BR9912555A - Processo de soldagem por refusão de componentes eletrônicos, utilizando-se pré-depósitos de liga de solda forte e dispositivo de soldagem para a aplicação desse processo - Google Patents

Processo de soldagem por refusão de componentes eletrônicos, utilizando-se pré-depósitos de liga de solda forte e dispositivo de soldagem para a aplicação desse processo

Info

Publication number
BR9912555A
BR9912555A BR9912555-2A BR9912555A BR9912555A BR 9912555 A BR9912555 A BR 9912555A BR 9912555 A BR9912555 A BR 9912555A BR 9912555 A BR9912555 A BR 9912555A
Authority
BR
Brazil
Prior art keywords
welding
support
electronic components
solder alloy
remelting
Prior art date
Application number
BR9912555-2A
Other languages
English (en)
Inventor
Claude Carsac
Gilles Conor
Thierry Sindzingre
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of BR9912555A publication Critical patent/BR9912555A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Abstract

Patente de Invenção: <B>"PROCESSO DE SOLDAGEM POR REFUSãO DE COMPONENTES ELETRôNICOS, UTILIZANDO-SE PRé-DEPóSITOS DE LIGA DE SOLDA FORTE E DISPOSITIVO DE SOLDAGEM PARA A APLICAçãO DESSE PROCESSO"<D>. Nesse processo de soldagem por refusão de componentes eletrônicos (22) sobre um suporte (20), se dispõe de uma liga de solda forte pelo fato de essa liga de solda forte ter constituído o objeto de um pré-depósito sobre o suporte nos ou em locais de conexão dos componentes e/ou ter constituído o objeto de um pré-depósito sobre locais/terminações dos componentes propriamente ditos, se deposita cola polimerizável sobre locais de colagem do suporte (20) e procede-se a uma operação de fluxagem por via seca do suporte por colocação em contato desse suporte com uma atmosfera de fluxagem, compreendendo espécies excitadas ou instáveis e substancialmente desprovida de espécies eletricamente carregadas.
BR9912555-2A 1998-07-30 1999-07-08 Processo de soldagem por refusão de componentes eletrônicos, utilizando-se pré-depósitos de liga de solda forte e dispositivo de soldagem para a aplicação desse processo BR9912555A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9809774A FR2781974B1 (fr) 1998-07-30 1998-07-30 Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede
PCT/FR1999/001658 WO2000007418A1 (fr) 1998-07-30 1999-07-08 Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede

Publications (1)

Publication Number Publication Date
BR9912555A true BR9912555A (pt) 2001-05-02

Family

ID=9529207

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9912555-2A BR9912555A (pt) 1998-07-30 1999-07-08 Processo de soldagem por refusão de componentes eletrônicos, utilizando-se pré-depósitos de liga de solda forte e dispositivo de soldagem para a aplicação desse processo

Country Status (11)

Country Link
EP (1) EP1101393A1 (pt)
JP (1) JP2002521851A (pt)
KR (1) KR20010070971A (pt)
CN (1) CN1308838A (pt)
AU (1) AU4625499A (pt)
BR (1) BR9912555A (pt)
CA (1) CA2338181A1 (pt)
FR (1) FR2781974B1 (pt)
HU (1) HUP0104913A2 (pt)
TW (1) TW434073B (pt)
WO (1) WO2000007418A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
CN104002005B (zh) * 2014-06-16 2018-12-14 贵州永红航空机械有限责任公司 铝合金气路板真空钎焊及热处理一体化工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954292A (ja) * 1982-09-21 1984-03-29 松下電器産業株式会社 印刷配線板の製造法および加熱装置
DE4126913A1 (de) * 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
US5345056A (en) * 1991-12-12 1994-09-06 Motorola, Inc. Plasma based soldering by indirect heating
JP3365511B2 (ja) * 1993-04-05 2003-01-14 セイコーエプソン株式会社 ろう材による接合方法及び装置
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
FR2735054B1 (fr) * 1995-06-09 1997-07-25 Air Liquide Procede de fluxage par voie seche de surfaces metalliques avant brasage ou etamage utilisant une atmosphere comportant de la vapeur d'eau

Also Published As

Publication number Publication date
FR2781974B1 (fr) 2000-08-25
WO2000007418A1 (fr) 2000-02-10
TW434073B (en) 2001-05-16
AU4625499A (en) 2000-02-21
EP1101393A1 (fr) 2001-05-23
FR2781974A1 (fr) 2000-02-04
CN1308838A (zh) 2001-08-15
CA2338181A1 (fr) 2000-02-10
JP2002521851A (ja) 2002-07-16
HUP0104913A2 (en) 2002-05-29
KR20010070971A (ko) 2001-07-28

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]