CN103094165A - Jacking component used for chip transferring equipment and corresponding chip transferring equipment - Google Patents
Jacking component used for chip transferring equipment and corresponding chip transferring equipment Download PDFInfo
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- CN103094165A CN103094165A CN2011103340444A CN201110334044A CN103094165A CN 103094165 A CN103094165 A CN 103094165A CN 2011103340444 A CN2011103340444 A CN 2011103340444A CN 201110334044 A CN201110334044 A CN 201110334044A CN 103094165 A CN103094165 A CN 103094165A
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Abstract
The invention provides a jacking component used for a chip transferring equipment. The jacking component comprises a body and at least three supporting bodies extending from the body. The top ends of the at least three supporting bodies are on the same plane and the plane is basically vertical to the body of the jacking component. The jacking component used for the chip transferring equipment is capable of enabling the chip to be jacked steadily.
Description
Technical field
The invention belongs to the encapsulation technology field of sensor chip, be specifically related to chip-transfer apparatus.
Background technology
The basic operational sequence of the packaging process of wafer has: bottom preparation, scribing, get procuratorial work before sheet, procuratorial work, bonding die, routing, encapsulation, encapsulation, plating, Trim Molding, lettering and final test etc.
The bottom preparation is mainly the ending in wafer production process, need to be polished the thin wafer that could put into the special package body for those and polish, and removes impaired part and the dirt of bottom of wafer.Scribing is to utilize scribing saw or line-lift-off technology that wafer-separate is become one single chip.The non-defective unit chip on picker by after being recognized, just pick out from stroke broken wafer and be placed in carrier, this is for getting sheet and carrying.Subsequently, the chip in pallet all will be through the visual inspection of optical instrument, to determine whether the edge is complete, and contamination-free and blemish are arranged.After inspection, each chip attach is arrived the chip installation area territory of packaging body with forms such as silver slurry adhesive materials.Carry out subsequently the techniques such as routing.
With regard to general chip, be pick up the chip after scribing is processed and put it into carrier by pick device.Concrete pick-up operation comprises and utilizes thimble with chip jack-up from the carrier film, then will and put into carrier by the chip pickup of jack-up by mechanism for picking.Conventional chip is the integral body of not being with any hole, but some chip has hole thereon, such as sensor chip (for example, MEMS pressure sensor chip).The existence of hole makes the plant equipment that can't directly use conventional chip in the encapsulation process of this class chip.In addition, for not having pertusate chip, the plant equipment that is used for conventional chip in encapsulation process is subjected to the restriction of its thimble structure, and also existing can't be with the problem of the steady jack-up of chip.Thus, be necessary this kind equipment is improved.
Summary of the invention
In view of this, at first the present invention provides a kind of jack-up parts that are applied to chip-transfer apparatus, and with jack-up chip reposefully, no matter it has hole still there is no hole.Jack-up parts for chip-transfer apparatus of the present invention comprise body and from extended at least three supporters of body, the top of described at least three supporters is at same plane, and the body of the substantially vertical described jack-up parts in this plane.
The jack-up parts that are applied to chip-transfer apparatus of the present invention, the center of being preferred for has the chip of hole section, and the top of at least three supporters of described jack-up parts is centered around the outside of described hole section with respect to the hole section of this chip center the time.
The jack-up parts that are applied to chip-transfer apparatus of the present invention preferably, extend four supporters from described jack-up hardware body.
the present invention also provides a kind of chip-transfer apparatus, it comprises be used to the feeding part of sending into chip and lead frame, the detection part that chip is detected, the pick-up part that is used for chip pickup, be used for chip jack-up so that the jack-up parts that pick up, and for controlling described feeding part, detection part, the jack-up parts, and the control assembly of described pick-up part operation, described jack-up parts comprise body and from extended at least three supporters of body, the top of described at least three supporters is at same plane, and the body of the substantially vertical described jack-up parts in this plane.
Chip-transfer apparatus of the present invention is preferred for shifting the centre and has the chip of hole section, and the top of at least three supporters of described jack-up parts is centered around the outside of described hole section with respect to the hole section of this chip center the time.
Chip-transfer apparatus of the present invention preferably, is extended four supporters from described jack-up hardware body.
The present invention also provides a kind of spot gluing equipment that is used in the process that the chip with hole section is encapsulated, comprise apparatus body, the fixture that is connected with described apparatus body, the point glue component that is connected with described fixture, and the controller of controlling described glue component work, wherein, described controller is configured to carry out many places point glue around the hole section of the chip lead frame for the treatment of a glue, and the hole section of wherein said lead frame is corresponding to the hole section of described chip.
the present invention also provides a kind of system of encapsulation of the chip be used to having hole section again, described equipment comprises chip-transfer apparatus, the spot gluing equipment that couples with chip-transfer apparatus, and couple respectively and control the controller of its work with described transfer equipment and described spot gluing equipment, described chip-transfer apparatus comprises the feeding part of sending into chip and lead frame, the detection part that chip is detected, the pick-up part that is used for chip pickup, reach chip jack-up so that the jack-up parts that pick up, described spot gluing equipment comprises apparatus body, the fixture that is connected with described apparatus body, the point glue component that is connected with described fixture, wherein, the jack-up parts of described feeding part comprise body and from extended at least three supporters of body, the top of described at least three supporters is at the same plane of the body that is basically perpendicular to described jack-up parts and with respect to the hole section of described chip center, the top of at least three supporters of described jack-up parts is in the outside of described hole section and around described hole section, described controller is configured to carry out many places point glue around the hole section of the chip lead frame for the treatment of a glue, the hole section of wherein said lead frame is corresponding to the hole section of described chip.
The present invention also provides a kind of system of encapsulation of the chip be used to having hole section again, preferably, extends four supporters from the body of described jack-up parts.
According to the present invention, in above each execution mode, described chip is preferably sensor chip.
Jack-up parts provided by the invention can be reposefully with chip jack-up, and the equipment or the system that use these jack-up parts can and and then pick up the steady jack-up of chip equally.Spot gluing equipment provided by the present invention, due to multi-point adhesive, thus bonding chip better.
Description of drawings
Fig. 1 is the schematic diagram that is placed on the chip on carrier film;
Fig. 2 is the schematic diagram of existing conventional thimble;
Fig. 3 is the thimble that is applied to chip-transfer apparatus according to the embodiment of the present invention;
The schematic diagram that has the chip of hole section centered by Fig. 4;
Fig. 5 is the structural representation of chip-transfer apparatus according to the embodiment of the present invention;
Fig. 6 is the structural representation of spot gluing equipment according to the embodiment of the present invention;
Fig. 7 has illustrated to have the lead frame of hole section 80; And
Fig. 8 has illustrated the lead frame after some glue.
Embodiment
Below with reference to accompanying drawing to further elaboration the present invention.Need to prove, accompanying drawing only is used for signal, does not limit the size, ratio of the parts of illustrating etc. at this point, and identical label represents same or analogous parts in the accompanying drawings.
Fig. 1 is the signal that is placed on the chip on carrier film.Before carrying out the picking up of chip, as shown in Figure 1, a plurality of chips 10 are placed on carrier film 12.Fig. 2 is the schematic diagram of existing conventional jacking device, meaning as shown in the figure, and conventional jacking device is the thimble of single end head, that is, extend an end 21 from 20 of the body parts of thimble.Thimble is under the control of chip-transfer apparatus (not shown), touch the bottom (annotate: said " bottom " refers to the face relative with the face of carrier film 12 carries chips) of carrier film 12, and the jack-up that makes progress is so that chip breaks away from carrier film 12, opposite side in this bottom, being the chip 10 that is attached on carrier film, is the position of the corresponding chip center in carrier film 12 bottoms and thimble touches.In the situation that thimble is single end head, might makes the chip of being swung to the side by the chip of jack-up when leaving carrier film, thereby fit together with other chip.
Fig. 3 is the jack-up parts that are applied to chip-transfer apparatus according to the embodiment of the present invention.As shown in the figure, jack-up parts 4 comprise body 41 and from extended four supporters 42,43,44 of body, and 45.Four supporters 42,43,44 and 45 top are at same plane, and this plane is substantially vertical with the body of described jack-up parts.Need to prove, in all examples of the present invention, described " substantially vertical " is to consider the error that may cause in the processes such as manufacturing, assembling in practical application, and substantially vertical error is preferably between ± 2o; Further, preferably this plane is vertical with the body of described jack-up parts.In addition, need to prove, the part that the jack-up parts that jack-up hardware body described herein refers to directly extend supporter, the body that does not at this point limit the jack-up parts can only be linear pattern as schematically shown in Figure 3, correspondingly, basic vertical to refer in this application the part of directly extending supporter with these jack-up parts perpendicular with described body.In addition, only provided the part of jack-up parts involved in the present invention in this example, do not limited at this point that in practical application, the jack-up parts only have the part of illustrating.
After jack-up parts shown in Figure 3 are applied to chip-transfer apparatus, under the control of chip-transfer apparatus, being similar to above in conjunction with Fig. 1 and the described mode of Fig. 2, with chip jack-up from the carrier film.Because jack-up parts of the present invention have supporter (being four supporters as the present embodiment) more than three, and the top of supporter is on the substantially vertical plane of same and this body, thereby can guarantee reposefully chip jack-up, and avoid being swung to chip on every side by the chip of jack-up.
Need to prove, in the explanation in conjunction with Fig. 3, describe as an example of four supporters example, but in all examples of this paper, the number of this supporter can be 3,5,6 etc., not take 4 as restriction, as long as a basic plane vertical with body can be determined in its end.
The signal that has the chip of hole section centered by Fig. 4 as shown in the figure, has hole section 50 at the center of chip 5.In following exemplary explanation, be described take chip as sensor chip.
For the chip with hole section, according to the present invention, for will be by jack-up so that the chip that picks up, at jacking device during with respect to the hole section of described chip center, the supporter top is centered around the outside of this hole section.In conjunction with Fig. 3 and Fig. 4, that is the top of the supporter 42,43,44 of thimble shown in Figure 4 and 45 all should drop on the outside of the hole section 50 of chip 5 when touching the bottom of supporting part, and in other words, the supported body 42,43,44 of hole section 50 and 45 top surround.
For chip shown in Figure 4, to be similar to above the mode of describing in conjunction with Fig. 1 and Fig. 2, the bottom of carrier film is touched in the end of jacking device shown in Figure 3, more specifically, touches the position of the corresponding chip center in carrier film 12 bottoms, with chip jack-up.Can find out, if come jack-up chip shown in Figure 4 with conventional thimble, the end of thimble falls into hole section, thereby is difficult to reach the effect of jack-up.
Fig. 5 is the structural representation of chip-transfer apparatus according to the embodiment of the present invention.Chip-transfer apparatus is for chip is picked up and it is sent into the equipment of suitable packaging part from carrier film, for the part that itself and the present invention do not have direct relation, seldom does description at this.As shown in the figure, chip-transfer apparatus comprises the feeding part 60 of sending into chip and lead frame, the detection part 61 that chip is detected, the pick-up part 62 that is used for chip pickup, with chip jack-up so that the jack-up parts 64 of pick-up part 62 operation, and the control assembly 63 that is used for controlling described feeding part, detection part, pick-up part and 64 operations of jack-up parts.In this example, jack-up parts 64 comprise body and from extended at least three supporters of body, the top of described at least three supporters is at same plane, and the plane is substantially vertical with the body of these jack-up parts, has above provided an example of jack-up parts in conjunction with Fig. 3.In the situation that described chip-transfer apparatus is used for the chip (chip as schematically shown in Figure 4) shift the centre and have hole section, with respect to the hole section of described chip center, the top of at least three supporters of described jack-up parts is centered around the outside of described hole section.To be similar to above the mode of describing in conjunction with Fig. 1 and Fig. 2, the bottom of carrier film 12 is touched in the end of the jack-up parts of chip-transfer apparatus shown in Figure 5, more specifically, touches the position of the corresponding chip center in carrier film 12 bottoms, with chip jack-up.
Fig. 6 is the spot gluing equipment that uses according in the process that the chip with hole section is encapsulated of the present invention, comprise apparatus body 70, the fixture 71 that is connected with apparatus body, by the some glue component 72 of fixture 71 clampings, and the controller 73 of control point glue component 72 work.Here need to prove, for the chip with hole section, the lead frame (pad) that is used for it has corresponding hole section equally.According to this example, controller 73 is configured to carry out many places point glue around the hole section of the chip lead frame for the treatment of a glue, and controller 73 is the control point glue component directly, also can come the control point glue component by fixture or spot gluing equipment body.If the use routine techniques as single hole point glue or picture adhesive process, is difficult to guarantee that the glue coverage rate can reach absolutely on the one hand, may make again colloid enter into the hole simultaneously.In addition, in the situation that the lead frame that described chip uses needs pre-plastic packaging, preferably, use the bi-component glue of modulation according to a certain percentage, adopt the baking condition of 150o С.Fig. 7 has illustrated to have the lead frame of hole section 80.Fig. 8 has illustrated as shown in the figure, to have carried out the lead frame after some glue many places point glue with equipment illustrated in Figure 6 around hole section 80, thereby made the colloid 90 to be enclosed in the surrounding of hole section 80.Chip is sent in lead frame by chip-transfer apparatus as shown in Figure 6, and by the colloid of hole section 80 surroundings with chip attach at lead frame.
System according to the encapsulation of the chip be used to having hole section of the present invention.The spot gluing equipment that this system comprises chip-transfer apparatus, couples with chip-transfer apparatus, and couple respectively to control the controller of its work with transfer equipment and described spot gluing equipment.Described chip-transfer apparatus comprises the feeding part of sending into chip and lead frame, and the detection part that chip is detected is used for the pick-up part of chip pickup, with chip jack-up so that the jack-up parts of pick-up part operation.Described spot gluing equipment comprises apparatus body, and the fixture that is connected with described apparatus body is by the some glue component of described fixture clamping.These jack-up parts comprise body and from extended at least three supporters of body, the top of described at least three supporters is at same plane, and at these jack-up parts during with respect to described chip, the top of at least three supporters of described jack-up parts is around the outside of described hole section, as shown in Figure 3.Described controller is configured to carry out many places point glue around the hole section of the chip lead frame for the treatment of a glue, and the hole section of wherein said lead frame is corresponding to the hole section of described chip.Can be referring to above in conjunction with the description of Fig. 6-9 about described spot gluing equipment.Need to prove, the system of encapsulation of chip that is used for having hole section according to this example, it is the control chip transfer equipment that its controller is configured to, control point gluing equipment again, but in practical application, this controller can be formed two or more control assemblies, such as difference controls metastasis equipment and spot gluing equipment etc.
Although with reference to above-mentioned embodiment, the present invention has been carried out detailed elaboration; but those of ordinary skill in the art is to be understood that; can modify or the part technical characterictic is equal to replacement the specific embodiment of the present invention; and under the spirit that does not break away from technical scheme of the present invention, it all should be encompassed in the middle of the technical scheme scope that the present invention asks for protection.
Claims (13)
1. jack-up parts that are used for chip-transfer apparatus, it is characterized in that, described jack-up parts comprise body and from extended at least three supporters of body, the top of described at least three supporters is at same plane, and the body of the substantially vertical described jack-up parts in this plane.
2. jack-up parts according to claim 1, is characterized in that, the chip center that shift has hole section, and the top of at least three supporters of described jack-up parts is centered around the outside of described hole section with respect to the hole section of this chip center the time.
3. jack-up parts according to claim 1 and 2, is characterized in that, extends four supporters from described body.
4. jack-up parts according to claim 3, is characterized in that, described chip is sensor chip.
5. chip-transfer apparatus, comprise be used to the feeding part of sending into chip and lead frame, the detection part that chip is detected, the pick-up part that is used for chip pickup, be used for chip jack-up so that the jack-up parts that pick up, and for controlling described feeding part, detection part, the jack-up parts, and the control assembly of pick-up part operation, it is characterized in that, described jack-up parts comprise body and from extended at least three supporters of body, the top of described at least three supporters is at same plane, and this plane is basically perpendicular to the body of described jack-up parts.
6. chip-transfer apparatus according to claim 5, is characterized in that, the chip center that shift has hole section, and the top of at least three supporters of described jack-up parts is centered around the outside of described hole section with respect to the hole section of this chip center the time.
7. according to claim 5 or 6 described jack-up parts, is characterized in that, extends four supporters from described body.
8. jack-up parts according to claim 7, is characterized in that, described chip is sensor chip.
9. spot gluing equipment that is used in the process that the chip with hole section is encapsulated, comprise apparatus body, the fixture that is connected with described apparatus body, the point glue component that is connected with described fixture, and the controller of controlling described glue component work, it is characterized in that, described controller is configured to carry out many places point glue around the hole section of the chip lead frame for the treatment of a glue, and the hole section of wherein said lead frame is corresponding to the hole section of described chip.
10. spot gluing equipment according to claim 9, is characterized in that, described chip is sensor chip.
11. system for the encapsulation of the chip with hole section, described equipment comprises chip-transfer apparatus, the spot gluing equipment that couples with chip-transfer apparatus, and couple respectively and control the controller of its work with described transfer equipment and described spot gluing equipment, described chip-transfer apparatus comprises the feeding part of sending into chip and lead frame, the detection part that chip is detected, the pick-up part that is used for chip pickup, reach chip jack-up so that the jack-up parts that pick up, described spot gluing equipment comprises apparatus body, the fixture that is connected with described apparatus body, the point glue component that is connected with described fixture, it is characterized in that, described jack-up parts comprise body and from extended at least three supporters of body, the top of described at least three supporters is at the same plane of the body of substantially vertical described jack-up parts, and the hole section with respect to described chip center, the top of at least three supporters of described jack-up parts is in the outside of described hole section and around described hole section, described controller is configured to carry out many places point glue around the hole section of the chip lead frame for the treatment of a glue, the hole section of wherein said lead frame is corresponding to the hole section of described chip.
12. system according to claim 11 is characterized in that, extends four supporters from the body of described jack-up parts.
13. system according to claim 11 is characterized in that, described chip is sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103340444A CN103094165A (en) | 2011-10-28 | 2011-10-28 | Jacking component used for chip transferring equipment and corresponding chip transferring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103340444A CN103094165A (en) | 2011-10-28 | 2011-10-28 | Jacking component used for chip transferring equipment and corresponding chip transferring equipment |
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|---|---|
| CN103094165A true CN103094165A (en) | 2013-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103340444A Pending CN103094165A (en) | 2011-10-28 | 2011-10-28 | Jacking component used for chip transferring equipment and corresponding chip transferring equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108160414A (en) * | 2018-01-20 | 2018-06-15 | 梵利特智能科技（苏州）有限公司 | A kind of card rubber-coated mechanism |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837223A (en) * | 1994-07-25 | 1996-02-06 | Rohm Co Ltd | Semiconductor chip pick-up equipment |
| CN1341958A (en) * | 2000-08-04 | 2002-03-27 | 株式会社东芝 | Chip pickup device and method for manufacturing semiconductor |
| CN2833881Y (en) * | 2005-08-05 | 2006-11-01 | 华南理工大学 | Full-automatic chip loader |
| CN101219422A (en) * | 2007-01-11 | 2008-07-16 | 鸿富锦精密工业（深圳）有限公司 | Gluing device and needle head replacing method |
| CN102054726A (en) * | 2009-11-02 | 2011-05-11 | 联达科技设备私人有限公司 | System and method of flexibly transmitting semiconductor component in high speed |
-
2011
- 2011-10-28 CN CN2011103340444A patent/CN103094165A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837223A (en) * | 1994-07-25 | 1996-02-06 | Rohm Co Ltd | Semiconductor chip pick-up equipment |
| CN1341958A (en) * | 2000-08-04 | 2002-03-27 | 株式会社东芝 | Chip pickup device and method for manufacturing semiconductor |
| CN2833881Y (en) * | 2005-08-05 | 2006-11-01 | 华南理工大学 | Full-automatic chip loader |
| CN101219422A (en) * | 2007-01-11 | 2008-07-16 | 鸿富锦精密工业（深圳）有限公司 | Gluing device and needle head replacing method |
| CN102054726A (en) * | 2009-11-02 | 2011-05-11 | 联达科技设备私人有限公司 | System and method of flexibly transmitting semiconductor component in high speed |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108160414A (en) * | 2018-01-20 | 2018-06-15 | 梵利特智能科技（苏州）有限公司 | A kind of card rubber-coated mechanism |
| CN108160414B (en) * | 2018-01-20 | 2024-04-02 | 梵利特智能科技（苏州）有限公司 | Card gluing mechanism |
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Application publication date: 20130508 |