CN1599087A - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN1599087A
CN1599087A CNA2004100465931A CN200410046593A CN1599087A CN 1599087 A CN1599087 A CN 1599087A CN A2004100465931 A CNA2004100465931 A CN A2004100465931A CN 200410046593 A CN200410046593 A CN 200410046593A CN 1599087 A CN1599087 A CN 1599087A
Authority
CN
China
Prior art keywords
light
phosphor
led chip
emitting device
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004100465931A
Other languages
English (en)
Chinese (zh)
Inventor
森田康正
大场勇人
藤泽茂夫
田中稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of CN1599087A publication Critical patent/CN1599087A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Led Device Packages (AREA)
CNA2004100465931A 2003-09-17 2004-06-11 半导体发光装置 Pending CN1599087A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP324884/2003 2003-09-17
JP2003324884A JP2005093712A (ja) 2003-09-17 2003-09-17 半導体発光装置

Publications (1)

Publication Number Publication Date
CN1599087A true CN1599087A (zh) 2005-03-23

Family

ID=34270081

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004100465931A Pending CN1599087A (zh) 2003-09-17 2004-06-11 半导体发光装置

Country Status (3)

Country Link
US (1) US20050057144A1 (enExample)
JP (1) JP2005093712A (enExample)
CN (1) CN1599087A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373646C (zh) * 2005-03-25 2008-03-05 李洲科技股份有限公司 多波长发光二极体构造及其制程
CN100418242C (zh) * 2006-05-17 2008-09-10 广州南科集成电子有限公司 Led制造方法
CN101963315A (zh) * 2010-10-14 2011-02-02 友达光电股份有限公司 光源模块与液晶显示器
CN101449391B (zh) * 2006-05-30 2011-02-23 株式会社藤仓 发光元件安装用基板、光源、照明装置、显示装置、交通信号机及发光元件安装用基板的制造方法
CN1929159B (zh) * 2005-09-08 2011-08-10 斯坦雷电气株式会社 半导体发光装置
US8227822B2 (en) 2008-12-25 2012-07-24 Au Optronics Corporation Light emitting diode apparatus
CN102610602A (zh) * 2011-01-25 2012-07-25 四川柏狮光电技术有限公司 单一封装材质高解析度led光源及其制备工艺
CN102720957A (zh) * 2011-12-04 2012-10-10 深圳市光峰光电技术有限公司 发光装置、投影装置和照明装置
CN103107266A (zh) * 2012-12-18 2013-05-15 浙江中宙光电股份有限公司 Led白光器件及其制备方法
TWI427371B (zh) * 2010-10-06 2014-02-21 Au Optronics Corp 光源模組與液晶顯示器
CN103913799A (zh) * 2014-04-09 2014-07-09 常州巨猫电子科技有限公司 一种led导光柱及其应用

Families Citing this family (24)

* Cited by examiner, † Cited by third party
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JP2006308859A (ja) * 2005-04-28 2006-11-09 Mitsubishi Chemicals Corp 表示装置
JP4727297B2 (ja) * 2005-05-19 2011-07-20 三菱電機株式会社 半導体発光装置
KR100666189B1 (ko) 2005-06-30 2007-01-09 서울반도체 주식회사 발광 소자
KR100665222B1 (ko) * 2005-07-26 2007-01-09 삼성전기주식회사 확산재료를 이용한 엘이디 패키지 및 그 제조 방법
US7329907B2 (en) * 2005-08-12 2008-02-12 Avago Technologies, Ecbu Ip Pte Ltd Phosphor-converted LED devices having improved light distribution uniformity
KR100691440B1 (ko) * 2005-11-15 2007-03-09 삼성전기주식회사 Ｌｅｄ 패키지
JP4417906B2 (ja) * 2005-12-16 2010-02-17 株式会社東芝 発光装置及びその製造方法
JP2007273562A (ja) * 2006-03-30 2007-10-18 Toshiba Corp 半導体発光装置
JP2009540595A (ja) * 2006-06-14 2009-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 照明デバイス
JP2008041739A (ja) * 2006-08-02 2008-02-21 Tokai Kogaku Kk 蛍光発光装置
TWI418054B (zh) * 2006-08-08 2013-12-01 Ｌｇ電子股份有限公司 發光裝置封裝與製造此封裝之方法
US7910938B2 (en) 2006-09-01 2011-03-22 Cree, Inc. Encapsulant profile for light emitting diodes
JP4961978B2 (ja) * 2006-11-30 2012-06-27 日亜化学工業株式会社 発光装置およびその製造方法
JP5262054B2 (ja) * 2007-10-10 2013-08-14 日亜化学工業株式会社 発光装置の製造方法
KR101423723B1 (ko) * 2007-10-29 2014-08-04 서울바이오시스 주식회사 발광 다이오드 패키지
US8547009B2 (en) 2009-07-10 2013-10-01 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
JP5734581B2 (ja) * 2010-05-21 2015-06-17 シャープ株式会社 半導体発光装置
TWI562405B (en) 2013-09-23 2016-12-11 Brightek Optoelectronic Shenzhen Co Ltd Method of manufacturing led package structure for preventing lateral light leakage
CN103633230B (zh) * 2013-12-18 2016-05-11 东南大学 一种消除白光led色温偏差的荧光材料
JP6303805B2 (ja) 2014-05-21 2018-04-04 日亜化学工業株式会社 発光装置及びその製造方法
DE102015101216A1 (de) * 2015-01-28 2016-07-28 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung mit Strahlungskonversionselement und Verfahren zur Herstellung eines Strahlungskonversionselements
CN105405951A (zh) * 2015-12-20 2016-03-16 合肥艾斯克光电科技有限责任公司 一种led白光灯的封装方法
KR102389815B1 (ko) * 2017-06-05 2022-04-22 삼성전자주식회사 양자점 유리셀 및 이를 포함하는 발광소자 패키지

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US5122733A (en) * 1986-01-15 1992-06-16 Karel Havel Variable color digital multimeter
JP3420612B2 (ja) * 1993-06-25 2003-06-30 株式会社東芝 Ｌｅｄランプ
CN1264228C (zh) * 1996-06-26 2006-07-12 奥斯兰姆奥普托半导体股份有限两合公司 发光半导体器件、全色发光二极管显示装置及其应用
JP2001196642A (ja) * 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd 発光装置
JP4406490B2 (ja) * 2000-03-14 2010-01-27 株式会社朝日ラバー 発光ダイオード
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US6642652B2 (en) * 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
TW511303B (en) * 2001-08-21 2002-11-21 Wen-Jr He A light mixing layer and method
US6870311B2 (en) * 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
TW558775B (en) * 2002-06-27 2003-10-21 Solidlite Corp Package of compound type LED

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373646C (zh) * 2005-03-25 2008-03-05 李洲科技股份有限公司 多波长发光二极体构造及其制程
CN1929159B (zh) * 2005-09-08 2011-08-10 斯坦雷电气株式会社 半导体发光装置
CN100418242C (zh) * 2006-05-17 2008-09-10 广州南科集成电子有限公司 Led制造方法
CN101449391B (zh) * 2006-05-30 2011-02-23 株式会社藤仓 发光元件安装用基板、光源、照明装置、显示装置、交通信号机及发光元件安装用基板的制造方法
US8227822B2 (en) 2008-12-25 2012-07-24 Au Optronics Corporation Light emitting diode apparatus
TWI427371B (zh) * 2010-10-06 2014-02-21 Au Optronics Corp 光源模組與液晶顯示器
CN101963315A (zh) * 2010-10-14 2011-02-02 友达光电股份有限公司 光源模块与液晶显示器
CN101963315B (zh) * 2010-10-14 2016-01-20 友达光电股份有限公司 光源模块与液晶显示器
CN102610602A (zh) * 2011-01-25 2012-07-25 四川柏狮光电技术有限公司 单一封装材质高解析度led光源及其制备工艺
CN102720957A (zh) * 2011-12-04 2012-10-10 深圳市光峰光电技术有限公司 发光装置、投影装置和照明装置
CN103107266A (zh) * 2012-12-18 2013-05-15 浙江中宙光电股份有限公司 Led白光器件及其制备方法
CN103913799A (zh) * 2014-04-09 2014-07-09 常州巨猫电子科技有限公司 一种led导光柱及其应用

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Publication number Publication date
US20050057144A1 (en) 2005-03-17
JP2005093712A (ja) 2005-04-07

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