CN1564650A - 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 - Google Patents
用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 Download PDFInfo
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- CN1564650A CN1564650A CN 200410026849 CN200410026849A CN1564650A CN 1564650 A CN1564650 A CN 1564650A CN 200410026849 CN200410026849 CN 200410026849 CN 200410026849 A CN200410026849 A CN 200410026849A CN 1564650 A CN1564650 A CN 1564650A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 12
- 229910052802 copper Inorganic materials 0.000 title claims description 11
- 239000010949 copper Substances 0.000 title claims description 11
- 239000007788 liquid Substances 0.000 title abstract description 11
- 239000002861 polymer material Substances 0.000 title 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 19
- -1 water-soluble poymer Substances 0.000 claims abstract description 10
- 239000012964 benzotriazole Substances 0.000 claims abstract description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003112 inhibitor Substances 0.000 claims abstract description 5
- 230000007797 corrosion Effects 0.000 claims description 25
- 238000005260 corrosion Methods 0.000 claims description 25
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 24
- 239000012530 fluid Substances 0.000 claims description 22
- 239000002202 Polyethylene glycol Substances 0.000 claims description 13
- 229920001223 polyethylene glycol Polymers 0.000 claims description 13
- 239000011780 sodium chloride Substances 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- JXDYKVIHCLTXOP-UHFFFAOYSA-N isatin Chemical compound C1=CC=C2C(=O)C(=O)NC2=C1 JXDYKVIHCLTXOP-UHFFFAOYSA-N 0.000 claims description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- DDOLDGJVAPPRCI-UHFFFAOYSA-N OC1=CC=CC=2NN=NC21.CC=2C=C(C=C(C(=O)O)C2)C(=O)O Chemical compound OC1=CC=CC=2NN=NC21.CC=2C=C(C=C(C(=O)O)C2)C(=O)O DDOLDGJVAPPRCI-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- JMTMSDXUXJISAY-UHFFFAOYSA-N 2H-benzotriazol-4-ol Chemical compound OC1=CC=CC2=C1N=NN2 JMTMSDXUXJISAY-UHFFFAOYSA-N 0.000 claims description 4
- FJGPYNIWZJCGJE-UHFFFAOYSA-N ClC1=CC=CC=C1.CC=1C=C(C=C(C(=O)O)C1)C(=O)O Chemical compound ClC1=CC=CC=C1.CC=1C=C(C=C(C(=O)O)C1)C(=O)O FJGPYNIWZJCGJE-UHFFFAOYSA-N 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000003852 triazoles Chemical class 0.000 claims description 4
- 229920003169 water-soluble polymer Polymers 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 150000002475 indoles Chemical class 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
- 238000005187 foaming Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000005406 washing Methods 0.000 description 4
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000003851 azoles Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- XMUAGMCFZMDQTI-UHFFFAOYSA-N 1-hydroxy-5-methylbenzotriazole Chemical compound CC1=CC=C2N(O)N=NC2=C1 XMUAGMCFZMDQTI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- WQSRXNAKUYIVET-UHFFFAOYSA-N sulfuric acid;zinc Chemical compound [Zn].OS(O)(=O)=O WQSRXNAKUYIVET-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Abstract
Description
例 | 缓蚀剂 | 外观 | 蚀刻速率uin | 剥离强度lb/in | 热应力288±5℃10秒5次 |
比较例 | 苯并三氮唑 | 棕色 | 25 | 5.2 | 切片分析无分层、不起泡 |
实施例一 | 5-甲基-1-氯苯并三氮唑 | 均匀棕色 | 25 | 6.2 | 5次切片分析无分层、不起泡 |
实施例二 | 1-巯基苯并三氮唑 | 均匀浅棕色 | 25 | 6.0 | 5次切片分析无分层、不起泡 |
实施例三 | 5-甲基1-羟基苯并三氮唑 | 均匀棕色 | 25 | 6.3 | 5次切片分析无分层、不起泡 |
实施例四 | 4-羟基苯并三氮唑 | 均匀棕色 | 25 | 6.0 | 5次切片分析无分层、不起泡 |
实施例五 | 5-甲基-1-羟基苯并三氮唑1-巯基苯并三氮唑 | 均匀棕色 | 20 | 6.3 | 5次切片分析无分层、不起泡 |
实施例六 | 吲哚满二酮 | 深棕色 | 20 | 5.9 | 5次切片分析无分层、不起泡 |
实施例七 | BHTAM | 深棕色 | 20 | 5.9 | 5次切片分析无分层、不起泡 |
Claims (4)
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CNB2004100268492A CN100334927C (zh) | 2004-04-13 | 2004-04-13 | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 |
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CNB2004100268492A CN100334927C (zh) | 2004-04-13 | 2004-04-13 | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 |
Publications (2)
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CN1564650A true CN1564650A (zh) | 2005-01-12 |
CN100334927C CN100334927C (zh) | 2007-08-29 |
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CNB2004100268492A Expired - Fee Related CN100334927C (zh) | 2004-04-13 | 2004-04-13 | 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102168266A (zh) * | 2011-03-21 | 2011-08-31 | 东莞市富默克化工有限公司 | 一种适用于高温、无卤板材的电路板棕化液 |
CN104694909A (zh) * | 2014-07-03 | 2015-06-10 | 广东丹邦科技有限公司 | 一种铜表面粗化剂 |
CN104928661A (zh) * | 2015-06-08 | 2015-09-23 | 华南理工大学 | 一种用于印制电路板的复合离子液体棕化液 |
CN104928667A (zh) * | 2015-06-08 | 2015-09-23 | 华南理工大学 | 一种基于功能化离子液体的印制电路板处理用棕化液 |
CN105050324A (zh) * | 2015-07-01 | 2015-11-11 | 广东光华科技股份有限公司 | 铜表面粗化处理液及其处理方法 |
CN105714280A (zh) * | 2016-04-06 | 2016-06-29 | 武汉创新特科技有限公司 | 一种印制电路板棕化处理液 |
CN107190254A (zh) * | 2017-05-22 | 2017-09-22 | 博敏电子股份有限公司 | 一种印制电路板的新型棕化处理液 |
CN108882547A (zh) * | 2018-07-16 | 2018-11-23 | 信丰福昌发电子有限公司 | 一种线路板阻焊前处理的工艺 |
CN109706453A (zh) * | 2018-12-28 | 2019-05-03 | 广东东硕科技有限公司 | 苯并吡嗪类化合物在铜面粗化中的应用及包含其的铜面粗化用组合物 |
CN110093600A (zh) * | 2018-05-29 | 2019-08-06 | 苏州铱诺化学材料有限公司 | 一种pcb棕化液及其制备方法 |
CN110324989A (zh) * | 2018-03-28 | 2019-10-11 | 东莞市斯坦得电子材料有限公司 | 一种用于印制线路板内层芯板棕氧化工艺 |
CN111826645A (zh) * | 2020-07-31 | 2020-10-27 | 国网河南省电力公司西峡县供电公司 | 一种电路板内层铜箔棕化液 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
IT1307040B1 (it) * | 1999-05-31 | 2001-10-23 | Alfachimici Spa | Procedimento per promuovere l'aderenza tra un substrato inorganicoed un polimero organico. |
DE60030691T2 (de) * | 2000-05-22 | 2007-10-25 | MacDermid, Inc., Waterbury | Verfahren zur Verbesserung der Adhäsion von Polymermaterialien an Metalloberflächen |
US6383272B1 (en) * | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
CN1216516C (zh) * | 2000-09-21 | 2005-08-24 | 麦克德米德有限公司 | 改善高分子材料与金属表面粘附性的方法 |
-
2004
- 2004-04-13 CN CNB2004100268492A patent/CN100334927C/zh not_active Expired - Fee Related
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102168266B (zh) * | 2011-03-21 | 2013-01-23 | 东莞市富默克化工有限公司 | 一种适用于高温、无卤板材的电路板棕化液 |
CN102168266A (zh) * | 2011-03-21 | 2011-08-31 | 东莞市富默克化工有限公司 | 一种适用于高温、无卤板材的电路板棕化液 |
CN104694909A (zh) * | 2014-07-03 | 2015-06-10 | 广东丹邦科技有限公司 | 一种铜表面粗化剂 |
CN104694909B (zh) * | 2014-07-03 | 2017-01-25 | 广东丹邦科技有限公司 | 一种铜表面粗化剂 |
CN104928661A (zh) * | 2015-06-08 | 2015-09-23 | 华南理工大学 | 一种用于印制电路板的复合离子液体棕化液 |
CN104928667A (zh) * | 2015-06-08 | 2015-09-23 | 华南理工大学 | 一种基于功能化离子液体的印制电路板处理用棕化液 |
CN105050324B (zh) * | 2015-07-01 | 2018-06-12 | 广东光华科技股份有限公司 | 铜表面粗化处理液及其处理方法 |
CN105050324A (zh) * | 2015-07-01 | 2015-11-11 | 广东光华科技股份有限公司 | 铜表面粗化处理液及其处理方法 |
CN105714280A (zh) * | 2016-04-06 | 2016-06-29 | 武汉创新特科技有限公司 | 一种印制电路板棕化处理液 |
CN107190254A (zh) * | 2017-05-22 | 2017-09-22 | 博敏电子股份有限公司 | 一种印制电路板的新型棕化处理液 |
CN107190254B (zh) * | 2017-05-22 | 2019-04-23 | 博敏电子股份有限公司 | 一种印制电路板的新型棕化处理液 |
CN110324989A (zh) * | 2018-03-28 | 2019-10-11 | 东莞市斯坦得电子材料有限公司 | 一种用于印制线路板内层芯板棕氧化工艺 |
CN110093600A (zh) * | 2018-05-29 | 2019-08-06 | 苏州铱诺化学材料有限公司 | 一种pcb棕化液及其制备方法 |
CN108882547A (zh) * | 2018-07-16 | 2018-11-23 | 信丰福昌发电子有限公司 | 一种线路板阻焊前处理的工艺 |
CN109706453A (zh) * | 2018-12-28 | 2019-05-03 | 广东东硕科技有限公司 | 苯并吡嗪类化合物在铜面粗化中的应用及包含其的铜面粗化用组合物 |
CN111826645A (zh) * | 2020-07-31 | 2020-10-27 | 国网河南省电力公司西峡县供电公司 | 一种电路板内层铜箔棕化液 |
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Address after: Chen Dong Cun Industrial Zone Six fertile town Baiyun District of Guangzhou City, Guangdong province 510545 Co-patentee after: Guangdong Guanghua Science and Technology Co., Ltd. Patentee after: Guangdong Toneset Science & Technology Co., Ltd. Address before: Chen Dong Cun Industrial Zone Six fertile town Baiyun District of Guangzhou City, Guangdong province 510545 Co-patentee before: Guanghau Chemical Co., Ltd., Guangdong Patentee before: Guangdong Toneset Science & Technology Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070829 Termination date: 20190413 |
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CF01 | Termination of patent right due to non-payment of annual fee |