TWI545680B - System and method for flexible high speed transfer of semiconductor components - Google Patents

Description

System and method for elasticizing high speed transportation of semiconductor components

The present invention generally relates to a system and method for processing semiconductor components. More specifically, the present invention relates to a system and method for transporting semiconductor components between different package components.

The transfer process between different processing stations in the manufacturing plant, and the post-manufacturing distribution process, such as semiconductor wafers, die and integrated circuit (IC) wafers, are typically packaged or stored in suitable package components ( It is also known as a transfer member or a transport member). Package components of semiconductor components are generally classified as loose package components and fixed package components. Loose package components for packaging semiconductor components include, but are not limited to, JEDEC trays, TESEC trays, multi-channel metal rafts, and tubes. An example of a fixed package member is a belt member.

It is often desirable to transport semiconductor components between different types of package components, such as from a multi-channel metal crucible to a JEDEC tray. The transport of semiconductor components between different package components typically is significantly time consuming and repetitive, and is typically not performed manually for technical and/or efficiency reasons (eg, ESD protection issues, or the possibility of creating curved wires). Accordingly, mechanical or automated systems for transporting semiconductor components between package components are designed and fabricated. As the semiconductor component manufacturing and processing industries continue to increase market competition, there is a continuing need to increase the speed and throughput of existing systems for transporting semiconductor components between different package components.

Detecting and testing (collectively referred to as processing) semiconductor components are typically performed during the entire semiconductor component process. Existence for processing or performing detection and testing of semiconducting Some traditional systems and methods of body components. However, the gradual increase in the high-volume manufacturing requirements of high-quality semiconductor components has resulted in relatively increased detection and testing (ie, processing) systems and methods capable of detecting and testing semiconductor components with increased speed and accuracy.

The pick and place mechanism is used to unload the semiconductor component from the processing system to the package member for transporting the semiconductor component forward. However, the need to increase the speed and throughput of semiconductor component manufacturing has led to a gradual increase in the need for faster and more accurate pick and place mechanisms.

During fabrication of semiconductor components, semiconductor components are typically shipped or transferred between different processing stations or processing systems. As previously mentioned, to facilitate transport between different processing stations, the semiconductor components are typically packaged in a suitable package or transfer member. Semiconductor components that are brought into the processing system are commonly referred to as input semiconductor components. After the processing system has finished processing, the results of these semiconductor components are removed from the processing system and transported to another package component. The semiconductor component removed from the processing system is referred to as an output semiconductor component.

The package components of the input semiconductor component and the output semiconductor component are typically determined or selected based on consumer or application requirements. Processing or Detecting and Testing Semiconductor Components Most conventional systems provide limited options for packaging or transferring components (for packaging output semiconductor components that are unloaded from the system). Moreover, most conventional systems and methods for processing semiconductor components have unnecessarily limited speed and accuracy limitations for processing semiconductor components. A need for systems and methods is to overcome the limitations of the aforementioned conventional systems.

Embodiments of the invention relate to a system and method for transporting semiconductor components. The system and method provided by a particular embodiment of the present invention seeks to address at least one of the issues or problems highlighted in the "prior art."

In accordance with a first aspect of a particular embodiment of the present invention, a first exemplary system for transporting semiconductor components is disclosed, the first exemplary system including a carrier for continuously receiving a plurality of semiconductor components. The carrier includes a plurality of receivers formed thereon, each of the plurality of receivers for receiving one of a plurality of semiconductor components. The system further includes a simultaneous pick and place mechanism. At the same time, the pick and place mechanism operates to receive a plurality of semiconductor components from the carrier as a whole, and then transport the received plurality of semiconductor components to a predetermined package member. At the same time, the use of suction and placement results in a significant increase in system hourly unit (UPH) production.

In accordance with a second aspect of a particular embodiment of the present invention, a second exemplary system for transporting semiconductor components is disclosed, the second exemplary system including a rotary table structure. The rotary table structure includes a plurality of pick-up heads (or rotary heads), each of the plurality of rotary heads being configured for rotational displacement for continuously transporting one of the plurality of semiconductor components from the first position to the second position. The rotary table structure is designed such that the pick head can move dynamically up and down (during each index of rotational motion of the rotary table structure). This unique feature creates a significant increase in system throughput (UPH). In some embodiments, the entire set of pick-up heads or assemblies thereof that are carried or mounted around the rotatable structure are configured to rotate in unison and vertically, so that the total cost of the rotary table can be moved vertically (eg, Cycle time and control complexity are significantly reduced via one or more linear or other types of high speed motors or another component. The system further includes: a set of carriers for picking up from a plurality of The take-up head continuously receives a plurality of semiconductor components; and a simultaneous pick-and-place mechanism for receiving a plurality of semiconductor components from the carrier as a whole. At the same time, the further operation of the pick-and-place mechanism is for transporting the received plurality of semiconductor components to a package member disk.

In accordance with a third aspect of a particular embodiment of the present invention, a third exemplary system is disclosed that includes two carriers, each carrier circulating in motion with each other, in a first position (the position at which the component is transported from the rotating head to the carrier) and Movement between the second positions (the position of the components being transported from the carrier to a simultaneous pick-and-place mechanism). When the first carrier is receiving an element from the first position rotary table pickup head, the second carrier can transfer the element to the simultaneous pick and place mechanism that is adjacent to the second position of the output disk. After the component is delivered, the second carrier moves downward and is placed under the first carrier. If the first carrier is filled, it will be moved to the same suction and placement position for unloading. At this point, the second carrier will move up to the loading position under the rotary table. In other words, the second carrier waits under the first carrier to the second position, which is a device unloading position, and the first carrier leaves the loading element, the second carrier moves upwards and is ready to receive from Pick up the components of the head. The two-carrier cyclic motion can achieve a significant increase in system throughput (UPH).

The fabrication of semiconductor components typically involves multiple process steps such as visual defect inspection and electrical testing. Some processing systems are designed to handle semiconductor components. In order to enhance the quality, speed and throughput of semiconductor component manufacturing, processing systems need to be able to process semiconductor components with higher speed and accuracy. The semiconductor component is unloaded from the processing system to the output package member, which is also known as a transfer member or a transport member. The process of transferring between the processing system or the processing station, and after the completion of the manufacturing process, the semiconductor component package, or Placed in or on the package member. The continued competition in the semiconductor industry to provide consumers with semiconductor components to post-process more available output package components has gradually increased its importance. Particular embodiments of the present invention provide systems and methods for processing at least one of the above identified problems.

For the sake of brevity and clarity, the following description of exemplary embodiments of the present invention is directed to systems and methods for transporting semiconductor components. However, it should be understood by those skilled in the art that the present invention is not limited to other applications in which the basic principles (e.g., operational, functional, or performance features) are generally employed in other embodiments of the invention.

In accordance with a first embodiment of the present invention, an exemplary system (10) for transporting semiconductor components is shown in FIG. The exemplary system (10) includes a rotary table structure (rotary table) or rotating structure (12), a first carrier (14), a second carrier (16), and a simultaneous pick-and-place mechanism (18).

The system (10) transports the semiconductor component from a first device carrying or encapsulating member (20) (also known as an input package member) to a carrier or package member 22 (also known as an output package member) Two devices. The package members (20, 22) are also referred to as transfer members or transport members. In a semiconductor component manufacturing plant, the transfer process between the processing system or the processing station, and the dispensing process after fabrication, the semiconductor component is packaged or stored, or placed in or on the package member.

During transport of the semiconductor component from the first package member (20) to the second package member (22), the system (10) also facilitates processing of the semiconductor component. Examples of semiconductor components carried by system (10) include, but are not limited to, semiconductor wafers, dies, and integrated circuits (ICs).

The first encapsulating member (20) is, for example, a tray carrier or a metal crucible. The semiconductor component is configured, arranged, or packaged in the first package when transported to the system (10) In or on the member (20). The semiconductor component packaged in the first package member (20) is then loaded or transported from the first package member (20) to the system (10). The system (10) preferably includes a load module or load station (24). The loading station (24) is shaped and sized for receiving the first package member (20). The semiconductor component is preferably loaded or transported from the first package member (20) to the system (10) at the loading station (24).

The system (10) additionally includes components, devices or mechanisms for loading or transporting semiconductor components from the first package member (20) to the system (10). For example, pick and place mechanisms of various designs known in the art can be used to transport semiconductor components from the first package member (20) to the system (10). The semiconductor component is preferably transported from the first package member (20) to a conveyor, conveyor system or conveyor mechanism (11).

The conveyor mechanism (11) can be, for example, a belt drive assembly or a belt drive assembly. The conveyor mechanism (11) preferably transports the semiconductor components from the loading station (24) to the rotary table (12). More specifically, the conveyor mechanism (11) preferably continuously transports the semiconductor components from the loading station (24) to the rotating table (12). The semiconductor component placed in the conveyor mechanism (11) is displaced from the loading station (24) to the rotary table (12) by the conveyor mechanism (11). The speed at which the conveyor mechanism (11) displaces the semiconductor components can be determined and adjusted as needed. For example, the operation of the conveyor mechanism (11) can be software controlled.

2A is a schematic view of a rotary table structure or a rotary table (12) according to an embodiment of the present invention; and FIG. 2B illustrates an exemplary spatial relationship between a rotary table structure (12) and other components of the system (10). View, the system is configured to elastically transport high speed semiconductor components provided by one embodiment of the present invention. The rotary table (12) is also referred to as a rotary semiconductor component processing mechanism. The rotary table (12) includes: a fixed central shaft; and a rotatable portion coupled to the middle Central axis. Preferably, the central axis defines the rotatable portion as a rotatable first or main axis (eg, a vertical or z-axis).

The rotatable structure includes a plurality of pick-up heads (or swivel heads) (26) coupled thereto. The number of pick heads (26) can be, for example, between (and including) 24 and 36. The number of pick heads (26) can be varied as desired (eg, between 2 and 60 or greater). The pick-up head (26) forms a spatial configuration in a predetermined configuration. The pick-up head (26) preferably forms a spatial arrangement around the central axis. Further, the pickup heads (26) are preferably spaced apart from each other by a predetermined distance. The rotation of the rotatable structure or portion about the first axis relative to the rotational displacement of the pick-up head (26) about the first axis. In some embodiments, each pick head (26) is positioned or disposed at a radius or radial distance r formed with the first axis.

The system (10) preferably includes a motor (not shown). The motor operates to drive the rotatable portion about the first shaft and the pick head (26) is the same. The motor is preferably coupled to the central shaft. Motor operation is preferably controlled by software. Motor operation causes the pick head (26) to be displaced about the first axis along a predetermined travel path or travel path. It will be appreciated that the predetermined path of travel of the pick-up head (26) about the first axis can be varied as desired using techniques well known to those skilled in the art.

Each pick-up head (26) carries or receives a semiconductor component from a conveyor system or conveyor mechanism (11) at a pick-up position (or known as a first position). In other words, the semiconductor component is continuously transported from the conveyor system to the pick-up head (26) of the rotary table (12) at the pick-up position.

A pick-up head (26) includes a component holding or holding mechanism. The pick-up head (26) preferably employs vacuum suction for picking up the components from the conveyor and for securing the clamping elements during movement of the rotary table (12). Professionals in the technical field should White, other components or mechanisms may be used to pick up the semiconductor component from the conveyor mechanism (11) and to stabilize the semiconductor component during rotational displacement along a predetermined path of travel.

The rotational displacement of the pickup head (26) is rotationally displaced from the suction position to an unloading position (or known as the second position), displaced along a circumferential path defined by the rotary table (12). If the pick-up head (26) is in the unloading position, the semiconductor component attached to the pick-up head is preferably transported to the first carrier (14) or the second carrier (16).

As explained in more detail below, the additional configuration of the pick head (26) is for a high speed rotary z-axis/up and down motion that is displaced about the circumferential direction of the first axis. In a specific embodiment, a particular pick-up head (26) is vertically displaced during a rotational transformation around the first or main axis, wherein the vertical pick-up head shift occurs along the second or minor axis, defining the upper and the pick-up The head (26) itself is related and parallel to the first axis, as shown in Figure 2A. In other embodiments, the entire assembly carrying the multiple pick-up heads (26) (eg, the rotatable structure of the rotating table) is vertical along or parallel to the first axis (ie, in the +/- z-axis direction) Shifting to provide high-speed rotation of the upper and lower pickup head movements, reducing system complexity, simplifying system control loads, increasing system output, and improving system reliability.

The system (10) further includes a number of processing stations or modules (e.g., in the manner shown in Figure 2B) for operatively processing semiconductor components that are manipulated or transmitted by the system (10). More specifically, the processing module can facilitate processing of the semiconductor component as the semiconductor component moves from the pick-up position to the unloading position. The processing module includes (but is not limited to) a visual inspection module (like an image capture device) and a functional test module (like an electrical test module). The processing modules are configured in a predetermined space configuration. More specifically, the processing module is wound around the first or central axis of the rotating table (12). The scheduled space configuration is configured. The spatial configuration of the processing module can be changed as needed. The processing module is configured as far as possible to increase the space efficiency and throughput of the system (10). In order to increase the number of modules in which the system (10) processes the semiconductor component (10), it is also necessary to determine the spatial configuration of the processing module.

The number and type of processing modules used by system (10) can be changed as needed. It will be appreciated by those skilled in the art that the system (10) allows for multiple processing steps of the semiconductor component, but on the other hand, the system (10) processes or transfers the semiconductor components, thereby increasing the speed and accuracy of the processing of the semiconductor components by the system (10). And at least one of the production.

The rotary table structure (12) is configured to rotate or change its pick-up head (26) between different processing stations in a simultaneous or simultaneous manner. The rotary table structure from a special processing station to the next processing station is called a Turret Index. In general, a rotary table is indexed to a rotational or circumferential increment of the rotary table structure (12) corresponding to or relating to the separation distance between the processing stations. The adjacent pick-up heads (26) carried by the rotary table structure (12) continue to reach any particular processing station via rotational indexing of the rotary table structure. According to the detailed description of the specific embodiment, as with many and/or type of processing stations considered, the linear or curvilinear distance (eg, the rotary table rotation arc length) of the pick-up head (26) traveling each rotational index is a configurable Or programmable parameters.

The rotary table structure (12) is configured to provide dynamic up and down movement of the pick head (26) as a rotary table index between different processing stations. For example, for the first processing station P1 and the second processing station P2 exemplified in FIG. 2A, the rotating table structure (12) is in the above manner, in the vertical direction (for example, along the second axis, in the direction parallel to the first axis) Moving the pick-up head (26) at the P1 position; and above, additionally moving the pick-up head (26) at P2 vertically. Therefore, the pickup head (26) can be upward And/or downward movement becomes part of the transposition of each rotary table, that is, the dynamic behavior of the rotary table during the occurrence or progress of the index. With respect to dynamic pick-up head movement, a particular pick-up head (26) can be transported to a processing station positioned by a pick-up head (26) and/or a device removed from the processing station. Such dynamic up and down movement of the pick head (26) significantly increases the throughput of the system.

In a particular embodiment, each pick head (26) or set of pick heads (26) includes (or incorporates) a pneumatic actuator, such as the same electromagnetically driven pneumatic cylinder, configured for the z-axis or countershaft The pickup head 26 is vertically displaced in the direction. In various embodiments, the rotary table structure (12) is itself configured for z-axis displacement such that the carrier pickup (26) carried thereby moves through the z-axis of the rotary table structure, fully consistent vertically up and down . The rotary table structure (12) includes (or incorporates) a pneumatic cylinder, a solenoid valve, a linear motor or other means to cause the z-axis to shift. Providing the up and down dynamic motion of the pickup head (26) in this manner reduces system control complexity and increases machine operating speed and system throughput (UPH). A particular embodiment may additionally or additionally use a z-axis shifting mechanism, such as the same cam drive mechanism, configured to facilitate up and down pickup movement.

In general, each pick-up head (26) includes (or combines) (eg, in a wireless or wired manner) a set of limit sensors configured to sense a top or top pick position and a bottom or Minimum pick head position. In some embodiments, some or all of the pick-up heads (26) may include (or incorporate) one or more intermediate limit sensors configured to detect the position of the pick-up head between the top and bottom pick-up head positions. Specifically limiting the sensor signal representation or helping to determine whether the position (a) of the pick-up head (26) corresponds to a semiconductor component pick-up or release position; and/or (b) whether it is satisfied at the end portion or top end of the pick-up head (26) Pre-with a processing station The fixed space or separation distance condition (e.g., indicates whether the pickup head (26) has cleared the processing station vertically, and the rotational transfer of the rotary table of the pickup head (26) can be safely continued). Particular embodiments additionally include a sensor configured to detect a pick head position or a rotational transformation corresponding to one or more rotational transfer sensing locations.

The component or device shift control (e.g., an electrical test station or a visual inspection station) at any of the processing stations preferably includes two stages. In the first phase, a pick-up head (26) is located near or very close to the surface of the displacement plane associated with a particular processing station. If the pick-up head (26) reaches the processing station, the pick-up head (26) moves a short vertical distance and places the device on the processing station. This two-stage placement procedure helps reduce the burden compared to moving the device from the highest or top position to the processing station. The vertical distance at which the pick head (26) moves or shifts is a programmable parameter, for example, depending on the type or thickness of the component or semiconductor device under consideration.

Typically, the rotational motion of the rotary table (12) includes a series of short motions that the pickup head 26 transforms between different processing stations (e.g., P1 to P2). The pause in rotational motion between processing stations, or the rotary table wait, or delay time is typically determined by the throughput of the slowest processing station. For example, in the case where a test station takes about 5 seconds to test a device, and a test station takes about 15 seconds to detect a device, the rotary station between the processing stations waits, or the delay time is about 15 seconds. In various embodiments, the rotary table wait or delay time is a configurable or programmable parameter.

The inertial motion of the rotary table assembly (12) determines the settling time required for the rotatable portion of the rotary table and/or the pickup head (26) to stabilize, so that the components can be picked up and/or placed or released reliably or accurately. This inertial motion depends on the mass and vibration characteristics of the rotating table assembly (12). In general, in view of the detailed description and consideration of specific embodiments The component type, previous system operation history, and/or trial and error tests, programmable to specify the settling time and determine the appropriate settling time.

3A-3D and 4, the semiconductor component is unloaded or detached from the pick-up head (26) and transported to the carrier (14, 16) at the unloading position. As before, the system (10) includes a first carrier (14) and a second carrier (16) (each of the first carrier (14) and the second carrier (16) is also known as a mobile carrier or a carrier Device). Each of the first carrier (14) and the second carrier (16) shuttles (ie, moves or shifts) in a first position (receiving a semiconductor component from the pickup head (26)) and a second position (receiving The semiconductor component is transported between the pick-and-place mechanisms (18)).

The carrier (14, 16) is configured such that when a carrier (e.g., the carrier (14) of Figure 4) is receiving the device from the rotary table (12), the other carrier (16) transmits the component to the simultaneous pick-and-place mechanism (18), And returning to the waiting or preparatory position under the carrier (14), which is receiving the device from the pickup head (26) of the rotary table. If the carrier (14) of the receiving device from the rotary table (12) fills the component, the carrier (14) is moved to a transfer or empty position for transfer or supply of the component to the simultaneous pick-and-place mechanism (18). As long as the carrier (14) is removed, the ready carrier (16) will be lifted or moved to the receiving position and begin receiving the next set of components from the pick head (26). After the transfer element to the simultaneous pick-and-place mechanism (18), the freshly emptied carrier (14) is lowered and moved to a waiting or ready position just below the carrier (16), now receiving the component from the pick-up head (26). The cyclic motion of the two carriers (14, 16) ensures a high or very high machine throughput (UPH).

The first carrier (14) and the second carrier (16) are in a first position (a position at which the semiconductor element is transported from the pickup head (26) of the turntable (12) to the carrier (14, 16)) and a second position (semiconductor The element is circulated from the two carriers (14, 16) to the position of the simultaneous pick-and-place mechanism (18). This is illustrated in Figures 3A-3D and 4.

Preferably, two carriers are used (ie, the first carrier (14) and the second carrier (16)) The speed at which the semiconductor component is transported from the pick-up head (26) to the pick-and-place mechanism (18) is increased. In the case where the speed of the rotary table is increased so that more devices can be handled, the system (10) can reference more carriers or mobile carriers (eg, 3, 4, 6, or 8 carriers or mobile vehicles) as needed to increase The speed at which the semiconductor component is transported from the pick-up head (26) to the pick-and-place mechanism (18). Each of the first carrier (14) and the second carrier (16) can be coupled into a mover or a moving mechanism to receive the semiconductor component in a first position (from the pick-up head (26)) and the second position (received The semiconductor component is transported to the first pick-and-place mechanism (18) to displace the first carrier (14) and the second carrier (16).

As shown in Figure 4, each of the first carrier (14) and the second carrier (16) includes a plurality of receptacles (28) (also known as receiving slots) formed in the upper surface. The number of receptacles (28) formed on the upper surface of each of the first carrier (14) and the second carrier (16) can be varied as desired. Each of the number of receivers (28) is shaped and sized for receiving a semiconductor component from the pick-up head (26) of the rotary table (12). The receiver (28) is arranged in the carrier (14, 16) in a predetermined configuration. The receiver (28) is preferably arranged in an in-line or straight line on the upper surface of each of the first carrier (14) and the second carrier (16). The spacing between the receivers (28) is preferably consistent and can be varied as desired. In addition, the number of columns and/or columns of the receiver (28) may be modified or increased depending on the desired component loading capabilities of each carrier (14, 16), with all modifications being made, such that the receiver (28) Columns and columns can be properly positioned with the pick head (26).

Each of the first carrier (14) and the second carrier (16) is spatially displaced to facilitate receipt of each successive semiconductor component in one or more receivers (28). This displacement is preferably facilitated by a mover or moving mechanism coupled to each of the first carrier (14) and the second carrier (16). More specifically, the displacement distance of each of the first carrier (14) and the second carrier (16) is equal to one or more receivers (28) The receiver (28) spacing between each successive semiconductor component is received. The spatial displacement speeds of the first carrier (14) and the second carrier (16) are preferably the same and can be varied as desired. Furthermore, the speed of displacement of the first carrier (14) and the second carrier (16) can be controlled by the software.

As previously described, the first carrier (14) and the second carrier (16) receive the semiconductor component in a first position and are subsequently displaced to a second position. The semiconductor component received by the first carrier (14) and the second carrier (16) is transported to the pick and place mechanism (18) in the second position. At the same time, the pick-and-place mechanism (18) preferably includes a plurality of pick-up tips (30) extending from the body of the simultaneous pick-and-place mechanism (18). The pick-up tip (30) is configured in a predetermined configuration. The pick-up tip (30) is preferably configured in a linear configuration with consistent spacing. The spatial configuration of the pick-up tip (30) is preferably configured to conform to the receiver (28) of each of the first carrier (14) and the second carrier (16). More specifically, the pitch of the pick-up tip (30) is similar to the pitch of the receiver (28) of each of the first carrier (14) and the second carrier (16).

The simultaneous pick and place mechanism (18) depicted in Figure 4 is operative to transport semiconductor components from each of the first carrier (14) and the second carrier (16) to the output package member (22). The output package member (22) is preferably a tray carrier (32) or a disk carrier as shown in Figure 2B. The tray carrier (32) is also referred to as an output container. At the same time, the pick-and-place mechanism (18) is preferably displaceable for receiving or picking up a predetermined number of semiconductor components from each of the first carrier (14) and the second carrier (16). Simultaneously, the movement of the pick-and-place mechanism (18) from the first position to the second position is preferably parallel to the first axis and perpendicular to the direction of travel of the carrier (14, 16). At the same time, the pick-and-place mechanism (18) is preferably coupled to a motion controller for displacement of the pick-and-place mechanism (18). At the same time, the pick-and-place mechanism (18) can be moved or displaced in other directions and at different speeds as needed. At the same time, the movement of the pick-and-place mechanism (18) is preferably facilitated or controlled by a motion controller.

More specifically, the pick-up tip (30) of the pick-and-place mechanism (18) can receive a predetermined number of semiconductor components. A predetermined number of semiconductor elements are preferably equal to or greater than two. After receiving a predetermined number of semiconductor components, the pick and place mechanism (18) is further displaced for transporting a predetermined number of semiconductor components to the tray carrier (32). This displacement from the first position to the second position is preferably parallel to the first axis while being perpendicular to the direction of travel of the carrier (14, 16). More specifically, the pick and place mechanism (18) shifting mechanism is used to transport the semiconductor component from the pick-up tip (30) to the receiving slot or receiver (34) on the tray carrier (32). It will be understood by those skilled in the art that the simultaneous pick-and-place mechanism (18) can facilitate a predetermined number of semiconductor components from each of the first carrier (14) and the second carrier (16) to be simultaneously transported or transported entirely to the tray carrier ( 32).

The system (10) of the present invention facilitates the transport of semiconductor components from a series (from the conveyor mechanism (11) to the rotary table (12), and from the rotary table (12) to the first carrier (14) and the second carrier (16) Each of them) to the simultaneous or entire transport of semiconductor elements (from each of the first carrier (14) and the second carrier (16) to the tray carrier (32). The ability of the pick and place mechanism (18) to transport a predetermined number of semiconductor components as a whole allows the system (10) to use the tray carrier (32) as a selective output package member (22) for the semiconductor component. Thus, this allows the semiconductor component manufacturer or manufacturer to provide the consumer with the option of using the tray carrier (32) as an output package member (22) type. Those skilled in the art will appreciate that the system (10) can use other designs and configurations of tray carriers (32).

The system (10) preferably further includes a programmable controller or a processor (not shown) capable of signal and conveyor mechanism (11), rotating table (12), processing module, first carrier (14) communicating with at least one of the second carrier (16) and the simultaneous pick-and-place mechanism (18). Programmable controller is preferably programmable for control The operation of at least one of the rotary table (12), the processing module, the first carrier (14), the second carrier (16), and the simultaneous pick-and-place mechanism (18). For example, the programmable controller preferably controls the operation speed and duration of at least one of the rotating table (12), the processing module, the first carrier (14), the second carrier (16), and the simultaneous pick-and-place mechanism (18). time.

An exemplary method (100) for transporting semiconductor components is also provided in accordance with an embodiment of the present invention. Figure 5 provides an exemplary flow of steps for one of the methods (100).

At step 110 of method (100), the semiconductor component is loaded or introduced into system (10). As previously mentioned, the semiconductor component is loaded into a system located at the load module or load station (24). More specifically, at step 110, the semiconductor component is transported from the first package member (20) to the conveyor mechanism (11). This transport can be accomplished by a variety of different components or mechanisms known to those skilled in the art, such as by a simultaneous pick and place mechanism (18). At step 120, the conveyor mechanism (11) continuously transports the semiconductor components from the load module (24) to the rotary table (12).

At step 130, the semiconductor component is a pick-up head (26) of the rotary table (12) that is continuously transported from the conveyor system (11) at the pick-up position. More specifically, the semiconductor component is continuously transported individually from a portion of the conveyor mechanism (11) (e.g., a conveyor belt) to a continuous pick-up head (26) of the rotary table (12). As previously mentioned, each pick head (26) includes a channel or air passage defined therebetween. Vacuum or suction is applied to the channels to pick up the semiconductor components from the conveyor mechanism (11). Other devices or mechanisms may also be used by the pick-up head (26) to pick up the semiconductor components.

At step 140, the semiconductor component carried by the pick-up head (26) is rotationally transported (or passed) through a series of processing modules in a manner that facilitates fabrication, testing, and/or validation of the semiconductor component (eg, from the start Or a first processing module to a final processing module, wherein the processing module can perform electrical testing, optical inspection, And/or other operations). At step 150, the pick-up head (26) transports the semiconductor component to the unloading position (e.g., after the component has been processed by the processing module). As previously described, motor drive can cause the pick head (26) to be rotationally displaced from the pick-up position to the unloading position. The displacement of the pickup head (26) from the suction position to the unloading position follows a predetermined travel path. If the semiconductor component is displaced from the pickup position to the unloading position, the semiconductor component received by the pickup head (26) is processed. Steps 130, 140, and 150 are thus performed in a continuous or simultaneous manner (i.e., in parallel) via a forward rotational shift of the rotary table (the spatial transition of the pickup head (26) between the different processing modules).

An important aspect of the design of the rotary table mechanism is that the pickup head (26) moves up and down dynamically as the pickup head (26) moves between different processing stations. This results in a significant reduction in the indexing time of the system (10) and a significant increase in system throughput (UPH).

The system (10) includes a processing module, such as one or more visual inspection modules and one or more electrical, optical, or electro-optical test modules, each configured to shift the semiconductor component from a pick-up position to an unloading position During this process, the semiconductor components are processed. The number and type of processing modules can be changed by the user of the system (10) as needed. The ability to perform multiple processing steps on a semiconductor component during displacement of the semiconductor component from the pick-up position to the unloading position can increase at least one of speed, accuracy, and throughput of semiconductor component fabrication.

At step 150, the semiconductor component is continuously transported from the pickup head (26) of the rotary table (12) to the first carrier (14) at the first or receiving position. More specifically, at step 150, a predetermined number of semiconductor components (also known as a plurality of semiconductor components) are continuously transported (or transported) from the pickup head (26) to the first carrier (14). Each of the predetermined number of semiconductor components is one of the number of receivers (28) formed from a pick-up head (26) to a first carrier (14) located at a first location. In step 150, the pick-up head (26) is preferably moved to the first carrier at a predetermined distance (14). The air is preferably purged through the pick-up head (26) to facilitate separation or transport of the semiconductor component from the pick-up head (26) to the receiver (28) of the first carrier (14). An alternative component or mechanism can be used to transport the semiconductor component from the pick-up head (26) to the receptacle (28) of the first carrier (14).

The first carrier (14) is preferably spatially displaced between each of the continuous semiconductor elements of one of the number of receivers (28) of the first carrier (14). More specifically, the preferred spatial displacement distance of the first carrier (14) is equal to the receiver spacing between each of the semiconductor component receiving one of the number of receivers (28) of the first carrier (14).

At step 160, the system (10) can determine if the first carrier (14) is full, i.e., whether the first carrier (14) should be displaced to the simultaneous pick-and-place mechanism (18). If not, at step 150, method (100) continuously transports the component to the receiving carrier (in this example, the first carrier (14)).

At step 170, if the first carrier (14) is emptied or unloaded, the first carrier (14) is displaced or moved from the first position to the second position such that the simultaneous access mechanism (18) can access and unload the first carrier (14). Further, at step 175, the second carrier (16) is displaced or moved to the first receiving position in a manner that occurs simultaneously or generally simultaneously with the first carrier displacement of step 170. Once the second carrier (16) is in the first or receiving position (ie, the component or device unloading position in which the component is unloaded from the pick-up head (26) onto or into the carrier (16), at step 150, the component will rotate from The pick-up head (26) of the stage is continuously transported onto or into the second carrier (16).

At step 170, once the first carrier (14) is displaced, shifted, or transported to the simultaneous pick-and-place mechanism (18), a predetermined number of semiconductor components carried by the first carrier (14) are transported from the first carrier (14) to the entire carrier. At the same time, the pick-and-place mechanism (18), more specifically, is transported to the pick-up tip (30) of the pick-and-place mechanism (18) at the same time as step 180. That is, at step 180, a predetermined number of semiconductor components are simultaneously transported from the receiver of the first carrier (14) to the pick-up tip (30) of the simultaneous pick-and-place mechanism (18). At the same time, the picking tip (30) of the pick-and-place mechanism (18) is entirely moved toward the first carrier (14) for picking up two or more from the first carrier (14) (for example, 2, 8, 10, 12, 20 or more) semiconductor components. The programmable controller can control each of the distance, velocity and displacement of the pick-up tip (30) and can be changed as needed.

With respect to step 180, a predetermined number of semiconductor components are transported from the pick-up tip (30) of the simultaneous pick-and-place mechanism (18) to the second or output package member (22), in some embodiments, more specifically the tray carrier ( 32). The tray carrier (32) is also referred to as a semiconductor component container. At the same time, the picking tip (30) of the pick and place mechanism (18) is moved to the tray carrier (32) in the process of step 180. A predetermined number of semiconductor components are transported from the pick-up tip (30) of the simultaneous pick-and-place mechanism (18) to a receiving groove (34) formed on the surface of the tray carrier (32). The receiving groove (34) of the tray carrier (32) is configured in a predetermined configuration space. The spacing of the receiving grooves (34) of the tray carrier (32) is preferably uniform. More specifically, the spacing of the receiving grooves (34) of the tray carrier (32) conforms to the spacing of the picking tips (30) of the pick-and-place mechanism (18), thus conforming to each of the first carrier (14) and the second carrier (16). One of the receiver spacing. a receiving groove (34) of the tray carrier (32), a pick-up tip (30) of the pick-and-place mechanism (18), and a receiver (28) of each of the first and second carriers (14, 16) The correspondence between the similar spacing allows the semiconductor components to be properly transported therebetween. At the same time, the use of the pick-and-place mechanism (18) also results in a significant increase in system throughput (UPH).

As described above, the simultaneous pick-and-place mechanism (18) can be displaced in various directions and/or speeds as needed to facilitate transporting the semiconductor between the first carrier (14) or the second carrier (16) and the tray carrier (32). element. A motion controller (which can be software controlled) facilitates the displacement of the pick and place mechanism (18). Additionally, the system (10) can include an amount The external pick-and-place mechanism (18), and/or the carrier (14, 16) (also known as a container) depends on the details of the particular embodiment. The semiconductor component can be transported continuously or entirely between the additional pick-and-place mechanism and the carrier before being unloaded or transferred to the tray carrier (32). These additional simultaneous pick and place mechanisms (18) and carriers (14, 16) may be of similar or different variations in design and construction.

The first carrier (14) and the second carrier (16) operate in a cyclic configuration which significantly increases system throughput (UPH). When the first carrier (14) is receiving an element from the pick-up head (26) in the first position, the second carrier (16) can transfer the element to the pick-and-place mechanism (18) in the second position, and lowers Moving back to the preparatory or waiting position, which is close to the first position, and just below the carrier (14), the carrier is receiving the component from the pick-up head. In other words, the second carrier (16) is holding the first carrier (14) to complete the pick-up element and to move back to the second position (device unloading position). As soon as the first carrier (14) is moved to the unloading position, the second carrier (16) is moved up and ready to receive the component from the pick-up head (26). Typically, any time delay from vertically moving an empty carrier (16) from a waiting position to a receiving position (which can be received or loaded from the pickup head (26)) can be reduced or ignored.

This ensures that a predetermined number of semiconductor components are transported from the pick-up head (26) to the first carrier (14) in the first position, while a corresponding number of semiconductor components are transported from the second carrier (16) to the simultaneous pick-and-place mechanism (18) ,vice versa. The use of the first carrier (14) and the second carrier (16) (i.e., the two carriers) can increase the transport speed of the semiconductor components from the pick-up head (26) to the simultaneous pick-and-place mechanism (18). More carriers may be referenced to the system (10) as needed to further increase the semiconductor component transport speed from the pick-up head (26) to the simultaneous pick-and-place mechanism (18).

In conclusion, the exemplary system (10) and exemplary method (100) provided by the present invention allow semiconductor components to be output to a tray carrier (ie, a disk-type package member) (14, 16). Or other types of carrier members. This allows the user of the system to provide the consumer with additional semiconductor component output package component options. In addition, different input package components can also be used with semiconductor components that can be loaded or introduced into the system. The flexibility of the input package member and the output package member improves the ease of use and effectiveness of the exemplary system (10) and the exemplary method (100).

Moreover, the exemplary system (10) and exemplary method (100) provided by the present invention allow for the conversion from a series of inputs of individual semiconductor components to the entire or entire output of multiple semiconductor components. Moreover, the exemplary system (10) and exemplary method (100) provided by the present invention allow for multiple processing steps if the semiconductor component is being transported between different package components. During the transport of the system (10), the ability to perform multiple processing steps of the semiconductor component can increase at least one of speed, throughput, and accuracy of semiconductor component fabrication. Furthermore, the use of a rotating table (12) helps to increase the space efficiency of the system (10).

It will be understood by those skilled in the art that the system (10) according to the present invention may additionally or additionally be configured for unloading components, wherein the output package member (22) is considered to be an input package member (20) and the device is in reverse order Flow into the input package member (20). This is particularly the case when the component or device needs to be re-detected and the component carrier members (20, 22) used before and after re-detection are different.

In the foregoing method, an exemplary system and an exemplary method for transporting a semiconductor component provided by a specific embodiment of the present invention are described. Exemplary systems and methods address at least one of the issues or problems faced during the fabrication of the aforementioned semiconductor components. However, it should be understood by those skilled in the art that the present invention is not limited to the specific forms, configurations or structures of the foregoing specific embodiments. It will be apparent to those skilled in the art that many variations and/or changes can be made in view of this disclosure. Modifications do not detract from the scope and spirit of the invention.

3, 4, 6, 8 ‧ ‧ carrier or mobile vehicle

10‧‧‧System

11‧‧‧Conveyor mechanism

12‧‧‧Rotating table

14‧‧‧ first carrier

16‧‧‧second carrier

18‧‧‧At the same time pick and place institutions

20‧‧‧Input package components

22‧‧‧Output package components

24‧‧‧Loading station or loading module

26‧‧‧ pick up head

28‧‧‧ Receiver

30‧‧‧ Pick up the pointed

32‧‧‧Tray carrier

34‧‧‧ receiving slot

The following description of the invention relates to the drawings in which: FIG. 1 is a schematic diagram of an exemplary system for elasticizing high speed transporting semiconductor components in accordance with an embodiment of the present invention.

2A is a schematic diagram showing the structure of a rotary table having a plurality of pick-up heads that are rotatably movable and a plurality of carriers that are periodically moved to assist in high-volume unloading of the apparatus from the system.

2B is a top view illustrating an exemplary position of a rotating stage structure in a system configured to flexibly transport high speed semiconductor components provided by one embodiment of the present invention.

3A-3D are perspective representations (1) to (4) of the operation of the two carriers and the simultaneous pick-and-place mechanism.

4 is an isometric view of a simultaneous pick and place mechanism for transporting semiconductor components to a carrier carrier.

5 is an exemplary process flow step of elasticizing high speed transport of semiconductor components in accordance with an embodiment of the present invention.

10. . . system

11. . . Conveyor mechanism

12. . . Rotary table

14. . . First carrier

16. . . Second carrier

18. . . Simultaneous pick and place mechanism

20. . . Input package member

twenty two. . . Output package member

twenty four. . . Load station or load module

Claims (50)

A system for transporting a semiconductor component, comprising: a component carrier group comprising at least one component carrier, each component carrier being movable between a first position and a second position different from each other, configured to form A plurality of receivers on a top surface of the component carrier receive a plurality of semiconductor components, the plurality of receivers being separated from each other by a pitch; a moving mechanism configured to be in the first position and the second position different from each other Circulatingly shifting each component carrier; a rotating semiconductor component processing mechanism configured to (a) sequentially pick up the semiconductor component at the picking position of the rotating semiconductor component processing mechanism, simultaneously or in parallel (b) at the The unloading position of the rotating semiconductor component processing mechanism sequentially unloads the semiconductor component, wherein the rotating semiconductor component processing mechanism includes a plurality of picking heads configured to be disposed at the rotating semiconductor component processing mechanism and at the first The plurality of semiconductor components are sequentially transported between the plurality of receivers of the component carrier at a position; and a pick-and-place machine a group that operates to collectively pick up the plurality of semiconductor components and collectively transport the plurality of semiconductor components between the plurality of receivers of the component carrier and the plurality of slots of a package member disposed at the second location The plurality of semiconductor components may be located in or on the trench during transport between the processing stations or during distribution after production. The system of claim 1, wherein the plurality of pick-up heads of the rotating semiconductor component processing mechanism are configured to continuously receive a plurality of semiconductor components at a pick-up position and to bring the plurality of semiconductor components from the pick-up position Continuously transported to the unloading position. The system of claim 2, wherein the rotating semiconductor component processing mechanism is configured to use one of a plurality of semiconductor components The plurality of receivers that are sequentially transported to the component carrier disposed at the first location, or are configured to sequentially pick up a plurality of semiconductors by the plurality of receivers of the component carrier disposed at the first location One of the components, wherein the rotating semiconductor component processing mechanism comprises a plurality of pick-up heads, each of the plurality of pick-up heads configured to carry one of the plurality of semiconductor components. The system of claim 3, wherein each of the plurality of pick-up heads is rotationally displaced along a predetermined travel path to continuously receive or carry one of the plurality of semiconductor components, And transporting one of the plurality of semiconductor components from the suction position to the unloading position. The system of claim 1, wherein the rotating semiconductor component processing mechanism is further configured to (c) sequentially transport the plurality of semiconductor components through the plurality of pick-up heads through the plurality of processing modules. And simultaneously or in parallel in (a) and (b), and wherein each of the plurality of pick-up heads includes a retention mechanism configured to provide vacuum suction for holding one of the plurality of semiconductor components. The system of claim 5, wherein each of the plurality of pick-up heads is vertically displaceable. The system of claim 5, wherein the plurality of processing modules are configured to process the semiconductor components with rotation of the rotating semiconductor component processing mechanism along a predetermined path of travel. The system of claim 4, wherein the component carrier group comprises a second component carrier, wherein the plurality of processing modules comprise: at least one detection module and at least one test module, Travel along schedule During the rotational shift of the path, a plurality of semiconductor components carried by the plurality of pick-up heads are respectively detected and tested, wherein the pick-and-place mechanism group is configured to: when the second component carrier is located at the second position Transporting the semiconductor component between the second component carrier and the package component, or transporting the semiconductor between the rotary semiconductor component processing mechanism and the first component carrier when the first component carrier is in the first position An element; and when the first component carrier is in the second position, transporting the semiconductor component between the first component carrier and the package component, or when the second component carrier is in the first position, in the rotation A semiconductor component is transported between the semiconductor component processing mechanism and the second component carrier. The system of claim 1, further comprising: a conveyor mechanism configured to sequentially transport the plurality of semiconductor components to the rotating semiconductor component processing mechanism, or to rotate the semiconductor component The processing mechanism sequentially transports the plurality of semiconductor elements. The system of claim 9, further comprising: a programmable controller for controlling at least one of a rotational shift of the rotating semiconductor component processing mechanism and an operation of the pick and place mechanism group. The system of claim 1, wherein the rotating semiconductor component processing mechanism is configured to sequentially unload the plurality of semiconductor components to the first component carrier, or for when the first component carrier is located The first location receives the plurality of semiconductor components from the first component carrier, and the pick and place mechanism group includes a plurality of prongs configured to simultaneously move toward the first component carrier, facilitating One component carrier In the second position, the first component carrier between the receivers and the plurality of slots of the package member carries a plurality of semiconductor components. The system of claim 1, wherein the plurality of receivers of the component carrier are spaced apart from each other, and each of the plurality of semiconductor components is a semiconductor die or an integrated circuit (IC). The system of claim 1, wherein the plurality of pointed ends are configured in a linear configuration, the spacing being at least substantially equal to the spacing of the plurality of receivers of each of the component carriers. The system of claim 1, wherein the plurality of prongs are simultaneously displaceable to achieve a plurality of semiconductor components being transported from the component carrier to the package member. The system of claim 14, wherein the package member is a disk type package member. The system of claim 15 wherein the disk-type package member comprises a plurality of grooves formed thereon, the plurality of grooves of the disk-type package member having a pitch corresponding to each of the component carriers The spacing of the receivers. The system of claim 1, wherein the moving mechanism is further configured to place a component carrier in the first position at a distance equal to the spacing between the plurality of receivers of the component carrier, Wherein the plurality of receivers of the component carrier are located between the rotating component processing mechanism and the component carrier, and the plurality of receivers are associated with a semiconductor component. A system for transporting components, comprising: a first component package member comprising a plurality of slots, the plurality of components being located in or on the slots when transported between the plurality of components and the plurality of processing stations, or in the manufacture of the plurality of components The finished component is located in or on the slots; a second component package member includes a plurality of slots, the plurality of components being located when the plurality of components are transported between the plurality of processing stations In or on the grooves, or in or after the dispensing of the plurality of components, wherein the second component package member is different from the first component package member; a component carrier comprising a first component carrier and a second component carrier, each of the first component carrier and the second component carrier being displaceable between the first position and the second position, and the first component carrier And each of the second component carriers is configured to carry the plurality of receptacles in a plurality of receptacles, the plurality of receptacles being formed on a top surface of each of the first component carrier and the second component carrier And each other a spacing separation; a group of pick and place mechanisms configured for simultaneous use of each of the first component carrier and the second component carrier with one of the first component package component and the second component package component a transporting element; a rotating element processing mechanism configured to (a) sequentially pick up a semiconductor component at the picking position of the rotating component processing mechanism, simultaneously or in parallel (b) at the unloading of the rotating component processing mechanism Position sequentially unloading the semiconductor component, the rotary component processing mechanism further configured to sequentially transport the semiconductor component between the conveyor mechanism and the other of the first component package component and the second component package component; and a moving mechanism Configured for the first component carrier and the second The component carrier is coordinated to cyclically shift such that each of the first component carrier and the second component carrier is displaceable between the first position and the second position such that in the first position The components may be transported between the component carrier and the rotary component processing device in sequence, and the components in the second location may also be transported collectively between the component carrier and the pick and place mechanism. The system of claim 18, wherein the moving mechanism is configured to be cyclically disposed: (a) the first component carrier is located when the rotating component processing mechanism and the first component carrier are transported by the component The first position, and the second component carrier is located at (i) the second position, when the pick-and-place mechanism is in the second component carrier and the first package member and the second package member When the component group is transported, it is then located at (ii) a preliminary position below the first component carrier, when the second component carrier remains waiting until the rotating component processing device and the first component carrier The inter-component transport is completed; and (b) the second component carrier is located in the first position when the rotating component processing mechanism and the second component carrier are transported, and the first component carrier is located at: (i) The second position is when the pick-and-place mechanism group carries the component group in the first component carrier and one of the first package member and the second package member, and then is located at (ii) Second component carrier The lower preparatory position is when the first component carrier remains waiting until the component transport between the rotary component processing device and the second component carrier is completed. The system of claim 18, wherein the pick and place mechanism comprises a plurality of pick-up tips, the shifting of which assists in achieving each of the first and second component carriers and the first component package member and A simultaneous transport element between one of the two component package members. The system of claim 20, wherein the plurality of receivers of each of the first and second component carriers are configured in a consistent spacing configuration. The system of claim 21, wherein the plurality of pointed configuration spacings are at least substantially equal to the spacing of the plurality of receivers of each of the first and second component carriers. The system of claim 18, wherein the rotating semiconductor component processing mechanism comprises a plurality of pick-up heads configured to sequentially carry a plurality of components between the pick-up position and the unloading position . A system for transporting a semiconductor component, comprising: a rotatable rotary table structure including a plurality of rotary heads, the rotary heads being rotationally displaceable along a predetermined travel path and configured to be in the rotary table structure The picking position sequentially receives the semiconductor component, each of the plurality of rotating heads configured to receive one of the plurality of semiconductor components at the picking position, and transport the received semiconductor component to the unloading position through the plurality of processing stations; And a device configured to sequentially carry the semiconductor component and configured to carry the semiconductor component transport with the rotary table structure at the pick-up or unloading position; a first component carrier configured to carry a plurality of semiconductor components carrying a plurality of receivers The plurality of receivers are separated from each other by a pitch and formed in the first a top surface of the component carrier, the first component carrier being displaceable between a first position and a second position, the first component carrier being configured to sequentially perform with the rotary table structure when coordinated in the first position Transporting the component, thereby transporting a first portion of the plurality of semiconductor components between the first plurality of rotating heads and the first component carrier, wherein the first portion of the plurality of components comprises a plurality of components; and a first pick and place a group of mechanisms configured to collectively transport a first portion of the plurality of semiconductor components between the first component carrier and the first package component when the first component carrier is disposed in the second position, wherein the first The package member includes a plurality of slots, the semiconductor component being located in or on the slots when the semiconductor component is transported between the plurality of processing stations, or located in the distribution process after the semiconductor component is manufactured In or on an equal groove; a second pick-and-place mechanism group configured to collectively transport a semiconductor component between the conveyor device and the second package member, the second package member The first package member is different, and the second package member includes a plurality of slots, and the semiconductor component is located in or on the slots when the semiconductor component is transported between the plurality of processing stations, or The semiconductor component is in or on the trenches after the fabrication of the semiconductor component is completed, and the semiconductor components are semiconductor dies or integrated circuits (ICs). The system of claim 24, further comprising a second component carrier, the second component carrier comprising a plurality of receivers spaced apart from each other and formed on a top surface of the second component carrier, the The two component carrier is slidable between a first position and a second position, the second component carrier being configured to sequentially perform component transport with the rotary table structure when configured in the first position, thereby corresponding to the second plurality Rotating head and the first Transporting a second portion of the plurality of semiconductor components between the two component carriers, wherein the second portion of the plurality of components comprises a plurality of semiconductor components, wherein the first pick and place mechanism is configured to be configured when the second component carrier is configured In the second position, the second portion of the plurality of semiconductor elements is commonly carried between the second component carrier and the first package member. The system of claim 25, further comprising a moving mechanism configured to use the first component carrier and the second component carrier in the first position and the second position Coordinated cyclic shift between. The system of claim 26, wherein the operation of the first and second component carriers transports the plurality of semiconductor components separately from the first and second portions of the rotary table structure in an independent manner. A method for transporting a plurality of semiconductor components, the method comprising: continuously transporting a plurality of semiconductor components from a rotating semiconductor component processing mechanism to a component carrier; retrieving the semiconductor components from the plurality of component carriers; and a plurality of semiconductors The component is transported from the component carrier to a package member. The method of claim 28, wherein the recovering the plurality of semiconductor elements from the component carrier comprises shifting a pick-and-place mechanism to pick up a plurality of semiconductor components from the component carrier. The method of claim 29, wherein the rotating semiconductor component processing mechanism comprises a plurality of heads for carrying a plurality of semiconductor components, and wherein a plurality of semiconductor components are continuously transported from the rotating semiconductor component processing mechanism to the component carrier. Scheduled travel path rotation Each of the plurality of heads is shifted, thereby rotating the semiconductor elements carried by the displacement along the predetermined travel path. The method of claim 30, wherein each of the plurality of heads is vertically displaceable for facilitating and achieving transport of the semiconductor component carried thereby to the component carrier. The method of claim 31, further comprising processing a plurality of semiconductor components during a rotational shift along a predetermined travel path. The method of claim 32, wherein the processing the plurality of semiconductor components comprises: detecting and testing at least a plurality of semiconductor components during a rotational shift along a predetermined travel path. The method of claim 31, wherein the pick and place mechanism comprises a plurality of pick-up tips configured to pick up a plurality of semiconductor components from the component carrier. The method of claim 34, further comprising moving the plurality of pick-up tips toward the component carrier, thereby facilitating and achieving the picking of the plurality of semiconductor components from the component carrier. The method of claim 35, further comprising simultaneously shifting a plurality of pick-up tips for transporting the plurality of semiconductor components from the component carrier to the package member. The method of claim 34, wherein the plurality of pick-up tips of the pick-and-place mechanisms are configured in a consistent pitch configuration. The method of claim 34, the component carrier comprising a plurality of receivers configured to receive a plurality of semiconductor components, wherein The plurality of receivers of the component carrier have a uniform configuration with the plurality of pick-up tips of the pick-and-place mechanism. The method of claim 34, wherein the package member is a disk-type package member, comprising a plurality of receiving grooves formed thereon, and wherein the plurality of receiving grooves are spaced apart from the plurality of component carriers The receivers have the same spacing as each of the plurality of pick-up tips of the pick-and-place mechanism. The method of claim 38, further comprising a spacing of the displacement element carrier, which is equal to each of the plurality of semiconductor elements being transported from the rotating semiconductor element processing mechanism to the component carrier. The spacing between multiple receivers. The method of claim 38, further comprising: the component carrier is from an input location (wherein the component carrier is at the input location, the plurality of semiconductor components are received by the plurality of receivers of the component carrier from the rotating semiconductor The component processing mechanism is continuously received and shifted to an output position (wherein the component carrier is carried by the plurality of pick-up tips of the pick-and-place mechanism when the component carrier is at the output position). The method of claim 41, further comprising: coupling a programmable controller to the rotating semiconductor component processing mechanism, the component carrier, and at least one of the pick and place mechanism for controlling the rotating semiconductor At least one of a rotational displacement of the component processing mechanism, a rotational displacement of the component carrier, and an operation of the pick and place mechanism. A method for transporting a plurality of components, the method comprising: transporting an component from an input package member to an input position of a rotary component processing mechanism, wherein the input package member comprises a plurality of slots, the The plurality of components are located in or on the plurality of slots when transported between the plurality of components and the plurality of processing stations, or are located in the plurality of slots during distribution of the plurality of components or after the plurality of components are manufactured or a transport path transporting element along the rotational travel path between the input position and an unloading position of the rotary element processing mechanism; and transporting the component from the input package member to the input position of the rotary element processing mechanism simultaneously or in parallel, Transporting the component from the unloading position to an output package member, the output package member including a plurality of slots, the plurality of components being located in the plurality of slots when transported between the plurality of components and the plurality of processing stations Or in or among the plurality of slots during the dispensing process after the plurality of components are manufactured, wherein the transporting member to the input position of the rotating member processing mechanism and the transporting member from the unloading position to the output package member One of the following includes: continuously transporting components between the rotating element processing mechanism and a plurality of component receivers, wherein the plurality of component receivers are To first movable member in a top surface of the carrier; and to the first support element, between the input member and one of the package of the output member and the entire package conveying element. The method of claim 43, further comprising processing the component at a particular location along the rotational travel path during transport of the plurality of components between the input location and the unloading location. The method of claim 43, wherein the input position of the transport element to the rotary element processing mechanism, and the transporting element from the unloading position to the output package member comprises: Continuingly transporting elements between the rotating element processing mechanism and a plurality of component receivers, wherein the plurality of component receivers are formed on a top surface of a movable second component carrier; and in the second component carrier The plurality of component receptacles and the entire transport component between the input package member and one of the output package members. The method of claim 45, wherein the continuous transport element and the entire transport element comprise the first element carrier displaced in a coordinated cyclic manner with respect to the second element carrier. The method of claim 45, wherein the entire transport element between the component carrier and one of the input package member and the output package member comprises simultaneously carrying the plurality of components using a pick and place mechanism group. The method of claim 47, wherein the pick-and-place mechanism group comprises a plurality of pick-up heads that are displaceable, thereby facilitating and achieving one of the component carrier and the input package member and the output package member Transport components simultaneously. The method of claim 48, wherein the plurality of pick-up tips have a consistent spacing configuration. The method of claim 49, wherein the plurality of receivers of each of the first and second component carriers have a substantially equal spacing configuration as compared to the plurality of picking tips.