CN1663120B - 具有一个多层衬底的电子组件 - Google Patents

具有一个多层衬底的电子组件 Download PDF

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Publication number
CN1663120B
CN1663120B CN038149338A CN03814933A CN1663120B CN 1663120 B CN1663120 B CN 1663120B CN 038149338 A CN038149338 A CN 038149338A CN 03814933 A CN03814933 A CN 03814933A CN 1663120 B CN1663120 B CN 1663120B
Authority
CN
China
Prior art keywords
electronic building
building brick
multilayer substrate
chip assembly
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN038149338A
Other languages
English (en)
Chinese (zh)
Other versions
CN1663120A (zh
Inventor
A·普尔扎卡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN1663120A publication Critical patent/CN1663120A/zh
Application granted granted Critical
Publication of CN1663120B publication Critical patent/CN1663120B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0557—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the other elements being buried in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Transceivers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN038149338A 2002-06-25 2003-05-07 具有一个多层衬底的电子组件 Expired - Lifetime CN1663120B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10228328A DE10228328A1 (de) 2002-06-25 2002-06-25 Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren
DE10228328.1 2002-06-25
PCT/DE2003/001465 WO2004001963A1 (de) 2002-06-25 2003-05-07 Elektronisches bauelement mit einem mehrlagensubstrat und herstellungsverfahren

Publications (2)

Publication Number Publication Date
CN1663120A CN1663120A (zh) 2005-08-31
CN1663120B true CN1663120B (zh) 2011-06-22

Family

ID=29761391

Family Applications (1)

Application Number Title Priority Date Filing Date
CN038149338A Expired - Lifetime CN1663120B (zh) 2002-06-25 2003-05-07 具有一个多层衬底的电子组件

Country Status (6)

Country Link
US (1) US7795728B2 (ja)
JP (1) JP4778228B2 (ja)
KR (1) KR100954030B1 (ja)
CN (1) CN1663120B (ja)
DE (1) DE10228328A1 (ja)
WO (1) WO2004001963A1 (ja)

Cited By (1)

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CN110071101A (zh) * 2018-01-22 2019-07-30 三星电子株式会社 存储器封装件和相关的半导体封装件

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JP4343082B2 (ja) * 2003-12-25 2009-10-14 アルプス電気株式会社 電子回路ユニット、及びその製造方法
DE102004003884A1 (de) * 2004-01-26 2005-08-11 Epcos Ag Chip-Bauelement mit Resonatoren und Verwendung dafür
DE102004031397A1 (de) * 2004-06-29 2006-01-26 Epcos Ag Duplexer
DE102004032928B4 (de) 2004-07-07 2013-03-07 Epcos Ag RF-Modul mit verbesserter Integration
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US7327030B2 (en) * 2005-12-16 2008-02-05 Atmel Corporation Apparatus and method incorporating discrete passive components in an electronic package
DE102006022580B4 (de) * 2006-05-15 2014-10-09 Epcos Ag Elektrisches Bauelement
DE102007019082B4 (de) * 2007-04-23 2018-04-05 Snaptrack Inc. Frontendmodul
DE102007020288B4 (de) * 2007-04-30 2013-12-12 Epcos Ag Elektrisches Bauelement
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KR101393771B1 (ko) * 2007-06-28 2014-05-13 엘지이노텍 주식회사 프론트 앤드 모듈 및 그 제조 방법
US7956713B2 (en) * 2007-09-25 2011-06-07 Intel Corporation Forming a helical inductor
JP4438864B2 (ja) * 2007-12-28 2010-03-24 株式会社村田製作所 基板及びこれを備えた電子装置
KR101018785B1 (ko) * 2008-11-28 2011-03-03 삼성전기주식회사 전자기 밴드갭 구조물 및 회로 기판
DE102009012516B4 (de) * 2009-03-10 2011-02-10 Epcos Ag Mehrlagensubstrat für hochintegriertes Modul
KR101215303B1 (ko) * 2009-07-21 2012-12-26 한국전자통신연구원 엘티씨씨 인덕터를 포함하는 전자 장치
DE102009034101B4 (de) * 2009-07-21 2017-02-02 Epcos Ag Filterschaltung mit verbesserter Filtercharakteristik
JP5170174B2 (ja) * 2010-06-28 2013-03-27 株式会社村田製作所 モジュール
KR101059485B1 (ko) 2010-08-12 2011-08-25 연세대학교 산학협력단 동위상 전력 분배기
DE102010034914A1 (de) 2010-08-20 2012-02-23 Epcos Ag Duplexer mit Balun
CN103098359B (zh) * 2011-01-25 2015-04-29 株式会社村田制作所 Dc-dc 变换器模块以及多层基板
DE112012002879B4 (de) 2011-07-08 2018-03-01 Murata Manufacturing Co., Ltd. Schaltungsmodul
US9058455B2 (en) * 2012-01-20 2015-06-16 International Business Machines Corporation Backside integration of RF filters for RF front end modules and design structure
DE102012207833A1 (de) * 2012-05-10 2013-11-14 Bayerische Motoren Werke Aktiengesellschaft Verfahren zur Bildung einer Spule in einer Leiterplatte
US9246467B2 (en) * 2012-05-31 2016-01-26 Texas Instruments Incorporated Integrated resonator with a mass bias
CN103078157B (zh) * 2013-01-16 2016-03-30 天津大学 一种压电声波双工器模块
US20150223323A1 (en) * 2014-02-05 2015-08-06 Colin Patrick O'Flynn Footprint for Prototyping High Frequency Printed Circuit Boards
WO2015162656A1 (ja) * 2014-04-21 2015-10-29 株式会社日立製作所 多層プリント基板
CN111164889B (zh) * 2017-09-29 2023-11-03 株式会社村田制作所 混合滤波器装置以及多路调制器
CN107958897A (zh) * 2017-11-28 2018-04-24 上海旦迪通信技术有限公司 一种北斗lna集成模块及其制备方法
DE102017130924B3 (de) * 2017-12-21 2019-05-16 RF360 Europe GmbH Hybridfilter
DE102018105091A1 (de) * 2018-03-06 2019-09-12 RF360 Europe GmbH HF-Filter, HF-Filterkomponente und Verfahren zur Herstellung eines HF-Filters
KR102084066B1 (ko) 2018-06-12 2020-03-04 주식회사 모다이노칩 적층형 소자
US10573803B1 (en) * 2018-08-21 2020-02-25 Semiconductor Components Industries, Llc Current sensor packages with through hole in semiconductor
JP7252770B2 (ja) * 2019-02-01 2023-04-05 太陽誘電株式会社 高周波デバイスおよびマルチプレクサ
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CN110602866B (zh) * 2019-08-01 2021-03-09 苏州浪潮智能科技有限公司 一种减少远端参考电源噪声影响信号质量的方法和系统
CN111669129B (zh) * 2020-06-05 2023-06-20 中国电子科技集团公司第十三研究所 放大器芯片
KR20230151010A (ko) * 2021-03-23 2023-10-31 스펙트론 (선전) 테크놀로지스 씨오., 엘티디 무선주파수 필터 및 이의 제조 방법

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110071101A (zh) * 2018-01-22 2019-07-30 三星电子株式会社 存储器封装件和相关的半导体封装件
CN110071101B (zh) * 2018-01-22 2024-05-14 三星电子株式会社 存储器封装件和相关的半导体封装件

Also Published As

Publication number Publication date
US7795728B2 (en) 2010-09-14
KR100954030B1 (ko) 2010-04-20
KR20050013159A (ko) 2005-02-02
WO2004001963A1 (de) 2003-12-31
CN1663120A (zh) 2005-08-31
DE10228328A1 (de) 2004-01-22
US20050230812A1 (en) 2005-10-20
JP4778228B2 (ja) 2011-09-21
JP2005531138A (ja) 2005-10-13

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20170911

Address after: California, USA

Patentee after: SNAPTRACK, Inc.

Address before: Munich, Germany

Patentee before: EPCOS AG

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20110622

CX01 Expiry of patent term