CN1579011A - Cvd设备以及使用cvd设备清洗cvd设备的方法 - Google Patents
Cvd设备以及使用cvd设备清洗cvd设备的方法 Download PDFInfo
- Publication number
- CN1579011A CN1579011A CNA038014041A CN03801404A CN1579011A CN 1579011 A CN1579011 A CN 1579011A CN A038014041 A CNA038014041 A CN A038014041A CN 03801404 A CN03801404 A CN 03801404A CN 1579011 A CN1579011 A CN 1579011A
- Authority
- CN
- China
- Prior art keywords
- gas
- reative cell
- recirculation passage
- cleaning
- exhaust gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45593—Recirculation of reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP89048/2002 | 2002-03-27 | ||
JP2002089048 | 2002-03-27 | ||
JP2002164687A JP3527914B2 (ja) | 2002-03-27 | 2002-06-05 | Cvd装置およびそれを用いたcvd装置のクリーニング方法 |
JP164687/2002 | 2002-06-05 | ||
PCT/JP2003/003337 WO2003081652A1 (fr) | 2002-03-27 | 2003-03-19 | Dispositif cvd et procede de nettoyage d'un dispositif cvd |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1579011A true CN1579011A (zh) | 2005-02-09 |
CN100385623C CN100385623C (zh) | 2008-04-30 |
Family
ID=28456295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038014041A Expired - Lifetime CN100385623C (zh) | 2002-03-27 | 2003-03-19 | Cvd设备以及使用cvd设备清洗cvd设备的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8277560B2 (zh) |
EP (1) | EP1489646B8 (zh) |
JP (1) | JP3527914B2 (zh) |
KR (1) | KR100746493B1 (zh) |
CN (1) | CN100385623C (zh) |
TW (1) | TWI278530B (zh) |
WO (1) | WO2003081652A1 (zh) |
Cited By (4)
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CN105493229A (zh) * | 2013-08-19 | 2016-04-13 | 应用材料公司 | 用于杂质分层外延法的设备 |
CN105940480A (zh) * | 2014-01-30 | 2016-09-14 | 应用材料公司 | 用于减少掉落颗粒缺陷的底部泵送与净化以及底部臭氧清洁硬件 |
CN113005428A (zh) * | 2019-12-20 | 2021-06-22 | 台湾积体电路制造股份有限公司 | 薄膜沉积系统以及沉积薄膜的方法 |
WO2023241278A1 (zh) * | 2022-06-16 | 2023-12-21 | 深圳市恒运昌真空技术有限公司 | 复合式等离子体源系统与分体式远程等离子体设备 |
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US7037376B2 (en) * | 2003-04-11 | 2006-05-02 | Applied Materials Inc. | Backflush chamber clean |
JP4531467B2 (ja) * | 2004-07-07 | 2010-08-25 | 大陽日酸株式会社 | 半導体薄膜形成装置のチャンバー内のクリーニング方法 |
KR100725348B1 (ko) * | 2005-12-06 | 2007-06-07 | 동부일렉트로닉스 주식회사 | 반도체 제조용 챔버 클리닝장치 및 클리닝방법 |
KR100960958B1 (ko) * | 2007-12-24 | 2010-06-03 | 주식회사 케이씨텍 | 박막 증착 장치 및 증착 방법 |
CN101999158A (zh) * | 2008-04-12 | 2011-03-30 | 应用材料股份有限公司 | 等离子体处理设备与方法 |
EP2311065B1 (en) * | 2008-07-09 | 2014-09-10 | TEL Solar AG | Remote plasma cleaning method and apparatus for applying said method |
US8293013B2 (en) * | 2008-12-30 | 2012-10-23 | Intermolecular, Inc. | Dual path gas distribution device |
KR101427726B1 (ko) * | 2011-12-27 | 2014-08-07 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반도체 장치의 제조 방법 |
US9111980B2 (en) * | 2012-09-04 | 2015-08-18 | Applied Materials, Inc. | Gas exhaust for high volume, low cost system for epitaxial silicon deposition |
US10443127B2 (en) * | 2013-11-05 | 2019-10-15 | Taiwan Semiconductor Manufacturing Company Limited | System and method for supplying a precursor for an atomic layer deposition (ALD) process |
JP5764228B1 (ja) * | 2014-03-18 | 2015-08-12 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラム及び記録媒体 |
US10648075B2 (en) | 2015-03-23 | 2020-05-12 | Goodrich Corporation | Systems and methods for chemical vapor infiltration and densification of porous substrates |
US10337101B2 (en) * | 2016-12-13 | 2019-07-02 | The Boeing Company | System and process for chemical vapor deposition |
US11557460B2 (en) * | 2018-07-09 | 2023-01-17 | Lam Research Corporation | Radio frequency (RF) signal source supplying RF plasma generator and remote plasma generator |
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WO2024157905A1 (ja) * | 2023-01-25 | 2024-08-02 | 大熊ダイヤモンドデバイス株式会社 | Cvdシステム、制御装置、制御方法、及びプログラム |
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JPH09251981A (ja) * | 1996-03-14 | 1997-09-22 | Toshiba Corp | 半導体製造装置 |
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JP3695865B2 (ja) * | 1996-10-16 | 2005-09-14 | 株式会社荏原製作所 | 真空排気装置 |
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JP2000009037A (ja) | 1998-06-18 | 2000-01-11 | Fujitsu Ltd | 排気装置及び排気方法 |
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JP3682207B2 (ja) | 2000-06-12 | 2005-08-10 | 株式会社東芝 | プラズマ処理方法 |
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2002
- 2002-06-05 JP JP2002164687A patent/JP3527914B2/ja not_active Expired - Lifetime
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2003
- 2003-03-19 EP EP03715381A patent/EP1489646B8/en not_active Expired - Lifetime
- 2003-03-19 KR KR1020047006224A patent/KR100746493B1/ko active IP Right Grant
- 2003-03-19 WO PCT/JP2003/003337 patent/WO2003081652A1/ja active Application Filing
- 2003-03-19 US US10/492,539 patent/US8277560B2/en active Active
- 2003-03-19 CN CNB038014041A patent/CN100385623C/zh not_active Expired - Lifetime
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105493229A (zh) * | 2013-08-19 | 2016-04-13 | 应用材料公司 | 用于杂质分层外延法的设备 |
CN105493229B (zh) * | 2013-08-19 | 2019-04-05 | 应用材料公司 | 用于杂质分层外延法的设备 |
CN105940480A (zh) * | 2014-01-30 | 2016-09-14 | 应用材料公司 | 用于减少掉落颗粒缺陷的底部泵送与净化以及底部臭氧清洁硬件 |
CN105940480B (zh) * | 2014-01-30 | 2019-06-28 | 应用材料公司 | 用于减少掉落颗粒缺陷的底部泵送与净化以及底部臭氧清洁硬件 |
CN113005428A (zh) * | 2019-12-20 | 2021-06-22 | 台湾积体电路制造股份有限公司 | 薄膜沉积系统以及沉积薄膜的方法 |
CN113005428B (zh) * | 2019-12-20 | 2023-10-10 | 台湾积体电路制造股份有限公司 | 薄膜沉积系统以及沉积薄膜的方法 |
WO2023241278A1 (zh) * | 2022-06-16 | 2023-12-21 | 深圳市恒运昌真空技术有限公司 | 复合式等离子体源系统与分体式远程等离子体设备 |
Also Published As
Publication number | Publication date |
---|---|
KR100746493B1 (ko) | 2007-08-06 |
TW200307055A (en) | 2003-12-01 |
EP1489646B8 (en) | 2012-02-08 |
EP1489646A4 (en) | 2008-01-23 |
JP3527914B2 (ja) | 2004-05-17 |
EP1489646B1 (en) | 2011-09-14 |
EP1489646A1 (en) | 2004-12-22 |
US8277560B2 (en) | 2012-10-02 |
CN100385623C (zh) | 2008-04-30 |
WO2003081652A1 (fr) | 2003-10-02 |
US20040250775A1 (en) | 2004-12-16 |
KR20040047975A (ko) | 2004-06-05 |
TWI278530B (en) | 2007-04-11 |
JP2004002944A (ja) | 2004-01-08 |
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