CN1308838A - Method for brazing by solder reflow etectronic components using pre-dre-deposits of solder alloy and brazing device therefor - Google Patents
Method for brazing by solder reflow etectronic components using pre-dre-deposits of solder alloy and brazing device therefor Download PDFInfo
- Publication number
- CN1308838A CN1308838A CN99808478A CN99808478A CN1308838A CN 1308838 A CN1308838 A CN 1308838A CN 99808478 A CN99808478 A CN 99808478A CN 99808478 A CN99808478 A CN 99808478A CN 1308838 A CN1308838 A CN 1308838A
- Authority
- CN
- China
- Prior art keywords
- substrate
- atmosphere
- soldering
- fusion
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Abstract
The invention concerns a method for brazing by solder reflow electronic components(22) on a support(20), which consists in: providing a solder alloy which has been subjected to a pre-deposit on the support sites for connecting the components and/or which has been subjected to a pre-deposit on sites/terminations of the components properly speaking; depositing curable glue on the support(20) bonding sites; and carrying out a dry process fluxing of the support by contacting said support with a fluxing atmosphere comprising excited or unstable species substantially free from electrically charged species.
Description
The present invention relates to a kind of process of an electronic component reflow soldering to the substrate (for example printed circuit board (PCB)) that be used for, and relate to the brazing equipment that is used for realizing a kind of like this process.
The two kinds of the most frequently used methods that are used for carrying out brazing operation are " flow brazings " and " reflow soldering ".
Under first kind of situation, flow brazing in other words, soldering comprise makes the plate that carries the electronic component of wanting soldering contact with one or more ripples of liquid solder alloy, and these ripples are included in a solder pot circulation in the groove and obtain by making by means of a nozzle.In general, in upstream region, use solder flux to spray or solder flux foam precoating substrate, thereby and preheat the previous solder flux that deposits of activation then, thereby the surface of soldering is wanted in cleaning, so that remove oxide, organic pollution etc.
In second kind of " backflow " soldering tech, the point place of Connection Element uses a certain amount of solder alloy on circuit, for example before depositing on the printed circuit, comprise the solder cream wire mark of metal alloy and flux mixture on printed circuit to the element of wanting soldering by handle.
Another kind of state-of-the-art technology comprises: the some place of solder alloy one or many pre-deposition Connection Element to the substrate, backflow (" backflow ") pre-deposition solder joint, the pre-deposition solder joint that refluxes before this generally then flattens (SIPAD that the formation of " raised points "-reference industry is suitable for
TMOr OPTIPAD
TMThe operation on surface process) is perhaps even by in the fact of following solder alloy pre-deposition of the situation of some element on the terminal of actual components.
Only position operation then at on-chip element.
Then the substrate that element is housed is inserted in the reflow ovens, makes the metal alloy backflow and make the fusion element that is included in cream or the pre-deposition material activate necessary heat thereby provide.
As under the flow brazing situation, the use of this Technology Need solder flux, thereby the surface that soldering is wanted in cleaning.The use of these solder flux has the defective of some, and particularly because its cost and they stay residue onboard, this often causes the integrity problem of the electron plate of design like this.Therefore for these technology, must provide the additional step of cleaning plate after soldering, this step adopts its purposes often to be subjected to the chlorinated solvent of the considerable restraint of current effective rules usually.And this auxiliary cleanup step often enlarges markedly the cost of making circuit.
Moreover, oriented miniaturization and in microelectronics industry to the strong trend of the high integrated level on the circuit (the I/O quantity on element) development, particularly along with connection be used for being connected to the appearance of the new-type element of the complex geometric shapes on the circuit, as in this field, being called the appearance of BGA or Flip Chip (flip-chip) with very large amount.
For example, the performance of known BGA is extremely attractive to industry, but these elements particularly because scolder connects and engage not along the component side form of routine lead-in wire (not with) but be positioned at the fact below the element, also have the defective of some, make its be difficult to cleaning and carry out any repairing).
About these new elements and new solder deposition technology, with reference to periodical " advanced encapsulation (Advanced Packaging) " July/1997 Augusts.
File EP-658 under the applicant name, 391 and EP-747,159 have proposed to be used for the process and the equipment of dry fusion, soldering or zinc-plated before use the admixture of gas that comprises activation or unstable chemical species and the essentially no thing class that electrifies.
The research of being finished by applicant shows that these processes can further be improved under the situation of reflow soldering, particularly so that allow to improve the counterflow condition that is used for new several generations element.
Purpose of the present invention particularly in, the answer to above-mentioned technical problem is provided.
Therefore purpose of the present invention is a kind of process that is used for electronic component to the reflow soldering of substrate, during this process:
-use a certain amount of solder alloy,
-element is placed on tie point place to substrate,
-use described solder alloy to carry out the practical operation of soldering element by the heat treatment of substrate,
The combination that it is characterized in that following steps realizes:
-use described solder alloy according to one or more of following method:
I) solder alloy one or many pre-deposition some some places that element connects on substrate, make the pre-deposition solder joint stand reflux operation then;
J) the point/end of solder alloy one or many pre-deposition on actual components, make the pre-deposition solder joint stand reflux operation then;
-before the step of deposition element, but the some place of some slaking binder depositions at bonding substrate, and the described adhesive of slaking then, thereby element is adhered on the substrate at the bounding point place;
-before brazing operation, carry out drying fusion operation, wherein by fusing substrate near this substrate is contacted with fusion atmosphere, described fusion atmosphere comprises and activates or unstable earnest class and the thing class that do not electrify basically.
Process according to the present invention may further include the one or more of following steps:
-obtain fusing atmosphere by making initial fusion gas through overdischarge;
-initially fuse gas and comprise the reducing gas mixture that comprises hydrogen;
-obtain fusing atmosphere at the gas outlet of the device that is used for forming activation or unstable earnest class, in this device, changed initial fusion gas;
-before or after deposit binder, fuse the described operation of substrate;
-described the operation of after being deposited on the substrate, having fused substrate to element;
-this process continues with the heat treatment of described substrate, so that use described solder alloy, contact, under approaching atmospheric pressure, carry out the described soldering of element by making substrate and processing atmosphere, described processing atmosphere comprises activation or the unstable chemical species and the thing class that do not electrify basically, this atmosphere obtains through overdischarge by making initial treatment gas, and the heat treatment of substrate obtains by means of the chemical species that so heats under discharge process;
-initial treatment gas comprises the reducing gas mixture that comprises hydrogen;
-obtain handling atmosphere at the gas outlet of the device that is used for forming activation or unstable earnest class, in this device, changed initial treatment gas;
-the step of on two big surfaces of substrate, carrying out placing element and soldering, by means of being used for forming activation or two devices of unstable chemical species carry out described fusion operation, each installs one of substrate surface vis-a-vis;
-the step of carrying out placing element and soldering on two big surfaces of substrate is carried out described processing operation by means of two devices that are used for forming activation or unstable chemical species, and each installs one of substrate surface vis-a-vis;
-this process further is included in soldering afterwards by making substrate cool off the step of substrate through the cooling atmosphere that comprises inert gas;
The operation on its surface that after refluxing, stands to flatten of-alloy pre-deposition.
The present invention also aims to a kind of be used to use solder alloy the electronic component reflow soldering to supporting, be used to realize the equipment of said process, it is characterized in that, it comprises a part that is used for carrying substrate, these substrates carry at least one of its surface [sic] wants the element of soldering at the some place that connects substrate, this conveying member transmits substrate by allowing first device in the adhesive solder joint slaking of bonding substrate point place existence, and by comprising second device of at least one device that is used for forming the fusion atmosphere that comprises activation or the unstable chemical species and the thing class that do not electrify basically, this fusion atmosphere can used near under the atmospheric pressure, so that make substrate stand dry fusion.
According to one of embodiment of the invention, second device is positioned at the upstream of first device.
According to another of the embodiment of the invention, second device is positioned at the downstream of first device.
Advantageously, this equipment comprises at least one device that is used for forming the processing atmosphere that comprises activation or the unstable chemical species and the thing class that do not electrify basically along conveying member in the downstream of first and second devices, the temperature of this processing atmosphere makes it can be used to carry out the heat treatment of substrate, so that carry out the actual soldering of element.
Saying " near atmospheric pressure " should be understood to according to the present invention and is meant and is positioned at scope [0.1 * 10 expediently
5Pa, 3 * 10
5Pa] pressure.
As reading has above been understood, can on characteristic, alter a great deal according to the various substrates that use in the electronics industry to " substrate " of its soldering, and be applicable to the electronic component of wanting soldering too certainly according to element of the present invention.As an illustration, substrate can be (no matter primary surface state or finished product how) of printed circuit type, perhaps for example is the cermet substrate such as hybrid circuit, perhaps or even to its must be in the overall package process outer casing bottom of soldering circuit.
Equally, the component variation that relates to is very big, and passive or active electron component is to complicated and reluctant element from routine, no matter they be encapsulate or the element of exposed die (BGA, MCM, Flip Chip etc.).Also can comprise according to " element " of the present invention and must before encapsulation, be soldered on another substrate or be soldered to circuit on the outer casing bottom.
From only providing as an example and will manifesting additional features and advantage, in the accompanying drawings with reference to the following description of accompanying drawing:
-Fig. 1 is the view that is used to realize according to the brazing equipment of process of the present invention;
-Fig. 2 is the cutaway view of the example of being used for of using during the equipment in Fig. 1 the is formed module that forms activation or unstable chemical species.
Fig. 1 represents to be applicable to the summary of enforcement according to the reflow soldering equipment of process of the present invention.
This equipment comprises a conveying member 10 that has a belt 12, and belt 12 is represented by dotted lines, be placed in the housing 14, and drive its at least one two guide rollers 16 with 18 between extension.
As can seeing in the figure, one group of printed substrate as 20, is placed on the belt 12, and at least one of the big surface of these substrates, one group of electronic component that placement must soldering is as 22.
Electronic component is placed on for example tie point place of tin and lead alloy solder joint of pre-deposition scolder, and solder joint is flattened after it refluxes.Moreover, but be suitable for estimating that the solder joint of the slaking adhesive of purposes has been deposited on the suitable some place of bonding substrate (for example on the polymer surfaces of printed circuit, between two tie points), guarantee that element keeps putting in place during soldering after it.
Belt 12 guarantee to transmit carry element 22 printed substrate 20 by a first stop 24 by the adhesive of (for example by radiation) slaking deposition of conducting heat, and be used for dry second station 26 of fusing substrate by one then.
At last, belt 12 guarantees substrate 20 to be sent to a cooling stations 30 that wherein substrate is placed in the nitrogen type atmosphere in 26 downstreams, second station.
As can be seeing among this Fig. 1, can consider 26 and treating stations in the second fusion station 28 are merged, two stations are made up of a module 32, so that form a kind of processing and fusion gas that comprises activation or unstable chemical species and the essentially no thing class that electrifies.
In this Fig. 1, suppose that element 22 is placed on one of big surface of substrate 20, be used for forming module 32 these surfaces of sensing of activation or unstable earnest class.
Apparent for the professional and technical personnel, if element 22 is placed on two big relatively surfaces of each substrate 20, then equipment can comprise two two modules 32 that are used for forming activation or unstable chemical species, and each is placed facing to one of surface of substrate 20.
The function of module 32 is, make then pass through discharge if desired a kind of for example comprising expediently to its initial fusion gas that has added the reducing gas mixture of water vapour based on nitrogen and hydrogen, in this discharge, change initial gas, thereby, produce the fusion atmosphere that comprises activation or unstable chemical species and the essentially no thing class (saturated) that electrifies away from plasma at the gas outlet of module.
Fig. 2 represents to produce the cutaway view of an example of the module 32 of this chemical species.
The figure shows module 32 and comprise one first hollow edged electrode 34, first hollow edged electrode 34 is for example formed by the inner surface of a metal derby 36, and wherein place an assembly that forms by for example ceramic pipe of making 38 of dielectric material with one heart, on pipe 38 inner surface,, for clarity sake in Fig. 2, exaggerated the thickness of second electrode 40 by one second electrode 40 of metalling deposition.
The dielectric tube 38 and second electrode 40, with first electrode 34, limit a tubular gas passage 42, and limit a wherein internal volume 44 of circulate coolant in inside.
Piece 36 has two radially relative cannelures 46 and 48, cannelure 46 and 48 be formed for respectively in passage 42, changing (activation) initial treatment gas import and be used to comprise activation or unstable gaseous state thing class and the processing of the essentially no thing class that electrifies or the mobile outlet of fusion atmosphere.
Groove 46 and 48 extends on the whole axial length of cavity 42.
Piece 36 further comprises a plurality of for example conduits that flow of water of cooling agent that are used for expediently around the circumference of first electrode 34, as 50.
Fig. 2 represents that also gas feed slit 46 is communicated with a homogenizing chamber 52, and homogenizing chamber 52 is formed in the housing 54 that is connected on the piece 36, and has a pipe 56 that is used for supplying with initial gas.
Module is finished by the high voltagehigh frequency generator 58 that produces discharge in the admixture of gas that is designed in inflow gas passage 42, thereby activates the gas molecule of forming admixture of gas by ionization, and thereby generation activation or unstable chemical species, particularly H
+Or H
2 +Base, the surface (Fig. 1) of these chemical species deoxidations and decontamination printed substrate 20.
Here carry out as follows then according to of the present invention electronic component is soldered to on-chip process.
Pre-deposition is used thereon at the some place of Connection Element in supposition below, refluxes and the substrate 20 of the solder alloy of flattening then.
As mentioned above, according to the present invention, the solder joint of adhesive is deposited on the some place of bonding substrate, thereby guarantees element to be kept putting in place during soldering.
Secondly, element is placed on the tie point place, and then the substrate of preparation like this is placed on the conveying member, particularly on the belt 12.
The latter is sent to plate then and is used for the first stop 24 of slaking adhesive from loading station, and thereby preheats circuit.
During next stage, substrate is sent to the module 32 that is used for forming activation or unstable chemical species, abovely this module has been described with reference to Fig. 2, and wherein substrate is on the one hand owing to the effect of the chemical species of being carried by module 32 stands the fusion operation, and on the other hand owing to the effect of passing to the heat on these activator classes by discharge effect, element is soldered on the substrate.
This process continues to be attended by cooling step owing to be transported to the effect of the nitrogen current of cooling stations 30.
In the illustrative examples that reference Fig. 1 describes, suppose slaking heat treatment and the pre-warmed first step of carrying out substrate by means of specific station 24 always.
Yet becoming example as one might be by means of carrying out this heating in advance by the heated air of module 32 outputs that are used for producing activating chemical thing class.
Moreover activation or unstable chemical species by means of placing before by means of adhesive coating bounding point by one, the module identical with module 32 carried might provide the step of fusing substrate.
At last, and according to an embodiment who does not have expression, still within the scope of the invention, might be not yet by means of one and identical module 32 but, carry out the fusion and the soldering heat treatment of substrate by means of two continuous separation modules 32.
Should be appreciated that the present invention of Miao Shuing just now used dry fusion step before actual soldering, make the quality that might significantly improve the soldered joint that so obtains, avoid using the later step of chlorinated solvent simultaneously.
Can see such fact: the invention enables of describing just now might be carried out reflow soldering, and without solder flux and need not conventional solder cream, thereby might avoid later circuit cleaning operation with bigger assurance, say nothing of the use of chlorinated solvent:
-forming the necessary solder alloy of solder bonds by supplying with at the pre-deposition solder joint that connects substrate point place and/or the point/end on actual components, there is not chemical flux (pre-deposition solder joint/backflow/preferably flatten) in this;
-therefore, solder flux keeps the function that puts in place because finishing its element can not resembling usually here, so before the step of deposition element, but the some place of slaking binder deposition at bonding substrate, and this adhesive of slaking then, thereby element is adhered on the substrate at the bounding point place;
-the fusion atmosphere of the essentially no thing class that electrifies contacts with comprising activation or unstable earnest class by make this substrate under approaching atmospheric pressure, carry out the operation (before or after deposit binder, perhaps even after being deposited on the substrate) of dry fusion substrate to element;
-expediently, use heat and active species, as obtaining those from discharge output, carry out finite reflux heat treatment (cleaning, deoxidation etc.), make and during soldering, to avoid any oxidative phenomena, and therefore not only improve wet performance widely, and relax the solder flux shortage of line upstream in this stage.
Therefore can see, the combination of step of the present invention provides the effective answer to asking a question, therefore and make to adapt to and in microelectronics, wish further integrated strong trend, keep higher reliability simultaneously, and avoid the international agreement strict target that cleanup step-may imagining seem be very difficult to be in harmonious proportion that limit relevant with environment.
Although described the present invention about specific embodiment, it is restricted never by any way thus, but opposite, can modifications and changes, and this is obvious for those skilled in the art in context in claims below.
Thereby, the most for example understand the present invention although be used for forming the module (or even each module in surface) of handling or fusing atmosphere by location in the path of substrate hereinbefore, but might imagine the existence of series connection and/or several modules in parallel certainly, the feasible effect that might obtain requiring, but also might imagine such fact (situation that depends on each user scene): pass through by carrying out continuously, pass through module, relatively a module (no matter for handling still for fusion) is only placed on one of substrate or each surface, so that obtain wishing effect.
Claims (17)
1. be used for the process of electronic component (22) to the reflow soldering of substrate (20), during it:
-use a certain amount of solder alloy,
-element (22) is placed on tie point place to substrate,
-use described solder alloy to carry out the practical operation of soldering element (22) by the heat treatment of substrate (20),
The combination that it is characterized in that following steps realizes:
-use described solder alloy according to one or more of following method:
I) some some places that solder alloy one or many pre-deposition is connected with element on substrate make the pre-deposition solder joint stand reflux operation then;
J) the point/end of solder alloy one or many pre-deposition on actual components, make the pre-deposition solder joint stand reflux operation then;
-before the step of deposition element, but the some place of some slaking binder depositions at bonding substrate (20), and the described adhesive of slaking then, thereby element is adhered on the substrate at the bounding point place;
-before brazing operation, carry out drying fusion operation, wherein by fusing this substrate near this substrate is contacted with fusion atmosphere, described fusion atmosphere comprises and activates or unstable earnest class and the thing class that do not electrify basically.
2. process according to claim 1 is characterized in that, obtains fusing atmosphere by making initial fusion gas through overdischarge.
3. process according to claim 2 is characterized in that, initially fuses gas and comprises the reducing gas mixture that comprises hydrogen.
4. according to claim 2 and 3 each described processes, it is characterized in that, obtain fusing atmosphere, in this device, changed initial fusion gas at the gas outlet of the device that is used for forming activation or unstable earnest class.
5. according to the described process of one of above claim, it is characterized in that, before or after deposit binder, fuse the described operation of substrate (20).
6. according to the described process of one of claim 1 to 4, it is characterized in that the described operation of after being deposited on the substrate, having fused substrate (20) to element.
7. according to the described process of one of above claim, it is characterized in that, this process continues with the heat treatment of described substrate, so that use described solder alloy, contact, under approaching atmospheric pressure, carry out the described soldering of element by making substrate and processing atmosphere, described processing atmosphere comprises activation or the unstable chemical species and the thing class that do not electrify basically, this atmosphere obtains through overdischarge by making initial treatment gas, and the heat treatment of substrate obtains by means of the chemical species that so heats under discharge process.
8. process according to claim 7 is characterized in that, initial treatment gas comprises the reducing gas mixture that comprises hydrogen.
9. according to claim 7 or 8 described processes, it is characterized in that, obtain handling atmosphere, in this device, changed initial treatment gas at the gas outlet of the device that is used for forming activation or unstable earnest class.
10. process according to claim 4, it is characterized in that, the step of on two big surfaces of substrate (20), carrying out placing element and soldering, formation activates or two devices of unstable chemical species (32) carry out described fusion operation by means of being used for, and each installs one of substrate surface vis-a-vis.
11. process according to claim 9, it is characterized in that, the step of on two big surfaces of substrate (20), carrying out placing element and soldering, carry out described processing by means of two devices (32) that are used for forming activation or unstable chemical species and operate, each installs one of substrate surface vis-a-vis.
12. according to each described process of claim 1 to 11, it is characterized in that, this it further be included in after the soldering by making the step of substrate through the cooling atmosphere cooling substrate that comprises inert gas.
13., it is characterized in that pre-deposition is in the deposition operation on its surface that stands before the element to flatten according to the described process of one of above claim.
Support (20) 14. be used to use solder alloy that electronic component (22) reflow soldering is arrived, be used to realize equipment according to each described process of claim 1 to 13, it is characterized in that, it comprises a part (10) that is used for carrying substrate (20), these substrates (20) carry at least one of its surface [sic] wants the element (22) of soldering at the some place that connects substrate, this conveying member (10) transmits substrate (20) by allowing first device (24) in the adhesive spots slaking of the some place of bonding substrate (20) existence, and by comprising second device of at least one device (28) that is used for forming the fusion atmosphere that comprises activation or the unstable chemical species and the thing class that do not electrify basically, this fusion atmosphere can used near under the atmospheric pressure, so that make substrate stand dry fusion.
15. equipment according to claim 14 is characterized in that, second device is positioned at the upstream of first device.
16. equipment according to claim 14 is characterized in that, second device is positioned at the downstream of first device.
17. according to the described equipment of one of claim 14 to 16, it is characterized in that, it comprises at least one device (28) that is used for forming the processing atmosphere that comprises activation or the unstable chemical species and the thing class that do not electrify basically along conveying member in the downstream of first and second devices, the temperature of this processing atmosphere makes it can be used to carrying out the heat treatment of substrate near under the atmospheric pressure, so that carry out the actual soldering of element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR98/09774 | 1998-07-30 | ||
| FR9809774A FR2781974B1 (en) | 1998-07-30 | 1998-07-30 | METHOD OF BRAZING BY REFUSION OF ELECTRONIC COMPONENTS USING SOLDER ALLOY PRE-DEPOSITS AND BRAZING DEVICE FOR CARRYING OUT SUCH A METHOD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1308838A true CN1308838A (en) | 2001-08-15 |
Family
ID=9529207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99808478A Pending CN1308838A (en) | 1998-07-30 | 1999-07-08 | Method for brazing by solder reflow etectronic components using pre-dre-deposits of solder alloy and brazing device therefor |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP1101393A1 (en) |
| JP (1) | JP2002521851A (en) |
| KR (1) | KR20010070971A (en) |
| CN (1) | CN1308838A (en) |
| AU (1) | AU4625499A (en) |
| BR (1) | BR9912555A (en) |
| CA (1) | CA2338181A1 (en) |
| FR (1) | FR2781974B1 (en) |
| HU (1) | HUP0104913A2 (en) |
| TW (1) | TW434073B (en) |
| WO (1) | WO2000007418A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104002005A (en) * | 2014-06-16 | 2014-08-27 | 贵州永红航空机械有限责任公司 | Vacuum brazing and heat treatment integrated process of aluminium alloy gas circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6468833B2 (en) | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954292A (en) * | 1982-09-21 | 1984-03-29 | 松下電器産業株式会社 | Method of producing printed circuit board and heater |
| DE4126913A1 (en) * | 1991-08-14 | 1993-02-18 | Siemens Ag | METHOD FOR SOLDERING AND ASSEMBLING PCBS WITH COMPONENTS |
| US5345056A (en) * | 1991-12-12 | 1994-09-06 | Motorola, Inc. | Plasma based soldering by indirect heating |
| US5735451A (en) * | 1993-04-05 | 1998-04-07 | Seiko Epson Corporation | Method and apparatus for bonding using brazing material |
| FR2713528B1 (en) * | 1993-12-15 | 1996-01-12 | Air Liquide | Method and device for dry fluxing of metal surfaces before brazing or tinning. |
| FR2735054B1 (en) * | 1995-06-09 | 1997-07-25 | Air Liquide | PROCESS FOR FLUXING BY DRY WAY OF METAL SURFACES BEFORE BRAZING OR TINNING USING AN ATMOSPHERE CONTAINING WATER VAPOR |
-
1998
- 1998-07-30 FR FR9809774A patent/FR2781974B1/en not_active Expired - Fee Related
-
1999
- 1999-07-08 WO PCT/FR1999/001658 patent/WO2000007418A1/en not_active Application Discontinuation
- 1999-07-08 CN CN99808478A patent/CN1308838A/en active Pending
- 1999-07-08 KR KR1020017000667A patent/KR20010070971A/en not_active Application Discontinuation
- 1999-07-08 JP JP2000563113A patent/JP2002521851A/en active Pending
- 1999-07-08 EP EP99929438A patent/EP1101393A1/en not_active Withdrawn
- 1999-07-08 AU AU46254/99A patent/AU4625499A/en not_active Abandoned
- 1999-07-08 HU HU0104913A patent/HUP0104913A2/en unknown
- 1999-07-08 CA CA002338181A patent/CA2338181A1/en not_active Abandoned
- 1999-07-08 BR BR9912555-2A patent/BR9912555A/en not_active Application Discontinuation
- 1999-07-13 TW TW088111843A patent/TW434073B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104002005A (en) * | 2014-06-16 | 2014-08-27 | 贵州永红航空机械有限责任公司 | Vacuum brazing and heat treatment integrated process of aluminium alloy gas circuit board |
| CN104002005B (en) * | 2014-06-16 | 2018-12-14 | 贵州永红航空机械有限责任公司 | The vacuum brazing of aluminium alloy gas path plate and heat treatment integral process |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1101393A1 (en) | 2001-05-23 |
| BR9912555A (en) | 2001-05-02 |
| FR2781974A1 (en) | 2000-02-04 |
| WO2000007418A1 (en) | 2000-02-10 |
| JP2002521851A (en) | 2002-07-16 |
| FR2781974B1 (en) | 2000-08-25 |
| CA2338181A1 (en) | 2000-02-10 |
| HUP0104913A2 (en) | 2002-05-29 |
| TW434073B (en) | 2001-05-16 |
| AU4625499A (en) | 2000-02-21 |
| KR20010070971A (en) | 2001-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1083155C (en) | Method of bulging substrate by holding soldering paste stacking | |
| KR100321352B1 (en) | Method and apparatus for applying dry flux to metal surfaces before soldering or tin plating | |
| CN101176200B (en) | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | |
| CN1065798C (en) | Flux composition and corresponding soldering method | |
| CN1231952A (en) | Method and apparatus for reflow metallic surfaces | |
| CN1143892A (en) | Method and device for wave soldering incorporating dry fluxing operation | |
| CN1501490A (en) | Circuit device and manufacturing method thereof | |
| US7884470B2 (en) | Semiconductor packages with stiffening support for power delivery | |
| EP0541282B1 (en) | Method of soldering including removal of flux residue | |
| CN1451504A (en) | Return soldering method | |
| US20100038411A1 (en) | Method of producing conductive circuit board | |
| CN1268183C (en) | Electronic component and manufacture method thereof | |
| KR101739787B1 (en) | Die attachment apparatus and method utilizing activated forming gas | |
| CN1307508A (en) | Method for brazing by solder reflow electronic components and brazing device therefor | |
| TW202025873A (en) | Electronic component and method for manufacturing electronic component | |
| CN1308838A (en) | Method for brazing by solder reflow etectronic components using pre-dre-deposits of solder alloy and brazing device therefor | |
| CN108807322A (en) | Encapsulating structure and its manufacturing method | |
| CN1604269A (en) | Device and method for manufacturing semiconductor device and semiconductor device | |
| CN107819066A (en) | A kind of production method of hypoxemia copper sintering DBC semiconductor heat electric substrates | |
| EP1436835A2 (en) | Electrically conductive thermal interface | |
| JP2003181631A (en) | Method using lead-free solder, device and mounting structure for flow soldering | |
| KR20170063544A (en) | SUBSTRATE FOR POWER MODULE WITH Ag UNDERLAYER AND POWER MODULE | |
| CN1115563A (en) | Core elements assembly and method for production and assembling same | |
| KR100676353B1 (en) | Method for manufacturing hybrid integrated circuit device | |
| CN1066373C (en) | Method for dry fluxing of metallic surface, before soldering or tinning, using atmosphere which includes water vapour |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |