HUP0104913A2 - Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor - Google Patents
Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device thereforInfo
- Publication number
- HUP0104913A2 HUP0104913A2 HU0104913A HUP0104913A HUP0104913A2 HU P0104913 A2 HUP0104913 A2 HU P0104913A2 HU 0104913 A HU0104913 A HU 0104913A HU P0104913 A HUP0104913 A HU P0104913A HU P0104913 A2 HUP0104913 A2 HU P0104913A2
- Authority
- HU
- Hungary
- Prior art keywords
- brazing
- substrate
- liquefaction
- electronic components
- carrier sheet
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005219 brazing Methods 0.000 title 2
- 229910000679 solder Inorganic materials 0.000 title 2
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 239000000126 substance Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000003292 glue Substances 0.000 abstract 2
- 238000006116 polymerization reaction Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9809774A FR2781974B1 (fr) | 1998-07-30 | 1998-07-30 | Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUP0104913A2 true HUP0104913A2 (en) | 2002-05-29 |
Family
ID=9529207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HU0104913A HUP0104913A2 (en) | 1998-07-30 | 1999-07-08 | Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP1101393A1 (fr) |
| JP (1) | JP2002521851A (fr) |
| KR (1) | KR20010070971A (fr) |
| CN (1) | CN1308838A (fr) |
| AU (1) | AU4625499A (fr) |
| BR (1) | BR9912555A (fr) |
| CA (1) | CA2338181A1 (fr) |
| FR (1) | FR2781974B1 (fr) |
| HU (1) | HUP0104913A2 (fr) |
| TW (1) | TW434073B (fr) |
| WO (1) | WO2000007418A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6468833B2 (en) | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| CN104002005B (zh) * | 2014-06-16 | 2018-12-14 | 贵州永红航空机械有限责任公司 | 铝合金气路板真空钎焊及热处理一体化工艺 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954292A (ja) * | 1982-09-21 | 1984-03-29 | 松下電器産業株式会社 | 印刷配線板の製造法および加熱装置 |
| DE4126913A1 (de) * | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
| US5345056A (en) * | 1991-12-12 | 1994-09-06 | Motorola, Inc. | Plasma based soldering by indirect heating |
| WO1994022628A1 (fr) * | 1993-04-05 | 1994-10-13 | Seiko Epson Corporation | Procede et appareil d'assemblage par brasage |
| FR2713528B1 (fr) * | 1993-12-15 | 1996-01-12 | Air Liquide | Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage. |
| FR2735054B1 (fr) * | 1995-06-09 | 1997-07-25 | Air Liquide | Procede de fluxage par voie seche de surfaces metalliques avant brasage ou etamage utilisant une atmosphere comportant de la vapeur d'eau |
-
1998
- 1998-07-30 FR FR9809774A patent/FR2781974B1/fr not_active Expired - Fee Related
-
1999
- 1999-07-08 EP EP99929438A patent/EP1101393A1/fr not_active Withdrawn
- 1999-07-08 KR KR1020017000667A patent/KR20010070971A/ko not_active Application Discontinuation
- 1999-07-08 CN CN99808478A patent/CN1308838A/zh active Pending
- 1999-07-08 WO PCT/FR1999/001658 patent/WO2000007418A1/fr not_active Application Discontinuation
- 1999-07-08 CA CA002338181A patent/CA2338181A1/fr not_active Abandoned
- 1999-07-08 HU HU0104913A patent/HUP0104913A2/hu unknown
- 1999-07-08 AU AU46254/99A patent/AU4625499A/en not_active Abandoned
- 1999-07-08 JP JP2000563113A patent/JP2002521851A/ja active Pending
- 1999-07-08 BR BR9912555-2A patent/BR9912555A/pt not_active Application Discontinuation
- 1999-07-13 TW TW088111843A patent/TW434073B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW434073B (en) | 2001-05-16 |
| AU4625499A (en) | 2000-02-21 |
| CA2338181A1 (fr) | 2000-02-10 |
| KR20010070971A (ko) | 2001-07-28 |
| JP2002521851A (ja) | 2002-07-16 |
| EP1101393A1 (fr) | 2001-05-23 |
| WO2000007418A1 (fr) | 2000-02-10 |
| FR2781974A1 (fr) | 2000-02-04 |
| BR9912555A (pt) | 2001-05-02 |
| FR2781974B1 (fr) | 2000-08-25 |
| CN1308838A (zh) | 2001-08-15 |
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