HUP0104961A2 - Method for brazing by solder reflow electronic components and brazing device therefor - Google Patents
Method for brazing by solder reflow electronic components and brazing device thereforInfo
- Publication number
- HUP0104961A2 HUP0104961A2 HU0104961A HUP0104961A HUP0104961A2 HU P0104961 A2 HUP0104961 A2 HU P0104961A2 HU 0104961 A HU0104961 A HU 0104961A HU P0104961 A HUP0104961 A HU P0104961A HU P0104961 A2 HUP0104961 A2 HU P0104961A2
- Authority
- HU
- Hungary
- Prior art keywords
- carrier
- solder
- elements
- treatment
- brazing
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 238000005219 brazing Methods 0.000 title 2
- 239000000126 substance Substances 0.000 abstract 4
- 238000010438 heat treatment Methods 0.000 abstract 3
- 238000006116 polymerization reaction Methods 0.000 abstract 2
- 238000011282 treatment Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002801 charged material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000005243 fluidization Methods 0.000 abstract 1
- 238000011221 initial treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A találmány tárgya eljárás és berendezés elektronikus elemekújraolvasztó forrasztására. Az eljárás során felvisznek egy bizonyosmennyiségű forraszt, az elemeket a hordozólap csatlakozási helyeirehelyezik, és elvégzik az elemek tulajdonképpeni forrasztási műveletéta forrasszal, a hordozólap hőkezelése útján. A találmány értelmében ahordozólap hőkezelését az elemek forrasszal való forrasztása végettúgy végzik, hogy a hordozólapot a légköri nyomáshoz közeli nyomásongerjesztett vagy instabil és villamosan töltött anyagokat lényegébennem tartalmazó vegyi anyagokból álló, kezelő-atmoszférával hozzákérintkezésbe, amelyet úgy állítanak elő, hogy kiinduló kezelőgáztvillamos kisülésen vezetnek át, és a hordozólap hőkezelését a kisüléshatására így felhevült vegyi anyagok hozzák létre. A berendezéstartalmaz egy szállítószervet (10) a hordozólapok (20) számára,amelyek a forrasztandó elemeket (22) legalább az egyik oldalukon ahordozólap csatlakozási helyein hordozzák. Ez a szállító szerv (10) ahordozólapokat (20) továbbítja első eszközökhöz (24 polimerizálóállomás), amelyek lehetővé teszik a hordozólap (20) ragasztási helyeinlévő ragasztópontok polimerizálását, valamint második eszközökhöz,amelyek között van legalább egy készülék (28 kezelő állomás)gerjesztett vagy instabil és villamosan töltött anyagokat lényegébennem tartalmazó vegyi anyagok által képzett folyósító atmoszféraelőállítására, amely folyósító atmoszféra a légköri nyomáshoz közelinyomáson a hordozólapon száraz úton végzett folyósításra használható. ÓThe subject of the invention is a method and equipment for remelting electronic components. During the process, a certain amount of solder is applied, the elements are placed at the connection points of the carrier board, and the actual soldering operation of the elements is carried out with solder, by means of heat treatment of the carrier board. According to the invention, the heat treatment of the carrier sheet is carried out in order to solder the elements with solder, by bringing the carrier sheet into contact with a treatment atmosphere consisting of chemicals that are pressure-excited close to atmospheric pressure or unstable and do not contain electrically charged substances, which is produced by passing through an initial treatment gas electric discharge, and the heat treatment of the carrier sheet is created by chemicals heated in this way due to the effect of the discharge. The equipment contains a transport member (10) for the carrier plates (20), which carry the elements to be soldered (22) on at least one of their sides at the connection points of the carrier plate. This transport member (10) conveys the carrier sheets (20) to first devices (polymerization station 24), which allow the polymerization of the adhesive points in the place where the carrier sheet (20) is glued, and to second devices, which include at least one device (28 treatment station) excited or unstable and for the production of a fluidizing atmosphere formed by chemical substances that essentially do not contain electrically charged materials, which fluidizing atmosphere can be used for dry fluidization on the substrate at a pressure close to atmospheric pressure. HE
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9809773A FR2781706B1 (en) | 1998-07-30 | 1998-07-30 | METHOD OF BRAZING BY REFUSION OF ELECTRONIC COMPONENTS AND BRAZING DEVICE FOR CARRYING OUT SUCH A METHOD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUP0104961A2 true HUP0104961A2 (en) | 2002-05-29 |
Family
ID=9529206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HU0104961A HUP0104961A2 (en) | 1998-07-30 | 1999-07-08 | Method for brazing by solder reflow electronic components and brazing device therefor |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP1100644A1 (en) |
| JP (1) | JP2002521207A (en) |
| KR (1) | KR20010053616A (en) |
| CN (1) | CN1307508A (en) |
| AU (1) | AU4625399A (en) |
| BR (1) | BR9912560A (en) |
| CA (1) | CA2338157A1 (en) |
| FR (1) | FR2781706B1 (en) |
| HU (1) | HUP0104961A2 (en) |
| TW (1) | TW416881B (en) |
| WO (1) | WO2000006333A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6468833B2 (en) | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| US6780225B2 (en) * | 2002-05-24 | 2004-08-24 | Vitronics Soltec, Inc. | Reflow oven gas management system and method |
| CN100427273C (en) * | 2003-08-26 | 2008-10-22 | 宏达国际电子股份有限公司 | Electronic component carrier and method for shattering and loading electronic components on circuit board |
| KR100975911B1 (en) * | 2008-03-17 | 2010-08-13 | 성안산업주식회사 | A Single Structure Non-Slip using Brass and Terrastone |
| CN102173849B (en) * | 2011-02-18 | 2012-08-08 | 成都泰格微波技术股份有限公司 | Reliable welding method of microwave medium ceramic and metal |
| WO2012173059A1 (en) * | 2011-06-13 | 2012-12-20 | 千住金属工業株式会社 | Solder paste |
| EP3165593B1 (en) | 2015-10-29 | 2019-01-23 | The Procter and Gamble Company | Liquid detergent composition |
| FR3066935B1 (en) * | 2017-06-01 | 2019-06-28 | Stiral | METHOD FOR BRAZING OR RECHARGING A MICRO-INTERSTICE PIECE, AND THERMAL EXCHANGER OBTAINED BY SUCH A METHOD |
| KR102101455B1 (en) * | 2020-02-01 | 2020-04-16 | 김상군 | Selective soldering device |
| CN111360361B (en) * | 2020-03-26 | 2021-09-07 | 诚联电源股份有限公司 | Electronic circuit board fixing device for switching power supply production |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4921157A (en) * | 1989-03-15 | 1990-05-01 | Microelectronics Center Of North Carolina | Fluxless soldering process |
| DE4032328A1 (en) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | METHOD AND DEVICE FOR PROCESSING JOINT PARTNERS TO BE SOLDERED |
| US5345056A (en) * | 1991-12-12 | 1994-09-06 | Motorola, Inc. | Plasma based soldering by indirect heating |
-
1998
- 1998-07-30 FR FR9809773A patent/FR2781706B1/en not_active Expired - Fee Related
-
1999
- 1999-07-08 KR KR1020017001258A patent/KR20010053616A/en not_active Application Discontinuation
- 1999-07-08 WO PCT/FR1999/001657 patent/WO2000006333A1/en not_active Application Discontinuation
- 1999-07-08 CN CN99808004A patent/CN1307508A/en active Pending
- 1999-07-08 JP JP2000562170A patent/JP2002521207A/en active Pending
- 1999-07-08 BR BR9912560-9A patent/BR9912560A/en not_active Application Discontinuation
- 1999-07-08 AU AU46253/99A patent/AU4625399A/en not_active Abandoned
- 1999-07-08 EP EP99929437A patent/EP1100644A1/en not_active Withdrawn
- 1999-07-08 CA CA002338157A patent/CA2338157A1/en not_active Abandoned
- 1999-07-08 HU HU0104961A patent/HUP0104961A2/en unknown
- 1999-07-22 TW TW088112437A patent/TW416881B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1307508A (en) | 2001-08-08 |
| AU4625399A (en) | 2000-02-21 |
| KR20010053616A (en) | 2001-06-25 |
| FR2781706A1 (en) | 2000-02-04 |
| BR9912560A (en) | 2001-05-02 |
| CA2338157A1 (en) | 2000-02-10 |
| EP1100644A1 (en) | 2001-05-23 |
| WO2000006333A1 (en) | 2000-02-10 |
| TW416881B (en) | 2001-01-01 |
| FR2781706B1 (en) | 2000-08-25 |
| JP2002521207A (en) | 2002-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HUP0104961A2 (en) | Method for brazing by solder reflow electronic components and brazing device therefor | |
| KR960015761A (en) | Plasma Treatment Equipment | |
| KR930012165A (en) | Soldering method by plasma heat conduction | |
| NO944618D0 (en) | Improved template or mask for applying solder to PCB and holder for this | |
| DE59010289D1 (en) | Method and device for processing joining partners to be soldered | |
| KR960002916A (en) | Electronic devices with batteries and batteries thereof | |
| BR8605482A (en) | MASS WELDING SYSTEM | |
| EP1574865A4 (en) | Pressing member and electronic component handling device | |
| DE59812719D1 (en) | METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES | |
| GB2099742B (en) | Bonding metals to non-metals | |
| DE59908997D1 (en) | Method and device for treating disc-shaped objects such as sheets, glass plates, printed circuit boards, ceramic substrates | |
| WO1998049375A3 (en) | Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment | |
| DE69802676T2 (en) | DEVICE FOR COATING PLATE-SHAPED SUBSTRATES, ESPECIALLY OF PCB | |
| KR960026338A (en) | Ashing Method and Apparatus for Resist | |
| KR910002551A (en) | Apparatus and method for soldering items | |
| JP3922003B2 (en) | Method of joining circuit body to flat panel display panel | |
| ATE269185T1 (en) | DEVICE FOR LASER PROCESSING WORKPIECES | |
| HUP0104913A2 (en) | Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor | |
| DE69902775T2 (en) | DEVICE FOR TRANSPORTING THIN PLATES, ESPECIALLY PCB | |
| AU5996096A (en) | Process and device for joining electric, heat source-bearing printed circuit boards to metallic heat dissipating plates | |
| JP2008010448A (en) | Method and apparatus of carrying base board | |
| JP2008041355A (en) | Plasma surface treatment device, and surface treatment method | |
| EP0381430A3 (en) | A method of firing copper compatible thick film materials | |
| JPH08230932A (en) | Article,and method to transfer said article | |
| TH42568A3 (en) | Process for reflow soldering of electronic components and soldering machines for the completion of the process. |