AU4625499A - Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor - Google Patents

Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor

Info

Publication number
AU4625499A
AU4625499A AU46254/99A AU4625499A AU4625499A AU 4625499 A AU4625499 A AU 4625499A AU 46254/99 A AU46254/99 A AU 46254/99A AU 4625499 A AU4625499 A AU 4625499A AU 4625499 A AU4625499 A AU 4625499A
Authority
AU
Australia
Prior art keywords
brazing
deposits
solder
electronic components
device therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU46254/99A
Other languages
English (en)
Inventor
Claude Carsac
Gilles Conor
Thierry Sindzingre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide SA, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical Air Liquide SA
Publication of AU4625499A publication Critical patent/AU4625499A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU46254/99A 1998-07-30 1999-07-08 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor Abandoned AU4625499A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9809774 1998-07-30
FR9809774A FR2781974B1 (fr) 1998-07-30 1998-07-30 Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede
PCT/FR1999/001658 WO2000007418A1 (fr) 1998-07-30 1999-07-08 Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede

Publications (1)

Publication Number Publication Date
AU4625499A true AU4625499A (en) 2000-02-21

Family

ID=9529207

Family Applications (1)

Application Number Title Priority Date Filing Date
AU46254/99A Abandoned AU4625499A (en) 1998-07-30 1999-07-08 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor

Country Status (11)

Country Link
EP (1) EP1101393A1 (fr)
JP (1) JP2002521851A (fr)
KR (1) KR20010070971A (fr)
CN (1) CN1308838A (fr)
AU (1) AU4625499A (fr)
BR (1) BR9912555A (fr)
CA (1) CA2338181A1 (fr)
FR (1) FR2781974B1 (fr)
HU (1) HUP0104913A2 (fr)
TW (1) TW434073B (fr)
WO (1) WO2000007418A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
CN104002005B (zh) * 2014-06-16 2018-12-14 贵州永红航空机械有限责任公司 铝合金气路板真空钎焊及热处理一体化工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954292A (ja) * 1982-09-21 1984-03-29 松下電器産業株式会社 印刷配線板の製造法および加熱装置
DE4126913A1 (de) * 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
US5345056A (en) * 1991-12-12 1994-09-06 Motorola, Inc. Plasma based soldering by indirect heating
WO1994022628A1 (fr) * 1993-04-05 1994-10-13 Seiko Epson Corporation Procede et appareil d'assemblage par brasage
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
FR2735054B1 (fr) * 1995-06-09 1997-07-25 Air Liquide Procede de fluxage par voie seche de surfaces metalliques avant brasage ou etamage utilisant une atmosphere comportant de la vapeur d'eau

Also Published As

Publication number Publication date
TW434073B (en) 2001-05-16
CA2338181A1 (fr) 2000-02-10
KR20010070971A (ko) 2001-07-28
JP2002521851A (ja) 2002-07-16
EP1101393A1 (fr) 2001-05-23
HUP0104913A2 (en) 2002-05-29
WO2000007418A1 (fr) 2000-02-10
FR2781974A1 (fr) 2000-02-04
BR9912555A (pt) 2001-05-02
FR2781974B1 (fr) 2000-08-25
CN1308838A (zh) 2001-08-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase