TW525199B - Electro-optical device - Google Patents

Electro-optical device Download PDF

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TW525199B
TW525199B TW090131702A TW90131702A TW525199B TW 525199 B TW525199 B TW 525199B TW 090131702 A TW090131702 A TW 090131702A TW 90131702 A TW90131702 A TW 90131702A TW 525199 B TW525199 B TW 525199B
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Den Reek Johannes Nicolaas Van
Klaas Willem Kerkhof
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Koninkl Philips Electronics Nv
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8423Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8721Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/874Passivation; Containers; Encapsulations including getter material or desiccant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/23Sheet including cover or casing

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

A7 B7
525199 五、發明説明(i 本發明係關於電光裝置,其包括·· 光線透射基板; 基板上的層疊,該層疊包括靠近基板之第一光線透射電 極層、第二電極層,以及介於第一與第二電極層之間的有 機電激發光層; 放置於層疊上方之中空覆蓋,該覆蓋以不漏氣的方式連 接到基板,並具有沿著層疊延伸的第一内壁;及 一水膠合吸氣劑,其容納於覆蓋中,以便緊靠第一内壁 此一電光裝置揭示於美國專利A-5,882,761。 藉著經由一電極層將電子射入發光層,並經由其他電極 層將電洞射入,藉由結合電洞與電子,於該層中產生光線 。私極之間較高之電壓,導致較強之光線放射。可是,可 以藉由製造過程所引起的濕氣,或由環境所引起的濕氣, 來消滅此一效應。 、為此,在已知裝置中,層疊係位於由基板與覆蓋所形成 <不漏氣的空間中,而且通常是用水膠合吸氣劑製作的。 舉例來說,藉由控制印刷電路板上的電子來操作裝置, 使黾極上的電壓能夠被控制或改變。 因此,存在於裝置與控制電子結合中之已知裝置的缺點 ’是佔去太多空間。 本發明 < 目的提供起始段落中所描述之類型的電光裝置 ,其被設計以便能夠限制裝置與相關控制電子所佔去的空 間。 裝 訂
-4 - 五、 發明説明( 口根據本發明,達成此—目的係在^覆蓋之第—内壁有缺 2,其巾容納控制f子,以便電地連接到第一電極與第二 電極。 裝置之設計使獲得—緊密的結構成為可能。此外, 义-裝置具有生產-種模組的優點,纟中控制f子位 t作裝置之電Μ件旁邊。此—模衫—個精緻完美的基 % ’可以供給較大裝置之裝配線,如電話。 此-裝置可以包括連續之第—電極層與連續之第二 層。這使裝置用作光源成為可能,舉例來說,作為背:。 :者是’第一與/或第二電極層可能是區段的,結果可以藉 由供給能量給區段㈣成影像或字元。這使裝置能作⑽ =1段也可能包括實質上在—層中平行的線,以及在、 “他層中,對其橫切地延伸而實質上平行的線,一 與影像由點構成。裝置可以是單色或 。子凡 說H έ疋早色成心顏色的,舉例來 %色與監色’以及其混合顏色,如白色與橘色 第-電極可能是電洞注入電極層,舉例來說是 如金、白金或銀,這些金屬在小的層 此一材料高的光線透射率。或者,也可以使 ,為 合物,如聚苯胺與聚骑二氧Β塞吩(pedot),以及::聚 物。舉例說,第一電極層可以是氧化錫细血聚 '出 吩(PEDOT)的雙層。該雙層通常產生改善的電洞、,主入希―礼口塞 第二電極層可以是電子注入電極層,舉::來王說入,具有低 本纸張尺度適用fii^_CNS) A4規格 -5 525199 A7 B7 五、發明説明( 功函數的金屬或金屬合金,如鏡(yb)、鈣(Ca)、鎂:銀 (Mg: Ag)、鐘:铭(Li: Αι)、鋇(Ba),或該層是各種層的薄片, 如鋇/鋁(Ba/ A1)或鋇/銀(Ba/ Ag)。 電激發光層基本上可以包括一種相當高或相當低之分子 里的有機電激發光材料。此一材料可能具有一實質上共軛 的月幹,如聚嘍吩、聚苯、聚乙晞噻吩,舉例來說,尤其 是監色發光聚(烷基)蔡與/或紅色、綠色或黃色發光聚兮苯 乙烯。 舉例來就,基板可以是合成樹脂,如熱塑性塑料,或是 玻璃,如石英玻璃,或者是陶瓷材料。 至於吸氣劑,舉例來說,則可用藉由壓縮或燒結固定於 覆蓋中之吸濕性物質來製成。此一物質的實例包含氧化鋇 (BaO)、氧化鈣(ca〇)、瓴酸鈣(CaS〇4)、氯酸鋇(如^幻⑶與氯酸 鈣(Ca(C104)” 已知裝置中所使用之玻璃覆蓋的缺點是其相當大的内壁 厚度,而為了足夠的機械強度,這是必要的。此一内壁的 厚度也導致相當大的重量。 因此,用金屬,舉例來說,鋁或鎳鉻鋼,來製作覆蓋是 較理想的。鎳鉻鋼是有吸引力的,因為與破璃基板結合, 其熱膨脹接近基板的熱膨脹,使覆蓋-基板的連接能夠經得 住相當大的溫度變化。此外,在此一情況中,舉例來說, 覆蓋可以用薄片材料或條狀材料,迅速地藉由深的拉延來 製造。 柔軟的箔片上有控制電子,並附有將控制電子與第_與 -6 · 本紙張尺度it财g S家標準(CNS) A视格(21GX297公爱) ------
裝 訂
線 525199
第二電極連接之導線軌跡較理想。這是有吸引力的,因為 泊片可以迅速地折疊成兩個,以便於覆蓋導線軌跡,因而 將其自覆蓋分離出來。結果,便不需要提供額外的絕緣體 控制電子,通常是一種積體電路(IC),可以藉由黏劑固定 方、缺口。此一措施具有產生堅定、容易操控單元的優點。
裝 如果覆蓋是用金屬製成,則舉例來說,覆蓋可以藉由密 2裝置連接到基板,其中電氣絕緣的粉末是分散的。舉例 來說,該粉末可以由玻璃珠組成。這使得黏劑,舉例來說 ,%氧基樹脂黏膠,能夠直接作用在覆蓋與基板上面,並 達到電極,而無須特殊的措施,以預防金屬覆蓋使基板上 的導線短路。在此一情況中,粉末係作為間隔。 參考下文中所敘述與說明之具體實施例,本發明之這些 興其他悲樣’將變得顯而易見。 。 圖式簡單說明: 圖式中: 圖1疋本裝置之圖表式、剖面圖。 圖2疋圖1足裝置的平面圖,其係於製造期間。 發明詳細說明: 圖1與圖2中,電光裝置包括一個光透射基板1,而圖中 基板1疋用玻璃製成的。基板丨上提供層之堆疊〕,此一堆 包含靠近電極層4之第—光透射電極層3,以及介於第一 =層3與第二電極層4之間的有機電激發光層5。_中,第 電極層3是包含氧化錫鋼3&與_層聚3,4m塞吩
5 五、發明説明( 3b之雙層。筮——化p ..^〜弟一电極層4是用鋇與鋁製成,而電激發光層5則 、χ % ^笨乙缔製成。在堆疊2上提供中空覆蓋10,以便於 〆一' 内2勺方式連接到基板1。覆蓋10具有沿著堆疊2延伸之 辟 11覆盍中容納水膠合吸氣劑12,以便緊靠第一内 壁:y圖1中,吸氣劑包括氧化鈣(Ca0)。 第内土11具有一缺口 13,其中容納操作裝置之控制電子 拴制I子並電地連接到第一電極3與第二電極4。控制電 子14包括—積體電路。圖中所示之覆蓋10係由金屬製成,即 鎳鉻鋼。 圖中的片15是聚酿亞胺,柔軟的搭片15上有控制電子14 並附有連接控制電子14到第一電極層3與第二電極層4的銅 導線軌跡16。 控制電子14藉由黏劑17,亦即圖中之環氧基樹脂黏膠,固 定於缺口 13中。 覆盖10藉由密封劑6連接到基板丨,期中電氣絕緣的粉末是 分散的,亦即圖1中附有玻璃珠的環氧基樹脂黏膠。 圖1所示之裝置係得自圖2之半成品,其分別沿著折疊線 15c與15d ’折疊落片15之側翼15a與说。如果需要,折疊的部 分可以使用一種黏劑來附著。側翼15b覆蓋導線圖樣16,而 側翼15a則覆盖導線ι8。亦請參見圖丨,箔片15藉著一種熱處 理的非均向導電黏膠,經由一種連接條15e連接到基板1。隨 後在覆盍ίο的上面提供箔片15,並於缺口 13中,藉由黏劑17 固定控制電子14。

Claims (1)

  1. 525199 A8 B8 C8 D8 六、申請專利範圍 1.. 一種電光裝置,包括: 一光線透射基板(1); 基板(1)上層之一堆疊(2),該堆疊包括靠近基板⑴之一 第一光線透射電極層(3),一第二電極層(4),以及介於第 一(3)與第二電極層⑷之間之一有機電激發光層(5); 一中空之覆蓋(10),放置於堆疊(2)的上面,該覆蓋以 不漏氣的方式連接到基板(1),並且具有沿著堆疊⑺延伸 的一第一内壁(11);及 一水膠合吸氣劑(12),其容納於覆蓋(10)之中,以便於 緊靠第一内壁(11), 其特徵為提供一附有缺口(13)之覆蓋(10).的第一内壁(11) ,其中容納控制電子(14),以便於電連接到第一電極(3) 與第二電極(4)。 2. 根據申請專利範圍第1項之電光裝置,其特徵為覆蓋(1〇) 係由金屬製成。 3. 根據申請專利範圍第1或2項之電光裝置,其特徵為控制 電子(14)係位於一附有導線軌跡(16)的柔軟箔片(15)上,該 導線軌跡連接控制電子(14)到第一電極層(3)與第二電極 層⑷。 4. 根據申請專利範圍第1或2項之電光裝置’其特徵為控制 電子(14)係藉由一種黏劑(17),固定於缺口(13)中。 5. 根據申請專利範圍第2項之電光裝置,其特徵為覆蓋(1〇) 係藉由一種密封劑(6)連接到基板⑴,其中電氣絕緣之粉 末是分散的。 • 9 - 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)
TW090131702A 2000-11-08 2001-12-20 Electro-optical device TW525199B (en)

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US6628070B2 (en) 2003-09-30
CN1411615A (zh) 2003-04-16
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US20020067126A1 (en) 2002-06-06
EP1336207A1 (en) 2003-08-20

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