BR9803799A - Composição para emover estanho e solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel de circuito impresso e processo para remover rapidamente pelo menos um metal ou liga de estanho ou solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel circuito impresso. - Google Patents

Composição para emover estanho e solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel de circuito impresso e processo para remover rapidamente pelo menos um metal ou liga de estanho ou solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel circuito impresso.

Info

Publication number
BR9803799A
BR9803799A BR9803799-4A BR9803799A BR9803799A BR 9803799 A BR9803799 A BR 9803799A BR 9803799 A BR9803799 A BR 9803799A BR 9803799 A BR9803799 A BR 9803799A
Authority
BR
Brazil
Prior art keywords
tin
alloy
copper
printed circuit
solder
Prior art date
Application number
BR9803799-4A
Other languages
English (en)
Inventor
Todd Ii Johnson
John T Fakler
Original Assignee
Morton Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Int Inc filed Critical Morton Int Inc
Publication of BR9803799A publication Critical patent/BR9803799A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

"COMPOSIçãO PARA REMOVER ESTANHO E SOLDA E UMA LIGA DE ESTANHO-COBRE SUBJACENTE DE UM SUBSTRATO DE COBRE DE UM PAINEL DE CIRCUITO IMPRESSO E PROCESSO PARA REMOVER RAPIDAMENTE PELO MENOS UM METAL OU LIGA DE ESTANHO OU SOLDA E UMA LIGA DE ESTANHO-COBRE SUBJACENTE DE UM SUBSTRATO DE COBRE DE UM PAINEL CIRCUITO IMPRESSO". é apresentada uma composição e processo para decapar estanho e solda e a liga estanho-cobre subjacente de um substrato de cobre de um painel de circuito impresso. O líquido inclui uma solução aquosa de ácido nítrico numa quantidade suficiente para dissolver a solda e o estanho, uma fonte de íons férrico numa quantidade suficiente para dissolver a liga estanho-cobre, e uma fonte de íons halogeneto numa quantidade suficiente para melhorar significativamente a resistência entre os circuitos impressos.
BR9803799-4A 1997-10-01 1998-09-29 Composição para emover estanho e solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel de circuito impresso e processo para remover rapidamente pelo menos um metal ou liga de estanho ou solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel circuito impresso. BR9803799A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/940,125 US6258294B1 (en) 1997-10-01 1997-10-01 Composition for stripping solder and tin from printed circuit boards

Publications (1)

Publication Number Publication Date
BR9803799A true BR9803799A (pt) 2000-01-18

Family

ID=25474278

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9803799-4A BR9803799A (pt) 1997-10-01 1998-09-29 Composição para emover estanho e solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel de circuito impresso e processo para remover rapidamente pelo menos um metal ou liga de estanho ou solda e uma liga de estanho-cobre subjacente de um substrato de cobre de um painel circuito impresso.

Country Status (10)

Country Link
US (1) US6258294B1 (pt)
EP (1) EP0906968A1 (pt)
JP (1) JPH11158660A (pt)
KR (1) KR100316987B1 (pt)
CN (1) CN1124367C (pt)
AU (1) AU718581B2 (pt)
BR (1) BR9803799A (pt)
CA (1) CA2248497C (pt)
IL (1) IL126094A (pt)
TW (1) TW460623B (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI231831B (en) * 2001-10-11 2005-05-01 Shipley Co Llc Stripping solution
AU2003272790A1 (en) * 2002-10-08 2004-05-04 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
TW200831710A (en) * 2006-09-25 2008-08-01 Mec Co Ltd Metal removing solution and metal removing method using the same
JP5792284B2 (ja) 2010-04-15 2015-10-07 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 老朽化したプリント回路基板のリサイクル方法
US20120244050A1 (en) * 2011-03-25 2012-09-27 Dowa Electronics Materials Co., Ltd. Cleaning agent for silver-containing composition, method for removing silver-containing composition, and method for recovering silver
JP5690244B2 (ja) * 2011-08-19 2015-03-25 地方独立行政法人東京都立産業技術研究センター はんだの組成分析方法
SG11201403228RA (en) 2011-12-15 2014-07-30 Advanced Tech Materials Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
JP6490012B2 (ja) * 2013-11-28 2019-03-27 東洋アルミニウム株式会社 回路基板の製造方法
CN105220156B (zh) * 2015-10-12 2016-06-22 广州市艺鎏化工有限公司 一种用于印刷电路板的退锡剂及其制备方法
CN106186420A (zh) * 2016-08-04 2016-12-07 深圳市洁驰科技有限公司 一种废退锡水处理系统及处理方法
CN106783537A (zh) * 2016-12-01 2017-05-31 武汉新芯集成电路制造有限公司 一种去除晶圆表面焊料的方法
CN111344105B (zh) * 2017-12-19 2022-05-13 郑州机械研究所有限公司 一种原位合成金属覆层药芯银钎料及其制备方法、焊接方法和连接体
US10955439B2 (en) * 2019-03-12 2021-03-23 International Business Machines Corporation Electrochemical cleaning of test probes
CN115110080B (zh) * 2022-06-24 2024-03-15 华南理工大学 一种环保型挂具退锡铜剥除液及其制备方法与应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713144A (en) * 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards
DE3738307A1 (de) 1987-11-11 1989-05-24 Ruwel Werke Gmbh Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen
JPH0375386A (ja) * 1989-08-18 1991-03-29 Metsuku Kk 錫又は錫‐鉛合金の剥離方法
US5244539A (en) * 1992-01-27 1993-09-14 Ardrox, Inc. Composition and method for stripping films from printed circuit boards
EP0559379B1 (en) * 1992-03-04 1997-09-24 Macdermid Incorporated Method for stripping tin or tin-lead alloy from copper surfaces
US5741432A (en) 1995-01-17 1998-04-21 The Dexter Corporation Stabilized nitric acid compositions
US5512201A (en) * 1995-02-13 1996-04-30 Applied Chemical Technologies, Inc. Solder and tin stripper composition
US5505872A (en) 1995-05-23 1996-04-09 Applied Electroless Concepts, Inc. Solder stripper recycle and reuse
US5911907A (en) * 1995-08-30 1999-06-15 Surface Tek Specialty Products, Inc. Composition and method for stripping tin and tin-lead from copper surfaces
JPH1072682A (ja) * 1996-08-30 1998-03-17 Mec Kk 錫および錫合金の剥離液

Also Published As

Publication number Publication date
AU8317898A (en) 1999-04-15
US6258294B1 (en) 2001-07-10
JPH11158660A (ja) 1999-06-15
AU718581B2 (en) 2000-04-13
KR100316987B1 (ko) 2002-04-17
CN1214610A (zh) 1999-04-21
CN1124367C (zh) 2003-10-15
CA2248497C (en) 2002-02-26
IL126094A0 (en) 1999-05-09
IL126094A (en) 2001-08-08
KR19990036670A (ko) 1999-05-25
TW460623B (en) 2001-10-21
CA2248497A1 (en) 1999-04-01
EP0906968A1 (en) 1999-04-07

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFERIDO O PRESENTE PEDIDO DE PATENTE COMO INVENCAO - DE ACORDO COM O ART. 8O DA LPI.