經濟部智慧財產局員工消費合作社印製 A7 _____ _B7_ 五、發明説明（ί ) ™ 發明背景 本發明係關於一種用以迴焊電子元件至一個諸如是印 刷電路板之基底的方法，而且也是關於達成此種方法的一 種迴焊的裝置。 用於進行焊接之兩種最普遍的操作方法是"波動焊接 "與、迴流焊接々。 在第一種，即波動焊接，的方法裡，其接焊的方式是 將攜載有電子元件的電路板與一或多個波型的液態焊料合 金接觸，而該焊料合金係藉由一個噴嘴促使容置在一槽中 的熔融焊料形成迴流而獲致。 一般而言，該電路板係藉著一種熔化的噴霧或熔化的 泡沬而在上游區域中預塗熔劑處理，然後.預熱而促使該熔 劑先行沉澱，以便淸理欲實施焊接的表面，使消除其氧化 物及有機的污染物質等。 其次，在第二種，即迴流焊接，的技術中，其係在與 位於電路上的電子元件相連接的點處使用一定量的焊料合 金，例如，在該欲進仃焊接之電子兀件的印刷電路板上鋪 印一種含有金屬合金與熔劑之焊糊並使其沉積在印刷電路 的上面。 另外，有一種先進的技術是使S亥焊料合金一或多次地 預先沉積在該與電子元件連接的點處’而該預先沉積的位 置即進行迴流焊接。在此之後，通常需對該先前迴流焊接 過之預先沉積的位置(隆凸的形狀)實施表面平坦化的操作( 可參照工業上所採用的〇PTIPADtm方法）；或者 本紙張尺度適用中國國標準{ CNS ) A4^ ( 210X29七公嫠1 ~~ ----------R------訂----1--.線 (請先閱讀背面之注意事項再填寫本頁) 416S81 __B7___ 五、發明説明（v ) ，在特定之電子元件的情形中，該焊料合金甚至可以預先 沉積在確切之電子元件的末端處。 然後’只完成將電子元件設置在基底的操作。 該具有電子元件的基底便嵌插入一個迴流的烘爐中， 以便提供必要的熱量促使該金屬合金迴流，並且容許該包 含在錫膏或預先沉積之材料中的熔劑成份活化。 如在波動焊接的情況中，這種技術需要使用一種熔劑 以便淸理欲焊接的表面。然而，使用這些焊劑會造成許多 特定的缺點，尤其是因爲它們的成本以及它們餘留在電路 板上的殘留物，這些都將導致藉此方式而設計之電子元件 的電路板產生可靠度的問題。因此，這些焊接的技術之後 ，尙必需提供淸理電路板之額外的步驟，而這個步驟通常 是運用氯消毒的溶劑。但是，現今這個方法卻受到一般法 令之極大的限制。而且，這種額外的淸理步驟卻也大大地 增加製造電路板的成本。 此外，在微電子工業界裡有一個走向微小化以及極高 度積體電路（電子元件上之輸入/輸出的數目）。尤其’适種 電路所具有的電子元件也保有新式樣的外觀，而且該電子 元件具備高數量的連接點以及複雜的幾何形狀以便與在此 行業之諸如BGA或nip-Onp等電子元件連接。 以BGA元件爲例，它的性能在電子工業界裡即很受青 睞，但這些電子元件也有許多特定的缺點，尤其是因爲當 焊料的連結點或連接處並非沿著電子元件的側邊，而是位 在電子元件的下方，這種情形使得對其所做的淸理與修復 玉紙g尺度適用中國S家標準（CNS ) A4規格（210X29手公釐) (請先閎讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印紫 經濟部智慧財產局員工消費合作社印製 41BS81 B7 —--— — —_________ 五、發明説明（A ) 變得非常困難。 有關這些新的電子元件以及新的焊料沉積技術，可以 參考1997年七月/八月號之“進階封裝，，（Advanced Packaging)期刊中的各篇論文。 在本發明申請人的第EP-658,391號和ep_747，i59號專 利文件中即已提出在使用包含激態或不穩定化學物質與大 致上爲不帶電荷之物質的氣體混合物以進行焊接或鍍錫之 前，用供乾燥熔解的方法和設備。 由本發明申請人所完成之硏究顯示，這些在迴流焊接 的情況中所用的方法需要做進一步的改良，不僅要改良用 於焊接特殊電子元件的條件，而且還要改良一般熔解的條 件，如此才能避免進行淸理基底的上游操作。 潑明摘要 本發明的目的是要提供一種因應前所述之問題的技術 方法與設備。 因而，本發明的目的是一種用來將電子元件迴焊至一 個基底的方法，在此方法期間： 一使用一特定劑量的焊材合金； 一該電子元件係配置在連結至該基底的點位置；以及 一藉由基底的熱處理及使用焊材合金，以達成焊接電 子元件的動作， 並且，其特徵在於基底係在熱處理的作用下便可運用 焊材合金完成電子元件的焊接，其係藉由一個趨近於大氣 壓力的情況下以促使基底與一個處理環境接觸，該處理環 I紙伕尺度適用中國國家標準（CNS ) A4规格（210'乂29^公釐) ---------------ΐτ------ (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局S工消費合作社印製 416881 A7 --__ 五、發明説明（f ) 胃包含激^不穩_化學補以及大致上顧不帶電荷 的物=，該環境係藉由通過—種經過放電的原始處理氣體 Μ獲得’且該基底的熱_係藉由在放電作用下受熱的化 學物質而達成。 5 亥依據本發明的方法可更包含一或多個下列步驟： 一在放置該電子元件的步驟之前，在該電子元件的若 干點位置設置許多可結合至基底的黏著劑，以便在該黏著 劑固著之後可使該電子元件以該結合點而附著至基底； 一該焊材合金係藉由在基底上與電子元件連結的點位 置處篩印一種錫膏； 一該焊材合金係一或多次地預先設置在該基底上之連 結至該電子元件的一個點或許多點處，然後便可在該預先 設置的點處進行一個迴焊的動作，接著便有利地進行一個 使基底表面平坦化的動作； 一該焊材合金係一或多次地預先設置在該確切電子元 件上的點/末端處，然後便可在該預先設置的點處進行一個 迴焊的動作； 一在結合至基底的點處設置黏著劑的步驟之前，或在 其步驟之後，抑或在該電子元件已完成放置在該基底上之 後，可在趨近於大氣壓力的情況下’藉由一種包含激態或 不穩定的化學物質以及大致上係爲不帶電荷的物質的熔解 環境以處理該基底，而達成熔解該基底的動作； 一熔解環境係藉由通過一種經過電排流的原始熔解氣 體而獲致，該原始熔解氣體係有利地包含一種含氫氣的還 本紙張尺度適用中國闺家標隼（CNS ) Α4規格（2丨〇><29^公董） ----------"------訂-----j 線 (請先閲讀背面之注意事項再填寫本頁) 绫濟部智慧財產局員工消費合作社印製 __41B881 ^ 五、發日月說明（（） 原氣韆迤合物； \敎原始處理氣體包含一種含氫氣的還原氣體混合物 > \庵理環境係在一種用來生成激態或不穩定物質之裝 置的〜個氣體出口處獲得，而該原始處理氣體則是在該裝 置中轉璨； \該熔解環境係在一種用來生成激態或不穩定物質之 的〜個氣體出口處獲得，而該熔解氣體則是在該裝置 中轉_ ; 咳放置電子兀件以及迴焊的步驟係在該基底之兩個 大的1¾¾上實施，而該熱處理操作則是藉由兩個用供生成 ^態或不穩定之化學物質的裝置以達成，該每一裝置係與 該基底之其中一個面相對： 〜本發明方法更包含一個在該迴焊之後，藉由將該基 底通過〜個包含鈍氣之冷卻環境以冷卻該基底的步驟。 本發明目的同時也包含一種用供迴焊電子元件至一種 諸如印刷電路板之基底的裝置，以便完成如先前所述的過 程’其特徵在於其包含一個用來傳輸以至少一個面搞載電 子元件之基底的構件，以便該電子元件藉由一種焊料合金 而焊接在連接點處，該傳輸構件輸送該基底使通過第_機 構以及第二機構，該第一機構容許出現在與該基底結合之 點處的黏著劑能夠固著，該第二機構包含至少〜個!用$± 成一種處理環境的裝置，該處理環境包含激態或不 化學物質且係大致上沒有帶電荷的物質，而該處$胃胃@ 度適用中國國家標隼（CNS ) A4規格（hOX29^公釐） ' - -----------裝------訂-------線 (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____ _B7_ V. Description of the Invention (ί) ™ Background of the Invention The present invention relates to a method for resoldering electronic components to a substrate such as a printed circuit board, and is also about achieving A reflow device for this method. The two most common operating methods for soldering are " wave soldering " and, reflow soldering. In the first method, wave soldering, the method of soldering is to contact a circuit board carrying electronic components with one or more wave solder liquid alloys, and the solder alloy is passed through a nozzle This is caused by the reflow of the molten solder contained in a tank. In general, the circuit board is pre-coated with a flux in the upstream area by a molten spray or molten foam, and then the pre-heating causes the flux to precipitate in advance, so that the surface to be soldered can be treated, Eliminate its oxides and organic pollutants. Second, in the second technique, reflow soldering, a certain amount of solder alloy is used at the point where the electronic components on the circuit are connected. For example, the electronic components to be soldered are A solder paste containing a metal alloy and a flux is printed on the printed circuit board and deposited on the printed circuit. In addition, there is an advanced technology in which the Shai solder alloy is previously deposited one or more times at the point where the electronic component is connected, and the pre-deposited position is subjected to reflow soldering. After this, it is usually necessary to perform a surface planarization operation on the previously deposited position (the shape of the bulge) that has been previously reflow soldered (refer to the 0PTIPADtm method used in the industry); or the Chinese standard is applicable to this paper size {CNS) A4 ^ (210X29 Qigongyuan 1 ~~ ---------- R ------ Order ---- 1--. Line (Please read the notes on the back before filling (This page) 416S81 __B7___ 5. Description of the Invention (v) In the case of a specific electronic component, the solder alloy can even be deposited in advance at the exact end of the electronic component. Then 'only the operation of setting the electronic component on the substrate is completed The substrate with electronic components is inserted into a reflow oven to provide the necessary heat to reflow the metal alloy and allow the flux component contained in the solder paste or pre-deposited material to activate. For example, in wave soldering In this case, this technique requires the use of a flux to manage the surface to be soldered. However, the use of these fluxes causes many specific disadvantages, especially because of their cost and their remaining on the circuit board Residues will cause reliability problems for the circuit boards of electronic components designed in this way. Therefore, after these soldering techniques, it is necessary to provide an additional step of managing the circuit board, and this step is usually applied Chlorine sterilizing solvent. However, this method is currently greatly restricted by general regulations. Moreover, this additional processing step also greatly increases the cost of manufacturing circuit boards. In addition, there is a trend in the microelectronics industry. Miniaturization and extremely highly integrated circuits (the number of inputs / outputs on electronic components). In particular, the electronic components of suitable circuits also have a new appearance, and the electronic components have a high number of connection points and complex Geometry to connect with electronic components such as BGA or nip-onp in this industry. Taking BGA components as an example, their performance is very popular in the electronics industry, but these electronic components also have many specific disadvantages, especially Because when the solder joint or connection is not along the side of the electronic component, it is located on the electronic component. In this case, the reasoning and repair of the jade paper g dimensions applied to the Chinese standard (CNS) A4 specifications (210X29 hand mm) (please read the precautions on the back before filling this page) Order Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed 41BS81 B7 ————— — — _________ V. Invention Description (A) becomes very difficult. About these new electronic components and new For solder deposition technology, you can refer to the various papers in the journal "Advanced Packaging" in July / August 1997. In the applicant's patents EP-658,391 and ep_747, i59 The document has proposed methods and equipment for drying and melting prior to the use of a gas mixture containing excited or unstable chemicals and a substantially uncharged substance for soldering or tinning. The research done by the applicant of the present invention shows that these methods used in the case of reflow soldering need to be further improved, not only to improve the conditions for soldering special electronic components, but also to improve the general melting conditions. Avoid upstream manipulation of the substrate. The Abstract of the Invention The object of the present invention is to provide a technical method and an apparatus for coping with the aforementioned problems. Accordingly, the object of the present invention is a method for resoldering an electronic component to a substrate, during which:-a specific dose of solder alloy is used;-the electronic component is arranged at a point position connected to the substrate ; And a heat treatment of the substrate and the use of a solder material alloy to achieve the action of welding electronic components, and is characterized in that the substrate can use the solder material alloy to complete the welding of electronic components under the effect of heat treatment, which is achieved by In the case of approaching atmospheric pressure to promote contact between the substrate and a processing environment, the paper ring size of the processing ring I applies the Chinese National Standard (CNS) A4 specification (210 '乂 29 ^ mm) ------- -------- ΐτ ------ (Please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economy, S Industrial Consumer Cooperative, 416881 A7 --__ V. Description of Invention (f ) The stomach contains instability _ chemical supplements and generally uncharged substances =, the environment is obtained by passing through a discharge of the original processing gas M ′ and the heat of the substrate is caused by the discharge Under heated chemicals to make. 5. The method according to the present invention may further include one or more of the following steps:-Prior to the step of placing the electronic component, a plurality of adhesives that can be bonded to the substrate are provided at a plurality of points of the electronic component so that the adhesive is provided on the adhesive. After fixing, the electronic component can be attached to the substrate with the bonding point; a solder alloy is screened with a solder paste at the point where the electronic component is connected to the substrate; a solder alloy is One or more points connected to the electronic component on the substrate are pre-set multiple times, and then a reflow operation can be performed at the pre-set points, and then a flat surface of the substrate is advantageously performed. -The solder alloy is pre-set one or more times at the point / end of the exact electronic component, and then a re-soldering operation can be performed at the pre-set point;- Before or after the step of placing the adhesive at the point of the substrate, or after the electronic component has been placed on the substrate, it may approach atmospheric pressure 'The action of melting the substrate is achieved by processing the substrate with a melting environment containing an excited or unstable chemical substance and a substantially uncharged substance; a melting environment is achieved by passing through an electrical discharge The original melting gas is obtained from the original melting gas system. The original melting gas system advantageously contains a hydrogen-containing paper which is sized to comply with the Chinese standard (CNS) A4 specification (2 丨 〇 > < 29 ^ 公 董)- -------- " ------ Order ----- j line (Please read the precautions on the back before filling this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs__41B881 ^ V. Explanation of the Sun and Moon (() Original gas thousand compounds; \ 敎 The original processing gas contains a mixture of reducing gas containing hydrogen > \ \ The physical environment is in a device used to generate excited or unstable substances It is obtained at ~ gas outlets, and the original processing gas is turned in the device; \ The melting environment is obtained at ~ gas outlets for generating excited or unstable substances, and the melting The gas is transferred in the device; The steps of electronic components and re-soldering are performed on the two large substrates of the substrate, and the heat treatment operation is achieved by two devices for generating chemical or unstable chemical substances, each of which The device is opposite to one of the surfaces of the substrate: ~ The method of the present invention further comprises a step of cooling the substrate by passing the substrate through a cooling environment containing inert gas after the reflow. The purpose of the present invention is also Comprising a device for re-soldering an electronic component to a substrate such as a printed circuit board in order to perform the process as previously described, 'characterized in that it comprises a means for transporting the substrate carrying the electronic component on at least one side, So that the electronic component is soldered at the connection point by a solder alloy, the transmission member transports the substrate so that the first mechanism allows the adhesive appearing at the point bonded to the substrate to pass through the second mechanism and the second mechanism. Fixation, the second mechanism contains at least ~! Use $ ± to form a device for processing the environment, the processing environment contains excitable or non-chemical substances and is roughly There are no charged substances on it, and the $ stomach and stomach @ degrees here are applicable to the Chinese National Standard (CNS) A4 specification (hOX29 ^ mm) '------------ pack ----- -Order ------- line (please read the precautions on the back before filling this page)
、發明説明（π / 經濟部智慧財產局員工消費合作社印製 礙度在接近大氣壓力時，可以對該基底進行熱處理，以達 成埤接該電子元件的確切目的。 有利地’本發明裝置在該第一機構的上游或在該第一 與第二機構之間，包含沿著該輸送構件而插置之至少 \個用供生成一種熔解環境的裝置，該熔解環境包含激態 或不穩定的化學物質且係大致上沒有帶電荷的物質，而該 培解環境可在氣態中用以熔解該基底。 依據本發明，該〜趨近於大氣壓力〃的敘述應解釋爲 處在0.1 Χ105與3 Χ105 Pa之範圍內而有利於本發明操作的 壓力環境。 而從以下進一步敘述將可瞭解，該依據本發明而焊接 至"基底〃之電子元件的種類，在本質上會隨著工業界中 所使用之不同的基底而有極大的變化。槪略而言，該基底 就可以是印刷電路的形式(不論它們的表面狀態爲何，或是 否抛光），例如用金屬處理的陶瓷基底，諸如混合電路，甚 至是必須以一種整體濃縮的方法以焊接電路的封裝底部。 類似地，相關之電子元件的範圍也可以從傳統被動式 或主動式的電子元件到愈來愈複雜且不易處理的電子元件 而有極大的變化，因而它們可以是封裝濃縮或裸露晶片的 電子元件(BGA、MCM、Flip-Chip等）。該依據本發明的* 電子元件〃也可以包含在封裝之前必須焊接至其它基底或 一個封裝底部的電路。 圖式說明 有關本發明之進一步的特徵和優點將從以下的敘述以 n 裝 i ![ 訂— -矣 (請先閱讀背面之注意事項再填寫本頁) 適用中""國國家標準（CNS ) A4规格（210X29$公釐）2. Description of the invention (π / When the consumer ’s cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints near the atmospheric pressure, the substrate can be heat treated to achieve the exact purpose of connecting the electronic component. Advantageously, the device of the present invention is in the Upstream of the first mechanism or between the first and second mechanisms, it includes at least \ means for generating a melting environment interposed along the conveying member, the melting environment containing excited or unstable chemistry Substances and substances that are substantially non-charged, and the digestion environment can be used to melt the substrate in the gaseous state. According to the present invention, the ~ approaching atmospheric pressure 〃 should be interpreted as being at 0.1 × 105 and 3 × 105 Within the Pa range, the pressure environment is favorable for the operation of the present invention. From the further description below, it will be understood that the types of electronic components soldered to the " substrate " The use of different substrates varies greatly. Basically, the substrates can be in the form of printed circuits (regardless of their surface state, or whether they are Light), such as ceramic substrates treated with metal, such as hybrid circuits, and even the bottom of the package must be soldered in a monolithic method. Similarly, related electronic components can range from traditional passive or active electronics Components have greatly changed to more and more complicated and difficult to handle electronic components, so they can be electronic components (BGA, MCM, Flip-Chip, etc.) that encapsulate concentrated or bare wafers. The * electronic components according to the invention * It can also include circuits that must be soldered to other substrates or to the bottom of a package before packaging. Schematic illustrations of further features and advantages of the present invention will be assembled from the following description in n! [ORDER —-矣 (Please read the back first Please note this page before filling in this page) Applicable " " National Standard (CNS) A4 Specification (210X29 $ mm)
五、發明説明（?） 及參照僅做爲範例介紹的附加圖式而逐一呈現，其中： f請先聞讀背面之注意事項再填寫本頁) 第一圖係顯禾一種用供達成依據本發明方法之焊接裝 置的槪略視圖：以及 第一圖係顯禾一個用於如第一圖所示之裝置的結構中 且用供生成激1¾或不穩定化學物質之模組範例的槪略剖視 圖。 發明詳述 第一圖顯示〜種適合用於實施本發明方法之迴焊裝置 的一般視圖。這個裝置包含一個具有一條輸送帶12的輸送 組件10’該輸送帶係安裝在一個封閉空間14中並以虛線 表示，其並延展於兩個導引滾輪16和〖8之間，且其中至 少一個導引滾輪係受到驅動。 同時’在這個圖式中也可以看見一組印刷電路板20放 置在該輸送帶12上，而在印刷電路板之至少一個大塊面積 的表面上則插滿了一組焊接方式固著的電子元件22。 經濟部晳慧財產局員工消費合作杜印" 該電子元件係放置在諸如一種錫與鉛合金之錫膏的連 接點處。而且，在用以連結至該電路板之適當的點位置可 沉積一點適合辨識用途之可膠著的黏著劑(例如，在該印刷 電路板之塗有聚合物質的表面上，或在兩個連接點之間）， 以便在焊接期間可確保電子元件固定不變。 該輸送帶12可使攜載有電子元件22的印刷電路扳20 傳遞通過第一機構24,且該第一機構可以使該沉積的黏著 劑藉由熱傳遞（諸如熱輻射)而固著，然後再經過一個第二 機構28以進行熱處理，而其中實行該電子元件焊接的操作 國國家標準（CNS ) ( 2!OX297公釐）V. The description of the invention (?) And the references are presented one by one as additional examples for illustration, among which: f Please read the notes on the back before filling in this page. A schematic view of the welding device of the inventive method: and the first figure is a schematic cross-sectional view showing an example of a module used in the structure of the device as shown in the first figure and used to generate 1¾ or unstable chemicals . Detailed description of the invention The first figure shows a general view of a reflow device suitable for carrying out the method of the invention. This device contains a conveyor assembly 10 'with a conveyor belt 12, which is installed in an enclosed space 14 and indicated by a dashed line, and extends between two guide rollers 16 and 8 and at least one of them The guide roller train is driven. At the same time, in this figure, a group of printed circuit boards 20 can be seen on the conveyor belt 12, and a surface of at least one large area of the printed circuit board is filled with a group of electrons fixed by soldering. Element 22. Consumer Electronics Co., Ltd.'s Consumer Electronics Co., Ltd., the Ministry of Economic Affairs, said the electronic component is placed at the connection point of a solder paste such as a tin and lead alloy. Furthermore, a small amount of adhesive that is suitable for identification purposes can be deposited at the appropriate point location for attachment to the circuit board (for example, on the polymer-coated surface of the printed circuit board, or at two connection points). Between) to ensure that the electronic components are fixed during soldering. The conveyor belt 12 can transfer the printed circuit board 20 carrying the electronic component 22 through the first mechanism 24, and the first mechanism can fix the deposited adhesive by heat transfer (such as heat radiation), and then Go through a second mechanism 28 for heat treatment, in which the national standard (CNS) (2! OX297 mm) of the operating country of the electronic component welding is implemented
Ii6S81 五、發明説明（y) 最後’該輸送帶12再使該印刷電路板20向該熱處理 的第二機構28下游傳輸到達一個冷卻機構30，而該電路 板在冷卻機構中是放置在一個氮氣形式的環境裡。 在第一圖中可以看出，該進行熱處理的第二機構28可 視爲與一個熔解機構26合倂，且這兩個機搆可以構成一個 模組32 ’這個模組係用以生成一種用供處理與熔解的氣體 ’該氣體包含激態或不穩定的化學物質且係大致上沒有帶 電荷的物質。 在第一圖中，其係假設該電子元件22是擺置在該電路 板20之大面積的表面上，且該用於生成激態或不穩定物質 的模組32則是朝向這個表面。然而，對於熟悉本技術的人 士均可瞭解，如果在該電路板20之相互對應的兩個大面積 的表面上均設置電子元件22，則本發明裝置可包含兩個用 以生成激態或不穩定物質的模組32 ,且使每個模組分別面 對該電路板20之其中一個大的表面而擺設^ 該模組32的功能是產生一種原始處理氣體，該原始處 理氣體可更有利地包含一種諸如以氮氣和氫氣爲基礎之還 原的氣體混合物：如有需要’可經由一個放電而加入水蒸 汽’而該原始處理氣體會在放電中轉換，以便在該模組的 氣體出口處產生包含有激態或不穩定氣態物質的處理氣體 ，並且這種處理氣體大致上是不帶電荷的物質(在遠離電紫 的情況）。 在閱讀完前文之後便可瞭解，依據所要焊接的電路以 (請先閱讀背面之注意事項再填寫本頁) '-a 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨OX297公釐} A7 B7 416881 五、發明説明（f ) 及依據所應用的焊料合金，該離開電排流之物質的溫度(大 約190°C) —般將正好足供運用。然而’在特定之特別的情 況中（例如，特定之金屬的共鎔合金），其也可以在它進入 放電作用之前稍微預熱該原始氣體。 桌一圖係以一個剖面視圖顯不〜種可以產生這種化學 物質之模組32的例子。 這個圖式顯示該模組32包含〜個第—管狀電極34， 該管狀電極係以諸如一個金屬塊36之一內表面所構成，且 在其中以同心圓的方式放置一個由諸如陶瓷之介電材料％ 製成之管狀結構的組合件，而在該金屬塊之內表面上則是 以金屬處理方式沉積一個第二電極40，在第二圖中之第二 電極的厚度係爲淸楚觀看的理由而誇大。 該介電管38和第二電極40 ’以及該第一電極34共同 疋義一個管狀的氣體通道42’並在其內側所形成的內部容 積裡循環著一種冷卻劑。 在該金屬塊36上有兩個徑向對立的縱向切槽46和48 ’其中一個做爲入口並用於該原始處理氣體在該通道42中 進行轉換（激態），另一個則爲出口並用於該包含激態或不 穩定物質的處理環境流動’其中該激態或不穩定的氣態物 質大致上係不帶電荷的物質。 該切槽46和48係延伸穿越該凹穴42之整個的軸向長 度。 更有利地，該金屬塊36在該第一電極34的環境周邊 包含複數個管道50，以流通諸如水的冷卻劑。 本紙張尺度適用中國國家標準/ CNS )从規格（釐） ' — -----^-----ί------訂--------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財凌局員工消费合作社印製 416 8 § ^ A7 —---- __ 五、發明説明（ffc ) 第二圖也顯示出該氣體入口的切槽46與一個同質的腔 室52連通的情形，該㈣室係形成在-fi附著於該金屬塊 36且具有-個用以H給該原始氣體之管子％的殻體54內 部。 該模組係運用〜個設計用來在該流通於氣體通道42中 的氣體混合物裡產生〜個放電之高電壓高頻率的電動發電 機58 ’使藉著離子化作用而激發該氣體混合物的組合分子 ’並因而產生激態或不穩定的化學物質，尤其是可以使印 刷電路板20(如第〜贿所示）之外表面上還原或消除污染的 Η或沁基。 該用以焊接電子元件至一塊印刷電路板上的方法是藉 以下的方式實施的。 在以下所提的電路板20上，其係已經在該電子元件的 連接點處篩印錫膏。其也可以運用該焊材合金使一或多次 地預先設置在該電路板上之連結至該電子元件的許多點， 然後一般是在隨後的迴焊之前，進行一個使因預先設置焊 料合金而產生點的表面平坦化的動作(這種在工業上所運用 的方法對於熟悉微電子技藝的人士而言是耳熟能詳的）。而 所使用之具有接觸點/末端的電子元件也可以使其在該處預 先沉積一種焊料合金。 依據本發明，如先前所述之點狀的黏著劑係預先沉積 在連結的點，以便在焊接的期間確保該電子元件固定不動 〇 其次，該電子元件係設置在該連接的點，然後將準備 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） {請先閎讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 A7 ___ 416881 B7 _ 五 '發明説明（丨I ) 好的電路板放置在該輸送構件中，特別是放置在該輸送帶 12 上·> 然後，輸送帶便將電路板從該負載機構傳輸到用以固 著黏著劑的第一機構24，如此便可以預熱該電路。 在下一個步驟期間，該電路板係傳送到一個用以生成 激態或不穩定化學物質的模組32。該摸組係如先前所述並 參照第二圖所示。該電路板一方面因爲該模組32所生成之 化學物質的作用而進行一個熔解的操作，以及同時在另一 方面，由於藉由該電排流效果而使得熱傳遞到這些受激物 質的作用，故可以使該電子元件焊接到該電路板。 然後，持續一個冷卻該電路板的步驟，這是藉由使氮 氣流動到該冷卻機構30的效果而達成。 在該參考第一圖所敘述的例子中，其已假設在第一步 驟中以熱處理而使黏著劑固著以及使該電路板預熱的操作 是藉在一特定的機構24中達成。 然而，其也可以使用一種變通的方式，即藉由該用以 產生受激態化學物質的模組32所輸出之受熱的氣體來達成 前一步驟所進行的加熱效果。 此外，其也可以在藉由黏著劑而包覆該連結點的步驟 之前，利用由與該模組32相同之模組所提供之激態或不穩 定的化學物質，以達成預先助熔該電路板的步驟。 最後，依據一個未顯示的實施例，其也可以不僅只利 用一個模組，並且可以藉由兩個分別的模組32而對基底實 施助熔以及在焊接時的熱處理。 __ - —________ __- ___ 本紙張尺度適用中國國家橾準（CNS ) Α4规格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 A7 B7 1?^81Ii6S81 V. Description of the invention (y) Finally, the conveyor belt 12 transports the printed circuit board 20 downstream of the heat-treated second mechanism 28 to a cooling mechanism 30, and the circuit board is placed under a nitrogen gas in the cooling mechanism. Environment of form. It can be seen in the first figure that the second mechanism 28 for heat treatment can be regarded as being combined with a melting mechanism 26, and the two mechanisms can form a module 32 '. This module is used to generate a type for processing. Dissolved gas' This gas contains excitable or unstable chemicals and is substantially non-charged. In the first figure, it is assumed that the electronic component 22 is placed on a large-area surface of the circuit board 20, and the module 32 for generating an excited or unstable substance is directed toward this surface. However, as will be understood by those skilled in the art, if electronic components 22 are provided on two large-area surfaces of the circuit board 20 corresponding to each other, the device of the present invention may include two A module 32 for stabilizing the material, and each module is arranged to face one of the large surfaces of the circuit board 20 respectively. The function of the module 32 is to generate an original processing gas, which can be more advantageous. Contains a reduced gas mixture, such as based on nitrogen and hydrogen: 'Water vapor can be added via a discharge' if needed and the original process gas is switched in the discharge to produce a containment at the gas outlet of the module Process gas with an excitable or unstable gaseous substance, and this process gas is generally an uncharged substance (in the case of being far away from electric violet). After reading the previous article, you can understand that according to the circuit to be soldered (please read the notes on the back before filling this page) ) A4 specification (2 丨 OX297 mm) A7 B7 416881 V. Description of the invention (f) and the temperature of the substance leaving the electrical discharge (approximately 190 ° C) according to the applied solder alloy-generally will be just enough for use However, 'in certain special cases (for example, a rhenium alloy of a specific metal), it can also slightly preheat the original gas before it enters the discharge effect. The table is shown in a sectional view An example of a module 32 that can produce this chemical substance. This diagram shows that the module 32 contains ~ first-tubular electrodes 34, which are formed with an inner surface, such as a metal block 36, and in which A tube-shaped assembly made of a dielectric material such as ceramic is placed in a concentric circle, and a metal processing method is used to deposit a first metal block on the inner surface of the metal block. The thickness of the electrode 40 in the second figure is exaggerated for reasons of viewing. The dielectric tube 38, the second electrode 40 ', and the first electrode 34 collectively define a tubular gas channel 42. 'And a coolant is circulated in the internal volume formed by its inner side. There are two radially opposite longitudinal slits 46 and 48 on the metal block 36' One of them is used as an inlet and is used for the original process gas in the A transition (excited state) is performed in channel 42 and the other is an outlet and is used for the flow of the processing environment containing the excited or unstable substance, wherein the excited or unstable gaseous substance is substantially an uncharged substance. The The notches 46 and 48 extend through the entire axial length of the cavity 42. More advantageously, the metal block 36 contains a plurality of pipes 50 around the environment of the first electrode 34 to circulate a coolant such as water. This paper scale applies Chinese National Standards / CNS) from the specifications (centimeters) '— ----- ^ ----- ί ------ order -------- line (please read the back first (Please note this page before filling out this page.) # 416 8 § ^ A7 —---- __ 5. Description of the Invention (ffc) The second figure also shows the case where the gas inlet 46 is in communication with a homogeneous chamber 52, which is formed at- Fi is attached to the metal block 36 and has an interior of a casing 54 for supplying a tube% of the original gas. This module uses a combination of ~ high-voltage and high-frequency motor-generators 58 'designed to generate ~ discharges in the gas mixture flowing in the gas channel 42 so that the gas mixture is excited by ionization Molecules' and thus produce excitable or unstable chemicals, in particular tritium or phenyl groups that can reduce or eliminate contamination on the surface of the printed circuit board 20 (shown as the first to the third). The method for soldering electronic components to a printed circuit board is implemented in the following manner. On the circuit board 20 mentioned below, the solder paste has been screened at the connection points of the electronic components. It can also use the solder alloy to make one or more pre-arranged connections on the circuit board to many points of the electronic component, and then generally, before subsequent re-soldering, perform a The action of flattening the surface of the dots (this industrially used method is familiar to those familiar with microelectronics). The use of electronic components with contact points / ends allows them to deposit a solder alloy there in advance. According to the present invention, a dot-shaped adhesive as previously described is deposited in advance at a joint point to ensure that the electronic component is fixed during soldering. Second, the electronic component is disposed at the connection point, and then the preparation is performed. This paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) {Please read the precautions on the back before filling this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs A7 ___ 416881 B7 _ 5 ' DESCRIPTION OF THE INVENTION (丨 I) A good circuit board is placed in the conveying member, especially on the conveyer belt 12. Then, the conveyer belt transfers the circuit board from the load mechanism to the adhesive for fixing the adhesive. The first mechanism 24 thus preheats the circuit. During the next step, the circuit board is transferred to a module 32 for generating excited or unstable chemicals. The touch system is as described previously and shown with reference to the second figure. On the one hand, the circuit board performs a melting operation due to the action of the chemical substances generated by the module 32, and at the same time, on the other hand, due to the electric drainage effect, heat is transferred to the excited substances. Therefore, the electronic component can be soldered to the circuit board. Then, a step of cooling the circuit board is continued by the effect of flowing nitrogen gas to the cooling mechanism 30. In the example described with reference to the first figure, it has been assumed that in the first step, the operation of fixing the adhesive by heat treatment and preheating the circuit board is achieved by a specific mechanism 24. However, it is also possible to use a workaround by using the heated gas output by the module 32 for generating excited chemical substances to achieve the heating effect performed in the previous step. In addition, it can also use an excited or unstable chemical provided by the same module as the module 32 before the step of covering the connection point with an adhesive to achieve pre-fluxing of the circuit Plate steps. Finally, according to an embodiment not shown, it is also possible to use not only one module, but also to perform fluxing and heat treatment on the substrate by means of two separate modules 32. __-—________ __- ___ This paper size applies to China National Standard (CNS) Α4 size (210 × 297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 1? ^ 81
五、發明説明（fM 對本發明所做的敘述可以瞭解，其係藉由該激態或不 穩定且大致上爲不帶電荷的化學物質以實施迴焊/熱處理的 步驟，而這些均是利用電排流的作用進行加熱，其並且可 以大大地改善藉此方式所達成之焊接點的品質，而免除後 續使用含氯溶劑以實施淸理的步驟： 一該確切之迴焊的熱處理是使用活化物質(淸理、還原 作用等)實施，其可避免任何的氧化現象，並因而實質地改 良濡溼的效能； 一而且，其可以假想藉由已稍微熔解的錫膏(在焊接之 後具有低活性/在基底上的少量殘餘物），或者最好仍使用 可預先設置焊料合金而不需在該基底上的適當點或在該電 子元件上的末端部進行助熔的系統，則該依據本發明的方 法便可結合而完全地符合焊接效能的要求，且可免除隨後 必須進行淸理基底的操作。 雖然本發明是依特定的實施例而描述，但其並非因而 受到限制，相反地，對於熟悉本技藝之人士而言，在以下 所附之申請專利範圍中的修飾與變化均是明顯易懂的。 因此，雖然本發明在先前特別以在該基底的路徑中設 置一個可用以生成處理或熔解環境的模組(或者甚至在每一 個表面放置一個模組）做爲例子，當然其也可以串聯及/或 並聯方式運用許多這種模組；但是，其也可以(依每一個使 用者的用途情形)只利用一個放置在相對於該基底之一側或 每一側面的模組（無論是做爲處理或是助熔）5並藉由進行 連續之通過該模組的焊道，以便獲得所期望的效果。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 l·線！ 經濟部智慧財產局員工消費合作社印製5. Description of the invention (fM's description of the present invention can be understood, it is the reflow / heat treatment step by using the excited or unstable and substantially uncharged chemical substance, and these are using electricity The effect of drainage is to heat, and it can greatly improve the quality of the solder joints achieved in this way, without the need to use chlorine-containing solvents to perform the following steps:-The exact heat treatment of reflow is the use of activated substances (Regulation, reduction, etc.), which can avoid any oxidation phenomenon, and thus substantially improve the performance of wetting; first, it can be imagined by the solder paste that has been slightly melted (having low activity after soldering / A small amount of residue on the substrate), or preferably still using a system that can pre-set solder alloys without fluxing at appropriate points on the substrate or at the ends of the electronic component, the method according to the invention It can be combined to fully meet the requirements of welding performance, and can eliminate the need to perform subsequent operations of the substrate. Although the present invention is described according to a specific embodiment However, it is not limited thereby. On the contrary, for those skilled in the art, the modifications and changes in the scope of the patent application attached below are obvious and understandable. Therefore, although the present invention has been particularly As an example, a module (or even a module placed on each surface) can be used in the path of the substrate to generate a processing or melting environment. Of course, it can also use many such modules in series and / or parallel. ; However, it can also (depending on the use case of each user) use only one module placed on one side or each side relative to the substrate (whether for processing or fluxing) 5 and by Continuously pass the bead of the module in order to obtain the desired effect. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) Order l · Line! Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs