CN1285242C - Distribution base plate, electronic device, electrooptics device and electronic instrument - Google Patents

Distribution base plate, electronic device, electrooptics device and electronic instrument Download PDF

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Publication number
CN1285242C
CN1285242C CN03107244.5A CN03107244A CN1285242C CN 1285242 C CN1285242 C CN 1285242C CN 03107244 A CN03107244 A CN 03107244A CN 1285242 C CN1285242 C CN 1285242C
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mentioned
separator
film
substrate
dielectric constant
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CN1446028A (en
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宫泽贵士
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BOE Technology Group Co Ltd
BOE Technology HK Ltd
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Abstract

The purpose of the present invention is to reduce the parasitic capacitance generated in the conductive portion for stabilizing the performance. The solution is to allocate a structural member 18 with a low permittivity less than 4 on the substrate 15, and to dispose a functional film 140 divided by the structural member 18 with a low permittivity.

Description

Wiring substrate, electronic installation, electro-optical device, and electronic instrument
Technical field
The invention relates to electronic installations such as electro-optical device and semiconductor device, be suitable for electronic installation wiring substrate, be suitable for the electro-optical device electronic instrument of display unit.
Technical background
As display unit, have and have liquid crystal cell, electro-optical device such as the liquid crystal indicator of organic electroluminescent (to call organic EL in the following text) element and organic EL display.Particularly organic EL display is with high briliancy self-luminous, but dc low-voltage drive, but high-speed responsive etc., so display performance is good.And, but display unit slimming, lightweight, low consumption electrification (for example, Patent Document 1).
[Patent Document 1] international No. 98/36406 brochure of WO that discloses
Yet known in electro-optical device, because wiring closet etc. produce parasitic capacity, can bring obstacle to the data rewrite action.The capacity of this wiring closet depends on distribution length etc., along with distribution increases and strengthens, for example, electro-optical device during as display unit, is become the reason that hinders big picture.
Present situation in recent years is in semiconductor devices such as memory, requires Highgrade integration, also requires the action high speed simultaneously, and the capacity that produces between conductive portion such as distribution has just become problem.
Summary of the invention
Purpose of the present invention is exactly in view of the above problems, and a kind of wiring substrate that is suitable for stable performanceization is provided, and can form big picture, and the stable electro-optical device of long-term work, and the electronic instrument that uses them.
In order to achieve the above object, the 1st kind of wiring substrate of the present invention is characterized in that comprising the matrix that contains distribution and is configured in the parts with 4 following dielectric constants of substrates, is provided with the zone that does not form above-mentioned parts on above-mentioned.
Common silicon oxide layer dielectric constant is 4.2, so above-mentioned parts have the dielectric constant that is lower than this value.According to wiring substrate of the present invention, owing to disposed parts with low dielectric constant below 4, for example, configuration electrooptic material in not forming the zone of above-mentioned parts, when forming conductive portion such as electrode above it, deposit capacity by the parasitism that this conductive portion and above-mentioned distribution can reduce to generate.
The 2nd kind of wiring substrate of the present invention, it is characterized in that comprising and contain insulated substrate and the matrix of set distribution above above-mentioned insulated substrate, with the separator that is configured in above-mentioned substrates, be provided with the zone that does not form above-mentioned parts on above-mentioned matrix, the dielectric constant of above-mentioned separator is lower than the dielectric constant of above-mentioned insulated substrate.
When above-mentioned exhausted substrate is used for display unit etc., preferably with quartz or glass etc. as above-mentioned insulated substrate, in this case, the dielectric constant of above-mentioned separator is preferably in below 4.
In the above-mentioned wiring substrate, the dielectric constant of above-mentioned separator is below 3, better below 2.5.Also a plurality of above-mentioned zones can be set on matrix.
In above-mentioned wiring substrate, for example, when containing active element in the above-mentioned matrix,, can utilize higher frequency or high-speed driving signal to make active element work by reducing parasitic capacity.As active element, element of 2 terminals such as semiconductor elements such as transistor and M1M etc. is for example arranged.
In aforesaid substrate, above-mentioned separator for example is to comprise any in silica glass, alkyl siloxane polymer, alkyl silicon silsequioxane polymer, hydrogenation alkyl silicon silsequioxane polymer, the polyaryl ether rotary press modelling film, diamond film, and fluorinated amorphous carbon element film etc. on glass plate.
Above-mentioned parts also can be formed by porous matter.
Specifically have aeroge, porous matter silica, the gel that has disperseed the magnesium fluoride particulate, fluorine based polymer, and porous polymer contain the article etc. of particulate.
Electronic installation of the present invention is characterized in that corresponding configuration feature film with the above-mentioned zone of above-mentioned record substrate.
In the above-mentioned electronic installation, disposed the lower above-mentioned separator of dielectric constant because above-mentioned functions is intermembranous, so can reduce the parasitic capacity of the intermembranous generation of above-mentioned functions.
In above-mentioned electronic installation, during conducting film such as configured electrodes, above-mentioned distribution and above-mentioned electrode are isolated by above-mentioned parts above the above-mentioned functions film, so can reduce the parasitic capacity that above-mentioned electrode and above-mentioned wiring closet produce.When particularly above-mentioned distribution is supplied with signal, can alleviate signal delay, problem such as die down.As the material that forms conducting film, for example comprise organic conductive material, inorganic conductive material (metal etc.), reach their mixture etc.
In the above-mentioned electronic installation, the entire circumference that is not limited at the above-mentioned functions film disposes above-mentioned parts.
The 1st kind of electro-optical device of the present invention, it is characterized in that comprising contain substrate and the matrix of distribution set above the aforesaid substrate, be configured in above-mentioned substrates a plurality of pixel electrodes, be configured in above the pixel electrodes to electrode, at each above-mentioned a plurality of pixel electrodes with the functional membrane that contains electrooptic material that disposes between to electrode and be arranged on around the above-mentioned functions film, be configured in above-mentionedly to the separator between electrode and the above-mentioned substrates, the dielectric constant of above-mentioned separator is lower than the dielectric constant of aforesaid substrate.
In the above-mentioned electro-optical device, preferably use quartz and glass as aforesaid substrate.In this case, the dielectric constant of above-mentioned parts is preferably in below 4.
The 2nd kind of electro-optical device of the present invention, it is characterized in that comprising the matrix, a plurality of pixel electrodes that are configured in above-mentioned substrates that contain distribution, be configured in the pixel electrodes top to electrode, each above-mentioned a plurality of pixel electrodes with to the functional membrane that contains electrooptical material that disposes between the electrode be provided with around the above-mentioned functions film, be configured in above-mentionedly to the separator between electrode and the above-mentioned substrates, the dielectric constant of above-mentioned separator is below 4.
In the above-mentioned electro-optical device, the dielectric constant of above-mentioned separator is preferably in below 3, better below 2.5.
As above-mentioned electron optics material, except electroluminescent organic material, for example also have liquid crystal cell, the moving element of electrophoresis or electronics to disengage the material that uses in the element.
In the above-mentioned electro-optical device, above-mentioned matrix also contains the active element that is connected with pixel electrodes, and above-mentioned distribution also comprises signal wiring from signal to above-mentioned active element that supply with.As above-mentioned active element, element of 2 terminals such as semiconductor elements such as transistor and M1M etc. is for example arranged.
In the above-mentioned electro-optical device, above-mentioned separator, for example be any rotary press modelling film, the diamond film on glass plate that contains in silica glass, alkyl siloxane polymer, alkyl silicon silsequioxane polymer, hydrogenation alkyl silicon silsequioxane polymer, the polyaryl ether, and fluorinated amorphous carbon element film etc.
Above-mentioned parts also can be formed by porous matter.
Aeroge, porous matter silica, the gel that has disperseed the magnesium fluoride particulate, fluorine based polymer, porous polymer are specifically arranged, and contain the material etc. of particulate in the prescribed material.
Above-mentioned electro-optical device in the middle of above-mentioned separator and above-mentioned active element, also can be provided with the barrier layer that inhibiting substances sees through.
As above-mentioned separator, use when hanging down the dielectric constant material, the low general majority of dielectric constant material is porous material or low density material, and materials such as metal and oxygen are easy to see through, and the material that sees through is easy to produce problems such as active element deterioration, distribution etc. are corroded.To this, between above-mentioned parts and active element,, can suppress to cause the material permeance of reasons such as deterioration, corrosion by above-mentioned barrier layer is set.
In the above-mentioned electro-optical device, above-mentioned separator, at least a portion is covered by the diaphragm that prevents material permeance.
Above-mentioned parts so above-mentioned separator at least a portion covers with said protection film, can suppress the only diffusion of the material between between above-mentioned parts because material sees through easily.Thus, can reduce the corrosion and the deterioration of inner distribution of electro-optical device or active element.Low dielectric constant material says that generally majority is that mechanicalness is easily crisp, so, by on above-mentioned parts, diaphragm being set, played the mechanical effect of enhancing.
Electronic instrument of the present invention is characterized in that as display unit, has the electronic installation of above-mentioned record.
According to electronic instrument of the present invention,, for example,, can carry out good, stable tracking demonstration work for high frequency or input signal at a high speed by reducing parasitic capacity.
Description of drawings
Fig. 1 is the section structure schematic diagram of electro-optical device of the present invention and substrate.
Fig. 2 is that the organic EL display of the invention process form example constitutes ideograph.
Fig. 3 is the organic EL display circuit of a routine active array type.
Fig. 4 is pixel region (organic El device) section structure pattern diagram, (a) represents high radial pattern, (b) back emission type.
Fig. 5 is the planar structure form example of separator.
Fig. 6 is the enlarged diagram of high radial pattern pixel region (organic El device) section structure.
Fig. 7 is to use to make has the display unit process implementing example of organic EL, and the manufacture method figure of electro-optical device of the present invention is described.
Fig. 8 is to use to make has the display unit process implementing example of organic EL, and the manufacture method figure of electro-optical device of the present invention is described.
Fig. 9 is to use to make has the display unit process implementing example of organic EL, and the manufacture method figure of electro-optical device of the present invention is described.
Figure 10 is to use to make has the display unit process implementing example of organic EL, and the manufacture method figure of electro-optical device of the present invention is described.
Figure 11 is to use to make has the display unit process implementing example of organic EL, and the manufacture method figure of electro-optical device of the present invention is described.
Another form illustration intention of Figure 12 organic El device.
Figure 13 is another form illustration intention of organic El device.
Figure 14 is another illustration intention of organic EL display circuit.
Figure 15 is the schematic diagram of electronic instrument embodiment of the present invention.
Figure 16 is the schematic diagram of another embodiment of electronic instrument of the present invention.
Figure 17 is the schematic diagram of another embodiment of electronic instrument of the present invention.
Figure 18 is the schematic diagram of another embodiment of electronic instrument of the present invention.
Figure 19 is the schematic diagram of another embodiment of electronic instrument of the present invention.
Figure 20 is the schematic diagram of another embodiment of electronic instrument of the present invention.
Among the figure, 10, the 100-organic EL display; 15, the 121-host material; 16,142,143-TFT (active element); 17, the 102-light-emitting zone; 18, the 281-separator; 20, the 271-barrier layer; 21, the 271-diaphragm; 140-organic EL (functional membrane).
Embodiment
Below the present invention is elaborated.
Fig. 1 is the section structure from conceptive expression electro-optical device of the present invention and substrate, and symbol 10 is that electro-optical device, symbol 11 are wiring substrates.Wiring substrate 11 is to constitute by containing the thin-film transistor active elements such as (TFT:Thin Film Transistor below are called TFT) that is located on the host material 15 and the multilayer wired type of insulating barrier.Electro-optical device 10 on wiring substrate 11, is provided as a plurality of light-emitting zones 17 that contain luminescent layer of functional membrane, and its luminance is controlled by active element 16.On the border of a plurality of light-emitting zones 17, be provided with separator (storage member) 18 as insulating barrier.
Electro-optical device 10 of the present invention is characterized in that separator 18 is formed by low dielectric constant material.Separator 18 is by being formed by low dielectric constant material, can reduce the parasitic capacity that produces between conductive portion such as distribution.
The dielectric constant (than dielectric constant) of low dielectric constant material for example is preferably in below 4, below 3, better below 2.5.Low dielectric constant material by being formed by the high porous matter (hole body is arranged) of voidage, can obtain the low dielectric constant material of above-mentioned low dielectric constant.
As utilizing low dielectric constant material to form the method for separator 18, for example, use various rubbing methods and CVD method (chemical vapor deposition method) etc., behind the cambium layer, utilize corrosion and photoetch method etc. again, form pattern, obtain the separator 18 of regulation shape.
As low dielectric constant material, any spin-on-glass film of containing in silica glass, alkyl siloxane polymer, alkyl silicon silsequioxane polymer, hydrogenation alkyl silicon silsequioxane polymer, the polyaryl ether, diamond film, and fluorinated amorphous carbon element film etc. are for example arranged.
And then, as low dielectric constant material, for example also can use aeroge, porous matter silica, the gel that has disperseed the magnesium fluoride particulate, fluorine based polymer, porous polymer, reach the article that contain particulate in the prescribed material, etc.
As aeroge, for example can use silica aerogel, with the aeroge of aluminium oxide as matrix.Silica aerogel is the solgel reaction that utilizes silicon alkoxide, and the moistening gel of formation utilizes supercritical drying, the porous plastid with homogenous superfine micro-structural that obtains.The space of silica aerogel accounts for more than 90% of volume, and all the other are by being condensed into the trickle SiO of dendritic tens of nm 2The material that particulate constitutes.And, can adjust dielectric constant by changing voidage.
The manufacturing of silica aerogel, be through utilization sol-gel process make the process of moistening gel, with the process of moistening gel slaking and utilize supercritical drying that moistening gel drying is obtained the supercritical drying process of aeroge and make.Supercritical drying is the liquid in the colloidal gelatinous mass that will be formed by solid phase and liquid phase, by displacement, removal supercritical fluid, gel is not shunk, and gelatinous mass is carried out dry proper method, can obtain having the aeroge of high voidage.
In addition, when forming above-mentioned spin-on-glass film (Spin on glass), also can use above-mentioned supercritical drying.By using supercritical drying, can further improve lining property and film quality.
When utilizing silica aerogel to form separator 18, utilize rubbing method with moistening gel coating after on the host material, carry out supercritical drying, also can in moistening gel, mix synthetic resin (organic substance).At this moment synthetic resin, be that its thermal denaturation temperature compares supercritical fluid, when for example using alcohol, as the critical temperature high synthetic resin of its thermal denaturation temperature than alcohol, (wherein PVB and EC are dissolved in alcohol, and water insoluble) such as hydroxypropyl cellulose (HPC), polyvinylbutyral (PVB), ethyl celluloses (EC) arranged.As solvent, when using ether, as resin, can select chlorine is polyethylene etc., uses CO 2When making solvent, preferably select HPC etc.
Porous matter silica (has porous SiO 2Film), can utilize plasma CVD method (plasma chemistry chemical vapour deposition) to form,, use SiH as reacting gas 4And N 2O.And then, at this SiO 2On the film, formation has porous SiO 2Film.This SiO 2Film can utilize atmospheric pressure cvd method (normal pressure chemical chemical vapour deposition) to form, and uses and contains TEOS (tetrem oxosilane), O 2(oxygen) and low concentration O 3The reacting gas of (ozone).So-called low concentration O 3, be the O that says than the oxidation desired concn of above-mentioned TEOS 3Concentration.
As the fluorine based polymer or contain its material, for example, the hybrid films of perfluoroalkyl-polyethers, perfluoroalkyl amine or perfluoroalkyl-polyethers-perfluoroalkyl amine etc. is arranged.
And then, in the polymer adhesive of regulation, also can sneak into solubility or dispersed fluorocarbon.
As polymer adhesive, polyvinyl alcohol, polyacrylic acid, polyvinylpyrrolidone, polyvinyl sulfonic acid sodium salt, polyvinyl methyl ethermaleic anhydride, polyethylene glycol, poly-α-trifluoromethyl acrylate, polyvinyl methyl ether-be total to-maleic anhydride, polyethylene glycol-be total to-propylene glycol, polymethylacrylic acid etc. are arranged.
As fluorocarbon, 4 grades of ammonium iodide of perfluoro alkyl sulfonic acid tetramethyl ammonium, fluorinated alkyl that perfluoro alkyl sulfonic acid ammonium salt, C-7 and the C-10 of perfluoro caprylic acid-ammonium salt, perfluoro caprylic acid-tetramethyl ammonium, C-7 and C-10 are arranged, 4 grades of ammonium salts of perfluor adipic acid and perfluor adipic acid etc.
Low dielectric constant material, also available particulate form the space with micropore between particulate or in the particulate.As particulate, can use inorganic particles or organic fine particles.Inorganic particles is preferably amorphous.Inorganic particles is preferably formed by oxide, nitride, sulfide or the halide of metal, is more preferably by metal oxide or metal halide to form, and especially good is to be formed by metal oxide or metal fluoride.As metallic atom, preferably Na, K, Mg, Ca, Ba, Al, Zn, Fe, Cu, Ti, Sn, In, W, Y, Sb, Mn, Ga, V, Nb, Ta, Ag, Si, B, Bi, Mo, Ce, Cd, Be, Pb and Ni are more preferably Mg, Ca, B and Si.Also can use the inorganic compound that contains two kinds of metals.Good especially is silicon dioxide, i.e. SiO 2
Micropore in the inorganic particles for example, by being cross-linked to form the silica molecule of particulate, forms, when crosslinking-oxidization silicon divides the period of the day from 11 p.m. to 1 a.m, and volume-diminished, particulate forms porous matter.Inorganic particles with micropore (porous matter), utilize sol-gel process (spy opens each communique record of clear 53-112732 number, special public clear 57-9051 number) or deposition method (APPLIEDOPTICS, 27,3356 pages (1988) record), can disperse thing directly synthetic.The powder that obtains with drying precipitated method carries out mechanical crushing, also can obtain disperseing thing.Also can use commercially available porous matter inorganic particles (for example, silicon dioxide melten gel).Inorganic particles with micropore preferably is dispersed in the suitable medium and uses.As dispersant, preferably water, alcohol (for example methyl alcohol, ethanol, isopropyl alcohol) and ketone (for example, methyl ethyl ketone, methylisobutylketone).
Organic fine particles preferably also is a noncrystalline.Organic fine particles preferably utilizes the synthetic polymer particles of polymerization reaction (for example, emulsion polymerization method) of monomer.The polymer of organic fine particles preferably contains fluorine atom, for synthetic fluoropolymer, the monomer example of employed contain fluorine atoms, (for example comprise the fluoroolefins class, PVF, vinylidene are fluoridized thing, tetrafluoroethene, hexafluoropropylene, perfluor-2,2-dimethyl-1,3-two  are luxuriant), the fluorinated alkyl esters class and the ethylene fluoride ethers of acrylic or methacrylic acid.Also can use the contain fluorine atoms monomer and the copolymer of fluorochemical monomer not.The example of contain fluorine atoms monomer not, comprise that olefines (for example, ethene, propylene, isobutene, vinyl chloride, the vinyl chloride fork), esters of acrylic acid (for example, methyl acrylate, ethyl acrylate, 2-ethylhexyl acrylate), methyl acrylic ester (for example, methyl methacrylate, EMA, butyl methacrylate), phenylethylene (styrene, vinyl toluene, AMS), the ethene ethers (for example, ethylene methacrylic ether), vinyl esters (for example, vinylacetate, propionate), acrylic acid amides class (for example, N-tert-butylacrylic acid acid amides, N-cyclohexyl acrylic acid amides), methacrylic acid amide-type and vinyl cyanide.
Micropore in the organic fine particles for example, can form by the polymer that is cross-linked to form particulate.Volume-diminished when cross-linked polymer, particulate forms porous matter.In order to be cross-linked to form the polymer of particulate,, preferably form polyfunctional monomer more than 20% mole for the monomer of synthetic polymer.The ratio of polyfunctional monomer, 30-80 mole % more preferably, especially good is 35-50 mole %, the example of polyfunctional monomer, comprise that dienes (for example, butadiene, pentadiene), polyalcohol and acrylic acid ester are (for example, the ethylene glycol diacrylate, 1,4-cyclohexane diacrylate, dipentaerythritol acrylate), ester (the example of polyalcohol and methacrylic acid, the ethylene glycol dimethylacrylate, 1,2,4-cyclohexane tetramethyl acrylate, pentaerythrite tetramethyl acrylate), the divinyl compound (for example, the divinyl cyclohexane, 1, the 4-divinylbenzene), divinyl sulfone, diacrylate amide-type (for example, methylene diacrylate acid amides) and dimethacrylate amide-type.Micropore between particulate forms by overlapping 2 above particulates at least.
As low dielectric constant material, also can use material with trickle emptying aperture and microgranular inorganic matter.At this moment, after the utilization coating forms the above-mentioned material layer, carry out activated gas and handle, from layer, break away from, form trickle emptying aperture by making gas.
Also can sneak into ultra micron more than 2 kinds (MgF for example 2And SiO 2).At this moment, ultra micron, the SiO that generates by the thermal decomposition of ethyl esters of silicon acis 2Engage.In the thermal decomposition of ethyl esters of silicon acis, utilize the burning of ethyl part, generate carbon dioxide and water vapour.The disengaging from layer by carbon dioxide and water vapour forms the space between ultra micron.
Also can form the layer that contains by the inorganic micro powder of porous matter silica end and adhesive,, carry out overlappingly more than 2, also can form between particulate interstitial layer by the particulate that will form by fluoropolymer.
As low dielectric constant material, also can use the material that on the molecular structure level, can improve voidage, for example, have the polymer of branch's structures such as dendroid.
Between separator 18 and active element 16, the barrier layer 20 that anti-metal passes through is set preferably.By the isolated part 18 that low dielectric constant material forms, most cases is to be formed by porous matter, and material such as metal is easy to see through, and can invade active element 16 through the metal of separator 18, carries out chemical reaction, causes active element 16 deteriorations.Between separator 18 and active element 16, by above-mentioned barrier layer 20 is set, thereby restrain the deterioration of active element 16, and restrain the reduction of element function.
As the formation material of barrier layer 20, for example, except silicon-containing compounds such as ceramic and silicon nitride, oxidized silicon nitride, silica, also can use material with exothermal effect, for example, the nitride of the nitride of aluminium, the carbide of silicon, silicon, the nitride of boron, the phosphide of boron etc.Barrier layer 20 except barrier metals, by having exothermal effect, can alleviate the influence that the separator 18 that is formed by low dielectric constant material is subjected to thermal contraction.
In addition, also can use, for example contain a kind of rare earth element (as, at least a element in cerium, ytterbium, samarium, erbium, yttrium, lanthanum, cadmium, dysprosium and the neodymium) and nitrogen, silicon, aluminium, and the material of oxygen.Also can form the layer that titanium nitride, tantalum nitride etc. have conductivity.When formation has the barrier layer of conductivity, determine the thickness and the shape of people's barrier layer, the distribution actual resistance is raise.
By the barrier layer that this material forms, for example available CVD method, formation such as various rubbing methods, sputtering method, vapour deposition method.Barrier layer 20 can be a single layer structure, also can be multilayer structure.
Separator 18, at least a portion is by preventing that the diaphragm 21 that liquid component and materials such as gas or metal pass through from covering.Because the separator 18 by low dielectric constant material forms is easy to be invaded by material, so in manufacture process etc.,, can reduce the low dielectric constant performance of separator 18 owing to the intrusion of material.Separator 18, at least a portion is covered by said protection film 21, can keep the low-dielectric of separator 18 really, and obtains the low capacityization of distribution.Say that generally the mechanical property of low dielectric constant material is easily crisp, said protection film has also played the effect that strengthens aspect mechanical property.Owing to restrain diffusion, avoided passing through of the influence of the material of separator 18 to other zones between 18 materials of separator.
As the formation material of diaphragm 21, pottery and silicon nitride, oxidized silicon nitride, silica etc. are for example arranged.When forming film, except inorganic spin-on-glass system, organic spin-on-glass system, PSG (phosphate glass), preferably use high inorganic polymer of flexibility and organic polymer etc. in the edges and corners of separator 18.
When forming the spin-on-glass mesentery, can use above-mentioned supercritical drying.By using supercritical drying, can further improve lining property and film quality.
Diaphragm 21 by this material forms can form by using various rubbing methods such as method of spin coating, infusion process, distributor rubbing method, circumfluence method.Diaphragm 21 can be a single layer structure, also can be multilayer structure.
Also can form diaphragm 21 and replace above-mentioned barrier layer 20.That is, comprise, cover separator 18, can save barrier layer 20 with diaphragm 21 towards active element 16 sides.At this moment, the material of the above-mentioned barrier layer 20 of available formation forms diaphragm 21.
Like this, electro-optical device 10 of the present invention forms separator 18 by utilizing low dielectric constant material, has reduced the parasitic capacity that produces between conductive portion, and has obtained the high speed of operating rate.When the operating rate high speed, except considering parasitic capacity, also must consider the reductionization of wiring resistance, need the global design distribution structure.Wiring substrate 11 of the present invention also comprises the situation when low dielectric constant material is used for other parts beyond the separator.
Below the embodiment that electro-optical device of the present invention and wiring substrate is applicable to active matrix (active matrix) the type display unit of using organic EL is described.In each figure of reference,, sometimes size is dwindled different with reality for the size of discernible layer on drawing and parts.
Fig. 2 is the pattern diagram that embodiment of the invention organic EL display constitutes, and this organic EL display 100 as active element, has adopted effective type type of drive of using TFT.
The structure of display unit 100 is on host material 121, form following lamination successively, that is, as active element contain the active element part 146, luminescent layer of TFT, positive hole transfer layer, and as the organic EL 140 that contains functional membrane such as electron supplying layer, negative electrode 154, and enclosure portion 147 etc.
As host material 121, used glass substrate in this example.In addition, also can use silicon substrate, quartz base plate, ceramic substrate, metal substrate, plastic base, plastic film substrate etc., the various known host material that uses in electro-optical device and the wiring substrate.
On host material 121, with rectangular assortment, carry out colour when showing as a plurality of pixel regions 102 of light-emitting zone, for example, and with red (Red), green (Green), blue (Blue) corresponding pixel region 102 of all kinds, parallel in accordance with regulations assortment.
In each pixel region 102, configuration pixel electrode 141 on its next door, configuration signal line 132, is given scan line that electric wire 133, scan line 131 and other not shown pixel electrodes use etc. jointly.The flat shape of pixel region 102 except illustrated rectangle, also can be other shapes such as circle, Long Circle.For example, during charge transport layers such as the luminescent layer that uses liquid phase process such as ink jet method to form to constitute organic ELs and electronics or positive hole transfer layer,, preferably remove shapes such as the circle at angle or ellipse in order above pixel electrode, to form uniform above-mentioned layer.
Enclosure portion 147 is intrusions of prevention of water and oxygen, prevents the part of negative electrode 154 or organic EL 140 oxidations, comprises the sealing resin that is coated on the host material 121, and is fitted in the closed substrate (closed container) 148 on the host material 121.As the material of sealing resin, for example, use thermosetting resin or ultraviolet hardening resin etc., preferably use a kind of epoxy resin of thermosetting resin.Shut 148 can be formed by glass or metal etc., by sealant with host material 121 and closed substrate 148 involutions.At the inboard of host material 121 configuration drier.The space that forms forms and has filled N between the two 2The N of gas 2Gas packed layer 149.
Fig. 3 is the circuit structure of expression display unit 100.
Among Fig. 3, disposing multi-strip scanning line 131, many signal line 132 of on relative scanning line 131 is crisscross, extending and the many common electric wires 133 of giving that extend side by side with holding wire 132 on the host material 121.Corresponding with each intersection point of scan line 131 and holding wire 132, form above-mentioned pixel region 102.
Holding wire 132 for example is connected with the data side drive circuit 103 that contains shift register, level shifter, video line and analog switch.Scan line 131 is connected with the scan-side drive circuit 104 that contains shift register and level shifter.
In pixel region 102, be provided with by scan line 131 with sweep signal supply with the 1st TFT 142 that the gate electrode switch uses, by this TFT 142 keep by holding wire 132 supply with picture signals maintenance capacity 145, will supply with gate electrode by the picture signal that maintenance capacity 145 keeps driving with the 2nd TFT 143, pass through this TFT 143, with common when being electrically connected for electric wire 133, by the common pixel electrode 141 (anode) of giving electric wire 133 inflow drive currents altogether and pixel electrode 141 with to the organic EL 140 of clamping between the electrode 154 (negative electrode).Organic EL 140 is the layers that contain electroluminescent organic material as electrooptic material, and the formation of organic El device comprises pixel electrode 141, negative electrode 154, reaches organic EL 140 etc.
In pixel region 102, when driven sweep line 131 was opened the 1st TFT 142, this moment, the current potential of holding wire 132 remained in the maintenance capacity 145, according to the state of this maintenance capacity 145, determined the conducting state of the 2nd TFT 143.According to the magnitude of current of TFT conducting state at that time,, supply with organic ELs 140 from the common electric wire 133 of giving by pixel electrode 141.Determine the luminous intensity of organic EL 140 according to the magnitude of current of supplying with this moment.
Fig. 4 (a) and (b) are pixel region 102 section structure pattern diagram of organic El device, and (a) so-called high radiation (TOP emission) type of expression, (b) represent so-called back emission type.
Among Fig. 4 (a), be in the formation of the actinomorphic organic El device of height, from host material 121 opposition sides that are provided with TFT 143, penetrate the light that organic EL 140 sends.Thus, as host material 121, can be transparent, also can be opaque.
As opaque host material, for example,, thermosetting resin, thermoplastic resin etc. are arranged except to the insulation processing such as sheet metals such as pottery, stainless steel such as aluminium oxide enforcement surface oxidation.Pixel electrode 141 preferably has reflexive film by metal film etc. and constitutes.Fig. 4 (a) and (b) in, in this example, with pixel electrode 141 as anode, will be to electrode 154 as negative electrode, also can be with the formation of anode and negative electrode exchange.
Among Fig. 4 (b), the formation of the organic El device of back emission type is to penetrate the light that organic EL 140 sends from host material 121 sides that are provided with TFT 143.For this reason, use transparent or semitransparent material as host material 121.As transparent or semitransparent host material, glass substrate is for example arranged, quartz base plate, resin substrate (plastic base, plastic film substrate) etc. preferably use cheap soda-lime glass substrate.When using the soda-lime glass substrate,, the weak soda-lime glass of resistance to acids and bases can be protected, simultaneously, the flatness of host material can be improved by it being implemented the silica coating.Configuration colour filter film and the variable color film or the dielectric reflectance coating that contain the photism material on host material, also may command penetrates light wavelength.
Symbol 281 is provided in a side of the separator (storage member) on pixel region 102 borders.Separator 281 has the effect that the material that prevents adjacent organic EL 140 is mixed with each other when forming organic EL 140.In the figure, the structure of separator 281 is that top margin length is cone-shaped less than base length, also can form top margin length greater than base length or equal structure.
In the organic El device of back emission type, because its formation is the light that luminescent layer 286 sends, penetrate from host material 121 1 sides that are provided with TFT 143, so will effectively penetrate light as purpose, so avoid directly disposing TFT 143 140 times, preferably TFT 143 be configured under the separator 281 at organic EL.
Fig. 5 shows the embodiment of separator 281 planar structures.
Separator 281 is positioned at the border of a plurality of pixel regions 102, and corresponding a plurality of pixel region 102 assortments form, and have opening.
Among Fig. 5 (a), separator 281 is arranged to clathrate corresponding to a plurality of pixel regions 102 with rectangular assortment.Among Fig. 5 (b), separator 281 is arranged to linear corresponding to a plurality of pixel regions 102 with rectangular assortment.In this example, separator 281 forms cancellate planar structure shown in Fig. 5 (a).The flat shape of the assortment of pixel region 102 and separator 281 is not limited in this, for example, also can form the assortment that each row separates, the pixel region of so-called triangle assortment and and its corresponding shape.Also can be according to the shape of last pixel electrode 154 shown in Figure 2.Also can determine the shape of separator 281 according to the shape of last pixel electrode 154 shown in Figure 2.For example, pixel electrode is when removing shapes such as the circle at angle or ellipse, and separator 281 matches with it and also forms acerous shape.
Fig. 6 is the enlarged section structure chart of high radial pattern organic El device.
The pixel electrode 141 (anode) that among Fig. 6, organic El device has host material 121, formed by indium tin oxide transparent electrode materials such as (ITO), the luminescent layer 286 (organic EL layer) that can carry the positive hole in positive hole to carry to lead 285, contain the organic EL material of one of electro-optical substance by pixel electrode 141, be located at electron supplying layer 287 above the luminescent layer 286, be located at negative electrode 154 (to electrode) above the electron supplying layer 287 and the TFT 142,143 that on host material 121, forms.The formation of negative electrode 154 is that whole element of covering and pixel electrode 141 formation are right, plays the effect of injecting electronics to organic EL 140.This negative electrode 154 is single layer structure, also multiple layer member.As the formation material of negative electrode 154, aluminium (Al), magnesium (Au), silver (Ag), calcium (Ca) are for example arranged, also have lithium fluoride etc. in addition.These materials can use separately, use after also can making these monomer materials formation stack membranes or forming alloy.
TFT 142,143, and in this example, both sides form n road type.In addition, it all is n road type that TFT 142,143 is not limited to both sides, also can use both sides or the either party TFT as P road type.
TFT 142,143, for example have by with SiO 2Bottom protective film 201 as main body is located on host material 121 surfaces; the semiconductor film 204 that forms by silicon that forms on bottom protective film 201 upper stratas etc.; 205; cover semiconductor film 204; 205; be located at the gate insulation film 220 on bottom protective film 201 upper stratas; inside on gate insulation film 220; with semiconductor film 204; 205 gate electrodes 229 that relatively partly are provided with; 230; cover gate electrode 229; 230; be located at the 1st interlayer dielectric 250 on gate insulation film 220 upper stratas; on whole gate insulation film 220 and the 1st interlayer dielectric 250, carry out perforate; pass through contact hole; with semiconductor film 204; the 205 source electrodes 262 that connect; 263; at clamping gate electrode 229; 230; with source electrode 262; be provided with on the 263 relative positions; on whole gate insulation film 220 and the 1st interlayer dielectric 250, carry out perforate; by contact hole and semiconductor film 204; 205 drain electrodes 265 that connect; 266; with the source of covering electrode 262; 263 and drain electrode 265; 266, be located at the 2nd interlayer dielectric 270 on the 1st interlayer dielectric 250 upper stratas.
During high radial pattern, preferably the 2nd interlayer dielectric 270 is formed planarization films, can suppress the irregular reference of light thus.
Configuration pixel electrode 141 on the 2nd interlayer dielectric 270 is connected with drain electrode 266 with pixel electrode 141 by the contact hole 275 that is located on the 2nd interlayer dielectric 270.
In addition, the material of the 1st interlayer dielectric 250 and the 2nd interlayer dielectric 270 as shown in the figure, is located at contact hole and the contact hole 275 that is located on the 2nd interlayer dielectric 270 on the 1st interlayer dielectric 250 not simultaneously each other, had better not overlap during formation.
In the semiconductor film 204,205, clamping gate insulation film 220 is with gate electrode 229,230 overlapping regions, as zone, road 246,247.In the semiconductor film 204,205,246,247 the source in the zone, road.Source region 233,236 is set, and 246,247 the leakage side in the zone, road is provided with drain region 234,235.In it, source region 233,236 by form the contact hole of perforate on gate insulation film 220 and the 1st interlayer dielectric 250, is connected with source electrode 262,263.On the other hand, drain region 234,235 by forming the contact hole of perforate on gate insulation film 220 and the 1st interlayer dielectric 250, and is connected with the drain electrode 265,266 that one deck forms with source electrode 262,263.Pixel electrode 141 is electrically connected with drain region 235 formation of semiconductor film 205 by drain electrode 266.
Be provided with in the 2nd interlayer dielectric 270 surfaces between the part and negative electrode 154 beyond the organic El device, the 3rd insulating barrier that forms as low dielectric constant materials such as utilizing above-mentioned silica aerogel, and separator 281 is set.Separator 281 is because form with low dielectric constant material, so parasitic capacity can be suppressed to very low.
Between separator 281 and the 2nd interlayer dielectric 270, the barrier layer 271 that is formed by silicon nitride, oxidized silicon nitride or titanium nitride, tantalum nitride etc. is set.This barrier layer 271 has played the effect of preventing for invading TFT 142,143 by the metal (for example, alkali metal (mobile ion)) of separator 281.
The side of separator 281 and above, the diaphragm 272 that is formed by inorganic polymer or organic polymer etc. is covered.Diaphragm 273 can prevent in the materials intrusion separators 281 such as liquid component and gas or metal.The material that utilizes this diaphragm 272 to restrain between 281 of separators spreads.In the separator 281, by the lining zone that diaphragm 272 forms, do not limit illustratedly, for example, available diaphragm 272 covers separators 281 comprehensively.
Following with reference to Fig. 7-Figure 11, have the display unit process implementing example of above-mentioned organic El device about being suitable for to make, the manufacture method (manufacture method that comprises wiring substrate) of electro-optical device of the present invention is described.Wherein, to the above-mentioned organic El device that contains TFT 142,143 with make the N type and P type drive circuit describes simultaneously with the technology of TFT.
At first, shown in Fig. 7 (a),, as required, as raw material, utilize plasma CVD method to form FEOS (tetrem oxosilane) and oxygen etc. by the film formed bottom protective film 201 of the thick silicon oxidation of 200-500nm for host material 121.As bottom protective film, except silicon oxide layer, silicon nitride film or silicon oxidation nitride film can be set also.
Then, the temperature of host material 121 is set in about 350 ℃, on the surface of bottom protective film, utilizes ICVD method, plasma CVD method, form the film formed semiconductor film 200 of crystal silicon of being altogether unjustifiable by 30-70nm.As semiconductor film 200, be not limited to amorphous silicon film, also can be micro-crystallization semiconductor film etc. contain the non crystalline structure semiconductor film.It also can be the compound semiconductor film that amorphous silicon germanium film etc. contains amorphous structure.
Then, to this semiconductor film 200, utilize the laser annealing method or rapidly heating (lamp annealing method and thermal annealing method etc.) carry out crystallisation procedure does, make semiconductor film 200 crystallizations form poly-silicon fiml.In the laser annealing method, for example, when using excimer laser, use the wire harness of beam length dimension as 400mm, its output intensity for example is taken as 200mJ/cm 2Also can use the 2nd high frequency or the 3rd high frequency of YAG laser.About wire harness, the laser intensity on its short dimensional directions is equivalent to 90% part of peak value, and is overlapping at every turn in each zone, and wire harness is scanned.
Then, shown in Fig. 7 (b), form pattern by using photoetching process etc., that removes semiconductor film (poly-silicon fiml) 200 does not need part, forms with TFT and respectively forms regional corresponding island semiconductor film 202,203,204,205.
Then, TEOS and oxygen etc. as raw material, are utilized plasma CVD method, form the gate insulation film 220 that forms by thick silicon oxide layer of 60-150nm or nitride film (silicon oxidation nitride film etc.).And cover semiconductor film 200.Gate insulation film 220 can be a single layer structure.It also can be laminated construction.Be not limited in plasma CVD method, also can use additive methods such as thermal oxidation method.When utilizing thermal oxidation method to form gate insulation film 220, semiconductor film 200 also carries out crystallization, and these semiconductor films also can form poly-silicon fiml.
Then, shown in Fig. 7 (c), on the surface of whole gate insulation film 220, form doped silicon, silicide film and, contain the conducting film 221 that the formation gate electrode of metals such as aluminium, tantalum, molybdenum, titanium, tungsten is used.The thickness of this conducting film 221 for example is 200nm.Then, on conducting film 221 surfaces that the formation gate electrode is used, form the screened film 222 that pattern-making is used, under this state, carry out pattern-making, shown in Fig. 7 (d), forming P type drive circuit formation gate electrode 223 on transistor one side.At this moment, in the drive circuit transistor side of N type pixel electrode, cover owing to form the screened film 222 that conducting film 221 that gate electrode uses used by pattern-making, so the conducting film 221 that the formation gate electrode is used can not form pattern with transistor and N type.Gate electrode can be formed by the individual layer conducting film, also can form laminated construction.
Then, shown in Fig. 7 (e), will P type drive circuit with transistorized gate electrode 223 and form N type pixel electrode with transistorized zone and formation N type drive circuit with transistorized zone on, the conducting film 221 that residual formation gate electrode is used is made screened film, injects p type impurity element ion (this example is a boron).Dosage for example is about 1 * 10 15Cm -2Its result, impurity concentration is as 1 * 10 20Cm -2The source and drain areas 224,225 of high concentration can form self coupling for gate electrode 223.Therefore, cover, do not import the part of impurity, form zone, road 226 by gate electrode 223.
Then, shown in Fig. 8 (a), form the screened film 227 that the pattern-making that formed by etchant resist etc. is used, safety covering P type drive circuit transistor side, and, cover N type pixel electrode forms gate electrode with transistor side with TFT 10 and N type drive circuit zone.
Then, shown in Fig. 8 (b), the screened film 227 that the use pattern is used will form conducting film 221 patternings that gate electrode is used, form N type pixel electrode with transistor and N type drive circuit with transistorized gate electrode 228,229,230.
Then, with residual pattern-making membrane screen 227, original state is injected n type impurity element ion (this example is a phosphorus).Dosage for example is 1 * 10 15Cm -2As a result, the screened film 227 for pattern-making is used imports impurity but self mate ground, forms high concentration source and drain areas 231,232,233,234,235,236 in semiconductor film 203,204,205., in semiconductor film 203,204,205, do not import the zone of high concentration phosphorus herein, regional wideer than what cover by gate electrode 228,229,230.Promptly, in the semiconductor film 203,204,205, with the both sides of gate electrode 228,229,230 opposed area, and form the zone (following low concentration source and drain areas) that does not import high concentration phosphorus between the high concentration source and drain areas 231,232,233,234,235,236.
Then, remove the screened film 227 that pattern-making is used, under this state, inject n type impurity element ion (this example is a phosphorus).Dosage for example is 1 * 10 13Cm -2
The result is shown in Fig. 8 (c), and in semiconductor film 203,204,205, for gate electrode 228,229,230, self mates the impurity that ground imports low concentration, forms low concentration source and drain areas 237,238,239,240,241,242.With gate electrode 228,229,230 overlapping areas in, do not import impurity, form zone, road 245,246,247.
Then, shown in Fig. 8 (d),, form the 1st interlayer dielectric 250, utilize photoetching process to form pattern, on the source electrode position and drain electrode position of regulation, form contact hole in the face side of gate electrode 228,229,230.As the 1st interlayer dielectric 250, for example, can use siliceous dielectric films such as silicon oxidation nitride film oxide-film.Can be individual layer, also stack membrane.And then, in hydrogeneous atmosphere, heat-treat, make the terminal (hydrogenation) of the paired key place formation hydrogen of semiconductor film.Also can use hydrogen to carry out hydrogenation by plasma excitation.
Then,, use metal films such as aluminium film, chromium film or tantalum film, form the conducting film 251 of source electrode, drain electrode by on it.The thickness of conducting film 251 for example is about 200-300nm.Conducting film can be individual layer, also can be stack membrane.
Then, on the position of source electrode, drain electrode, form the membrane screen 252 that pattern-making is used, simultaneously, carry out patterning, form the source electrode 260,261,262,263 shown in Fig. 8 (e) simultaneously, reach drain electrode 264,265,266.
Then, shown in Fig. 9 (a), form the 2nd interlayer dielectric 270 that forms by silicon nitride etc.The thickness of the 2nd interlayer dielectric 270, for example 1-2 μ m.As the material that forms the 2nd interlayer dielectric 270, use the material of light-permeables such as silicon oxide layer and organic resin.As organic resin, can use acrylic acid, polyimides, polyamide, BCB (benzyl ring butylene) etc.
Then, shown in Fig. 9 (b), erosion removal the 2nd interlayer dielectric 270 forms the contact hole 275 that reaches drain electrode 266.
Then, shown in Fig. 9 (c), for example, with ITO and the SnO that mixes fluorine formation 2Be embedded in the contact hole 275, further form film, form the pixel electrode 141 that is electrically connected with source and drain areas 235,236 by transparent electrode materials such as ZnO and polyanilines.With the anode of this pixel electrode 141 as EL element.
Then, shown in Figure 10 (a), form barrier layer 271.Form the position of barrier layer 271, be after the position of separator 281 of formation, be with the 2nd interlayer dielectric 270 on the adjacent position of pixel electrode 141.The material of barrier layer 271 for example can use silicon nitride, oxidized silicon nitride, titanium nitride, tantalum nitride etc.The formation method of barrier layer 271 can suitably be selected according to material, for example uses CVD method, rubbing method, sputtering method, vapour deposition method etc.Barrier layer 271 for example is formed on material membrane the 2nd interlayer dielectric 270 and the whole of pixel electrode 141 and draws, and subsequently, utilizes photoetching process to form pattern material membrane.The opening portion of barrier layer 271 and the corresponding setting in the formation position of pixel electrode 141.Also can make the peripheral part of the part of barrier layer 271 and pixel electrode 141 overlapping during formation.
Then, shown in Figure 10 (b), utilize low dielectric constant materials such as silica aerogel, porous matter silica, on barrier layer 271, form separator 281.For example, when using silica aerogel, as above-mentioned, through utilizing sol-gel process to make the process of moistening gel, making the process of moistening gel slaking and utilize supercritical drying moistening gel drying to be obtained the supercritical drying process of aeroge, on host material 121, form the silica aerogel layer, afterwards, utilize corrosion and photoetch method etc. to form pattern, obtain the separator 281 of regulation shape.And, when forming pattern be enclosed within the barrier layer 271 end of separator 281.
Then, shown in Figure 10 (c), use materials such as inorganic polymer and organic polymer, form diaphragm 272.The diaphragm 272 that form this moment can cover the top and side of separator 281.Diaphragm 272.Also only part is coated with separator 281 formation, perhaps, after forming tunicle on whole of element, utilizes formation patterns such as photoetching process again.Utilize this diaphragm 272 can strengthen the mechanical performance of separator 281, in the process afterwards, can prevent in the material intrusion separator 281 simultaneously.When the ratio barrier layer that forms when the bottom surface of separator 281 271 was narrow and small, the whole wall of separator 281 can be covered by diaphragm 272 and barrier layer 271, can prevent effectively that material from invading in the separator 281 and between the material diffusion of 281 of separators.Then the positive hole transfer layer of explanation forms material etc., when liquid material is configured in the aperture position of separator 281, also can will have the material of lyophobicity or lyophily to this liquid material as diaphragm 272.Perhaps, utilize surface treatments such as plasma treatment, this fluent material is paid desired affinity,, be easy to dispose fluent material, and can improve the flatness that forms film by this material by the affinity of control diaphragm to fluent material.
Then, shown in Figure 11 (a), form positive hole transfer layer 285, cover pixel electrode 141.In the forming process of positive hole transfer layer 285, as the ejection drop, for example use ink jet device, can will form injection of material to pixel electrode 141.Afterwards, carry out dried and heat treatment, on pixel electrode 141, form positive hole transfer layer 285.In using ink jet mode cambium layer, for example, with nozzle H1 and the pixel electrode 141 relative configurations that form on the ink-jet head, by nozzle H1 ejection material.Around pixel electrode 141, form separator 281, nozzle H1 and host material 121 are relatively moved, and meanwhile spray to pixel electrode 141, and control nozzle H1 sprays per 1 liquid measure.
As the spraying technique of ink jet mode, charged control mode is arranged, pressurization and vibration mode, electromechanical transform, electric heating mapping mode, electrostatic attraction mode etc.Charged control mode is by charged electrode electric charge to be paid material, and the heading of control material under deviating electrode is to spray in the nozzle.The pressurization and vibration mode is that material is applied 30kg/cm 2Superhigh pressure, material is all sprayed by the nozzle end.Do not add control during voltage, material directly carries out spraying from nozzle, when applying control voltage, causes at storeroom the repulsion of static material to be dispersed, and can not spray from nozzle.In addition, the electromechanical mapping mode is to utilize piezoelectric element to accept the character of pulse electrical signal distortion, by the piezoelectric element distortion, pays pressure by the deflection material to the space of storage material, material is squeezed out from this space, and spray from nozzle.The electric heating mapping mode is the heater that utilizes in the space that is located at storage material, and material is sharply gasified, and forms bubble, utilizes the pressure of bubble that the material in the space is sprayed.The electrostatic attraction mode is to apply slight pressure in the space of storage material, makes material form meniscus at the nozzle place, under this state, by applying electrostatic attraction, material is extracted out.In addition, utilize electric field to make the mode of fluid generation viscosity change and the technology such as mode of splashing, all can use with discharge spark.
When utilizing liquid droplets to form positive hole transfer layer 285 and following luminescent layer 286, electron supplying layer 287; preferably use plasma treatment etc.; in advance pixel electrode 141 surfaces are carried out the lyophily processing and separator 281 surfaces (diaphragm 272 surfaces) are carried out the lyophoby processing.
The later process that comprises this positive hole transfer layer forming process is preferably formed as atmosphere anhydrous, anaerobic.For example, be preferably in nitrogen atmosphere, carry out in the inert gas atmospheres such as argon gas atmosphere.
Do not have particular determination as the material that forms positive hole transfer layer 285, can use material known, pyrazoline derivative, arylamine derivative, diphenyl ethylene derivatives, triphenyl diamine derivative etc. are for example arranged.Concrete example have the spy open clear 63-70257 number, with 63-175860 communique, spy open flat 2-135359 number, with 2-135361 number, with 2-209988 number, with 3-37992 number, with put down in writing in the 3-152184 communique or the like, but triphenyl diamines preferably, wherein, 4,4 '-two (N (3-tolyl)-N-phenyl is by base) biphenyl is the most handy.
Also can form positive hole injecting layer, replace positive hole transfer layer, also can form positive hole injecting layer and positive hole transfer layer simultaneously.This moment is as the formation material of positive hole injecting layer, copper phthalocyanine (CuPc) and poly-tetrahydrochysene thio-phenyl phenylene ethylene support, 1 is for example arranged, 1-two-(4-N, the amino phenyl of N-dimethylbenzene) cyclohexane, three times of (oxine) aluminium etc. preferably use copper phthalocyanine (CuPc).When forming positive hole injecting layer and positive hole transfer layer at the same time, for example, before forming positive hole transfer layer, form positive hole injecting layer in the pixel electrode side earlier, form positive hole transfer layer more thereon.By positive hole injecting layer is formed with positive hole transfer layer, the may command driving voltage rises like this, can prolong simultaneously to drive the life-span (half life).
Then, shown in Figure 11 (b), on positive hole transfer layer 285, form luminescent layer 286.In the process that forms luminescent layer 286, the same with positive hole transfer layer 285, as the ejection drop, for example,, will form injection of material to pixel electrode 141 by using ink jet device.Afterwards, carry out dried and heat treatment, on pixel electrode 141, form luminescent layer 286.When corresponding colour, form and blue (B), red (R) and green (G) corresponding luminescent layer 286 of all kinds with the regulation assortment.
Formation material as luminescent layer 286 does not have particular determination, can use low molecular organic light emission pigment and polymeric luminescent material, that is, and and the luminescent substance that forms by various fluorescent materials and alkene stimulative substance.In form the conjugated system macromolecule of luminescent substance, preferably contain fragrant rare vinylene structure.In low molecular fluorescence body, for example can use the metal complex, aromatic amine, tetraphenyl cyclopentadiene derivant etc. of pigment, oxine and derivatives thereof such as derivative, polymethine system, xanthenes system, coumarin series, Hua Jing system in derivative, the north of naphthalene derivatives, anthracene, perhaps specially open clear 57-51781, with middle known fluorophor of putting down in writing such as 59-194393 communiques.
Then, shown in Figure 11 (c), on luminescent layer 286, form electron supplying layer 287.In the forming process of electron supplying layer 287, the same with positive hole transfer layer 285 and luminescent layer 286, as the ejection drop, for example use ink jet device, will form injection of material to pixel electrode 141.Afterwards, carry out dried and heat treatment, forming electron supplying layer 287 on the pixel electrode on 141.
Formation material as electron supplying layer 287, do not have particular determination, example has the metal complex of  oxadiazole derivative, anthraquinone bismethane and derivative, benzoquinones and derivative thereof, naphthoquinones and derivative thereof, anthraquinone and derivative thereof, four cyano anthraquinone bismethane and derivative thereof, fluorenone derivatives, diphenyl dicyano ethene and derivative thereof, phenoquinone derivative, oxine and derivative thereof etc.Specifically, the same with the formation material of above-mentioned positive hole transfer layer, example have the spy open clear 63-70257 number, with 63-175860 communique, spy open flat 2-135359 number, with 2-135361 number, with 2-209988 number, with 3-37992 number, with put down in writing in the 3-152184 communique etc., 2-(4-xenyl)-5-(4-t-butyl benzene)-1 preferably, 3,4-oxadiazoles, benzoquinones, anthraquinone, three times of (oxine) aluminium.
The formation material of positive hole transfer layer 285 and the formation material of electron supplying layer 287 are mixed with the formation material of luminescent layer 286, also can be used as luminescent layer and form material.At this moment, positive hole transfer layer forms the consumption that material and electron supplying layer form material, according to the kind of using compound and difference is when considering them, in the weight range that does not damage the abundant film forming and the characteristics of luminescence, suitably definite.Usually form material for luminescent layer, be taken as 1-40 weight %, preferably be taken as 2-30 weight %.
Then, shown in Figure 11 (d), on whole host material (121) surface, form linear negative electrode 154 (to electrodes).Negative electrode can be the single layer structure of monomer materials such as Al, Mg, Li, Ga, also can be laminated construction.Perhaps, can be the single layer structure of Mg: Ag alloy materials such as (10: 1 alloys), also can be to contain the cambial laminated construction of alloy material.Li is specifically arranged 2O (0.5nm)/Al or LiF (0.5nm)/Al, MgF 2The stack membrane of/Al.For example be preferably in the luminescent layer side and form the little material of work function, for example, can use Ga, Ba etc.,, in lower floor, form very thin one deck LiF etc. sometimes according to material.On upper side (closed side), use the work function material higher, for example Al than lower side.
These negative electrodes 154, for example formation such as the most handy vapour deposition method, sputtering method, CVD method just prevent to consider that because of fire damage luminescent layer 286 the most handy vapour deposition method forms.
On the top of negative electrode 154, preferably use the Al film, the Ag film that form by vapour deposition method, sputtering method, CVD method etc.The scope of the best 100-1000nm of its thickness, better 200-500.For anti-oxidation, on negative electrode 154, also SiO can be set 2, SiN etc. protective layer.
Utilize above technology to finish organic El device, and the TFT that uses of N type and P type drive circuit.
At last, utilize the sealing resin, host material 121 and the closed substrate 148 (with reference to Fig. 6) that forms organic El device sealed.Closed process is preferably in the inert gas atmospheres such as nitrogen, argon, helium and moves.When carrying out in atmosphere, can produce defectives such as pore on the negative electrode 154, because this defect part, moisture and oxygen can be invaded negative electrode 154, cause negative electrode 154 oxidations, and is very undesirable.
The distribution of negative electrode 154 with host material 121 is connected, simultaneously, with the distribution of circuit element part 146 (with reference to Fig. 6), be located at host material 121 on or outside drive IC (drive circuit) be connected, obtain the display unit 100 of this example.
Figure 12 illustrates other form examples of organic El device.
Organic El device shown in Figure 12 is different with above-mentioned example, have the confining bed that cuts off gas and metal ion and invade (the 1st confining bed the 300, the 2nd confining bed 301, and the 3rd confining bed 302 at least a).
The 1st confining bed 300 is formed between the 1st interlayer dielectric 250 and the 2nd interlayer dielectric 270, covers source electrode 262,263 and drain electrode 265,266, and thickness for example is 50-500nm.As the material that constitutes the 1st confining bed 300, for example materials such as useful ceramics and silicon nitride, oxidized silicon nitride, silica.The 1st confining bed 300 is for TFT 142,143, can prevent moisture and from the intrusion of luminescent layer 286 alkali metal (sodium) such as (EL layers).
Material as constituting the 1st confining bed 300 except sealing alkali-metal effect, can use the material with exothermal effect.As such material, for example contain at least a element among B (boron), C (carbon), the N (nitrogen), and the dielectric film of at least a element among Al (aluminium), Si (silicon), the P (phosphorus).For example, can use the nitride of aluminium, the carbide of silicon, the nitride of silicon, the nitride of boron, the phosphide of boron etc.And then also can use the dielectric film that contains Si, Al, N, O, M (M is at least a in the rare earth element, preferably Ce (cerium), Yb (ytterbium), Sm (samarium), Er (erbium), Y (yttrium), La (lanthanum), Gd (gadolinium), Dy (dysprosium), Nd (neodymium), at least a element).
The 2nd confining bed 301 is formed between the 2nd interlayer dielectric 270 and the pixel electrode 141, thickness, for example 50-500nm.As the material that constitutes the 2nd confining bed 301, for example materials such as useful ceramics, silicon nitride, oxidized silicon nitride, silica.The 2nd confining bed 301 for TFT142,143, can prevent moisture and from the intrusion of the alkali metal (sodium) of luminescent layer 286 (EL layer) etc.
Material as constituting the 2nd confining bed 301 can use the material that acts in above-mentioned the 1st confining bed.Except having the alkali-metal effect of sealing, also has exothermal effect.
When forming the 2nd confining bed 301, also can save above-mentioned barrier layer 271.
The 3rd confining bed 302 forms covered cathode 154, thickness, for example 50-500nm.As the material that constitutes the 3rd confining bed 302, for example materials such as useful ceramics, silicon nitride, oxidized silicon nitride, silica.The 3rd confining bed 302 can prevent that moisture from invading from the outside.Material as constituting the 3rd confining bed 302 also can use the material that uses in above-mentioned the 1st confining bed.Except having the alkali-metal effect of above-mentioned sealing, also has exothermal effect.In addition, the organic El device of Figure 18 is high actinomorphic, and the 3rd confining bed 302 preferably forms with thicker light transmissive material.
In addition, replace this confining bed, perhaps, in addition, penetrate efficient, also can form low-index layer for improving light.Low-index layer is the printing opacity refractive index from the low layer of host material 121, for example, can be made of above-mentioned silica aerogel.
The refractive index of host material 121, as glass be 1.54, quartz is 1.45.As low-index layer, also can use to have porous SiO 2Other materials such as film and polymer.Also can be in the material that constitutes forming low-refractive-index layer, dispersion of dry drying prescription or chemosorbent.Can pay sealing effect to grazing shot folding rate layer thus.
Figure 13 shows another form example of organic El device.
In above-mentioned each example, the TFT 142 that switch is used illustrates with so-called simple gate structure, but the present invention is not limited to this.Promptly, as shown in figure 13, can form the two-door structure that 2 gate electrodes 310,311 is electrically connected by not shown door line, perhaps three doors or the like also can form so-called multi-door structure (comprise and have the structure that connects 2 with upper track zone semiconductor film in upright arrangement).Multi-door structure helps reducing the close current value, also helps picture and maximizes.
Figure 14 (a) and (b) show other practical circuit of organic EL display.
Figure 14 (a) and (b) shown in circuit, be the energising control of carrying out EL element by Control current, the circuit of so-called electric current program mode (PM).Figure 14 (a) has adopted so-called popular miller circuit.By adopting such circuit, can make EL keep constant conducting state, and can make the EL layer stably luminous.Also help constituting big picture display unit is arranged.
Formation material as luminescent layer, when using high-molecular luminous material, can use the macromolecular material that has luminous base on the side chain, preferably contain the conjugated system structure on the main chain, preferably polythiophene, poly--the p-penylene, poly-fragrant rare vinylene, poly-fluorenes and derivative thereof.Wherein, preferably poly-fragrant rare vinylene and derivative thereof.As poly-fragrant rare vinylene and derivative thereof, preferably contain repetitive with following chemical formula (1) expression, always repeat the unit at 50 moles of polymer more than the %.According to the structure of repetitive, be more preferably the repetitive that contains with chemical formula (1) expression, always repeat 70% above polymer of unit.
-Ar-CR＝CR’-……(1)
[wherein, Ar represents fragrant rare base or heterocyclic compound base, R, R ' represent respectively hydrogen, a 1-20 carbon organic group, cross the base in fluoroalkyl, the cyano group.]
This high-molecular luminous material, the repetitive as except that the repetitive of chemical formula (1) expression also comprises aromatic compound base or derivatives thereof, heterocyclic compound base or derivatives thereof, and their are made up the base that obtains etc.Repetitive and other repetitives of chemical formula (1) expression for example, can be connected by the non-conjugated unit with ether, ester group, amide groups, imido grpup etc., also can contain these non-conjugated parts on repetitive.
As poly-fragrant rare vinylene class, PPV shown in the formula (2) (poly-(phenylenevinylene's support)), Mo-PPV (poly-(2 are for example arranged, 5-dimethoxy-1, the support of 4-phenylene ethylene)), CN-PPV (poly-(2,5-two own oxygen-1,4-penylene-(1-cyano group vinylene))) the PPV derivative of MEH-PPV (poly-[2-methoxy-5-(2 '-(the own oxygen of ethyl))] phenylenevinylene support) etc. etc..
Except that material shown in above-mentioned, poly-(to penylene), poly alkyl fluorene etc. are for example arranged, preferably the poly alkyl fluorene of chemical formula (3) the expression poly alkyl fluorene based copolymer of chemical formula (4) expression (specifically just like).
[changing 1]
[changing 2]
Figure C0310724400282
Above-mentioned high-molecular luminous material is can be above random, the copolymer of bulk or grafting, and the macromolecule with these intermediate structure for example can be the random copolymer that has bulk.Consider from obtaining the high high-molecular luminous material of luminescent quantum yield, the random copolymer and bulk or the graft copolymer that preferably have bulk by random copolymer completely, therefore, the organic EL that forms, from utilizing thin-film light emitting to consider, preferably use the high-molecular luminous material with good luminous quantum yield of solid state.
In the above-mentioned material, when forming luminescent layer, can use the material that is liquid under the temperature when forming luminescent layer, perhaps want solvent be presented the material of good solubility, be suitable for fluent material of ink jet method or the like.As this solvent, for example the most handy chloroform, carrene, dichloroethanes, oxolane, toluene, dimethylbenzene etc.Send out the structure and the molecular weight of material according to macromolecule, usually in these solvents more than the dissolving 0.1wt%.
As above-mentioned high-molecular luminous material, molecular weight is preferably 10 with polystyrene conversion 3-10 7, also can use molecular weight 10 3Following oligomer.
By adopting synthetic method, can obtain desired high-molecular luminous material according to want high-molecular luminous material.For example by on the rare base of virtue in conjunction with the dialdehyde compounds of 2 aldehyde radicals, two microcosmic salts that on the rare base of virtue, obtain in conjunction with the compound and the triphenyl phosphatization hydrogen of 2 halogenation methyl, the Wittig reaction example of being undertaken by this salt.As other synthetic methods, have on the rare base of virtue in conjunction with the compound of 2 halogenation methyl, remove the method example of hydrogen halides from this compound.And then, have on the rare base of virtue in conjunction with the compound of 2 halogenation methyl, with the microcosmic salt intermediate that polymerization obtains in alkali of this compound, obtain the microcosmic salt decomposition method example of high-molecular luminous material again by heat treatment.
Specifically the method method to the rare vinylene based copolymer of synthetic virtue of one of above-mentioned high-molecular luminous material example describes.For example, when the high-molecular luminous material that utilizes the Wittig reaction to obtain, for example, at first, with two (halogenation methyl) compound, more specifically say, for example with 2,5-two hot oxygen-P-penylene dimethyl dibromide, at N, in the dinethylformamide solvent, with the H-H reaction of triphenyl phosphatization, synthetic microcosmic salt, with this salt and dicarbaldehyde compound, more specifically say, for example with terephalic acid formaldehyde, for example in ethanol, use the lithium b-oxide to carry out condensation, by this Wittig reaction, obtain containing phenylene ethylene support base and 2, the high-molecular luminous material of 5-two hot oxygen-P-phenylene ethylene support base.At this moment, in order to obtain copolymer, two microcosmic salts more than 2 kinds and/or the dicarbaldehyde compound more than 2 kinds are reacted.
[changing 3]
Figure C0310724400301
Poly-fluorenes based copolymer
[changing 4]
When these high-molecular luminous materials were used as the material of formation luminescent layer, because its purity is influential to the characteristics of luminescence, so after synthetic, for example, preferably utilize to precipitate again and make with extra care, chromatography etc. were carried out refinement treatment respectively.
When macromolecular material is the low material of dissolubility, for example, behind the corresponding presoma of coating, can pass through the heat hardening shown in the chemical formula (5), obtain luminescent layer.For example, when constituting the high-molecular luminous material of luminescent layer by polyhenylene-vinylene, the microcosmic salt of corresponding presoma is configured in the position that forms luminescent layer after, by heat treated the sulfonium base is broken away from, obtain polyhenylene-vinylene with luminescent layer performance function.
As the low molecular material that can form luminescent layer,, just can use basically so long as show visible luminous material.Wherein, it is the most handy to have a substituent material of fragrant family.For example, generally use aluminium oxyquinoline complex compound (Alq 3) and distyryl biphenyl, and then the BeBq that can use chemical formula (6) to represent 2And Zn (O * Z) 2Deng.In addition, also have pyrazoline dimer, quinolizine carboxylic acid, benzene pyrans father-in-law perchloro-hydrochlorate, benzene pyrans quinolizine, red English alkene, phenanthroline europium complex etc.
From being suitably to select blue look, green, and the material of emitting red light the macromolecular material of representative and the low molecular material with above-mentioned, be configured in and just can carry out the colour demonstration on the assigned position.When disposing, can use shielding vapour deposition method, print process or ink jet method etc. with assigned position.
[changing 5]
Figure C0310724400321
Host (host) is dispersed among the visitor master (guest) as intermediate value performance function so-called host/objective principal mode luminescent layer.
In host/objective principal mode luminescent layer, determine this luminescent layer illuminant colour, be objective main material basically, can select objective main material according to desired illuminant colour.The general material that uses the emitting fluorescence excellent in efficiency.Host material is said basically, has energy reference ratio and the high material of the luminous relevant energized condition benchmark of objective main material, and optimum is made host material.Sometimes also requiring is the high material of carrier degree of excursion, in this case, also can select from above-mentioned polymer body.
As presenting blue look luminous objective main material, for example, coronene class, distyryl biphenyl class etc. are arranged, as the objective main material that presents green emitting, quinoline ketone, rubrene etc. are for example arranged, as the objective main material that presents emitting red light, as fluorchrome, objective main material as presenting emitting red light for example has the rhodamine class.
Host material can be selected according to objective main material is suitable.If enumerate numerical example,, form Zn (O * Z) respectively with host material and objective main material 2With the luminescent layer of coronene, obtain presenting blue look luminous luminescent layer.
As objective main material, also can use phosphor material.For example, preferably use the Ir (ppy) of chemical formula (7) expression 3, Pt (thpy) 2, PtOEP etc.
[changing 6]
Figure C0310724400331
With above-mentioned phosphorus with chemical formula (7) expression during as objective main material, as host material, CBP, the DCTA, TCPB or the Alq that for example preferably use chemical formula (8) to illustrate 3Deng.
Host/objective principal mode luminescent layer can utilize common vapour deposition method, perhaps with host material and objective main material or their presoma formation fluidization thing, carries out rubbing method, forms.
[changing 7]
In above-mentioned example, lower floor as luminescent layer forms positive hole transfer layer, form electron supplying layer as the upper strata, but the present invention is not limited to this, for example, also can only form a kind of in positive hole transfer layer and the electron supplying layer, also can form positive hole injecting layer and replace positive hole transfer layer, also cocoa only forms luminescent layer separately.
And then, except positive hole injecting layer, positive hole transfer layer, luminescent layer, electron supplying layer, for example, at the comparative electrode side formation sealing of hole layer of luminescent layer, to obtain the long lifetime of luminescent layer.Material as forming this sealing of hole layer for example can use the BAIq shown in BCP shown in the chemical formula (9) and the chemical formula (10), considers with regard to long lifetime, preferably BAIq.
[changing 8]
[changing 9]
Figure C0310724400342
As the electro-optical device of above making, clearly, use any mode in active mode and the passive mode all can drive.
Figure 15-20 shows the embodiment of electronic instrument of the present invention.
The electronic instrument that this is routine as display unit, has electro-optical devices of the present invention such as above-mentioned organic EL display.
Figure 15 is that an example shows the display unit that video image and computer are carried writings and image.Among Figure 15, the display unit of electro-optical device of the present invention has been used in symbol 1000 expressions.Display unit main body 1000, by using above-mentioned organic EL showing device, also can also big picture corresponding.
Figure 16 shows the guider of a routine vehicle mounted.Among Figure 16, symbol 1010 expression guider main bodys, the display part (display unit) that electrical devices of the present invention has been used in symbol 1011 expressions.
Figure 17 shows a routine portable image tape deck (video camera).Among Figure 17, the display part that electrical devices of the present invention has been used in symbol 1020 expression tape deck main bodys, symbol 1021 expressions.
Figure 18 illustrates a routine portable phone.Among Figure 18, symbol 1030 expression portable phone main bodys, the display part (display unit) that electro-optical device of the present invention is used in symbol 1031 expressions.
Figure 19 shows information processors such as a routine word processor, personal computer.Among Figure 19, symbol 1040 expression information processors, symbol 1041 expression information processor main bodys, importations such as symbol 1042 expression keyboards, the display part that electro-optical device of the present invention has been used in symbol 1043 expressions.
Figure 20 illustrates a routine Wristwatch-type electronic instrument.Among Figure 20, the display part that electro-optical device of the present invention has been used in symbol 1050 expression wrist-watch main bodys, symbol 1051 expressions.
Electronic instrument shown in Figure 15-20 as display unit, has electro-optical device of the present invention, so can realize durability and superior in quality demonstration.
Above one side is with reference to accompanying drawing, most preferred embodiment of the present invention has been described on one side, but can not say, the present invention only limits to this example, in the above-mentioned example, each shape of each shown component parts and combination etc. only are examples, in the scope that does not break away from main points of the present invention, according to designing requirement etc., can make many variations.
According to substrate of the present invention and manufacture method thereof, for example, can reduce the parasitic capacity that produces by conductive portion etc., realized the stability of substrate.
According to electronic installation of the present invention and manufacture method thereof, functional membrane can be brought into play good performance, because the high speed of suitable work, thus pictureization greatly, and realized that electro-optical device can work steadily in the long term.
According to electronic instrument of the present invention, as showing dress, has electronic installation of the present invention, so can show work in tracking property good stable ground.

Claims (18)

1. wiring substrate, it is characterized in that: comprise contain insulated substrate (15,121) and above above-mentioned insulated substrate set distribution (131,132,133) matrix and at the separator (18,281) of above-mentioned substrates configuration, be provided with the zone that does not form above-mentioned separator on above-mentioned matrix, the dielectric constant of above-mentioned separator is lower than the dielectric constant of above-mentioned insulated substrate.
2. wiring substrate according to claim 1 is characterized in that: the dielectric constant of above-mentioned separator (18,281) is below 3.
3. wiring substrate according to claim 1 is characterized in that: the dielectric constant of above-mentioned separator (18,281) is below 2.5.
4. according to any described wiring substrate among the claim 1-3, it is characterized in that: contain active element (16,142,143) in the above-mentioned matrix.
5. wiring substrate according to claim 4 is characterized in that: between above-mentioned active element (16,142,143) and the above-mentioned separator (18,281), be provided with the barrier layer (20,271) that inhibiting substances sees through at least.
6. according to any described distributing board among the claim 1-3, it is characterized in that: above-mentioned separator (18,281) comprise any in silica glass, alkyl siloxane polymer, alkyl silicon silsequioxane polymer, hydrogenation alkyl silicon silsequioxane polymer, the polyaryl ether on glass plate rotary press modelling film, diamond film, and fluorinated amorphous carbon element film at least a.
7. according to any described wiring substrate among the claim 1-3, it is characterized in that: above-mentioned separator (18,281) is formed by porous material.
8. according to any described wiring substrate among the claim 1-3, it is characterized in that: above-mentioned separator (18,281) contains at least a kind in the article that contain particulate in aeroge, porous matter silica, the gel that has disperseed the magnesium fluoride particulate, fluorine based polymer and the porous polymer.
9. electronic installation, have wiring substrate (11) and functional membrane (140,286), it is characterized in that: described wiring substrate comprise contain substrate (15,121) and above described matrix set distribution (131,132,133) matrix and at the slider (18,281) of above-mentioned substrates configuration, on aforesaid substrate, be provided with the zone that does not form above-mentioned separator, the dielectric constant of above-mentioned separator is lower than the dielectric constant of aforesaid substrate, and at the above-mentioned zone of above-mentioned wiring substrate, corresponding configuration feature film.
10. electro-optical device, it is characterized in that: comprise and contain substrate (15,121) set distribution (131 and above aforesaid substrate, 132,133) matrix, be configured in a plurality of pixel electrodes (141) of above-mentioned substrates, be configured in pixel electrodes top to electrode (154), at each above-mentioned a plurality of pixel electrodes with the functional membrane that contains electrooptic material (140 that disposes between to electrode, 286) and be arranged on around the above-mentioned functions film, be configured in above-mentioned to the separator (18 between electrode and the above-mentioned substrates, 281), the dielectric constant of above-mentioned separator is lower than the dielectric constant of aforesaid substrate.
11. electro-optical device according to claim 10 is characterized in that: above-mentioned electrooptic material is an electroluminescent organic material.
12. according to claim 10 or 11 described electro-optical devices, it is characterized in that: above-mentioned matrix also contains the active element (16,142,143) that is connected with pixel electrodes, and above-mentioned distribution contains signal wiring from signal to above-mentioned active element that supply with.
13., it is characterized in that according to claim 10 or 11 described electro-optical devices: above-mentioned separator (18,281) comprise any in silica glass, alkyl siloxane polymer, alkyl silicon silsequioxane polymer, hydrogenation alkyl silicon silsequioxane polymer, the polyaryl ether on glass plate rotary press modelling film, diamond film, and fluorinated amorphous carbon element film at least a.
14. according to claim 10 or 11 described electro-optical devices, it is characterized in that: above-mentioned separator (18,281) is formed by porous matter.
15. according to claim 10 or 11 described electro-optical devices, it is characterized in that: above-mentioned separator (8,281) contains at least a kind in the article that contain particulate in aeroge, porous matter silica, the gel that has disperseed the magnesium fluoride particulate, fluorine based polymer and the porous polymer.
16. electro-optical device according to claim 12 is characterized in that: between above-mentioned separator (18,281) and above-mentioned active element (16,142,143), be provided with the barrier layer (20,271) that the energy inhibiting substances sees through.
17., it is characterized in that above-mentioned separator (18,281) at least a portion is by preventing that the diaphragm that material passes through (21,272) from being covered according to claim 10 or 11 described electro-optical devices.
18. electronic instrument, has electro-optical device as display unit, it is characterized in that: described electro-optical device (10) comprises and contains substrate (15,121) set distribution (131 and above aforesaid substrate, 132,133) matrix, be configured in a plurality of pixel electrodes (141) of above-mentioned substrates, be configured in pixel electrodes top to electrode (154), at each above-mentioned a plurality of pixel electrodes with the functional membrane that contains electrooptic material (140 that disposes between to electrode, 286) and be arranged on around the above-mentioned functions film, be configured in above-mentioned to the separator (18 between electrode and the above-mentioned substrates, 281), the dielectric constant of above-mentioned separator is lower than the dielectric constant of aforesaid substrate.
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