CN1297948C - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
CN1297948C
CN1297948C CNB038033518A CN03803351A CN1297948C CN 1297948 C CN1297948 C CN 1297948C CN B038033518 A CNB038033518 A CN B038033518A CN 03803351 A CN03803351 A CN 03803351A CN 1297948 C CN1297948 C CN 1297948C
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mentioned
tft
thin film
film transistor
light
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CN1628333A (zh
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森田聪
田中慎一郎
小林修
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Sanyo Electric Co Ltd
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Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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    • G02F1/136213Storage capacitors associated with the pixel electrode
    • GPHYSICS
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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    • G02F1/13624Active matrix addressed cells having more than one switching element per pixel
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    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
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Abstract

本发明的显示装置是将多个发光元件配置成矩阵状。使扫描信号流过栅极信号线,使数据信号流过源极信号线,将数据信号供给在从平面看两信号线交叉部分配置的控制用TFT的源极,将扫描信号供给栅极。这样,当控制用TFT接通时,使栅极连接在控制用TFT的漏极的驱动用TFT接通,从电力供给线通过驱动用TFT的源极和漏极,向有机EL元件供给电流而使有机EL发光。在控制用TFT和驱动用TFT之间存在有保持电容,即使扫描信号为低电位且控制用TFT断开,驱动用TFT的栅极电位也由保持电容保持规定的时间,使有机EL元件继续发光。

Description

显示装置
技术领域
本发明涉及一种将发光元件配置成矩阵状的显示装置。
背景技术
近年来,作为平板型显示器从便携电话到大型电视广泛地使用LCD(液晶显示器)。可是LCD由于不是自发光型,所以视场角狭窄,由于需要背光等光源,所以在低消耗电力化方面也有界限。因此,作为代替LCD的显示装置,研究着例如使用有机场致发光(以下称为有机EL)的自发光型显示装置。
该显示装置是将具有有机EL元件的像素配置成矩阵状,驱动各有机EL元件,使其发光而进行图像显示。在作为该驱动方式使用有源矩阵方式时,由于在各像素上设置薄膜晶体管(以下称为TFT)并能独立驱动各像素,所以能得到高清晰且高亮度的显示,进而能得到高效率的发光特性,可实现低消费电力化。该显示装置对每个像素设置由一对电极夹着发光层的有机EL元件、向有机EL元件的一个电极供给电流的驱动用TFT、控制该驱动用TFT动作的控制用TFT。通常,该驱动用TFT和控制用TFT使用活性层多晶化的多晶硅型TFT。
但是,驱动用TFT和控制用TFT是多晶硅型TFT的情况下,制造工序复杂且困难,需要有高的制造技术和高价的制造设备。因而,那些成品的显示装置也是高价的。并且,由于活性层难以均匀的多晶化,所以大面积制造特性均匀的TFT是困难的,成为大型化的障碍。
发明的公开
本发明是鉴于这些问题而研制的,其目的是提供一种能够容易制造TFT、也适于大型化的自发光型的显示装置。
为了达成上述目的,本发明的显示装置,将多个像素配置成矩阵状,其中,具有:纵向长状的发光元件,设置在各像素内;驱动用TFT,设置在每个像素内,并向上述发光元件供给电流而使其发光;控制用TFT,控制上述驱动用TFT的动作,上述驱动用TFT形成为横向长状,以其长度方向与上述发光元件的长度方向正交的方式相邻于上述发光元件的短边而配置,并且上述驱动用TFT和控制用TFT的半导体层由非晶硅形成。
本发明在上述构成的显示装置中,使发光元件形成为纵向长状,使上述驱动用TFT形成为横向长状,将连接于上述控制用TFT的栅极信号线和源极信号线配置成矩阵状,将上述发光元件配置成其长度方向与上述源极信号线平行,将上述驱动用TFT配置成其长度方向与上述栅极信号线平行。
本发明在上述构成的显示装置中,上述驱动用TFT是这样配置的:使通道区域形成为细长状,该通道区域的长度方向与上述栅极信号线平行。
本发明在上述构成的显示装置中,上述驱动用TFT是将源极和漏极中的一个电极形成为直线状,将另一个电极形成为包围住一个电极的形状。
本发明在上述构成的显示装置中,上述驱动用TFT具有U字形的源极、和配置在上述U字形的两叉之间的漏极。
本发明在上述构成的显示装置,在每行中具有与在矩阵行方向的各像素内设置的上述控制用TFT的栅极共用地连接着的栅极信号线、和平行于该栅极信号线而被配置且通过上述驱动用TFT向上述发光元件供给电流的电力供给线,在每列中具有与在列方向的各像素内设置的上述控制用TFT的源极共用地连接着的、并与上述栅极信号线交叉的源极信号线,在由上述栅极信号线和上述源极信号线包围的区域内,从平面看,沿着源极信号线按发光元件、驱动用TFT、电力供给线、控制用TFT的顺序进行配置。
本发明在上述构成的显示装置中,在上述驱动用TFT和上述控制用TFT之间设置有长度方向平行于上述栅极信号线的保持电容,上述保持电容的一个电极兼用作电力供给线,另一个电极由与上述控制用TFT的漏极连接的辅助电极形成,上述辅助电极电连接于上述驱动用TFT的栅极。
本发明在上述构成的显示装置中,具有发出不同颜色的发光元件,设置与每个发光颜色对应的多条电力供给线,将该多条电力供给线配置在驱动用TFT和控制用TFT之间,向发光元件供给来自对应的电力供给线的电流。
本发明在上述构成的显示装置中,作为上述控制用TFT的栅极使用栅极信号线,上述控制用TFT形成在栅极信号线上。
本发明在上述构成的显示装置中,在上述发光元件的周围配置有触排层,上述触排层以也重叠在上述驱动用TFT上的形式形成,在上述发光元件和上述驱动用TFT之间的上述触排层上形成有切口部,至少在切口部附近的上述触排层上层叠有遮光性的膜。
本发明在上述构成的显示装置中,在上述发光元件的周围配置有触排层,上述触排层以也重叠在上述控制用TFT上的形式形成,在上述发光元件和设置于相邻的像素上的上述控制用TFT之间的上述触排层上形成有切口部,至少在切口部附近的上述触排层上层叠有遮光性的膜。
本发明在上述构造的显示装置中,以覆盖上述驱动用TFT和上述控制用TFT的形式形成触排层,上述触排层的端缘位于驱动用TFT以及控制用TFT、和上述发光元件之间,在上述触排层上层叠有遮光性的膜。
本发明在上述构成的显示装置中,具有:像素电极,配置在上述发光元件的发光层的下方,并与上述驱动用TFT连接;相对电极,隔着上述发光层而与上述像素电极相对配置,并覆盖上述触排层,上述遮光性的膜由上述相对电极形成。
本发明在上述构成的显示装置中,上述驱动用TFT和上述控制用TFT由n通道型形成。
本发明在上述构成的显示装置中,上述驱动用TFT和上述控制用TFT由p通道型形成。
本发明在上述构成的显示装置中,上述发光元件为有机EL。
附图的简单说明
图1是作为本发明实施例的显示装置的像素部分的电路图。
图2是本发明显示装置的像素和周边的平面图。
图3是像素内设置的发光元件的剖视概略图。
图4是RGB的3像素中的一个像素的平面图。
图5是控制用TFT周边的剖视概略图。
图6是电力供给线和保持电容周边的剖视概略图。
图7是驱动用TFT周边的剖视概略图。
图8A和图8B是表示不遮光时和遮光时向TFT入射光的视图。
实施发明的最佳方式
参照附图说明本发明的实施例。图1模式地表示出本发明像素部分的电路图。图2是显示装置的像素周边的平面图。图3是在像素内设置的发光元件的剖视概略图(图2的D-D剖面)。该实施例中发光元件使用了有机EL元件1。另外,图3所示的相对电极33为了容易理解图面,在图2中省略。
如图1所示,有机EL元件1通过电流从像素电极14流向相对电极33而发光,通过控制该电流值能调整亮度。为了使某个特定的像素的有机EL元件1发光,通过使扫描信号流过栅极信号线2、数据信号流过源极信号线3,从而向在从平面看两信号线交叉的部分配置的作为第2晶体管的控制用TFT6的源极11供给数据信号,向栅极13供给扫描信号。这样,当控制用TFT6接通时,将栅极10连接到控制用TFT6的漏极12的作为第1晶体管的驱动用TFT5接通,从电力供给线4通过驱动用TFT5的源极8和漏极9将电流供给有机EL元件,使有机EL元件发光。在控制用TFT6和驱动用TFT5之间存在有保持电容34,保持电容34的一个电极由电力供给线4形成,另一个电极由和漏极12同时形成的辅助电极形成。而且,即使扫描信号变成低电位而控制用TFT6断开,驱动用TFT5的栅极电位也由保持电容34保持规定的时间,有机EL元件1的发光继续。
接着,参照图2、图3说明本发明显示装置的构造。在显示区域,将栅极信号线2和源极信号线3配线成矩阵状,在由栅极信号线2和源极信号线3包围的部分形成像素。在各像素内设置在发光层16使用了有机EL的有机EL元件1,分别形成将来自电力供给线4的电流供给该有机EL元件1的驱动用TFT5、和控制驱动用TFT5的接通/断开的控制用TFT6。而且,当从电力供给线4向有机EL元件1供给电流时,发光层16以各种颜色进行发光,通过控制电流值能调整亮度。
在玻璃基板30上使多个栅极信号线2平行配线,沿栅极信号线2配线3条电力供给线4。栅极信号线2和电力供给线4都在同一工序中同时形成,由Al或Cr形成。3条电力供给线4分别对应于像素的R、G、B而设置,R用电力供给线4R与具有红色的发光层16(R)的有机EL元件1连接,G用电力供给线4G与具有绿色的发光层16(G)的有机EL元件1连接,B用电力供给线4与具有兰色的发光层16(B)的有机EL元件1连接。有机EL元件1由于发光材料而发出的颜色不同,与此同时其发光效率也不同,所以针对每个颜色设置电力供给线4,通过供给适宜于各种颜色的电流,可进行最适当的全色显示。
在形成栅极信号线2和电力供给线4时,在电力供给线4和有机EL元件1之间同时形成驱动用TFT5的栅极10。该栅极10沿电力供给线4形成为横向长状,其一方的短边是直线状,另一方的短边是圆弧状。驱动用TFT5为了实现将电流供给有机EL元件的功能,在接通时必须流过尽可能大的电流,因此驱动用TFT5的栅极10尽可能大地形成。
在玻璃基板30上层叠由SINX(硅氮化膜)构成的栅极绝缘膜31,由该栅极绝缘膜31覆盖栅极信号线2和电力供给线4。在栅极绝缘膜31上层叠有非晶硅层(以下称为a-Si层),用光刻法仅残留对应于TFT5、6的半导体层(活性层)7、13的部分。这时驱动用TFT5的a-Si层7形成为沿着栅极10的外缘的形状,层叠在栅极10的大部分上,一部分从栅极10的短边部和圆弧部突出。并且,控制用TFT6的a-Si层13形成跨越栅极信号线2的四角形状。
在a-Si层7、13和栅极绝缘膜31上形成层叠了Al和Mo的金属层,用光刻法使该金属层形成图形,形成源极信号线3和TFT5、6的源·漏极等。这时源极信号线3和栅极信号线2正交地设置,从源极信号线3在和栅极信号线2的交差部附近突出延伸到控制用TFT6的a-Si层13上的源极11。控制用TFT6的漏极12通过辅助电极134和后述的透明电极21与驱动用TFT5的栅极10连接,在控制用TFT6接通时将流过源极信号线3的电流提供给驱动用TFT5的栅极10。与控制用TFT6的漏极12连接的辅助电极134将栅极绝缘膜31夹在中间而覆盖电力供给线4,由电力供给线4和辅助电极134形成保持电容34。特别是在a-Si型TFT的情况下,与多晶硅型TFT相比栅极绝缘膜31厚,所以保持电容34的电容变小。因此为了补充其电容不足,最好是尽量使由辅助电极134覆盖电力供给线4的部分宽广,用辅助电极134覆盖像素内的电力供给线4的大部分。
在驱动用TFT5内形成着大致U字形的源极8、和位于该源极8的两叉间的大致直线状的漏极9。在该源极8上形成从不与漏极9相对的外缘部分突出并延伸到电力供给线4附近的电极8a,通过后述的透明电极19与对应于各像素颜色的电力供给线4连接。并且,在漏极9形成有在从a-Si层7突出的部分向有机EL元件1侧弯曲并延伸到有机EL元件1的像素电极14的电极9a,并与像素电极14电连接。
驱动用TFT5的源极8的外缘形成为沿着栅极10的外缘的形状,U字形的两叉部分在栅极10上尽可能长,漏极9也对应于源极8的两叉部分的形状细长地形成。在驱动用TFT5由于必须向像素电极14供给电力供给线4的电流,所以在接通状态时必须尽可能地使电流流动。a-Si型TFT与多晶硅型相比,电流流动更难,所以在驱动用TFT5使用a-Si型TFT时,必须使该驱动用TFT5尽可能大。即,为了使电流容易流动,可以使通道长度较短,使通道宽度较大,但使通道长度较小在制造技术方面有界限,所以有效的方法是使驱动用TFT5尽可能的大而使通道宽度大。因此,在该实施例中对源·漏极8、9的形状想办法,通过驱动用TFT5尽可能地使电流流动。即,通过使驱动用TFT5的栅极10横向较长,源极8和漏极9为细长,在限定的空间内能使通道宽度较大。尤其是通过配置横向较长的栅极10,使其纵向和栅极信号线2平行,能遍及相邻的源极信号线3之间而形成驱动用TFT5,再通过使其通道宽度方向与栅极信号线2平行,能在驱动用TFT5的有限大小内有效地增大通道宽度。进而通过使源极8成为U字形,并在U字形的两叉之间配置漏极9,由于源极8位于漏极9的两侧,通道宽度成为2倍,所以能在小的空间内有效地使通道宽度变大。
由于控制用TFT6仅控制驱动用TFT的接通/断开即可,和驱动用TFT5不同,流动的电流较少即可,仅此就能使其尺寸较小。若使控制用TFT6较小,则能因此而确保配置驱动用TFT5的空间,能使驱动用TFT5变大。因此,从平面看在栅极信号线2和源极信号线3交叉的附近,使源极信号线3的配线分支,将该分支的前端部分作为控制用TFT6的源极11使用。而且,如后所述,通过将源极信号线3和该分支部分、即源极11从立体看配线在栅极信号线2的上方,又通过控制用TFT6的漏极12也同时形成在与源极11在构造上相同的阶层中,从而产生能将栅极信号线2兼用作控制用TFT6的栅极13的优点。
在控制用TFT6,源极11和漏极12在a-Si层13上,仅相互的一边相对,但是在驱动用TFT5,由于以包围漏极9的形式配置源极8,因此其通道宽度变大,另外,在该实施例中,由于与驱动用TFT5的源极8相对的漏极9的长度是控制用TFT6的通道宽度的3倍以上,所以驱动用TFT5的通道宽度则是控制用TFT6的通道宽度的6倍以上。如此若确保使驱动用TFT5的通道宽度增大,则即使在驱动用TFT使用a-Si型TFT的情况下也能实现最适宜的显示。还有,在该实施例中,由于使驱动用TFT5尽可能的大,所以驱动用TFT5的通道宽度是控制用TFT6的通道宽度的6倍,但若使驱动用TFT5的通道宽度是控制用TFT6的通道宽度的4倍以上,就能得到高等级的显示。在该实施例中,将控制用TFT6和驱动用TFT5的通道长度设定成大致相同,但若使驱动用TFT5的通道长度比控制用TFT6的通道长度小,则因此而电流容易流动。
形成由SiNX构成的绝缘膜32,使其覆盖源极信号线3和TFT5、6,在绝缘膜32上层叠由ITO(氧化铟锡)或IZO(氧化铜锌)构成的透明电极。用光刻法使该透明电极形成图形,从而形成像素电极14。该像素电极14位于各像素内并成大致椭圆状,并沿着源极信号线3配置,其一部分突出,与驱动用TFT5的漏极9a的一部分重叠。在该像素电极14和漏极9a重叠的部分,在漏极9a上的绝缘膜32上形成接触孔23,像素电极14通过接触孔23与漏极9a电连接。
在形成像素电极14时,透明电极也残留在电力供给线4和驱动用TFT5的源极8a之间,使电力供给线4和源极8a电连接。即,在对应于像素的电力供给线4的上面,在栅极绝缘膜31和绝缘膜32上形成接触孔18a,使得电力供给线4的一部分露出,在驱动用TFT5的源极8a的上面,在绝缘膜32上形成接触孔18b,使得源极8a的一部分露出,透明电极19与在两接触孔18a、18b露出的电力供给线4、源极8a接触。
并且,透明电极也残留在辅助电极134和驱动用TFT5的源极10之间,透明电极21与在两接触孔20a、20b露出的辅助电极134、栅极10接触,电连接两电极10、134。
接着,在图4表示图2所示的RGB的3像素中1像素的平面图,并说明各要部的层的剖面。图5是控制用TFT6周边的概略剖视图(图4的A-A剖面)。最初,作为显示装置,在共用的玻璃基板30上形成栅极信号线2。在其上形成由SiNx构成的栅极绝缘膜31,所以也由栅极绝缘膜31同时覆盖栅极信号线2。在栅极绝缘膜31上,a-Si层13以跨越栅极信号线2的形式层叠在其上方。在a-Si层13的上面通过含有N型杂质的N型a-Si薄膜13a,形成层叠了Al和Mo的金属层,通过光刻法使该金属层形成图形,形成源极信号线3、从源极信号线3分支的源极11、漏极12。在其上分别层叠由SiNx构成的绝缘膜32、由SiO2(氧化硅)构成的保护膜15、触排(バンク)层17、相对电极33。
如上述那样,3条电力供给线4分别与像素的R、G、B对应而设置,但即使这样布线3条电力供给线4,将电力供给4相对于栅信号线2行布线,使得能分给有机EL元件1的面积也不减少,同时为了形成保持电容34而不追加新的保持电容线和平面区域,利用电力供给线4在其上部立体设置保持电容34。通常为了形成保持电容34,如栅极信号线2和源极信号线3那样,以贯通各像素的形式来布线保持电容线,但本实施例没有那种必要。
参照图6的电力供给线和保持电容周边的概略剖视图(图4的B-B剖面),说明该电力供给线4和保持电容34的具体构造图。首先,作为显示装置,在共用的玻璃基板30上的和图5所示的栅极信号线2相同的层上分别形成B用电力供给线4B、G用电力供给线4G、R用电力供给线4R,同时实现保持电容34的一个电极的功能。在其上由于形成由SiNx构成的栅极绝缘膜31,所以由栅极绝缘膜31同时覆盖3条电力供给线4。而且,在栅极绝缘膜31上的与图5所示的源极11和漏极12的电极相同的层上形成层叠了Al和Mo的金属层,用光刻法使该金属层形成图形,延长图5所示的漏极12而形成保持电容34的另一个辅助电极134。这样形成的电力供给线4和保持电容34具体地构成各色像素需要的保持电容34a、34b、34c(图1)。
保持电容34使其辅助电极134与驱动用TFT5的栅极10(图2)连接。即,在保持电容34的辅助电极134上的绝缘膜32上形成接触孔20a,使得辅助电极134的一部分露出,进而如图2所示,在栅极绝缘膜31和绝缘膜32的一部分上也形成接触孔20b,使得驱动用TFT5的栅极10的一部分露出。并且,以跨越两接触孔20a、20b的形式形成由ITO或IZO构成的透明电极21,从接触孔20a露出的辅助电极134和从接触孔20b而露出的栅极10通过透明电极21电连接。在其上面层上分别层叠保护膜15、触排层17、相对电极33。
接着,在图7的驱动用TFT周边的概略剖视图(图4的C-C剖面)示出驱动用TFT5的构造。首先,作为显示装置在共用的玻璃基板30上形成栅极10。在其上形成由SiNx构成的栅极绝缘膜31,所以由栅极绝缘膜31同时覆盖栅极10。进一步在栅极绝缘膜31上层叠由a-Si层7构成的半导体层。在该a-Si层7上,通过含有N型杂质的N型a-Si薄膜7a,形成层叠了Al和Mo的金属层,用光刻法使该金属层形成图形,分别形成由U字形的源极8和漏极9构成的电极。进而,在其上形成由SiNx构成的绝缘膜32。
通过上述这样形成的各元件和布线,驱动有机EL元件1并发光,参照图3说明其构造。15是由SiO2构成的保护膜,在绝缘膜32上形成,重叠在有机EL元件1的像素电极14的周边部分。即,保护膜15覆盖像素电极14的周边部分,但包含像素电极14中央部分的大部分被除掉。17是在保护膜15上形成的由酚醛清漆树脂构成的触排层,形成得比保护膜15和绝缘膜32厚。在用该触排层17包围的区域内涂敷作为发光材料的有机EL,从而沿像素电极14的外缘以包围像素电极14的形式形成触排层。若仅存积发光材料,则触排层17设置在像素电极14的周围即可,但在该实施例中也设置在两TFT5、6和电力供给线4上。触排层17只要是绝缘体即可,也可以用酚醛清漆树脂以外的有机树脂或者无机树脂形成。
在像素电极14上用喷墨方式涂敷与各像素的颜色对应的发光材料,并积存在由触排层17包围的区域内。该发光材料使用有机EL,例如使用共轭高分子前驱体。然后,用加热处理使发光材料高分子化,对每个像素形成R、G、B的发光层16。
33是由Al和Cr构成的相对电极,层叠在发光层16上。相对电极33形成在整个显示区域,供给规定的电压。若用金属层构成该相对电极33,可由发光层16产生发光,所以也可以用Al和Cr以外的金属形成相对电极33,但若如该实施例那样用Al和Cr那样的光反射率高的金属层构成相对电极33,则可有效地将来自发光层16的光利用于显示,可实现更高亮度的显示。向像素电极14供给阈值以上的电流时,发光层16发光,能从玻璃基板30侧观察该光。
例如,当向R、G用的电力供给线4供给+8V(Vdd(R)、Vdd(G))、向B用的电力供给线4供给+10V(Vdd(B))、向相对电极33供给-3V时,当向栅极信号线2输出扫描信号、向源极信号线3供给数据信号时,扫描的控制用TFT6接通,这时流过源极信号线3的数据信号通过控制用TFT6的漏极12供给到驱动用TFT5的栅极10,驱动用TFT5接通。然后,即使控制用TFT6断开,由于由保持电容34维持驱动用TFT5的接通状态,所以流过对应的电力供给线4的电流通过驱动用TFT5供给到像素电极14。而且,在像素电极14和相对电极33之间产生规定以上的电位差,电流在发光层16中流动,发出对应于发光材料的颜色的光。另外,在有机EL,兰色发光材料的发光效率比其他颜色的发光材料的发光效率差,所以要向兰色的像素的像素电极14提供比其他像素的像素电极14高的电压。
在本发明中,使发光层16为纵向长状并与源极信号线3平行配置,使驱动用TFT5为横向长状并配置成与栅极信号线2平行。即,配置驱动用TFT5,使得驱动用TFT5的纵向与发光层16的纵向正交。根据这种配置,在用源极信号线3和栅极信号线2包围的有限区域内,能在配置大的发光层16的同时使驱动用TFT5尽可能的大。尤其能将驱动用TFT5设置到源极信号线3的附近,能遍及相邻的源极信号线3之间的区域配置驱动用TFT5,所以能使驱动用TFT5较大。因此,即使使驱动用TFT5为a-Si型TFT,也能向发光层16提供充分的电流,能得到最佳的显示。
这里,使横向长状的驱动用TFT5与纵向长状的发光层16正交地配置,是为了用驱动用TFT5使充分的电流流动,即,通道宽度变大。因而,在驱动用TFT5形成细长的通道,若该通道宽度的方向(通道的纵向)与发光层16的纵向正交,则在有限的区域内能有效地增大通道的宽度。
在本发明中,在由栅极信号线2和源极信号线3包围的区域内,沿着源极信号线3以发光层16、驱动用TFT5、3条电力供给线4、控制用TFT6的顺序排列。按照该配置,可将各元件配置整齐,能缩小发光元件以外的元件的配置面积,同时能使从电力供给线到发光元件的电流线路长度变短。另外,在驱动用TFT5和控制用TFT6之间配置电力供给线4,由于该电力供给线4兼用作驱动用TFT5的保持电容34,所以能有效使用像素内的空间,能设置与各发光层16对应的多条电力供给线4。
层叠这样的各种层而形成的像素有多个如图5~图7所示的栅极绝缘膜31、绝缘膜32、透明电极21、保护膜15、触排层17或图3所示的像素电极14等的接近透明的层。又,从前述的说明可知,由于尽量使配置有关控制的元件和布线的区域小并尽量使发光区域大,所以控制用TFT6配置在相邻像素的发光层16附近,并且驱动用TFT5配置在像素内的发光层16附近,特别是驱动用TFT5有大的通道宽度,相对于发光层16平行配置。由此,来自发光层16的光就容易入射到这些TFT的半导体层,但在入射时在TFT产生光泄漏,规定的电流不能供给发光元件。因此,实际的显示状态和对应于要再现的显示信号的显示状态不同,显示等级低下。
参照图8A、图8B,说明来自发光层16的光的遮光。图8A是表示不遮光时对TFT入射光的视图,图8B是表示遮光时的光路的视图。为说明方便,仅图示主要层,其他层省略。在图8A中,从覆盖相对电极33的发光层16发出的光透过触排层17入射到驱动用TFT5的未图示的半导体活性层中。这时来自发光层16的光包括直接入射到半导体活性层的侧面的光和由相对电极33反射后从半导体活性层上面入射的光。同时也入射到控制用TFT6的未图示的半导体活性层。特别是a-Si也可用作半导体而容易受到光的影响,由光照射产生大的漏电流。
因此,如图8B所示,在发光层16和驱动用TFT5之间的触排层17设置切口部35。又,在发光层16和驱动用TFT6之间的触排层也设置同样的切口部36。然后,从上面覆盖相对电极33而形成。相对电极33如上述那样是Al或Cr等这样的反射光的金属层,通过覆盖切口部35和36而形成的相对电极33的内面,使光不入射到TFT而被反射。
这时,通过切口部35、36的相对电极33的内面形状,将光反射到图的下侧、即未图示的玻璃基板方向时,提高了从玻璃基板侧观看显示时的所见的亮度。切口部35、36的形状,为使发光层侧的轮廓沿着发光层16的轮廓的形状,更能将来自发光层16的光高效率地用于显示,将TFT侧的轮廓尽量位于TFT附近,则更能可靠地防止光向TFT的入射。
如图2所示,在像素的宽度方向上直线地设置位于发光层16和驱动用TFT5之间的切口部35,但位于发光层16和控制用TFT6之间的切口部36为几乎沿着发光层16宽度方向的外缘那样的形状。即,驱动用TFT5由于是a-Si型TFT,遍及像素的宽度方向较大地形成,使得能向像素电极14供给充分的电流,为了防止向该驱动用TFT5入射光,沿驱动用TFT5较长地形成切口部35。由于控制用TFT6形成在栅极信号线2和源极信号线3的交叉部,所以切口部36至少形成在两信号线2、3的交叉部附近。而且,在两信号线2、3交叉部之间也形成切口部36,能可靠防止向控制用TFT6照射光,同时能将发光层16的光引导到下方的显示区域。若这样,则能以覆盖光源的形式对来自发光层16的不要光进行遮光,同时使由切口部36反射的光与发光层16的原来的光路重叠,能够更进一步提高亮度。
来自发光层16的光的影响不停留在同一像素内,也有影响到相邻像素的驱动用TFT的可能性,而且,从切口部提高反射效率的观点来看,切口部35、36最好为与像素的短边接近的长度。
在覆盖两TFT5、6的触排层17上形成相对电极33。即,通过用遮光性的相对电极33覆盖两TFT5、6的上方,能防止来自两TFT5、6的上方的光入射。在用相对电极33那样的导电体覆盖TFT5、6的上方的情况下,触排层17也实现扩展TFT5、6和相对电极33的间隔的功能。为了在相对电极33附加通常一定的电压而将相对电极33配置在接近TFT5、6的部位时,对TFT5、6的动作造成不好的影响。因而,TFT5、6和相对电极33最好尽量隔开,通过使覆盖TFT5、6的触排层17的膜厚变厚而能确保其间隔。因而,即使在发光元件的周围不形成触排层17的情况下,通过在TFT5、6上设置触排层17,在该触排层17上层叠相对电极33,也能防止向TFT5、6入射光,在TFT5、6上设置触排层17是有效的。这时,由于设置触排层17,使得触排层17的端缘位于发光元件和TFT5、6之间,也能形成不设置切口部35、3 6的结构。
在该实施例中,用相对电极形成位于触排层的切口部和TFT的上方的遮光性的膜。因而,不需要形成相对电极以外的遮光性的膜,所以制造工序简单。然而,本发明并不限定于用相对电极形成该遮光性的膜,例如,也可以在覆盖TFT的触排层上形成黑色的树脂膜。
如以上那样,本发明的目的是用a-Si型TFT形成向有机EL元件供给电流的TFT,因此没有必要制造多晶硅型TFT,所以制造工序简单,能得到廉价的显示装置。而且,只要是在不脱离本发明的宗旨的范围内,也可以是上述实施例以外的形式。例如,在该实施例中,作为驱动用TFT5,使用了具有直线状的漏极9、包围漏极9那样的U字形的源极8的TFT,形成了在漏极9的两侧面具有细长状的通道区域的结构,但若是能向有机EL元件供给充分电流的结构,则不将驱动用TFT限定在该形式,例如,也可以是这样配置源、漏极的形式:分别具有横向长状的源极和漏极,其通道宽度方向与发光层16的纵向正交。并且,驱动用TFT5的源、漏极也可形成其他形状,也可以将源极形成为コ字形并将漏极形成为直线状,或者将漏极形成为U字形并将源极形成直线状。
在本发明中用n通道型的a-Si型TFT形成向有机EL元件供给电流的TFT,但也可以用p通道型的a-Si。即,由于用同一种类的通道形成TFT,制造工序简单,能得到廉价的显示装备。
产业上的可利用性
本发明是在将多个像素配置成矩阵状的显示装置中,具有在各像素内设置的纵向长状的发光元件、在每个像素中设置同时向上述发光元件供给电流而使其发光的驱动用TFT、控制驱动用TFT的动作的控制用TFT,驱动用TFT形成为横向长状,以使其纵向和发光元件的纵向正交的方式相邻于上述发光元件的短边而配置,使驱动用TFT和控制用TFT的半导体层是a-Si。因此,即使是使用a-Si型TFT的情况下,能够使驱动用TFT尽可能的大,能够向发光元件供给充分的电流。而且,不需要高的制造技术和高价的制造装置,由于能以大面积制造特性均匀的TFT,所以能提供低价格、也适宜大型化的自发光型的显示装置。
另外,通过沿着源极信号线按发光元件、驱动用TFT、电力供给线、控制用TFT的顺序进行配置,能够在像素内的有限空间内有效的配置各元件,能够将发光元件配置成较大的同时,使驱动用TFT较大,因此得到良好的显示状态的显示装置。
通过将驱动用TFT的通道区域形成为细长状,将源、漏极中的一方的电极形成为大致直线状,另一方的电极形成为包围一方的电极的形状,从而能增大驱动用TFT的通道宽度,即使用a-Si型TFT的情况下也能向发光元件供给充分的电流。
通过在驱动用TFT和控制用TFT之间设置有长度方向平行于上述栅极信号线的保持电容,保持电容的一方的电极兼用作电力供给线,另一方的电极由连接控制用TFT的漏极和驱动用TFT的栅极的辅助电极形成,从而不需要形成保持电容用的专用电容线,能将各元件配置得紧密,扩大可分配给发光元件的面积,在提高发光效率和亮度方面作出贡献。
通过设置对应于发光元件的各个发光颜色的多条电力供给线,在驱动用薄膜晶体管和控制用薄膜晶体管之间配置该多条电力供给线,向发光元件供给来自对应的电力供给线的电流,从而供给适宜于发光效率不同的各种颜色的发光元件的电流,由此可进行最适合的全色显示。
作为控制用TFT的栅极而使用栅极信号线,在栅极信号线上形成控制用TFT,从而即使不特别设置栅极也可以,由于不需要形成控制用TFT用的新的区域,由此能较大地确保配置驱动用TFT的空间。
形成配置在发光元件周围的触排层,使其也与驱动用TFT和控制用TFT重叠,进一步在发光元件、和驱动用TFT以及邻接的像素中设置的控制用TFT之间的触排层上形成切口部,至少在切口部附近的触排层上层叠遮光性的膜,由此能减少来自发光层的光入射到这些TFT的半导体层中引起的光泄漏,能提供显示等级高的显示装置。
并且,通过用n通道型或p通道型中的任一种的a-Si形成驱动用TFT和控制用TFT,从而能使制造工序简单化,也不需要复杂的制造设备,能在提高成品率的同时实现本的降低。

Claims (16)

1.一种显示装置,将多个像素配置成矩阵状,其特征在于,具有:纵向长状的发光元件,设置在各像素内;驱动用薄膜晶体管,设置在每个像素内,并向上述发光元件供给电流而使其发光;控制用薄膜晶体管,控制上述驱动用薄膜晶体管的动作,上述驱动用薄膜晶体管形成为横向长状,以其长度方向与上述发光元件的长度方向正交的方式相邻于上述发光元件的短边而配置,并且上述驱动用薄膜晶体管和控制用薄膜晶体管的半导体层由非晶硅形成。
2.如权利要求1所述的显示装置,其特征在于,使发光元件形成为纵向长状,使上述驱动用薄膜晶体管形成为横向长状,将连接于上述控制用薄膜晶体管的栅极信号线和源极信号线配置成矩阵状,将上述发光元件配置成其长度方向与上述源极信号线平行,将上述驱动用薄膜晶体管配置成其长度方向与上述栅极信号线平行。
3.如权利要求2所述的显示装置,其特征在于,上述驱动用薄膜晶体管是这样配置的:使通道区域形成为细长状,该通道区域的长度方向与上述栅极信号线平行。
4.如权利要求1所述的显示装置,其特征在于,上述驱动用薄膜晶体管是将源极和漏极中的一个电极形成为直线状,将另一个电极形成为包围住一个电极的形状。
5.如权利要求1所述的显示装置,其特征在于,上述驱动用薄膜晶体管具有U字形的源极、和配置在上述U字形的两叉之间的漏极。
6.如权利要求1所述的显示装置,其特征在于,在每行中具有与在矩阵行方向的各像素内设置的上述控制用薄膜晶体管的栅极共用地连接着的栅极信号线、和平行于该栅极信号线而被配置且通过上述驱动用薄膜晶体管向上述发光元件供给电流的电力供给线,在每列中具有与在列方向的各像素内设置的上述控制用薄膜晶体管的源极共用地连接着的、并与上述栅极信号线交叉的源极信号线,在由上述栅极信号线和上述源极信号线包围的区域内,从平面看,沿着源极信号线按发光元件、驱动用薄膜晶体管、电力供给线、控制用薄膜晶体管的顺序进行配置。
7.如权利要求6所述的显示装置,其特征在于,在上述驱动用薄膜晶体管和上述控制用薄膜晶体管之间设置有长度方向平行于上述栅极信号线的保持电容,上述保持电容的一个电极兼用作电力供给线,另一个电极由与上述控制用薄膜晶体管的漏极连接的辅助电极形成,上述辅助电极电连接于上述驱动用薄膜晶体管的栅极。
8.如权利要求6所述的显示装置,其特征在于,具有发出不同颜色的发光元件,设置与每个发光颜色对应的多条电力供给线,将该多条电力供给线配置在驱动用薄膜晶体管和控制用薄膜晶体管之间,向发光元件供给来自对应的电力供给线的电流。
9.如权利要求6所述的显示装置,其特征在于,作为上述控制用薄膜晶体管的栅极使用栅极信号线,上述控制用薄膜晶体管形成在栅极信号线上。
10.如权利要求1所述的显示装置,其特征在于,在上述发光元件的周围配置有触排层,上述触排层以也重叠在上述驱动用薄膜晶体管上的形式形成,在上述发光元件和上述驱动用薄膜晶体管之间的上述触排层上形成有切口部,至少在切口部附近的上述触排层上层叠有遮光性的膜。
11.如权利要求1所述的显示装置,其特征在于,在上述发光元件的周围配置有触排层,上述触排层以也重叠在上述控制用薄膜晶体管上的形式形成,在上述发光元件和设置于相邻的像素上的上述控制用薄膜晶体管之间的上述触排层上形成有切口部,至少在切口部附近的上述触排层上层叠有遮光性的膜。
12.如权利要求1所述的显示装置,其特征在于,以覆盖上述驱动用薄膜晶体管和上述控制用薄膜晶体管的形式形成触排层,上述触排层的端缘位于驱动用薄膜晶体管以及控制用薄膜晶体管、和上述发光元件之间,在上述触排层上层叠有遮光性的膜。
13.如权利要求10~12中任一项所述的显示装置,其特征在于,具有:像素电极,配置在上述发光元件的发光层的下方,并与上述驱动用薄膜晶体管连接;相对电极,隔着上述发光层而与上述像素电极相对配置,并覆盖上述触排层,上述遮光性的膜由上述相对电极形成。
14.如权利要求1~12中任一项所述的显示装置,其特征在于,上述驱动用薄膜晶体管和上述控制用薄膜晶体管由n通道型形成。
15.如权利要求1~12中任一项所述的显示装置,其特征在于,上述驱动用薄膜晶体管和上述控制用薄膜晶体管由p通道型形成。
16.如权利要求1~12中任一项所述的显示装置,其特征在于,上述发光元件为有机场致发光。
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