TWI259575B - Circuit board, electronic device, electro-optic device, and electronic machine - Google Patents

Circuit board, electronic device, electro-optic device, and electronic machine Download PDF

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Publication number
TWI259575B
TWI259575B TW092106057A TW92106057A TWI259575B TW I259575 B TWI259575 B TW I259575B TW 092106057 A TW092106057 A TW 092106057A TW 92106057 A TW92106057 A TW 92106057A TW I259575 B TWI259575 B TW I259575B
Authority
TW
Taiwan
Prior art keywords
substrate
film
wiring
disposed
polymer
Prior art date
Application number
TW092106057A
Other languages
English (en)
Chinese (zh)
Other versions
TW200306661A (en
Inventor
Takashi Miyazawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200306661A publication Critical patent/TW200306661A/zh
Application granted granted Critical
Publication of TWI259575B publication Critical patent/TWI259575B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/024Dielectric details, e.g. changing the dielectric material around a transmission line
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0187Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW092106057A 2002-03-20 2003-03-19 Circuit board, electronic device, electro-optic device, and electronic machine TWI259575B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002079509 2002-03-20
JP2003070531A JP4015044B2 (ja) 2002-03-20 2003-03-14 配線基板、電子装置及び電子機器

Publications (2)

Publication Number Publication Date
TW200306661A TW200306661A (en) 2003-11-16
TWI259575B true TWI259575B (en) 2006-08-01

Family

ID=28043810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092106057A TWI259575B (en) 2002-03-20 2003-03-19 Circuit board, electronic device, electro-optic device, and electronic machine

Country Status (4)

Country Link
JP (1) JP4015044B2 (ja)
KR (1) KR100574261B1 (ja)
CN (1) CN1285242C (ja)
TW (1) TWI259575B (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146208B1 (ko) * 2003-11-14 2012-05-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 표시 장치 및 그 제조 방법
KR20050113045A (ko) * 2004-05-28 2005-12-01 삼성에스디아이 주식회사 유기 전계 발광 표시 소자 및 그 제조방법
JP4876415B2 (ja) * 2005-03-29 2012-02-15 セイコーエプソン株式会社 有機el装置の製造方法、デバイスの製造方法
KR101143006B1 (ko) * 2005-10-28 2012-05-08 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
KR100777744B1 (ko) * 2006-10-27 2007-11-19 삼성에스디아이 주식회사 평판 디스플레이 장치
WO2008065589A1 (en) * 2006-11-28 2008-06-05 Koninklijke Philips Electronics N.V. Electronic device using movement of particles
KR101338739B1 (ko) * 2006-12-29 2013-12-06 엘지디스플레이 주식회사 액정 표시 장치용 박막 트랜지스터 기판 및 이의 제조 방법
CN101730938B (zh) * 2007-07-04 2012-10-10 皇家飞利浦电子股份有限公司 在衬底上形成图案化层的方法
WO2012073795A1 (ja) * 2010-11-30 2012-06-07 シャープ株式会社 表示装置およびその駆動方法、並びに電子装置
KR101874048B1 (ko) * 2011-01-14 2018-07-06 삼성디스플레이 주식회사 유기 발광 표시장치
KR102059014B1 (ko) 2013-05-28 2019-12-26 삼성디스플레이 주식회사 발광 표시 장치 및 그 제조 방법
WO2015111715A1 (ja) * 2014-01-24 2015-07-30 トッパン・フォームズ株式会社 配線板
CN104218190B (zh) 2014-08-26 2017-02-15 京东方科技集团股份有限公司 有机电致发光器件及其制造方法、显示装置
CN104409647A (zh) 2014-11-14 2015-03-11 京东方科技集团股份有限公司 一种像素单元及其制作方法、发光器件、显示装置
CN106848024A (zh) * 2017-02-20 2017-06-13 深圳市华星光电技术有限公司 发光器件及显示装置
US11985892B2 (en) 2017-09-12 2024-05-14 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, light-emitting apparatus, electronic device, and lighting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541625B2 (ja) * 1997-07-02 2004-07-14 セイコーエプソン株式会社 表示装置及びアクティブマトリクス基板
JP3580092B2 (ja) * 1997-08-21 2004-10-20 セイコーエプソン株式会社 アクティブマトリクス型表示装置
JP2000331991A (ja) * 1999-03-15 2000-11-30 Sony Corp 半導体装置の製造方法
JP4683696B2 (ja) * 1999-07-09 2011-05-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001284297A (ja) * 2000-03-31 2001-10-12 Sony Corp 研磨装置、研磨方法および半導体装置の製造方法
JP4889872B2 (ja) * 2000-04-17 2012-03-07 株式会社半導体エネルギー研究所 発光装置及びそれを用いた電気器具
JP2002026122A (ja) * 2000-07-04 2002-01-25 Sony Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
CN1285242C (zh) 2006-11-15
KR100574261B1 (ko) 2006-04-27
TW200306661A (en) 2003-11-16
KR20030079684A (ko) 2003-10-10
JP4015044B2 (ja) 2007-11-28
CN1446028A (zh) 2003-10-01
JP2004004610A (ja) 2004-01-08

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