BR9912560A - Processo de soldagem por refusão de componentes eletrônicos, e dispositivo de soldagem para a aplicação desse processo - Google Patents

Processo de soldagem por refusão de componentes eletrônicos, e dispositivo de soldagem para a aplicação desse processo

Info

Publication number
BR9912560A
BR9912560A BR9912560-9A BR9912560A BR9912560A BR 9912560 A BR9912560 A BR 9912560A BR 9912560 A BR9912560 A BR 9912560A BR 9912560 A BR9912560 A BR 9912560A
Authority
BR
Brazil
Prior art keywords
support
components
electronic components
welding
application
Prior art date
Application number
BR9912560-9A
Other languages
English (en)
Inventor
Claude Carsac
Gilles Conor
Thierry Sindzingre
Denis Verbockhaven
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of BR9912560A publication Critical patent/BR9912560A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Patente de Invenção: <B>"PROCESSO DE SOLDAGEM POR REFUSãO DE COMPONENTES ELETRôNICOS, E DISPOSITIVOS DE SOLDAGEM PARA A APLICAçãO DESSE PROCESSO"<D>. Nesse processo de soldagem por refusão de componentes eletrônicos (22) sobre um suporte, por exemplo uma plaqueta (20), de circuito impresso, se dispõe de uma liga de solda forte sobre um suporte (20), em locais de conexão dos componentes (22), se colocar os componentes nos locais de conexão, se efetuar uma operação de soldagem propriamente dita dos componentes (22) por tratamento térmico do suporte por sua colocação em contato a uma pressão próxima da pressão atmosférica com uma atmosfera de tratamento, comportando espécies químicas excitadas ou instáveis e substancialmente desprovida de espécies eletricamente carregadas, a atmosfera sendo obtida por passagem de um gás inicial de tratamento em uma descarga elétrica, e o tratamento do suporte sendo obtido por meio das espécies químicas assim aquecidas sob a ação da descarga.
BR9912560-9A 1998-07-30 1999-07-08 Processo de soldagem por refusão de componentes eletrônicos, e dispositivo de soldagem para a aplicação desse processo BR9912560A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9809773A FR2781706B1 (fr) 1998-07-30 1998-07-30 Procede de brasage par refusion de composants electroniques et dispositif de brasage pour la mise en oeuvre d'un tel procede
PCT/FR1999/001657 WO2000006333A1 (fr) 1998-07-30 1999-07-08 Procede de brasage par refusion de composants electroniques et dispositif de brasage pour la mise en oeuvre d'un tel procede

Publications (1)

Publication Number Publication Date
BR9912560A true BR9912560A (pt) 2001-05-02

Family

ID=9529206

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9912560-9A BR9912560A (pt) 1998-07-30 1999-07-08 Processo de soldagem por refusão de componentes eletrônicos, e dispositivo de soldagem para a aplicação desse processo

Country Status (11)

Country Link
EP (1) EP1100644A1 (pt)
JP (1) JP2002521207A (pt)
KR (1) KR20010053616A (pt)
CN (1) CN1307508A (pt)
AU (1) AU4625399A (pt)
BR (1) BR9912560A (pt)
CA (1) CA2338157A1 (pt)
FR (1) FR2781706B1 (pt)
HU (1) HUP0104961A2 (pt)
TW (1) TW416881B (pt)
WO (1) WO2000006333A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
US6780225B2 (en) * 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
CN100427273C (zh) * 2003-08-26 2008-10-22 宏达国际电子股份有限公司 电子元件载具
KR100975911B1 (ko) * 2008-03-17 2010-08-13 성안산업주식회사 황동과 태라스톤을 사용한 일체형 논 슬립부재
CN102173849B (zh) * 2011-02-18 2012-08-08 成都泰格微波技术股份有限公司 一种可靠的微波介质陶瓷与金属的焊接方法
CN106985564B (zh) * 2011-06-13 2019-03-08 千住金属工业株式会社 焊膏的印刷方法
ES2718380T3 (es) 2015-10-29 2019-07-01 Procter & Gamble Composición detergente líquida
FR3066935B1 (fr) * 2017-06-01 2019-06-28 Stiral Procede de brasage ou rechargement d'une piece a micro-interstices, et echangeur thermique obtenu par un tel procede.
KR102101455B1 (ko) * 2020-02-01 2020-04-16 김상군 셀렉티브 솔더링 장치
CN111360361B (zh) * 2020-03-26 2021-09-07 诚联电源股份有限公司 用于开关电源生产的电子线路板固定装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921157A (en) * 1989-03-15 1990-05-01 Microelectronics Center Of North Carolina Fluxless soldering process
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5345056A (en) * 1991-12-12 1994-09-06 Motorola, Inc. Plasma based soldering by indirect heating

Also Published As

Publication number Publication date
CA2338157A1 (fr) 2000-02-10
JP2002521207A (ja) 2002-07-16
FR2781706A1 (fr) 2000-02-04
CN1307508A (zh) 2001-08-08
EP1100644A1 (fr) 2001-05-23
WO2000006333A1 (fr) 2000-02-10
FR2781706B1 (fr) 2000-08-25
TW416881B (en) 2001-01-01
KR20010053616A (ko) 2001-06-25
HUP0104961A2 (en) 2002-05-29
AU4625399A (en) 2000-02-21

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]