CN1308838A - 用来通过焊料回流钎焊电子元件的方法及其钎焊装置 - Google Patents

用来通过焊料回流钎焊电子元件的方法及其钎焊装置 Download PDF

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Publication number
CN1308838A
CN1308838A CN99808478A CN99808478A CN1308838A CN 1308838 A CN1308838 A CN 1308838A CN 99808478 A CN99808478 A CN 99808478A CN 99808478 A CN99808478 A CN 99808478A CN 1308838 A CN1308838 A CN 1308838A
Authority
CN
China
Prior art keywords
substrate
atmosphere
soldering
fusion
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN99808478A
Other languages
English (en)
Chinese (zh)
Inventor
克劳德·卡斯卡
吉莱斯·康纳尔
希尔瑞·辛德齐尼尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Publication of CN1308838A publication Critical patent/CN1308838A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN99808478A 1998-07-30 1999-07-08 用来通过焊料回流钎焊电子元件的方法及其钎焊装置 Pending CN1308838A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR98/09774 1998-07-30
FR9809774A FR2781974B1 (fr) 1998-07-30 1998-07-30 Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede

Publications (1)

Publication Number Publication Date
CN1308838A true CN1308838A (zh) 2001-08-15

Family

ID=9529207

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99808478A Pending CN1308838A (zh) 1998-07-30 1999-07-08 用来通过焊料回流钎焊电子元件的方法及其钎焊装置

Country Status (11)

Country Link
EP (1) EP1101393A1 (fr)
JP (1) JP2002521851A (fr)
KR (1) KR20010070971A (fr)
CN (1) CN1308838A (fr)
AU (1) AU4625499A (fr)
BR (1) BR9912555A (fr)
CA (1) CA2338181A1 (fr)
FR (1) FR2781974B1 (fr)
HU (1) HUP0104913A2 (fr)
TW (1) TW434073B (fr)
WO (1) WO2000007418A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104002005A (zh) * 2014-06-16 2014-08-27 贵州永红航空机械有限责任公司 铝合金气路板真空钎焊及热处理一体化工艺

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954292A (ja) * 1982-09-21 1984-03-29 松下電器産業株式会社 印刷配線板の製造法および加熱装置
DE4126913A1 (de) * 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
US5345056A (en) * 1991-12-12 1994-09-06 Motorola, Inc. Plasma based soldering by indirect heating
WO1994022628A1 (fr) * 1993-04-05 1994-10-13 Seiko Epson Corporation Procede et appareil d'assemblage par brasage
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
FR2735054B1 (fr) * 1995-06-09 1997-07-25 Air Liquide Procede de fluxage par voie seche de surfaces metalliques avant brasage ou etamage utilisant une atmosphere comportant de la vapeur d'eau

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104002005A (zh) * 2014-06-16 2014-08-27 贵州永红航空机械有限责任公司 铝合金气路板真空钎焊及热处理一体化工艺
CN104002005B (zh) * 2014-06-16 2018-12-14 贵州永红航空机械有限责任公司 铝合金气路板真空钎焊及热处理一体化工艺

Also Published As

Publication number Publication date
TW434073B (en) 2001-05-16
AU4625499A (en) 2000-02-21
CA2338181A1 (fr) 2000-02-10
KR20010070971A (ko) 2001-07-28
JP2002521851A (ja) 2002-07-16
EP1101393A1 (fr) 2001-05-23
HUP0104913A2 (en) 2002-05-29
WO2000007418A1 (fr) 2000-02-10
FR2781974A1 (fr) 2000-02-04
BR9912555A (pt) 2001-05-02
FR2781974B1 (fr) 2000-08-25

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication