CN1411615A - 电光装置 - Google Patents
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- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000007373 indentation Methods 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 229910052788 barium Inorganic materials 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229910020366 ClO 4 Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- -1 polyphenylene Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- AHIBWURJLGCHAY-UHFFFAOYSA-N [S].C1=CC=CC=C1 Chemical compound [S].C1=CC=CC=C1 AHIBWURJLGCHAY-UHFFFAOYSA-N 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
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- Y10T428/23—Sheet including cover or casing
Abstract
该电光装置包括在基底(1)之上的一叠层(2)，这叠层包括一夹在电极层(3，4)当中的有机发光层(5)。一个空罩(10)被配置在叠层(2)之上并以气密的方式被连接到基底(1)上。水结合吸气剂(12)被设置在罩(10)内，以便倚在沿着叠层(2)延伸的壁(11)上。所述的壁(11)有一容纳用来操作该装置的控制电子器件(14)的凹槽(13)。该控制电子器件(14)可以藉助于有导体轨道(16)的挠性箔(15)被连接到该装置上，并藉助于粘合剂(17)被固定在凹槽(13)中。
Description
本发明涉及一种电光装置，其包括：
一透光基底；
在此基底之上的叠层，此叠层包括一第一、在基底近傍的透光电极层、一第二电极层及这第一和第二电极层之间的有机电致发光层；
一放置在这叠层上面的空心罩，此罩以气密的方式被连接到基底上并有一沿着这叠层延伸的第一壁；及
一设置在罩内的水胶合吸气剂，以便倚在第一壁上。
这样一种电光装置在US-A-5,882,761中被公开。
把电子通过一个电极层射入荧光层并使孔穿过另一个电极层之后，由于把孔和电子结合起来，所以，光就在所述的层内被产生了。跨接在电极之间的更高的电压使光发射更强。然而，由于制造过程中带来的湿气或在周围环境中产生的湿气，这个效果可能被消除。
为此，在已知的装置中，这叠层被定位在由基底和罩形成的气密空间里，并利用了水胶合吸气剂。
该装置藉助于控制电子器件操作，例如，靠印刷电路板，举例而言，使跨接在电极之间的电压能被控制或变换。
该已知的装置的缺陷在于，该装置和控制电子器件的组合像这样就占据了太多的空间。
本发明的一个目的旨在提供在开始段落中所述的这类电光装置，其被设计成能使由该装置占据的空间的大小和相关的控制电子器件受到限制。
如本发明所述，这个目的是这样达到的，该罩的第一壁具备一个凹槽，其中控制电子器件被容纳成被电连接到第一电极和第二电极上。
该装置的设计方案能达到结构紧凑。此外，该装置还有它生成了一个组件的优点，其中，控制电子器件就存放在欲被操作的该装置的电光元件近傍。该组件是一个完成的标准块，其可供给更大装置的装配线，诸如电话。
该装置可能包括一连续的第一电极层和一连续的第二电极层。这使该装置能被用作光源，例如作为背光。交替地，第一和/或第二电极层可能被分割，由于其结果，图像或字符可通过激励分割的部分而生成。这就使该装置能被用作一个显示器。分割的部分还可能包括在一个分层中基本上平行的线及在另一个分层中，横向地向该处延伸的基本上平行的线，由于其结果，字符和图像则由点构成了。该装置可能是单色或显示器色，例如，红色、绿色和兰色及其混合色，诸如白色和桔黄色。
第一电极层可能是空页注入电极层，例如，金属的，诸如金、铂或银，在这些金属的层厚度很小处可透光，但更可取地，例如，利用铟锡氧化物，因为这种材料具有高度的透光性。交替地，有机导电性的聚合物也可以被利用，诸如，聚苯胺和聚-3，4-亚乙基二氧硫基(PEDOT)及由其衍生出的聚合物。第一电极层可以是，例如，双层的铟锡氧化物和PEDOT。所述的双层一般会使空穴注入性得到改善。
第二电极层可能是电子注入电极层，例如是金属，或是具有低逸出功的金属合金，诸如Yb、Ca、Mg∶Ag、Li∶Al、Ba，或者这一层是各个分层的一层，诸如Ba/Al或者Ba/Ag。
该电致发光层基本上可由或是较高或是较低分子重量的有机电致发光材料组成。这样一种材料可能有基本上共轭的基干，诸如，聚噻吩，聚亚苯基、聚噻吩乙烯基，特别是，例如，发射兰光的聚甲基氟和/或发射红光、绿光或黄光的聚-p-亚苯基乙烯基。
该基底可能是，例如，像热塑塑料这样的合成树脂，或者是玻璃的，诸如石英玻璃，或者是陶瓷材料的。
对于吸气剂，可以利用固定在罩内的吸湿物质，例如，通过压缩或热压结。这种物质的示例包括BaO、CaO、CaSO4、Ba(ClO4)和Ca(ClO4)。
玻璃罩的一个缺陷，如已用于已知的装置中的，是其较大的壁厚，其对于足够的机械强度是必需的。这个壁厚也带来了较大重量的后果。
因此，用金属制造该罩是受人欢迎的，例如，铝或铬镍钢。铬镍钢是有吸引力的，因为与玻璃基底结合起来，其热延伸率与该基底的热延伸率相接近，从而罩-基底连接就能承受较大的温度变化。此外，在这种情况下，该罩能很方便地用板材或带状材料制造，例如通过深拉拔法。
该控制电子器件安放在一个挠性箔上是有利的，导体轨道把该控制电子器件与第一和第二电极连接起来。这是有吸引力的，因为这块箔可以很方便地被折叠成两部分，以便遮盖导体轨道，并由此把它们与该罩分离开。结果，就毋需提供附加的绝缘体了。
该控制电子器件，通常是I.C.(集成电路)，可以用粘合剂固定在凹槽中。这个方法的优点是，它生成了一个坚固耐用的、易于处理的单元。
如果此罩是由金属制成的，那么，它就能藉助于，例如，封接装置，被连接到该基底上，电绝缘粉末在其中弥散着。所述的粉末可能由，例如，玻璃珠组成的。这就使粘合剂，例如环氧树脂胶，直接作用到罩和基底上，毋需专门的措施来排除，该金属罩短路导体定位在基底上并撞上电极。在这种情况下，粉末起着隔离物的作用。
本发明的这些和其它方面参照下文所述的实施例将会清楚明白并得到阐释。
在附图中：
图1为本装置的示意的截面视图；
图2为制造过程中的，图1的本装置的平面图。
在图1和图2中，该电光装置包括一透光基底1，在图中，其是由玻璃制成的。一叠层2被配置在基底1上，该叠层包括一基底1附近的第一透光电极层3，一第二电极层4及一在第一电极层3和第二电极层4之间的有机电致发光层5。在图1中，第一电极层3是一个双层，由一层铟锡氧化物3a和一层聚-3，4-亚乙基二氧硫苯组成。第二电极层4是由钡和铝构成的，而电致发光层5则是由聚-p-亚苯基乙烯基构成。在叠层2之上配置着空心罩10，以便以气密的方式被连接到基底1上。罩10有一沿着叠层2延伸的第一壁11。水胶合吸气剂12被设置在罩10中，从而倚在第一壁11上。在图1中，吸气剂包括CaO。
罩10的第一壁11有凹槽13，控制电子器件14就被容纳在其中，被电连接到第一电极3和第二电极4上。该控制电子器件包括集成电路。图中所示出的罩10是由金属制成的，亦即，铬镍钢。
控制电子器件被存放在挠性箔15上，在这些图中是聚酰亚胺制成的，铜导体轨道16把控制电子器件14连接到第一电极层3和第二电极层4上。
控制电子器件14藉助于粘合剂17被固定在凹槽13中，亦即，图中的环氧树脂胶。
罩10藉助于密接剂6被连接到基底1上，其中弥散着电绝缘粉，亦即，图1中的带有玻璃珠的环氧树脂胶。
图1中所示的该装置是以图2所示的半成品得到的，把箔15的垂悬物15a和15b分别绕着折叠线15c和15d折起来。如果需要的话，折叠部分可以用粘合剂被固定上。垂悬物15b遮盖着导体图形16，而垂悬物15a则遮盖着导体18。箔15已经通过连接带15e被连接到基底1上，亦见图1，藉助于各向异性的导电胶已被热固化。其后，箔15被顺序地设置在罩10之上，而控制电子器件14则由粘合剂17被固定在凹槽13中。
Claims (5)
1.一种电光装置，其包括：
一透光基底(1)；
在此基底(1)之上的一叠层(2)，此叠层包括一在基底(1)近傍的第一透光电极层(3)，一第二电极层(4)和一在第一(3)和第二电极层(4)之间的有机电致发光层(5)；
一放置在这叠层(2)上面的空心罩(10)，此罩以气密的方式被连接到基底(1)上并有一沿着叠层(2)延伸的第一壁(11)；及
一容放在罩(10)内的水胶合吸气剂，以便倚在第一壁(11)上，其特征在于，该罩(10)的第一壁(11)具备凹槽(13)，控制电子器件(14)被容纳于其中，以便被电连接到第一电极(3)和第二电极(4)上。
2.如权利要求1所述的电光装置，其特征在于，所述罩(10)是由金属制成的。
3.如权利要求1或2所述的电光装置，其特征在于，控制电子器件(14)被定位在带有导体轨道(16)的挠性箔(15)上，该导体轨道把控制电子器件(14)连接到第一电极层(3)和第二电极层(4)上。
4.如权利要求1、2或3所述的电光装置，其特征在于，控制电子器件(14)由粘合剂(17)被固定在凹槽(13)中。
5.如权利要求2所述的电光装置，其特征在于，所述罩(10)由密接剂(6)被连接到基底(1)上，其中弥散有电绝缘粉。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00203927.9 | 2000-11-08 | ||
| EP00203927 | 2000-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1411615A true CN1411615A (zh) | 2003-04-16 |
| CN1241273C CN1241273C (zh) | 2006-02-08 |
Family
ID=8172243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018060811A Expired - Fee Related CN1241273C (zh) | 2000-11-08 | 2001-11-02 | 电光装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6628070B2 (zh) |
| EP (1) | EP1336207A1 (zh) |
| JP (1) | JP3860793B2 (zh) |
| KR (1) | KR20020084084A (zh) |
| CN (1) | CN1241273C (zh) |
| TW (1) | TW525199B (zh) |
| WO (1) | WO2002039513A1 (zh) |
Cited By (3)
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| CN101578919B (zh) * | 2007-04-27 | 2010-12-01 | 长濑产业株式会社 | 有机el显示器的制造方法 |
| CN102812575A (zh) * | 2010-03-04 | 2012-12-05 | 通用电气公司 | 减轻封装式有机发光装置（oled）中的短路风险 |
| CN108598289A (zh) * | 2018-07-12 | 2018-09-28 | 京东方科技集团股份有限公司 | 封装盖板及其制造方法、显示面板及显示装置 |
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| DE10261609B4 (de) * | 2002-12-20 | 2007-05-03 | Novaled Ag | Lichtemittierende Anordnung |
| JP2004303522A (ja) * | 2003-03-31 | 2004-10-28 | Fujitsu Display Technologies Corp | 表示装置及びその製造方法 |
| JP2007505445A (ja) * | 2003-07-07 | 2007-03-08 | アイファイアー・テクノロジー・コープ | エレクトロルミネセント・ディスプレイのためのシールおよびシール方法 |
| DE10332015A1 (de) * | 2003-07-14 | 2005-03-03 | Infineon Technologies Ag | Optoelektronisches Modul mit Senderchip und Verbindungsstück für das Modul zu einer optischen Faser und zu einer Schaltungsplatine, sowie Verfahren zur Herstellung derselben |
| JP2005317476A (ja) | 2004-04-30 | 2005-11-10 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
| US7164520B2 (en) | 2004-05-12 | 2007-01-16 | Idc, Llc | Packaging for an interferometric modulator |
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| US7551246B2 (en) | 2004-09-27 | 2009-06-23 | Idc, Llc. | System and method for display device with integrated desiccant |
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| KR20060039658A (ko) * | 2004-11-03 | 2006-05-09 | 엘지전자 주식회사 | 유기 전계 발광 소자 키트 |
| US7332416B2 (en) * | 2005-03-28 | 2008-02-19 | Intel Corporation | Methods to manufacture contaminant-gettering materials in the surface of EUV optics |
| EP1878062A2 (en) * | 2005-04-28 | 2008-01-16 | Koninklijke Philips Electronics N.V. | Light source comprising led arranged in recess |
| JP2009523297A (ja) * | 2005-04-29 | 2009-06-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | エレクトロルミネセント装置 |
| EP1911110A2 (en) | 2005-07-27 | 2008-04-16 | Philips Intellectual Property & Standards GmbH | Light-emitting device with a sealing integrated driver circuit |
| US8040587B2 (en) | 2006-05-17 | 2011-10-18 | Qualcomm Mems Technologies, Inc. | Desiccant in a MEMS device |
| TWI421607B (zh) * | 2006-08-24 | 2014-01-01 | Creator Technology Bv | 可撓性裝置上的滲透阻障 |
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| JP5881926B2 (ja) | 2006-10-25 | 2016-03-09 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ | オプトエレクトロニクスデバイス及び該オプトエレクトロニクスデバイスを製造するための方法 |
| US7816164B2 (en) | 2006-12-01 | 2010-10-19 | Qualcomm Mems Technologies, Inc. | MEMS processing |
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| JP2000100558A (ja) * | 1998-09-18 | 2000-04-07 | Matsushita Electric Ind Co Ltd | 発光装置 |
| JP4066547B2 (ja) * | 1999-01-25 | 2008-03-26 | 松下電器産業株式会社 | 表示装置 |
| JP2000243555A (ja) * | 1999-02-17 | 2000-09-08 | Toyota Motor Corp | 有機ｅｌ表示装置 |
-
2001
- 2001-11-02 KR KR1020027008689A patent/KR20020084084A/ko not_active Application Discontinuation
- 2001-11-02 JP JP2002541729A patent/JP3860793B2/ja not_active Expired - Fee Related
- 2001-11-02 CN CNB018060811A patent/CN1241273C/zh not_active Expired - Fee Related
- 2001-11-02 WO PCT/EP2001/012900 patent/WO2002039513A1/en not_active Application Discontinuation
- 2001-11-02 EP EP01993949A patent/EP1336207A1/en not_active Withdrawn
- 2001-11-08 US US10/008,213 patent/US6628070B2/en not_active Expired - Fee Related
- 2001-12-20 TW TW090131702A patent/TW525199B/zh not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101578919B (zh) * | 2007-04-27 | 2010-12-01 | 长濑产业株式会社 | 有机el显示器的制造方法 |
| CN102812575A (zh) * | 2010-03-04 | 2012-12-05 | 通用电气公司 | 减轻封装式有机发光装置（oled）中的短路风险 |
| CN102812575B (zh) * | 2010-03-04 | 2016-01-13 | 通用电气公司 | 减轻封装式有机发光装置（oled）中的短路风险 |
| CN108598289A (zh) * | 2018-07-12 | 2018-09-28 | 京东方科技集团股份有限公司 | 封装盖板及其制造方法、显示面板及显示装置 |
| CN108598289B (zh) * | 2018-07-12 | 2019-11-08 | 京东方科技集团股份有限公司 | 封装盖板及其制造方法、显示面板及显示装置 |
| US11398617B2 (en) | 2018-07-12 | 2022-07-26 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Packaging cover plate and manufacturing method thereof, display panel, and display device each having packaging sheet with shaped plurality channels |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1241273C (zh) | 2006-02-08 |
| JP3860793B2 (ja) | 2006-12-20 |
| KR20020084084A (ko) | 2002-11-04 |
| US20020067126A1 (en) | 2002-06-06 |
| TW525199B (en) | 2003-03-21 |
| EP1336207A1 (en) | 2003-08-20 |
| US6628070B2 (en) | 2003-09-30 |
| WO2002039513A1 (en) | 2002-05-16 |
| JP2004514245A (ja) | 2004-05-13 |
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