JP5170174B2 - モジュール - Google Patents
モジュール Download PDFInfo
- Publication number
- JP5170174B2 JP5170174B2 JP2010145988A JP2010145988A JP5170174B2 JP 5170174 B2 JP5170174 B2 JP 5170174B2 JP 2010145988 A JP2010145988 A JP 2010145988A JP 2010145988 A JP2010145988 A JP 2010145988A JP 5170174 B2 JP5170174 B2 JP 5170174B2
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- JP
- Japan
- Prior art keywords
- wiring
- layer
- signal
- pattern
- balun
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1758—Series LC in shunt or branch path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/42—Balance/unbalance networks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0078—Constructional details comprising spiral inductor on a substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H5/00—One-port networks comprising only passive electrical elements as network components
Description
図1に示すように、モジュール1は、ベースバンド信号をRF信号に変調する変調回路部と、RF信号をベースバンド信号に復調する復調回路部とを有するIC2が実装された基板3を備えており、無線LAN規格やBluetooth(登録商標)規格の無線通信機器(図示省略)のマザーボードMBに実装される。
6とを含んでいる。
次に、図1のモジュール1の製造方法の一例についてその概略を説明する。この実施形態のモジュール1は、図3(a)〜(h)に示す第2の配線層5を形成する各層20〜27と、図3(i)に示す絶縁体層6を形成する層28と、図3(j)に示す第1の配線層4を形成する層29とを成す複数枚のグリーンシートが層20〜層29の順に積層されて低温焼成されることにより形成された基板3の上面にIC2が実装されることにより形成される。なお、第1の配線層4は、複数枚のグリーンシートが積層されることにより内部にベースバンド信号用回路7が設けられた多層構造であるが、この実施形態では、第1の配線層4を形成する層29についての詳細な説明は省略する。
図1に示すモジュール1において、アンテナ端子ANTを介して入力端子P1に入力された搬送波としてのRF信号は、フィルタ回路10で所望の周波数の信号を通過させるフィルタ処理をされる。そして、フィルタ回路10によりフィルタ処理されたRF信号は、バラン9において、不平衡状態から平衡状態に変換されて、接続配線12,13を介してIC2のRF端子TXA,TXBに入力される。
2 IC
3 基板
4 第1の配線層
5 第2の配線層
6 絶縁体層
9 バラン
9a 平衡側配線パターン
9b 不平衡側配線パターン
11 整合回路
12,13 接続配線
GNDa 接地電極パターン
P3,P4 平衡側端子
TXA、TXB RF端子
Claims (3)
- ベースバンド信号をRF信号に変調する変調回路部と、RF信号をベースバンド信号に復調する復調回路部とを有するICが実装された基板を備えるモジュールにおいて、
前記基板は、上面側に前記ICが配置された第1の配線層と、前記第1の配線層の下面側に配置された第2の配線層と、前記第1の配線層と前記第2の配線層との間に配置された絶縁体層とを含み、
前記第1の配線層には、ベースバンド信号用配線パターンが設けられ、前記第2の配線層には、RF信号用配線パターンが設けられて、前記絶縁体層の一方の面には、ほぼ全面に渡る平板状の接地電極パターンが設けられており、
前記第2の配線層には、前記RF信号用配線パターンにより少なくともバランが形成され、前記バランを形成する前記RF信号用配線パターンの少なくとも一部は、上面視で前記ICのRF端子と前記バランの平衡側端子とを電気的に接続する接続配線を囲んで前記第2の配線層の上面側に形成されるとともに、整合回路がさらに設けられ、前記整合回路は、上面視において前記バランを形成する前記RF信号用配線パターンに囲まれて配置されており、
前記RF端子と前記平衡側端子とは前記整合回路を介して前記接続配線により接続されていることを特徴とするモジュール。 - 前記第2の配線層の上面側に前記接続配線を囲んで形成される前記バランの前記RF信号用配線パターンは、前記バランの平衡側配線パターンであることを特徴とする請求項1に記載のモジュール。
- 前記RF信号用配線パターンによる前記バランの不平衡側配線パターンは、前記平衡側配線パターンよりも下面側に形成されていることを特徴とする請求項2に記載のモジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010145988A JP5170174B2 (ja) | 2010-06-28 | 2010-06-28 | モジュール |
CN201110190849.6A CN102437435B (zh) | 2010-06-28 | 2011-06-27 | 一种包含安装有ic的基板的模块 |
US13/169,095 US8797117B2 (en) | 2010-06-28 | 2011-06-27 | Modulation circuit with balun shielding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010145988A JP5170174B2 (ja) | 2010-06-28 | 2010-06-28 | モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012010224A JP2012010224A (ja) | 2012-01-12 |
JP5170174B2 true JP5170174B2 (ja) | 2013-03-27 |
Family
ID=45351983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010145988A Expired - Fee Related JP5170174B2 (ja) | 2010-06-28 | 2010-06-28 | モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US8797117B2 (ja) |
JP (1) | JP5170174B2 (ja) |
CN (1) | CN102437435B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9236907B2 (en) * | 2010-09-14 | 2016-01-12 | Hitachi Metals, Ltd. | Laminate-type electronic device with filter and balun |
CN103579731B (zh) * | 2012-08-03 | 2018-04-03 | Tdk株式会社 | 层叠构造型平衡‑不平衡变换器 |
CN103117427A (zh) * | 2013-02-05 | 2013-05-22 | 江苏万邦微电子有限公司 | 宽带微型低温共烧陶瓷平衡滤波器 |
KR101952870B1 (ko) | 2017-01-23 | 2019-02-28 | 삼성전기주식회사 | 안테나 통합형 rf 모듈 |
KR102362243B1 (ko) * | 2017-10-18 | 2022-02-11 | 삼성전자주식회사 | Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2739726B2 (ja) * | 1990-09-27 | 1998-04-15 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層プリント回路板 |
JP2000156548A (ja) * | 1998-11-20 | 2000-06-06 | Yaskawa Electric Corp | 電子回路部品の電源パターン接続構造 |
JP3800504B2 (ja) * | 2001-05-15 | 2006-07-26 | Tdk株式会社 | フロントエンドモジュール |
DE10228328A1 (de) * | 2002-06-25 | 2004-01-22 | Epcos Ag | Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren |
DE10316719B4 (de) * | 2003-04-11 | 2018-08-02 | Snaptrack, Inc. | Frontendschaltung für drahtlose Übertragungssysteme |
JP3770883B2 (ja) * | 2003-04-17 | 2006-04-26 | 双信電機株式会社 | 受動部品 |
JP2005027184A (ja) * | 2003-07-04 | 2005-01-27 | Seiko Epson Corp | 高周波複合部品 |
JP2005302823A (ja) * | 2004-04-07 | 2005-10-27 | Seiko Epson Corp | 電子部品モジュール |
JP2007243559A (ja) * | 2006-03-08 | 2007-09-20 | Mitsumi Electric Co Ltd | アンテナモジュール及びアンテナ装置 |
JP2007305861A (ja) * | 2006-05-12 | 2007-11-22 | Alps Electric Co Ltd | 相互インダクタンス素子および平衡不平衡変換器 |
-
2010
- 2010-06-28 JP JP2010145988A patent/JP5170174B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-27 CN CN201110190849.6A patent/CN102437435B/zh not_active Expired - Fee Related
- 2011-06-27 US US13/169,095 patent/US8797117B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012010224A (ja) | 2012-01-12 |
US8797117B2 (en) | 2014-08-05 |
CN102437435A (zh) | 2012-05-02 |
CN102437435B (zh) | 2014-07-09 |
US20110316642A1 (en) | 2011-12-29 |
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