CN1271711C - 暴露信号线以及在信号线与基片之间有间隙的半导体器件 - Google Patents
暴露信号线以及在信号线与基片之间有间隙的半导体器件 Download PDFInfo
- Publication number
- CN1271711C CN1271711C CNB021230021A CN02123002A CN1271711C CN 1271711 C CN1271711 C CN 1271711C CN B021230021 A CNB021230021 A CN B021230021A CN 02123002 A CN02123002 A CN 02123002A CN 1271711 C CN1271711 C CN 1271711C
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- electrode
- signal
- lead
- semiconductor device
- semiconductor chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP367309/2001 | 2001-11-30 | ||
JP2001367309A JP4054188B2 (ja) | 2001-11-30 | 2001-11-30 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1423326A CN1423326A (zh) | 2003-06-11 |
CN1271711C true CN1271711C (zh) | 2006-08-23 |
Family
ID=19177078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021230021A Expired - Fee Related CN1271711C (zh) | 2001-11-30 | 2002-06-13 | 暴露信号线以及在信号线与基片之间有间隙的半导体器件 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6781223B2 (zh) |
EP (1) | EP1316996A3 (zh) |
JP (1) | JP4054188B2 (zh) |
KR (1) | KR100728144B1 (zh) |
CN (1) | CN1271711C (zh) |
TW (1) | TW558805B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004349316A (ja) * | 2003-05-20 | 2004-12-09 | Renesas Technology Corp | 半導体装置及びその製造方法 |
US7425759B1 (en) * | 2003-11-20 | 2008-09-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bumped terminal and filler |
US6894382B1 (en) * | 2004-01-08 | 2005-05-17 | International Business Machines Corporation | Optimized electronic package |
US7009286B1 (en) * | 2004-01-15 | 2006-03-07 | Asat Ltd. | Thin leadless plastic chip carrier |
US20050285281A1 (en) * | 2004-06-29 | 2005-12-29 | Simmons Asher L | Pad-limited integrated circuit |
JP2006093575A (ja) * | 2004-09-27 | 2006-04-06 | Hitachi Cable Ltd | 半導体装置およびその製造方法 |
TWI284407B (en) * | 2005-11-03 | 2007-07-21 | Cyntec Co Ltd | Package device with electromagnetic interference shield |
JP2009515357A (ja) * | 2005-11-08 | 2009-04-09 | エヌエックスピー ビー ヴィ | 供給基準コームを備えたリードフレームベースのicパッケージ |
JP2008294278A (ja) * | 2007-05-25 | 2008-12-04 | Fujitsu Microelectronics Ltd | 半導体装置、リードフレーム、及び半導体装置の実装構造 |
JP5223635B2 (ja) * | 2008-12-04 | 2013-06-26 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP4996729B2 (ja) * | 2010-09-15 | 2012-08-08 | 株式会社東芝 | 電子機器および基板アセンブリ |
US9913363B2 (en) * | 2011-09-29 | 2018-03-06 | Rambus Inc. | Structure for delivering power |
JP5440748B1 (ja) * | 2012-02-28 | 2014-03-12 | 株式会社村田製作所 | 高周波モジュール |
US9269653B2 (en) * | 2012-06-27 | 2016-02-23 | Mediatek Inc. | SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern |
US10426035B2 (en) | 2012-06-27 | 2019-09-24 | Mediatek Inc. | SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2580674B2 (ja) | 1988-02-08 | 1997-02-12 | 三菱電機株式会社 | 高周波用モールド型パッケージ |
US5196725A (en) * | 1990-06-11 | 1993-03-23 | Hitachi Cable Limited | High pin count and multi-layer wiring lead frame |
JPH04107940A (ja) | 1990-08-29 | 1992-04-09 | Hitachi Ltd | 半導体装置及びその構成部品 |
JPH04186645A (ja) * | 1990-11-16 | 1992-07-03 | Sanyo Electric Co Ltd | マイクロ波集積回路の製造方法 |
JPH0828394B2 (ja) * | 1990-11-28 | 1996-03-21 | 三菱電機株式会社 | 半導体装置 |
US5557144A (en) | 1993-01-29 | 1996-09-17 | Anadigics, Inc. | Plastic packages for microwave frequency applications |
US5381037A (en) * | 1993-06-03 | 1995-01-10 | Advanced Micro Devices, Inc. | Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies |
JPH0714976A (ja) * | 1993-06-24 | 1995-01-17 | Shinko Electric Ind Co Ltd | リードフレーム及び半導体装置 |
US5637914A (en) * | 1994-05-16 | 1997-06-10 | Hitachi, Ltd. | Lead frame and semiconductor device encapsulated by resin |
JP3278093B2 (ja) * | 1994-08-31 | 2002-04-30 | 沖電気工業株式会社 | 半導体デバイス |
JP3181229B2 (ja) * | 1996-07-12 | 2001-07-03 | 富士通株式会社 | 半導体装置及びその製造方法及びその実装方法及びリードフレーム及びその製造方法 |
JP3129169B2 (ja) | 1995-11-08 | 2001-01-29 | 富士通株式会社 | 半導体装置及びその製造方法 |
JPH10247717A (ja) * | 1997-03-04 | 1998-09-14 | Matsushita Electron Corp | 半導体装置 |
JP3764587B2 (ja) * | 1998-06-30 | 2006-04-12 | 富士通株式会社 | 半導体装置の製造方法 |
US6285075B1 (en) * | 1998-11-02 | 2001-09-04 | Asat, Limited | Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly |
KR20000071375A (ko) * | 1999-02-25 | 2000-11-25 | 윌리엄 비. 켐플러 | 땜납 볼을 모방한 융기를 갖는 집적 회로 소자 및 그 제조방법 |
JP3691993B2 (ja) * | 1999-10-01 | 2005-09-07 | 新光電気工業株式会社 | 半導体装置及びその製造方法並びにキャリア基板及びその製造方法 |
JP4464527B2 (ja) | 1999-12-24 | 2010-05-19 | 大日本印刷株式会社 | 半導体搭載用部材およびその製造方法 |
KR100369393B1 (ko) * | 2001-03-27 | 2003-02-05 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법 |
US6608375B2 (en) * | 2001-04-06 | 2003-08-19 | Oki Electric Industry Co., Ltd. | Semiconductor apparatus with decoupling capacitor |
TW586208B (en) * | 2002-02-26 | 2004-05-01 | Advanced Semiconductor Eng | Wafer-level packaging structure |
JP5684505B2 (ja) * | 2010-07-16 | 2015-03-11 | 株式会社キーエンス | 画像処理装置、画像処理方法及びコンピュータプログラム |
JP5987477B2 (ja) * | 2012-05-30 | 2016-09-07 | 株式会社ニデック | 眼科撮影装置 |
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2001
- 2001-11-30 JP JP2001367309A patent/JP4054188B2/ja not_active Expired - Fee Related
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2002
- 2002-05-17 US US10/146,904 patent/US6781223B2/en not_active Expired - Fee Related
- 2002-05-17 EP EP02253491A patent/EP1316996A3/en not_active Withdrawn
- 2002-05-20 TW TW091110521A patent/TW558805B/zh active
- 2002-05-30 KR KR1020020030209A patent/KR100728144B1/ko not_active IP Right Cessation
- 2002-06-13 CN CNB021230021A patent/CN1271711C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1316996A3 (en) | 2005-02-02 |
EP1316996A2 (en) | 2003-06-04 |
US6781223B2 (en) | 2004-08-24 |
CN1423326A (zh) | 2003-06-11 |
JP2003168764A (ja) | 2003-06-13 |
KR20030044761A (ko) | 2003-06-09 |
TW558805B (en) | 2003-10-21 |
KR100728144B1 (ko) | 2007-06-13 |
JP4054188B2 (ja) | 2008-02-27 |
US20030102550A1 (en) | 2003-06-05 |
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