CN1591889A - 固态成像装置及其制造方法 - Google Patents
固态成像装置及其制造方法 Download PDFInfo
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- CN1591889A CN1591889A CNA2004100752118A CN200410075211A CN1591889A CN 1591889 A CN1591889 A CN 1591889A CN A2004100752118 A CNA2004100752118 A CN A2004100752118A CN 200410075211 A CN200410075211 A CN 200410075211A CN 1591889 A CN1591889 A CN 1591889A
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- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 22
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003311723A JP3838572B2 (ja) | 2003-09-03 | 2003-09-03 | 固体撮像装置およびその製造方法 |
JP311723/2003 | 2003-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1591889A true CN1591889A (zh) | 2005-03-09 |
CN100433343C CN100433343C (zh) | 2008-11-12 |
Family
ID=34131846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100752118A Expired - Fee Related CN100433343C (zh) | 2003-09-03 | 2004-09-03 | 固态成像装置及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7378748B2 (zh) |
EP (1) | EP1513200A3 (zh) |
JP (1) | JP3838572B2 (zh) |
KR (1) | KR100572388B1 (zh) |
CN (1) | CN100433343C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569604A (zh) * | 2011-10-27 | 2012-07-11 | 深圳市灏天光电有限公司 | 一种隐脚式大功率led支架及封装结构与封装工艺 |
CN112492135A (zh) * | 2014-12-17 | 2021-03-12 | Lg伊诺特有限公司 | 相机模块 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339448A (ja) * | 2005-06-02 | 2006-12-14 | Canon Inc | 受光ユニットを有する露光装置 |
US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
JP4467506B2 (ja) * | 2005-11-24 | 2010-05-26 | 三菱電機株式会社 | パッケージおよびそれを用いた電子装置 |
US9711343B1 (en) * | 2006-12-14 | 2017-07-18 | Utac Thai Limited | Molded leadframe substrate semiconductor package |
JP2008226378A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイス、その製造方法および光ピックアップモジュール |
JP5132957B2 (ja) * | 2007-03-14 | 2013-01-30 | パナソニック株式会社 | 半導体デバイス、その製造方法および光ピックアップモジュール |
JP2008227233A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイスの製造方法、光ピックアップモジュール、および半導体デバイス |
JP2008227232A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイスの製造方法、半導体デバイスおよび光ピックアップモジュール |
US8493748B2 (en) * | 2007-06-27 | 2013-07-23 | Stats Chippac Ltd. | Packaging system with hollow package and method for the same |
US7763983B2 (en) * | 2007-07-02 | 2010-07-27 | Tessera, Inc. | Stackable microelectronic device carriers, stacked device carriers and methods of making the same |
JP2009141198A (ja) * | 2007-12-07 | 2009-06-25 | Panasonic Corp | 半導体装置及びその製造方法と、該半導体装置を備えるカメラモジュール |
US20090152653A1 (en) * | 2007-12-14 | 2009-06-18 | Borzabadi Hamid R | Surface mount multi-axis electronics package for micro-electrical mechanical systems(MEMS) devices |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
CN102738013B (zh) * | 2011-04-13 | 2016-04-20 | 精材科技股份有限公司 | 晶片封装体及其制作方法 |
JP5865038B2 (ja) | 2011-11-30 | 2016-02-17 | 日東電工株式会社 | 素子接続用基板、その製造方法および発光ダイオード装置 |
TWI545714B (zh) * | 2015-03-06 | 2016-08-11 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
JP6859634B2 (ja) * | 2016-09-12 | 2021-04-14 | 新日本無線株式会社 | 中空パッケージの製造方法 |
FR3061629A1 (fr) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot |
FR3061628A1 (fr) | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | Procede de fabrication d'un capot d'encapsulation pour boitier electronique et boitier electronique comprenant un capot |
FR3061630B1 (fr) | 2017-01-03 | 2021-07-09 | St Microelectronics Grenoble 2 | Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot |
TWI797977B (zh) * | 2022-01-27 | 2023-04-01 | 台灣晶技股份有限公司 | 封裝結構 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58127474A (ja) | 1982-01-25 | 1983-07-29 | Hitachi Ltd | 固体撮像装置 |
JPS6428853U (zh) | 1987-08-13 | 1989-02-21 | ||
JP3074773B2 (ja) | 1991-05-15 | 2000-08-07 | 日本電気株式会社 | 固体撮像素子 |
JP2843464B2 (ja) * | 1992-09-01 | 1999-01-06 | シャープ株式会社 | 固体撮像装置 |
EP1213754A3 (en) * | 1994-03-18 | 2005-05-25 | Hitachi Chemical Co., Ltd. | Fabrication process of semiconductor package and semiconductor package |
TW436369B (en) * | 1997-07-11 | 2001-05-28 | Tokyo Seimitsu Co Ltd | Wafer polishing device |
JP2001077277A (ja) | 1999-09-03 | 2001-03-23 | Sony Corp | 半導体パッケージおよび半導体パッケージ製造方法 |
US6384472B1 (en) * | 2000-03-24 | 2002-05-07 | Siliconware Precision Industries Co., Ltd | Leadless image sensor package structure and method for making the same |
TW473951B (en) * | 2001-01-17 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Non-leaded quad flat image sensor package |
JP2002373950A (ja) | 2001-06-15 | 2002-12-26 | Seiko Instruments Inc | 気密封止icパッケージの製造方法 |
TW521410B (en) * | 2001-11-15 | 2003-02-21 | Siliconware Precision Industries Co Ltd | Semiconductor package article |
TW551644U (en) * | 2002-06-28 | 2003-09-01 | Cen Link Co Ltd | Electrical connector |
TW551611U (en) | 2002-12-13 | 2003-09-01 | Kingpak Tech Inc | Improved structure of photo sensor package |
-
2003
- 2003-09-03 JP JP2003311723A patent/JP3838572B2/ja not_active Expired - Fee Related
-
2004
- 2004-08-31 US US10/931,101 patent/US7378748B2/en not_active Expired - Fee Related
- 2004-09-01 EP EP04020750A patent/EP1513200A3/en not_active Withdrawn
- 2004-09-02 KR KR1020040069915A patent/KR100572388B1/ko not_active IP Right Cessation
- 2004-09-03 CN CNB2004100752118A patent/CN100433343C/zh not_active Expired - Fee Related
-
2008
- 2008-04-03 US US12/080,557 patent/US7691678B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569604A (zh) * | 2011-10-27 | 2012-07-11 | 深圳市灏天光电有限公司 | 一种隐脚式大功率led支架及封装结构与封装工艺 |
CN102569604B (zh) * | 2011-10-27 | 2013-11-06 | 深圳市灏天光电有限公司 | 一种隐脚式大功率led支架及封装结构与封装工艺 |
CN112492135A (zh) * | 2014-12-17 | 2021-03-12 | Lg伊诺特有限公司 | 相机模块 |
CN112492135B (zh) * | 2014-12-17 | 2022-11-04 | Lg伊诺特有限公司 | 相机模块 |
Also Published As
Publication number | Publication date |
---|---|
US7378748B2 (en) | 2008-05-27 |
KR20050024263A (ko) | 2005-03-10 |
CN100433343C (zh) | 2008-11-12 |
US20080194055A1 (en) | 2008-08-14 |
KR100572388B1 (ko) | 2006-04-18 |
US7691678B2 (en) | 2010-04-06 |
JP3838572B2 (ja) | 2006-10-25 |
US20050044618A1 (en) | 2005-03-03 |
JP2005079537A (ja) | 2005-03-24 |
EP1513200A2 (en) | 2005-03-09 |
EP1513200A3 (en) | 2006-05-24 |
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GR01 | Patent grant | ||
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Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141203 |
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Effective date of registration: 20141203 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20160903 |
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CF01 | Termination of patent right due to non-payment of annual fee |