CN1550579A - 改良镀液分析 - Google Patents

改良镀液分析 Download PDF

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Publication number
CN1550579A
CN1550579A CNA2004100346947A CN200410034694A CN1550579A CN 1550579 A CN1550579 A CN 1550579A CN A2004100346947 A CNA2004100346947 A CN A2004100346947A CN 200410034694 A CN200410034694 A CN 200410034694A CN 1550579 A CN1550579 A CN 1550579A
Authority
CN
China
Prior art keywords
working electrode
amount
plating bath
leveler
brightening agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004100346947A
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English (en)
Chinese (zh)
Inventor
W�����ϲ���
W·索南伯格
̩
L·R·巴斯泰德
R·克鲁兹
G·哈姆
M·J·卡佩克卡斯
E·雷丁顿
K·普赖斯
T·巴克利
T·古德里奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of CN1550579A publication Critical patent/CN1550579A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C13/00—Details; Accessories
    • A45C13/30—Straps; Bands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Multimedia (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CNA2004100346947A 2003-04-25 2004-04-23 改良镀液分析 Pending CN1550579A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46529703P 2003-04-25 2003-04-25
US60/465,297 2003-04-25

Publications (1)

Publication Number Publication Date
CN1550579A true CN1550579A (zh) 2004-12-01

Family

ID=32962777

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004100346947A Pending CN1550579A (zh) 2003-04-25 2004-04-23 改良镀液分析

Country Status (6)

Country Link
US (1) US7384535B2 (cg-RX-API-DMAC7.html)
EP (1) EP1471347A1 (cg-RX-API-DMAC7.html)
JP (1) JP2004323971A (cg-RX-API-DMAC7.html)
KR (1) KR20040092446A (cg-RX-API-DMAC7.html)
CN (1) CN1550579A (cg-RX-API-DMAC7.html)
TW (1) TW200506360A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100529750C (zh) * 2006-01-17 2009-08-19 欧恩吉亚洲股份有限公司 电镀铜加速剂浓度分析方法及其沉积电解液
CN104280445A (zh) * 2014-08-07 2015-01-14 香港应用科技研究院有限公司 同时分析电镀槽液中至少两种抑制剂的方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006068046A1 (ja) * 2004-12-24 2006-06-29 Nippon Mining & Metals Co., Ltd. 電気スズおよびスズ合金めっき液
JP4862508B2 (ja) * 2006-06-12 2012-01-25 日立電線株式会社 導体パターン形成方法
JP4932370B2 (ja) * 2006-07-28 2012-05-16 日本マクダーミッド株式会社 電解めっき方法、プリント配線板及び半導体ウェハー
DE102008056470B3 (de) * 2008-11-05 2010-04-22 Atotech Deutschland Gmbh Verfahren zum Untersuchen einer Metallschicht und Verfahren zur analytischen Kontrolle eines zum Abscheiden der Metallschicht dienenden Abscheideelektrolyten
US8992691B2 (en) 2011-04-05 2015-03-31 International Business Machines Corporation Partial solution replacement in recyclable persulfuric acid cleaning systems
JP6170938B2 (ja) * 2011-12-12 2017-07-26 ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 電気めっき溶液内のレベラー濃度の監視
US9689083B2 (en) 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast
EP2937686B1 (en) 2014-04-22 2017-03-08 Rohm and Haas Electronic Materials LLC Electroplating bath analysis
US10094038B2 (en) 2015-04-13 2018-10-09 Lam Research Corporation Monitoring electrolytes during electroplating
CN112986369B (zh) * 2021-02-05 2022-05-17 深圳日山科技有限公司 测量电镀液中光亮剂浓度的方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
US4666567A (en) * 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances
US4917777A (en) * 1986-04-24 1990-04-17 Shipley Company Inc. Method for analyzing additive concentration
US4917774A (en) * 1986-04-24 1990-04-17 Shipley Company Inc. Method for analyzing additive concentration
US5004525A (en) * 1988-08-23 1991-04-02 Shipley Company Inc. Copper electroplating composition
DE59700942D1 (de) 1990-03-19 2000-02-10 Atotech Deutschland Gmbh Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
US5223118A (en) * 1991-03-08 1993-06-29 Shipley Company Inc. Method for analyzing organic additives in an electroplating bath
US5192403A (en) * 1991-05-16 1993-03-09 International Business Machines Corporation Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5298129A (en) 1992-11-13 1994-03-29 Hughes Aircraft Company Method of selectively monitoring trace constituents in plating baths
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
JP2002506531A (ja) 1998-05-01 2002-02-26 セミトウール・インコーポレーテツド 電気メッキ浴中の添加物の測定法
US6471845B1 (en) * 1998-12-15 2002-10-29 International Business Machines Corporation Method of controlling chemical bath composition in a manufacturing environment
DE19911447C2 (de) 1999-03-08 2001-10-11 Atotech Deutschland Gmbh Verfahren zum analytischen Ermitteln der Konzentration von Zusatzstoffen in galvanischen Metallabscheidebädern
US6280602B1 (en) * 1999-10-20 2001-08-28 Advanced Technology Materials, Inc. Method and apparatus for determination of additives in metal plating baths
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
DE60113214T2 (de) * 2000-11-02 2006-06-08 Shipley Co., L.L.C., Marlborough Plattierungsbadanalyse
US6592747B2 (en) * 2001-06-18 2003-07-15 International Business Machines Corporation Method of controlling additives in copper plating baths
US6936157B2 (en) * 2001-08-09 2005-08-30 Advanced Technology Materials, Inc. Interference correction of additives concentration measurements in metal electroplating solutions
US6572753B2 (en) * 2001-10-01 2003-06-03 Eci Technology, Inc. Method for analysis of three organic additives in an acid copper plating bath
US6709568B2 (en) * 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US6808611B2 (en) * 2002-06-27 2004-10-26 Applied Materials, Inc. Methods in electroanalytical techniques to analyze organic components in plating baths
US6673226B1 (en) * 2002-12-20 2004-01-06 Eci Technology Voltammetric measurement of halide ion concentration
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100529750C (zh) * 2006-01-17 2009-08-19 欧恩吉亚洲股份有限公司 电镀铜加速剂浓度分析方法及其沉积电解液
CN104280445A (zh) * 2014-08-07 2015-01-14 香港应用科技研究院有限公司 同时分析电镀槽液中至少两种抑制剂的方法
CN104280445B (zh) * 2014-08-07 2016-06-22 香港应用科技研究院有限公司 同时分析电镀槽液中至少两种抑制剂的方法

Also Published As

Publication number Publication date
JP2004323971A (ja) 2004-11-18
KR20040092446A (ko) 2004-11-03
TW200506360A (en) 2005-02-16
US20050016856A1 (en) 2005-01-27
EP1471347A1 (en) 2004-10-27
US7384535B2 (en) 2008-06-10

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