JP3838572B2 - 固体撮像装置およびその製造方法 - Google Patents
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
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- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
図1は、実施の形態1における固体撮像装置の断面図、図2は下面図、図3は側面図である。
実施の形態2における固体撮像装置の製造方法について、図5〜7を参照して説明する。この製造方法は、実施の形態1に示した構造の固体撮像装置を製造する方法である。
実施の形態3における固体撮像装置の製造方法について、図9を参照して説明する。この製造方法は、実施の形態2に示した製造方法と概略同様であるが、透明板として、複数の固体撮像装置の領域に亘る大面積のものではなく、個別に装着される透明板を用いる点が相違する。初期の工程は図5(a)〜図5(c)と同様であるので、説明を省略する。
2 基板部
3 リブ
3a 低段部
4 内部空間
5 撮像素子
6 接合部材
7 透光版
8 接着材
9 金属リード片
9a 内部端子部
9b 外部端子部
9c 側面電極部
10 金属細線
21 リードフレーム
22 リード部
23 凹部
24 基板部
25 リブ形成部材
25a 溝部
26 筐体
27 透明板
28 接着材
29 ダイシングブレード
30 上金型
30a 凸部
31 下金型
32 凹部
33 空間部
34 透明板
35、36 フィレット
Claims (7)
- 基板部および矩形枠状のリブが樹脂により一体成形された筐体と、前記筐体に埋め込まれ、前記筐体の内部空間に面する内部端子部および前記筐体の外部に露出した外部端子部を各々有する複数本の金属リード片と、前記筐体の内部空間において前記基板部上に固定された撮像素子と、前記撮像素子の電極と前記金属リード片の内部端子部とを各々接続する金属細線と、前記リブの上端面に接合された透光板とを備えた固体撮像装置において、
前記リブの上端面に外周に沿って低くなった低段部が形成され、少なくとも前記低段部に充填された接着材により前記透光板が前記リブの上端面に接合されていることを特徴とする固体撮像装置。 - 前記各金属リード片は、前記内部端子部の位置における厚みが前記基板部の厚みと実質的に同一であり、前記内部端子部の位置に対応する裏面に前記外部端子部が形成された請求項1に記載の固体撮像装置。
- 前記リブの外側面は、前記基板部の面に対して実質的に直交する平面を形成し、前記透光板の端面は、前記リブの外側面と実質的に同一平面を形成している請求項1に記載の固体撮像装置。
- 基板部および矩形枠状のリブにより形成される筐体を複数個一括して、且つ前記筐体の各々に配置される複数本の金属リード片とともに一体的に樹脂成形して、前記各金属リード片により内部端子部および外部端子部を形成し、隣接する前記各筐体を形成する前記各リブを1本に合体させてリブ形成部材とするとともに、前記リブ形成部材の上端面にはその幅方向の中央部に配置され長さ方向に延在する溝部を設ける工程と、
前記各筐体の内部空間内の前記基板部上にそれぞれ撮像素子を固定する工程と、
前記撮像素子の電極と前記各金属リード片の前記内部端子部とを各々接続する工程と、
前記リブ形成部材の少なくとも前記溝を含む上端面に接着材を充填する工程と、
前記リブ形成部材の上端面に前記透明板を載置して接合する工程と、
前記各筐体毎に、前記基板部に直交し且つ前記各リブ形成部材の幅を2分する方向に前記溝内で切断して、固体撮像装置を各個片に分離する工程と
を備えたことを特徴とする固体撮像装置の製造方法。 - 前記筐体を前記複数本の金属リード片とともに一体的に樹脂成形する工程においては、
前記複数本の金属リード片を形成するためのリード部を複数組含み、前記各リード部の前記内部端子部に相当する位置における厚みが前記基板部の厚みと実質的に同一であるように形成したリードフレームを用意し、
前記リードフレームを、樹脂成形用金型の上金型における前記筐体の内部空間を形成する部分と下金型の間に、前記各リード部の内部端子部に相当する部分が挟み込まれてクランプされるように装着して前記筐体の樹脂成形を行う請求項4に記載の固体撮像装置の製造方法。 - 前記透明板を接合する際に、前記複数個の筐体に亘る大きさの前記透明板を前記リブ形成部材の上端面に載置し、前記各筐体毎に切断する際に、前記透明板も一括して切断する請求項4に記載の固体撮像装置の製造方法。
- 前記透明板を接合する際に、前記各筐体に対して各々別個の前記透明板を、隣接する前記各透明板の端縁を前記リブ形成部材の溝上に互いの間に隙間を形成して載置し、前記隙間の領域において前記各固体撮像装置を各個片に分離する請求項4に記載の固体撮像装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2003311723A JP3838572B2 (ja) | 2003-09-03 | 2003-09-03 | 固体撮像装置およびその製造方法 |
US10/931,101 US7378748B2 (en) | 2003-09-03 | 2004-08-31 | Solid-state imaging device and method for manufacturing the same |
EP04020750A EP1513200A3 (en) | 2003-09-03 | 2004-09-01 | Solid-state imaging device and method for manufacturing the same |
KR1020040069915A KR100572388B1 (ko) | 2003-09-03 | 2004-09-02 | 고체 촬상 장치 및 그 제조 방법 |
CNB2004100752118A CN100433343C (zh) | 2003-09-03 | 2004-09-03 | 固态成像装置及其制造方法 |
US12/080,557 US7691678B2 (en) | 2003-09-03 | 2008-04-03 | Solid-state imaging device and method for manufacturing the same |
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JP2003311723A JP3838572B2 (ja) | 2003-09-03 | 2003-09-03 | 固体撮像装置およびその製造方法 |
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JP2006183566A Division JP4219943B2 (ja) | 2006-07-03 | 2006-07-03 | 固体撮像装置 |
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JP2005079537A JP2005079537A (ja) | 2005-03-24 |
JP3838572B2 true JP3838572B2 (ja) | 2006-10-25 |
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JP2003311723A Expired - Fee Related JP3838572B2 (ja) | 2003-09-03 | 2003-09-03 | 固体撮像装置およびその製造方法 |
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US (2) | US7378748B2 (ja) |
EP (1) | EP1513200A3 (ja) |
JP (1) | JP3838572B2 (ja) |
KR (1) | KR100572388B1 (ja) |
CN (1) | CN100433343C (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339448A (ja) * | 2005-06-02 | 2006-12-14 | Canon Inc | 受光ユニットを有する露光装置 |
US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
JP4467506B2 (ja) * | 2005-11-24 | 2010-05-26 | 三菱電機株式会社 | パッケージおよびそれを用いた電子装置 |
US9711343B1 (en) * | 2006-12-14 | 2017-07-18 | Utac Thai Limited | Molded leadframe substrate semiconductor package |
JP2008227232A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイスの製造方法、半導体デバイスおよび光ピックアップモジュール |
JP2008227233A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイスの製造方法、光ピックアップモジュール、および半導体デバイス |
JP5132957B2 (ja) * | 2007-03-14 | 2013-01-30 | パナソニック株式会社 | 半導体デバイス、その製造方法および光ピックアップモジュール |
JP2008226378A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイス、その製造方法および光ピックアップモジュール |
US8493748B2 (en) * | 2007-06-27 | 2013-07-23 | Stats Chippac Ltd. | Packaging system with hollow package and method for the same |
US7763983B2 (en) * | 2007-07-02 | 2010-07-27 | Tessera, Inc. | Stackable microelectronic device carriers, stacked device carriers and methods of making the same |
JP2009141198A (ja) * | 2007-12-07 | 2009-06-25 | Panasonic Corp | 半導体装置及びその製造方法と、該半導体装置を備えるカメラモジュール |
US20090152653A1 (en) * | 2007-12-14 | 2009-06-18 | Borzabadi Hamid R | Surface mount multi-axis electronics package for micro-electrical mechanical systems(MEMS) devices |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
CN102738013B (zh) * | 2011-04-13 | 2016-04-20 | 精材科技股份有限公司 | 晶片封装体及其制作方法 |
CN202523753U (zh) * | 2011-10-27 | 2012-11-07 | 深圳市灏天光电有限公司 | 一种隐脚式大功率led支架及封装结构 |
JP5865038B2 (ja) * | 2011-11-30 | 2016-02-17 | 日東電工株式会社 | 素子接続用基板、その製造方法および発光ダイオード装置 |
CN116389867A (zh) * | 2014-12-17 | 2023-07-04 | Lg伊诺特有限公司 | 透镜驱动模块、相机模块和光学装置 |
TWI545714B (zh) * | 2015-03-06 | 2016-08-11 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
JP6859634B2 (ja) * | 2016-09-12 | 2021-04-14 | 新日本無線株式会社 | 中空パッケージの製造方法 |
FR3061628A1 (fr) | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | Procede de fabrication d'un capot d'encapsulation pour boitier electronique et boitier electronique comprenant un capot |
FR3061629A1 (fr) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot |
FR3061630B1 (fr) | 2017-01-03 | 2021-07-09 | St Microelectronics Grenoble 2 | Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot |
TWI797977B (zh) * | 2022-01-27 | 2023-04-01 | 台灣晶技股份有限公司 | 封裝結構 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58127474A (ja) | 1982-01-25 | 1983-07-29 | Hitachi Ltd | 固体撮像装置 |
JPS6428853U (ja) | 1987-08-13 | 1989-02-21 | ||
JP3074773B2 (ja) | 1991-05-15 | 2000-08-07 | 日本電気株式会社 | 固体撮像素子 |
JP2843464B2 (ja) * | 1992-09-01 | 1999-01-06 | シャープ株式会社 | 固体撮像装置 |
WO1995026047A1 (en) * | 1994-03-18 | 1995-09-28 | Hitachi Chemical Company, Ltd. | Semiconductor package manufacturing method and semiconductor package |
EP0890416A3 (en) * | 1997-07-11 | 2002-09-11 | Tokyo Seimitsu Co.,Ltd. | Wafer polishing apparatus |
JP2001077277A (ja) | 1999-09-03 | 2001-03-23 | Sony Corp | 半導体パッケージおよび半導体パッケージ製造方法 |
US6384472B1 (en) * | 2000-03-24 | 2002-05-07 | Siliconware Precision Industries Co., Ltd | Leadless image sensor package structure and method for making the same |
TW473951B (en) * | 2001-01-17 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Non-leaded quad flat image sensor package |
JP2002373950A (ja) | 2001-06-15 | 2002-12-26 | Seiko Instruments Inc | 気密封止icパッケージの製造方法 |
TW521410B (en) * | 2001-11-15 | 2003-02-21 | Siliconware Precision Industries Co Ltd | Semiconductor package article |
TW551644U (en) * | 2002-06-28 | 2003-09-01 | Cen Link Co Ltd | Electrical connector |
TW551611U (en) | 2002-12-13 | 2003-09-01 | Kingpak Tech Inc | Improved structure of photo sensor package |
-
2003
- 2003-09-03 JP JP2003311723A patent/JP3838572B2/ja not_active Expired - Fee Related
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2004
- 2004-08-31 US US10/931,101 patent/US7378748B2/en not_active Expired - Fee Related
- 2004-09-01 EP EP04020750A patent/EP1513200A3/en not_active Withdrawn
- 2004-09-02 KR KR1020040069915A patent/KR100572388B1/ko not_active IP Right Cessation
- 2004-09-03 CN CNB2004100752118A patent/CN100433343C/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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KR100572388B1 (ko) | 2006-04-18 |
EP1513200A3 (en) | 2006-05-24 |
EP1513200A2 (en) | 2005-03-09 |
JP2005079537A (ja) | 2005-03-24 |
US7691678B2 (en) | 2010-04-06 |
CN1591889A (zh) | 2005-03-09 |
US20050044618A1 (en) | 2005-03-03 |
US7378748B2 (en) | 2008-05-27 |
US20080194055A1 (en) | 2008-08-14 |
KR20050024263A (ko) | 2005-03-10 |
CN100433343C (zh) | 2008-11-12 |
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