CN1285242C - 配线基板、电子装置、电光学装置，及电子仪器 - Google Patents

配线基板、电子装置、电光学装置，及电子仪器 Download PDF

Info

Publication number
CN1285242C
CN1285242C CN03107244.5A CN03107244A CN1285242C CN 1285242 C CN1285242 C CN 1285242C CN 03107244 A CN03107244 A CN 03107244A CN 1285242 C CN1285242 C CN 1285242C
Authority
CN
China
Prior art keywords
mentioned
separator
film
substrate
dielectric constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN03107244.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN1446028A (zh
Inventor
宫泽贵士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
BOE Technology HK Ltd
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN1446028A publication Critical patent/CN1446028A/zh
Application granted granted Critical
Publication of CN1285242C publication Critical patent/CN1285242C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN03107244.5A 2002-03-20 2003-03-19 配线基板、电子装置、电光学装置，及电子仪器 Expired - Lifetime CN1285242C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002079509 2002-03-20
JP2002079509 2002-03-20
JP2003070531 2003-03-14
JP2003070531A JP4015044B2 (ja) 2002-03-20 2003-03-14 配線基板、電子装置及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNA2006101009564A Division CN101079439A (zh) 2002-03-20 2003-03-19 配线基板、电子装置、电光学装置，及电子仪器

Publications (2)

Publication Number Publication Date
CN1446028A CN1446028A (zh) 2003-10-01
CN1285242C true CN1285242C (zh) 2006-11-15

Family

ID=28043810

Family Applications (1)

Application Number Title Priority Date Filing Date
CN03107244.5A Expired - Lifetime CN1285242C (zh) 2002-03-20 2003-03-19 配线基板、电子装置、电光学装置，及电子仪器

Country Status (4)

Country Link
JP (1) JP4015044B2 (ja)
KR (1) KR100574261B1 (ja)
CN (1) CN1285242C (ja)
TW (1) TWI259575B (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100510922C (zh) * 2003-11-14 2009-07-08 株式会社半导体能源研究所 液晶显示装置及其制造方法、以及包含其的电视接收机
KR20050113045A (ko) * 2004-05-28 2005-12-01 삼성에스디아이 주식회사 유기 전계 발광 표시 소자 및 그 제조방법
JP4876415B2 (ja) * 2005-03-29 2012-02-15 セイコーエプソン株式会社 有機ｅｌ装置の製造方法、デバイスの製造方法
KR101143006B1 (ko) * 2005-10-28 2012-05-08 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
KR100777744B1 (ko) * 2006-10-27 2007-11-19 삼성에스디아이 주식회사 평판 디스플레이 장치
JP5456480B2 (ja) * 2006-11-28 2014-03-26 コーニンクレッカ フィリップス エヌ ヴェ 粒子を含む要素を有する電子装置を駆動する方法
KR101338739B1 (ko) * 2006-12-29 2013-12-06 엘지디스플레이 주식회사 액정 표시 장치용 박막 트랜지스터 기판 및 이의 제조 방법
EP2165366B8 (en) * 2007-07-04 2018-12-26 Beijing Xiaomi Mobile Software Co., Ltd. A method for forming a patterned layer on a substrate
WO2012073795A1 (ja) * 2010-11-30 2012-06-07 シャープ株式会社 表示装置およびその駆動方法、並びに電子装置
KR101874048B1 (ko) * 2011-01-14 2018-07-06 삼성디스플레이 주식회사 유기 발광 표시장치
KR102059014B1 (ko) 2013-05-28 2019-12-26 삼성디스플레이 주식회사 발광 표시 장치 및 그 제조 방법
CN106416432B (zh) * 2014-01-24 2020-03-24 凸版资讯股份有限公司 配线板
CN104218190B (zh) * 2014-08-26 2017-02-15 京东方科技集团股份有限公司 有机电致发光器件及其制造方法、显示装置
CN104409647A (zh) 2014-11-14 2015-03-11 京东方科技集团股份有限公司 一种像素单元及其制作方法、发光器件、显示装置
CN106848024A (zh) * 2017-02-20 2017-06-13 深圳市华星光电技术有限公司 发光器件及显示装置
JPWO2019053559A1 (ja) 2017-09-12 2020-10-15 株式会社半導体エネルギー研究所 発光素子、発光装置、電子機器、および照明装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541625B2 (ja) * 1997-07-02 2004-07-14 セイコーエプソン株式会社 表示装置及びアクティブマトリクス基板
JP3580092B2 (ja) * 1997-08-21 2004-10-20 セイコーエプソン株式会社 アクティブマトリクス型表示装置
JP2000331991A (ja) * 1999-03-15 2000-11-30 Sony Corp 半導体装置の製造方法
JP4683696B2 (ja) * 1999-07-09 2011-05-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001284297A (ja) * 2000-03-31 2001-10-12 Sony Corp 研磨装置、研磨方法および半導体装置の製造方法
JP4889872B2 (ja) * 2000-04-17 2012-03-07 株式会社半導体エネルギー研究所 発光装置及びそれを用いた電気器具
JP2002026122A (ja) * 2000-07-04 2002-01-25 Sony Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JP4015044B2 (ja) 2007-11-28
JP2004004610A (ja) 2004-01-08
TWI259575B (en) 2006-08-01
CN1446028A (zh) 2003-10-01
TW200306661A (en) 2003-11-16
KR100574261B1 (ko) 2006-04-27
KR20030079684A (ko) 2003-10-10

Similar Documents

Publication Publication Date Title
CN101079439A (zh) 配线基板、电子装置、电光学装置，及电子仪器
CN1268000C (zh) 电路板、电气光学装置及电子设备
CN1416299A (zh) 层压膜的制造方法、用该层压膜的装置及其制造方法
CN1423510A (zh) 电气光学装置、膜状部件、层压膜、低折射率膜
CN1251556C (zh) 电光学装置及电子仪器
CN1285242C (zh) 配线基板、电子装置、电光学装置，及电子仪器
CN1123034C (zh) 发光器件及其制造方法和有机发光器件结构
JP5810529B2 (ja) 有機エレクトロルミネッセンス素子、表示装置及び照明装置
KR101290099B1 (ko) 복합재료, 발광소자용 재료, 발광소자, 발광장치 및전자기기
CN1138458C (zh) 有机电致发光元件及其制造方法和有机电致发光显示装置
CN1822384A (zh) 半导体器件及其制造方法
CN1845648A (zh) 发光装置，电子设备和电视装置
CN1476737A (zh) 图案化方法及装置、膜形成方法及装置、电光学装置及其制法
CN1610465A (zh) 发光元件以及发光器件
CN1378409A (zh) 有机发光元件和使用该元件的显示设备
CN1543276A (zh) 发光器件和电子器具、以及制造设备
CN1477911A (zh) 发光装置及其制造方法以及电子仪器
CN1665357A (zh) 层叠型有机电致发光元件的制造方法及显示装置
WO2007004627A1 (ja) パターニング装置、有機エレクトロルミネッセンス素子とその製造方法及び有機エレクトロルミネッセンス表示装置
CN1890255A (zh) 有机金属络合物以及使用其的发光元件
JP4844276B2 (ja) 有機エレクトロルミネッセンス素子用材料溶液の製造方法
CN1732244A (zh) 电致发光元件及电致发光元件的制造方法
JPWO2019194209A1 (ja) インク組成物、有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子
JP2022099677A (ja) 有機エレクトロルミネッセンス素子、その製造方法、表示装置及び照明装置
JP2008305613A (ja) 有機エレクトロルミネッセンス素子の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160527

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd.

Address before: Hongkong, China

Patentee before: BOE Technology (Hongkong) Co.,Ltd.

Effective date of registration: 20160527

Address after: Hongkong, China

Patentee after: BOE Technology (Hongkong) Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Seiko Epson Corp.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20061115