test modules. The machining modules are arranged in a predetermined spatial arrangement. More specifically, the processing modules are arranged in a predetermined spatial arrangement around the first axis or central shaft of the turret 12. The spatial arrangement of the processing module can be changed as necessary. Preferably, the processing modules are spatially arranged to increase the space efficiency and throughput of the system 10. More preferably, the spatial arrangement of the processing modules is determined to increase the number of processing modules that can be used in the system 10 for processing semiconductor components.

The number and type of processing modules used in the system 10 can be changed as needed. Those skilled in the art will appreciate that the system 10 allows a plurality of machining steps to be performed on the semiconductor component, while the semiconductor component is handled or transported by the system 10 and thus the speed, accuracy, and accuracy of machining the semiconductor component by the system 10. It will be appreciated that one or more of the throughputs will be increased.

The turret structure 12 is arranged for rotationally moving or transporting its pickup head 26 from one processing station to another processing station in a synchronous or simultaneous manner. The rotation of the turret structure from a particular machining station to the next machining station is referred to as the turret index. In general, the turret index is a rotational or circumferential increase in the turret structure 12 that corresponds to or relates to the distance separated between the processing stations. Adjacent pickup heads 26 moved by the turret structure 12 continuously reach any particular processing station through the index of rotation of the turret structure. The linear or curved distance (eg, turret rotating arc length), which is the pickup head 26 movement per turret index, is deployable, based on the details of the embodiment, such as the number and / or type of processing stations considered. Or programmable parameters.

The turret structure 12 is arranged to provide on-the-fly up and down movement of the pickup head 26 as a turret index from one machining station to another. For example, for the first processing station P1 and the second processing station P2 shown in FIG. 2A, the turret structure 12 can move the pickup head 26 located at P1 in a vertical direction in a vertical direction (eg, , Along the second axis, in a direction parallel to the first axis), can further vertically move the pickup head 26 located at P2 in a vertical manner. Thus, the pickup head 26 may move up and / or down as part of each turret index, ie on-the-fly where the turret index is occurring or progressing. With regard to on-the-fly up and down pick head movements, a particular pick head 26 may transfer the device to and / or remove the device from where the pick head 26 is located. On-the-fly up and down movement of the pickup head 26 significantly increases the throughput of the system.

In certain embodiments, each pickup head 26 or set of pickup heads 26 is a pneumatic actuator, such as a solenoid-drive pneumatic, arranged to vertically move the pickup head 26 in the z-axis or longitudinal direction. Include or be connected to the cylinder. In various implementations, the turret structure 12 itself is arranged to make z-axis movement so that the pick-up head 26 carried by it can be moved vertically and vertically all at once through the z-axis movement of the turret structure. The turret structure 12 may comprise or be connected to a pneumatic cylinder, an electric solenoid, a linear motor, or other device (s) to facilitate the z-axis movement. Providing up and down on the fly movement of the pickup head 26 in the collective manner reduces system control complexity and increases machine operating speed and system throughput (UPH). Certain embodiments may additionally or alternatively utilize a z-axis movement mechanism, such as a cam-driven mechanism arranged to facilitate up and down pick-up head movement.

In general, each pickup head 26 includes a set of limiting sensors arranged to sense an upper or highest pickup head position and a lower or lowest pickup head position, or (eg, in a wireless or wired manner). ) Are connected. In some implementations, some or all of the pickup heads 26 may include or be coupled to one or more intermediate limit sensors arranged to sense pickup head position (s) between upper and lower pickup head positions. The specific limit sensor signal may include whether the position of the pickup head 26 corresponds to (a) the semiconductor component pickup or discharge position; And / or (b) determine or facilitate determination of whether a predetermined distance or separation distance condition between the distal end or end of the pickup head 26 and the processing station is met (eg, pickup head 26). ) Can drop the station vertically, and whether the rotational movement of the turret of the pickup head 26 can continue safely). Certain embodiments additionally include sensors arranged to detect rotational shifts or pick-up head positions corresponding to one or more rotational movement sensing positions.

In any station (eg, an electrical test station or visual inspection station), the control of the position of the member or device on or in preferably comprises two steps. In a first step, the pickup head 26 is located close to or very close to the surface of the placement face associated with the particular station. When pickup head 26 reaches the station, pickup head 26 moves a short vertical distance and places the device on the station. This two-stage positioning process contributes to minimizing overhead compared to devices moving from the highest or upper position to the station. The vertical distance at which the pickup head 26 is moved or moved may be a programmable parameter that may depend, for example, on the type or thickness of the member or semiconductor device under consideration.

Typically, the rotational movement of the turret 12 includes a series of short movements that feed the pick up head 26 from one processing station to another (eg, from P1 to P2). The rotational motion stop or turret wait or delay time between processing stations will generally be determined by the throughput of the slowest processing station. For example, if the test station needs about 5 seconds to test the device and the inspection station needs about 15 seconds to check the device, the wait or delay time of the turret between the processing stations will be about 15 seconds. In various implementations, the turret wait or delay time is a configurable or programmable parameter.

The moment of inertia of the turret assembly 12 determines the setting time required for the rotatable portion of the turret and / or the pickup head 26 to stabilize so that the member can be picked up and / or positioned or ejected reliably or accurately. The moment of inertia depends on the mass and vibration characteristics of the turret assembly 12. In general, the setting time may be programmatically and the appropriate setting time may be determined in terms of implementation details, the type of member under consideration, previous system operating history and / or trial and error testing.

As shown in FIGS. 3 and 4, the semiconductor component is separated from the pickup head 26 and transferred to the carriers 14, 16 in the detached position. As previously mentioned, the system 10 includes a first carrier 14 and a second carrier 16 (each of the first carrier 14 and the second carrier 16 also has a shuttle precursor. ) Or also known as packaging means). Each of the first carrier 14 and the second carrier 16 is between a first position that receives the semiconductor component from the pickup head 26 and a second position where the received semiconductor component is delivered to the collective pick and place mechanism 18. (I.e. move)

Carriers 14 and 16 have one carrier (eg, carrier 14 in FIG. 4) receiving the device from turret 12, and the other carrier 16 having a collective pick and place mechanism 18 with a semiconductor component. And return to the standby and ready position just below the carrier 14 which receives the device from the pick-up head 26 of the turret. When the carrier 14 receiving the device from the turret 12 is filled with semiconductor components, the carrier 14 moves to a delivery and empty position for delivering and providing the semiconductor components to the collective pick and place mechanism 18. do. As soon as the carrier 14 moves, the standby or ready carrier 16 may be lifted or shifted to the receiving position and begin to receive the next set of semiconductor parts from the pickup head 26. After transferring the semiconductor components to the collective pick and place mechanism 18, the next empty carrier 14 is now lowered and moved from the pickup head 26 to a standby and ready position below the carrier 16 which is containing the semiconductor components. do. The periodic movement of these two carriers 14, 16 ensures that the device throughput UPH is large or extremely large.

The first carrier 14 and the second carrier 16 have a first position (the position at which the semiconductor components are transferred from the pickup head 26 of the turret 12 to the carriers 14, 16) and the second position (the semiconductors). The component operates periodically to move between the two carriers (14, 16) from the position delivered to the collective pick and place mechanism (18). This is illustrated in FIGS. 3 and 4.

Preferably, the use of two carriers (ie, the first carrier 14 and the second carrier 16) speeds the transfer of semiconductor components from the pickup head 26 to the collective pick and place mechanism 18. Do it quickly. As the speed of the turret increases and thus more devices are operated, more carriers or shuttles are needed, as needed to increase the speed at which semiconductor components are transferred from the pickup head 26 to the collective pick and place mechanism 18. Precisors (eg, 3, 4, 6, or 8) are introduced and used in the system 10. Each of the first carrier 14 and the second carrier 16 has a first position in which the first carrier 14 and the second carrier 16 receive semiconductor components from the pickup head 26 and the received semiconductor components are collected. It may be connected to a mover or moving mechanism for moving between the second positions delivered to the enemy pick and place mechanism 18.

As shown in FIG. 4, each of the first carrier 14 and the second carrier 16 includes a plurality of receiving portions 28 (also referred to as accommodation pockets) formed on the top surface. The plurality of receptacles 28 formed on the top surfaces of the first carrier 14 and the second carrier 16 may vary as needed. The plurality of receptacles 28 are each shaped and sized to receive one semiconductor component from the pick-up head 26 of the turret. The receptacles 28 are arranged in a preset form on the carriers 14, 16. Preferably, the receptacle 28 is arranged in a straight line or transverse line on the top surface of each of the first carrier 14 and the second carrier 16. The pitch (pitch) between the receptacles 28 is preferably uniform and can be changed as necessary. In addition, the number of columns and / or rows of receptacles 28 may be changed or increased depending on the required semiconductor component capacity of each carrier 14, 16, and all columns and rows of receptacles 28 are selected from the pickup head. It may be appropriately changed so that it may be appropriately disposed with respect to (26).

Each of the first carrier 14 and the second carrier 16 is spatially moved to facilitate receipt of each successive semiconductor component in one of the plurality of receptacles 28. This movement may be facilitated by a mover or movement mechanism, preferably connected to each of the first carrier 14 and the second carrier 16. More preferably, each of the first carrier 14 and the second carrier 16 is the same distance as the pitch of the receptacles 28 between the receptacles of each successive semiconductor component in one of the plurality of receptacles 28. Is moved spatially. The speed of spatial movement of the first carrier 14 and the second carrier 16 is preferably the same and can be changed as necessary. In addition, the moving speeds of the first carrier 14 and the second carrier 16 may be software controlled.

As described above, the first carrier 14 and the second carrier 16 receive the semiconductor component at the first position and then move to the second position. The semiconductor component received by the first carrier 14 and the second carrier 16 is transferred to the collective pick and place mechanism 18 at the second position. Preferably, the collective pick and place mechanism 18 comprises a plurality of pick-up tips 30 extending from its body. The pick-up tip 30 is arranged in a predetermined form. Preferably, the pick-up tips 30 are arranged in line form and have a uniform pitch. More preferably, the spatial arrangement of the pick-up tip 30 corresponds to the arrangement of the receptacles 28 of each of the first carrier 14 and the second carrier 16. More specifically, the pitch of the pick-up tip 30 is similar to the pitch of the receptacles 28 of each of the first carrier 14 and the second carrier 16.

The collective pick and place mechanism 18 shown in FIG. 4 may be operable to deliver the semiconductor component from each of the first carrier 14 and the second carrier 16 to the discharge packaging means 22. Discharge packaging means 22 is preferably a tray carrier 32 or a tray-type carrier as shown in FIG. 2B. The tray carrier 32 is also referred to as the discharge container. The collective pick and place mechanism 18 is preferably moved to collectively receive or pick up a predetermined number of semiconductor components from each of the first carrier 14 and the second carrier 16. The movement of the collective pick and place mechanism 18 is preferably parallel to the first axis and perpendicular to the direction of movement of the carriers 14, 16 from the first position to the second position. Preferably, the collective pick and place mechanism 18 is connected to a movement controller to allow its movement. The collective pick and place mechanism 18 can be moved at different speeds in different directions as needed. Movement of the collective pick and place mechanism 18 is preferably facilitated and controlled by a movement controller.

More specifically, a predetermined number of semiconductor components are received by the pick-up tip 30 of the collective pick and place mechanism 18. The predetermined number of semiconductor components is preferably two or more. After receiving a predetermined number of semiconductor components, the collective pick and place mechanism 18 is further moved to deliver the predetermined number of semiconductor components to the tray carrier 32. This movement is preferably parallel to the first axis and perpendicular to the direction of movement from the first position to the second position of the carriers 14, 16. More specifically, the collective pick and place mechanism 18 is moved to transfer the semiconductor component from the pickup tip 30 to the receiving pocket or the receiving portion 34 of the tray carrier 32. Those skilled in the art will appreciate that the collective pick and place mechanism 18 facilitates a batch or collective movement of a predetermined number of semiconductor components from the first carrier 14 and the second carrier 16 to the tray carrier 32. You will know.

The system 10 of the present invention provides a series of transfers of semiconductor components (from the conveyor mechanism 11 to the turret 12 and from the turret 12 to the first carrier 14 and the second carrier 16 respectively). It facilitates the change of the package to a tray or collective transfer (each of the first carrier 14 and the second carrier 16 to the tray carrier 32). The performance of the collective delivery of a predetermined number of semiconductor components of the collective pick and place mechanism 18 is such that the tray carrier 32 is used by the system 10 as an optional ejection packaging means 22 for the semiconductor components. Make it possible. Thus, this allows the semiconductor component manufacturer to provide the tray carrier 32 as a kind of ejection packaging means 22 for the customer. Those skilled in the art will appreciate that other forms and configurations of tray carriers 32 may be used in the system 10.

Preferably system 10 also includes at least one of conveyor mechanism 11, turret 12, processing module, first carrier 14, second carrier 16 and collective pick and place mechanism 18. And a programmable controller or processor (not shown) in signal communication with. Preferably, the programmable controller is programmed to control the operation of at least one of the turret 12, the processing module, the first carrier 14, the second carrier 16, and the collective pick and place mechanism 18. For example, the programmable controller preferably sets the speed and duration of operation of at least one of the turret 12, the processing module, the first carrier 14, the second carrier 16, and the collective pick and place mechanism 18. To control.

In accordance with one embodiment of the present invention, an exemplary method 100 is also provided for semiconductor component delivery. A flowchart of exemplary steps of the method 100 is provided in FIG. 5.

In step 110 of the method 100, the semiconductor component is loaded or introduced into the system 10. As noted above, the semiconductor component is loaded into the system at the loading module or loading station 24. More specifically, the semiconductor component is transferred from the first packaging means 20 to the conveyor mechanism 11 in step 110. Such delivery is mediated using various means or mechanisms known to those skilled in the art, such as the collective pick and place mechanism 18. In step 120, the conveyor mechanism 11 continuously transfers the semiconductor component from the loading module 24 to the turret 12.

In step 130, the semiconductor components are continuously transferred from the conveyor mechanism 11 to the pickup head 26 of the turret 12 at the pickup position. More specifically, the semiconductor components are each continuously transferred from a portion of the conveyor mechanism 11 (eg a transfer belt) to the subsequent pickup head 26 of the turret 12. As noted above, each pickup head 26 includes a channel or air passage therein. Vacuum or suction is applied through the channel to pick up the semiconductor component from the conveyor mechanism 11. Alternative means or mechanisms may also be applied to the pickup head 26 for pickup of semiconductor components.

In step 140, the semiconductor component moved by the pickup head 26 is transferred from a series of processing modules (eg, initial or first processing module to final processing module, where the processing module is subjected to electrical testing, optical inspection, and / or other operations). Rotational transmission in a manner that facilitates semiconductor component manufacturing, testing and / or verification procedures. In step 150, pickup head 26 delivers the semiconductor component to the unloading position (eg, after the semiconductor component has been processed in the final processing module). As described above, the drive driver facilitates the rotational movement of the pickup head 26 from the pickup position to the unloading position. The movement of the pickup head 26 from the pickup position to the unloading position follows a predetermined movement profile. The semiconductor component accommodated in the pickup head 26 is processed while moving from the pickup position to the unloading position. Steps 130, 140 and 150 are thus executed continuously or simultaneously, ie in parallel, by the forward rotational movement of the turret which spatially moves the pickup head 26 from one processing module to another.

An important point in the form of the turret mechanism is the on-the-fly up-down movement of the pickup head 26 as the pickup head 26 is moved from one processing station to another processing station. As a result, the index time in the system 10 is significantly reduced, and the system UPH is significantly increased.

System 10 includes a processing module, such as one or more visual inspection modules and one or more electrical, optical, or electro-optical test modules, each of which is adapted to move the semiconductor component while the semiconductor component moves from the picked up position to the unloaded position. Is arranged to process. The number and type of processing modules may vary depending on the needs of the system 10 user. The ability to execute multiple processing steps in the semiconductor component while the semiconductor component moves from the picked up position to the unloaded position enhances at least one of the speed, accuracy, and throughput of semiconductor component manufacturing.

In step 150, the semiconductor component is continuously transferred from the pickup head 26 of the turret to the first carrier 14 in the first or receiving position. More specifically, a predetermined number of semiconductor components (or a plurality of semiconductor components) are continuously transferred from the pickup head 26 to the first carrier 14 of step 150. Each of the predetermined number of semiconductor components is transferred from one pick-up head 26 to one of a plurality of receptacles 28 formed in the first carrier 14 at a first position. Preferably, pickup head 26 is moved a predetermined distance towards the first carrier during step 150. More preferably, air enters the channel of the pickup head 26 to separate or transfer the semiconductor component from the pickup head 26 to the receiving portion 28 of the first carrier 14. Other means or mechanisms may be applied to move the semiconductor component from the pickup head 26 to the receptacle 28 of the first carrier 14.

The first carrier 14 is preferably spatially moved between the accommodation of each successive semiconductor component within one of the plurality of receptacles 28 of the first carrier 14. More specifically, the first carrier 14 is preferably at a distance equal to the pitch of the receptacles between the receptacles of each successive semiconductor component within one of the plurality of receptacles 28 of the first carrier 14. Moved spatially.

In step 160, the system 10 determines whether the first carrier 14 has been filled, ie should be moved to the collective pick and place mechanism 18 so that the first carrier 14 is empty. If not, the method 100 continues to deliver the semiconductor component to the receiving carrier (first carrier 14 in this example) at step 150.

If only the first carrier 14 is empty and unloaded, the first carrier 14 is moved from the first position to the second position or reciprocated in step 170. Accordingly, the collective pick and place mechanism 18 approaches and unloads the first carrier 14. In addition, the second carrier 16 is moved or reciprocated to the first or receptive position in step 175 simultaneously with or almost simultaneously with the movement of the first carrier in step 170. Once the second carrier 16 is in the first or receiving position (ie, the semiconductor component or device unloading position, from which position the semiconductor component is unloaded from the pickup head 26 into the carrier 16), the semiconductor The parts are continuously transferred from the pickup head 26 of the turret to the second carrier 16 in step 150.

Once the first carrier 14 has been moved, shifted, or delivered to the collective pick and place mechanism 18 in step 170, the predetermined number of moves moved by the first carrier 14 in step 180. The semiconductor components are collectively transferred from the first carrier 14 to the collective pick and place mechanism 18, more specifically to the pick-up tip 30 of the collective pick and place mechanism 18. That is, in step 180, a predetermined number of semiconductor components are simultaneously delivered from the receiving portion of the first carrier 14 to the pick-up tip 30 of the collective pick and place mechanism 18. The pick-up tip 30 of the collective pick and place mechanism 18 picks up two or more semiconductor components (eg, 2, 8, 10, 12, 20, or more) from the first carrier 14. Are collectively moved towards the first carrier 14. Each of the distances, speeds and directions of movement of the pick-up tip 30 can be controlled by a programmable controller and can be changed as needed.

In conjunction with step 180, the predetermined number of semiconductor components is transferred from the pick-up tip 30 of the collective pick and place mechanism 18 to the second or discharge packing medium 22, in some embodiments more particularly to the tray carrier 32. Is delivered. Tray carrier 32 is also referred to as a container for semiconductor components. The pick-up tip 30 of the collective pick and place mechanism 18 is moved towards the tray carrier 32 during step 180. A predetermined number of semiconductor components are transferred from the pick-up tip 30 of the collective pick and place mechanism 18 to the receiving pocket 34 formed on the surface of the tray carrier 32. The receiving pocket 34 of the tray carrier 32 is arranged in a spatially predetermined form. Preferably, the pitch of the receiving pocket 34 of the tray carrier 32 is uniform. More specifically, the pitch of the receiving pocket 34 of the tray carrier 32 corresponds to the pitch of the pick-up tip 30 of the collective pick and place mechanism 18, and thus the first carrier 14 and the second carrier. (16) corresponds to the pitch of each receptacle. Corresponding pockets of the receiving pocket 34 of the tray carrier 32, the pick-up tip 30 of the collective pick and place mechanism 18, and the receptacle 28 of each of the first and second carriers 14, 16, or Similar pitches allow for accurate transfer of semiconductor components therebetween. The use of the collective pick and place mechanism 18 also results in a significant increase in the system (UPH).

As described above, the collective pick and place mechanism 18 may vary the direction and / or speed required to facilitate the transfer of semiconductor components between the first carrier 14 or the second carrier 16 and the tray carrier 32. Can be moved to. Movement of the collective pick and place mechanism 18 is possible by a motion controller that can be controlled by software. In addition, system 10 may include additional pick and place mechanisms 18 and / or carriers 14, 16 (also known as containers) depending on the details of the implementation. The semiconductor components may be transferred continuously or collectively between the additional pick and place mechanism and the carrier before being unloaded or transported into the tray carrier 32. The additional pick and place mechanism 18 and the carriers 14, 16 may be similar or different in design and structure.

The first carrier 14 and the second carrier 16 operate in a cyclical arrangement, which significantly increases the system UPH. While the first carrier 14 receives the part from the pickup head 26 in the first position, the second carrier 16 delivers the part to the collective pick and place mechanism 18 in the second position, Immediately below the carrier 14, which is currently receiving parts from the pickup head, it is lowered and moved back to the ready or standby position close to the first position. That is, the second carrier 16 waits for the first carrier 14 to complete the pickup of the part and move to the second position (the device unloading position). As soon as the first carrier 14 is moved to the unloading position, the second carrier 16 is raised and ready to receive parts from the pickup head 26. Typically, any time delay associated with moving the empty carrier 16 vertically from the standby position toward the receiving position from which the parts may be loaded or loaded from the pickup head 26 may be minimal or neglected.

Thus, the predetermined number of semiconductor components is transferred from the pickup head 26 to the first carrier 14 at the first position, while the corresponding number of semiconductor components is at the second position from the second carrier 16. It is guaranteed to be conveyed back to the collective pick and place mechanism 18. The use of the first carrier 14 and the second carrier 16 (ie, two carriers) increases the speed of transferring semiconductor components from the pickup head 26 to the collective pick and place mechanism 18. More carriers may be introduced into the system 10 as needed to further increase the speed of movement of the semiconductor components from the pickup head 26 to the collective pick and place mechanism 18.

In short, the exemplary system 10 and the exemplary method 100 provided by the present invention allow a semiconductor component to be placed on a tray carrier (ie, tray-type packaging means) 14, 16 or another type of carrier container. To be discharged. This allows the user of the system to provide the consumer with additional semiconductor component output packaging means options. In addition, different input packaging means can be used with semiconductor components that are loaded or introduced into the system. The flexibility of the input packaging means and the output packaging means increases the usability and efficiency of the example system 10 and the example method 100.

In addition, the exemplary system 10 and the exemplary method 100 provided by the present invention enable the conversion of a series of inputs of individual semiconductor components into a collective output of a plurality of semiconductor components. In addition, the exemplary system 10 and method 100 provided by the present invention allows multiple processing steps to be performed on a semiconductor component when the semiconductor component is transferred between different packaging means. The ability to perform a plurality of processing steps on a semiconductor component while transferring the semiconductor component by the system 10 increases at least one of the speed, throughput, and accuracy of the semiconductor component fabrication. In addition, the use of the turret 12 helps to increase the space efficiency of the system 10.

Those skilled in the art can additionally or alternatively arrange the system 10 according to the invention to unload parts, wherein the output packaging means 22 is treated as an input packaging means 20, the apparatus being an input packaging means. It will be understood that it proceeds in reverse order to (20). This may be appropriate, in particular, in situations where the parts carrier vessels 20, 22 are used before and after the recheck and the parts or devices need to be rechecked.

As mentioned above, exemplary systems and exemplary methods for transferring semiconductor components provided by embodiments of the present invention are described. Exemplary systems and methods solve at least one of the problems or problems encountered during fabrication of the aforementioned semiconductor components. However, those skilled in the art will understand that the invention is not limited to the specific form, arrangement or structure of the embodiments described above. It will be apparent to those skilled in the art that many changes and / or modifications can be made without departing from the scope and spirit of the invention.

Claims (62)

A component carrier formed to sequentially receive a plurality of semiconductor components; And
And a pick-and-place mechanism for collectively picking up a plurality of semiconductor components moved by the component carrier and transferring the plurality of semiconductor components from the component carrier to packaging means. The method of claim 1,
And a rotatable semiconductor component handling device that sequentially receives a plurality of semiconductor components at a pick-up position and sequentially transfers the plurality of semiconductor components from the loading position to an unloading position. The method of claim 2,
And said rotatable semiconductor component handling device comprises a plurality of heads, said plurality of heads each being configured to carry one of said plurality of semiconductor components. The method of claim 3,
And the plurality of heads each rotate in a movement path designated to transfer one of the plurality of semiconductor parts from the loading position to the unloading position. The method of claim 4, wherein
And the plurality of heads each comprise a holding device for providing vacuum suction to hold one of the plurality of semiconductor components. The method of claim 4, wherein
The component carrier has a plurality of receptacles, the plurality of receptacles each being configured to receive one of a plurality of semiconductor components, and the plurality of heads respectively include one of a plurality of transferred semiconductor components of the plurality of component carriers. A semiconductor component transport system, which can be moved vertically to be delivered to one of the receptacles. The method of claim 4, wherein
And a plurality of processing modules disposed adjacent to the designated movement path, wherein the plurality of processing modules are configured to process a plurality of semiconductor components moved by the plurality of heads during rotational movement along the designated movement path. A semiconductor component transfer system, characterized in that. The method of claim 7, wherein the plurality of processing modules are:
And at least one inspection module and at least one test module for respectively inspecting and testing a plurality of semiconductor components moved by a plurality of heads during rotational movement along a designated movement path. The method of claim 7, wherein
A loading module for transferring a plurality of semiconductor components; And,
A conveyor system for transferring a plurality of semiconductor components from said loading module to a pickup position,
And the plurality of semiconductor components conveyed by the loading module are sequentially received in the plurality of heads of the rotating semiconductor component handling apparatus at the pick-up position. The method of claim 8,
And a programmable controller that controls rotational movement of at least one of said rotatable semiconductor component handling devices and drive of said pick and place mechanism. The method of claim 1,
Wherein the pick and place mechanism includes a plurality of pick-up tips that can move simultaneously toward the component carrier to collectively pick up the plurality of semiconductor components from the component carrier. The method of claim 11,
And the plurality of receiving portions of the component carriers are arranged at regular intervals. The method of claim 11,
And the plurality of pick-up tips are arranged in a straight line at intervals equal to the arrangement interval of the plurality of receiving portions of the component carriers. The method of claim 11,
And said plurality of pick-up tips are movable simultaneously to collectively transfer said plurality of semiconductor components from said component carrier to packaging means. The method of claim 14,
And said packaging means is a tray-type packaging means. 16. The method of claim 15,
And said tray-type packaging means comprise a plurality of receiving pockets, said plurality of receiving pockets having a spacing corresponding to the spacing of said plurality of receiving portions of said component carrier. The method of claim 12,
The component carrier is spatially moved from the rotatable semiconductor component handling apparatus by a distance equal to the distance between the plurality of housing portions between the housing of one of the semiconductor components and the subsequent receipt of the semiconductor component. Semiconductor component transfer system. First component packaging means;
Second component packaging means;
A first component carrier and a second component carrier, wherein the first and second component carriers are formed to periodically move between the first position and the second position, each of the first and second component carriers being a plurality of semiconductors A plurality of component carriers configured to move the components;
A pick and place mechanism for collectively transferring semiconductor components between each of the first and second component carriers and one of the first and second component packaging means; And
And a rotatable semiconductor component handling device that sequentially transfers the semiconductor component by rotational movement between each of the first and second component carriers and one of the first and second component packaging means. Conveying system. The method of claim 18,
And the plurality of component carriers are each configured to periodically move between a first position and a second position. The method of claim 18,
The pick and place mechanism includes a plurality of pick-up tips moveable to collectively transfer semiconductor components between each of the first and second component carriers and one of the first component packaging means and the second component packaging means. A semiconductor component transfer system, characterized in that. The method of claim 20,
And the first and second component carriers each include a plurality of receiving portions capable of receiving a plurality of semiconductor components, the plurality of receiving portions arranged at regular intervals. The method of claim 21,
And the plurality of pick-up tips are arranged at the same interval as the spacing of the plurality of receptacles of each of the first and second component carriers. The method of claim 18,
The rotatable semiconductor component handling apparatus includes a plurality of heads for sequentially transferring a plurality of semiconductor components between each of the first and second component carriers and one of the first component packaging means and the second component packaging means. Semiconductor component transfer system. A plurality of turret heads, the plurality of turret heads each conveying one of a plurality of semiconductor components and rotating in a designated movement path, thereby moving one of the plurality of semiconductor components along a designated path Turret structure;
A first component carrier capable of moving between the first position and the second position, the first component carrier being sequentially positioned to receive a first portion of the plurality of semiconductor components from a corresponding first plurality of turret heads; And
A pick and place mechanism configured to pick up a first portion of the plurality of semiconductor components from the first component carrier and collectively transfer it from the first component carrier to the packaging means when the first component carrier is in the second position; A semiconductor component transfer system, characterized in that. 25. The method of claim 24,
And a second component carrier capable of moving the first position and the second position, wherein the second component carrier, when placed in the first position, removes a second portion of the plurality of semiconductor components from the corresponding second plurality of turret heads. Formed to receive sequentially,
The pick and place mechanism is configured to pick up a second portion of the plurality of semiconductor components from the second component carrier and collectively transfer it from the second component carrier to the packaging means when the second component carrier is in the second position. A semiconductor component transfer system, characterized in that. The method of claim 25,
And the first component carrier and the second component carrier are formed to be periodically moved between the first position and the second position. The method of claim 26,
Operation of the first and second component carriers for receiving and transferring the first and second portions of a plurality of semiconductor components is performed independently and periodically. The method of claim 25,
And the plurality of turret heads are movable vertically to deliver the transferred semiconductor components to the first and second component carriers, respectively. The method of claim 25,
Wherein the pick and place mechanism is operable to collectively deliver the first and second portions of the plurality of semiconductor components to the packaging means in a periodic manner. The method of claim 25,
The first and second component carriers each include a plurality of receiving portions arranged at regular intervals, the plurality of receiving portions being formed to receive one of the plurality of semiconductor components, respectively. The method of claim 30,
And the pick and place mechanism includes a plurality of pick-up tips, the plurality of pick-up tips having a spacing equal to the spacing of the plurality of receptacles. The method of claim 30,
And the plurality of pick-up tips are movable vertically to collectively receive each of the first and second portions of the plurality of semiconductor components from the first and second component carriers. 25. The method of claim 24,
Said packaging means being a tray-type packaging means comprising a plurality of receiving pockets configured to receive a plurality of semiconductor components from a pick and place mechanism. 25. The method of claim 24,
And a plurality of processing modules formed and arranged to process the plurality of semiconductor components carried by the plurality of turret heads while the plurality of turret heads are rotating along a designated movement path. Conveying system. A first component carrier for transferring a plurality of semiconductor components;
A pick and place mechanism configured to collectively transfer semiconductor components between the first component carrier and packaging means; And
And a rotatable turret structure that includes a plurality of turret heads that rotate in a designated movement path and sequentially receive a plurality of semiconductor components from the first component carrier and move along a designated movement path. Semiconductor component transfer system. 36. The method of claim 35,
A second component carrier for transferring a plurality of semiconductor components,
The pick and place mechanism is configured to collectively transfer semiconductor components between the second component carrier and packaging means,
And the plurality of turret heads are configured to sequentially receive a plurality of semiconductor components from the second component carrier and to transport them along a designated movement path. The method of claim 36,
And the first component carrier and the second component carrier are capable of moving periodically between the first position and the second position. The method of claim 36,
The pick and place mechanism includes a plurality of pick-up tips arranged at regular intervals. The method of claim 38,
The first component carrier and the second component carrier each include a plurality of receptacles capable of accommodating a plurality of semiconductor components, the plurality of receptacles of each of the first component carrier and the second component carrier being equal to the spacing of the pick-up tip. A semiconductor component transport system having a spacing. In the method of transferring a plurality of semiconductor parts,
Sequentially transferring a plurality of semiconductor components from the rotatable semiconductor component handling apparatus to the component carrier;
Collectively recovering a plurality of semiconductor components from the component carriers; And
And collectively transferring the recovered plurality of semiconductor components from the component carrier to the packaging means. The method of claim 40,
And collectively withdrawing the plurality of semiconductor components from the component carrier, moving the pick and place mechanism to collectively pick up the plurality of semiconductor components from the component carrier. The method of claim 41, wherein
The rotating semiconductor component handling apparatus includes a plurality of heads configured to transfer a plurality of semiconductor components, and the step of sequentially transferring the plurality of semiconductor components from the rotating semiconductor component handling apparatus to the component carrier includes transferred semiconductors. And rotating the plurality of heads respectively along a designated movement path to rotate the component along the designated movement path. The method of claim 42, wherein
Wherein each of the plurality of heads can be moved vertically to move the transferred semiconductor component to the component carrier. The method of claim 43,
And processing the plurality of semiconductor components during the rotational movement of the plurality of semiconductor components along a designated movement path. The method of claim 44,
The processing of the plurality of semiconductor parts may include performing at least one of an inspection process and a test process while rotating the plurality of semiconductor parts along a designated movement path. The method of claim 41, wherein
Wherein the pick and place mechanism comprises a plurality of pick-up tips capable of picking up a plurality of semiconductor components from a component carrier. 47. The method of claim 46 wherein
Transferring the plurality of pick-up tips toward the component carrier to collectively pick up the plurality of semiconductor components from the component carrier. The method of claim 47,
And simultaneously moving the plurality of pick-up tips to collectively transfer the plurality of semiconductor components from the component carrier to the packaging means. 47. The method of claim 46 wherein
And the plurality of pick-up tips of the pick and place mechanism are arranged at regular intervals. 47. The method of claim 46 wherein
The component carrier comprises a plurality of receptacles formed to receive a plurality of semiconductor components, the plurality of receptacles of the component carrier and the plurality of pick-up tips of the pick and place mechanism arranged at corresponding intervals How to transport parts. 47. The method of claim 46 wherein
The packaging means is a tray-type packaging means comprising a plurality of receiving pockets, the plurality of receiving pockets having a spacing corresponding to the plurality of receptacles of the component carrier and the plurality of pick-up tips of the pick and place mechanism. Semiconductor component transfer method. 51. The method of claim 50,
Moving the component carrier by a distance equal to the distance between the plurality of receptacles between the continuous transfer of the semiconductor component from the rotatable semiconductor component handling device to the component carrier. Way. 51. The method of claim 50,
Moving the component carrier from an input position to an output position, wherein when the component carrier is in the input position, a plurality of semiconductor components are moved from the rotatable semiconductor component handling device to the plurality of receptacles of the component carrier. A semiconductor, characterized in that it is received sequentially and when the component carrier is in the output position, the plurality of semiconductor components carried by the component carrier are collectively picked up by the plurality of pick-up tips of the pick and place mechanism. How to transport parts. 54. The method of claim 53,
Program at least one of the rotating semiconductor component handling device, the component carrier and the pick and place mechanism to control at least one of rotational movement of the rotating semiconductor component handling device, movement of the component carrier, and driving of the pick and place mechanism. The method of transferring a semiconductor component, further comprising the step of connecting a possible controller. In the method of transferring a plurality of semiconductor parts,
Transferring the semiconductor component from the input packaging means to an input position of the rotatable component handling apparatus;
Moving the semiconductor component along a rotational movement path between the input position and the unloading position of the rotatable semiconductor component handling apparatus; And
Transferring the semiconductor component from an unloading position to an output packaging means;
One of the steps of transferring the semiconductor component to the input position of the rotatable component handling device and transferring the semiconductor component from the unloaded position to the output packaging means is:
Sequentially transferring the semiconductor component between the rotatable semiconductor component handling apparatus and a first component carrier; And
And collectively transferring the semiconductor component between the first component carrier and one of the input packaging means and the output packaging means. The method of claim 55,
Processing the semiconductor component at a specific location on the rotational movement path while transferring the plurality of semiconductor components between the input position and the unloading position. The method of claim 55,
One of the steps of transferring the semiconductor component to the input position of the rotatable component handling device and transferring the semiconductor component from the unloaded position to the output packaging means is:
Sequentially transferring the semiconductor component between the rotating semiconductor component handling apparatus and a second component carrier; And
Collectively transferring the semiconductor component between the second component carrier and one of the input packaging means and the output packaging means. The method of claim 57,
And sequentially delivering and collectively delivering the semiconductor components comprise periodically moving the first component carrier with respect to the second component carrier. The method of claim 57,
Collectively transferring the semiconductor component between component carriers and one of the input packaging means and the output packaging means comprises simultaneously moving a plurality of semiconductor components using a pick and place mechanism. A semiconductor component transfer method characterized by the above-mentioned. The method of claim 59,
The pick and place mechanism includes a plurality of pickup tips that can be moved to collectively transfer semiconductor components between the component carriers and one of the input packaging means and the output packaging means. How to transport parts. 64. The method of claim 60,
And the plurality of pick-up tips are arranged at regular intervals. 62. The method of claim 61,
Each of the first component carrier and the second component carrier includes a plurality of receiving pockets configured to receive semiconductor components, the plurality of receiving pockets of the first component carrier and the second component carrier being the same as the plurality of pick-up tips. The semiconductor component transfer method characterized by having a space | interval.

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