CN1245194A - 用烯丙基化酰胺化合物制备的底层填充密封剂 - Google Patents

用烯丙基化酰胺化合物制备的底层填充密封剂 Download PDF

Info

Publication number
CN1245194A
CN1245194A CN99118906A CN99118906A CN1245194A CN 1245194 A CN1245194 A CN 1245194A CN 99118906 A CN99118906 A CN 99118906A CN 99118906 A CN99118906 A CN 99118906A CN 1245194 A CN1245194 A CN 1245194A
Authority
CN
China
Prior art keywords
group
chain
alkyl
independently
carbon atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN99118906A
Other languages
English (en)
Chinese (zh)
Inventor
R·A·舒尔茨
D·赫尔
肖朝东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of CN1245194A publication Critical patent/CN1245194A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/285—Nitrogen containing compounds
    • C08G18/2875—Monohydroxy compounds containing tertiary amino groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN99118906A 1998-07-02 1999-06-30 用烯丙基化酰胺化合物制备的底层填充密封剂 Pending CN1245194A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US9150798P 1998-07-02 1998-07-02
US60/091,507 1998-07-02
US09/336,633 1999-06-18
US09/336,633 US6350840B1 (en) 1998-07-02 1999-06-18 Underfill encapsulants prepared from allylated amide compounds

Publications (1)

Publication Number Publication Date
CN1245194A true CN1245194A (zh) 2000-02-23

Family

ID=26784028

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99118906A Pending CN1245194A (zh) 1998-07-02 1999-06-30 用烯丙基化酰胺化合物制备的底层填充密封剂

Country Status (7)

Country Link
US (2) US6350840B1 (US06350841-20020226-C00029.png)
EP (1) EP0969061A3 (US06350841-20020226-C00029.png)
JP (1) JP2000095828A (US06350841-20020226-C00029.png)
KR (1) KR100591976B1 (US06350841-20020226-C00029.png)
CN (1) CN1245194A (US06350841-20020226-C00029.png)
SG (1) SG85119A1 (US06350841-20020226-C00029.png)
TW (1) TW499439B (US06350841-20020226-C00029.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103773391A (zh) * 2012-10-17 2014-05-07 Jsr株式会社 液晶取向剂、液晶取向膜、液晶显示元件、聚合物及化合物

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9816171D0 (en) 1998-07-25 1998-09-23 Secr Defence Monomers and network polymers obtained therefrom
GB9816169D0 (en) 1998-07-25 1998-09-23 Secr Defence Adhesives and sealants
GB9816167D0 (en) 1998-07-25 1998-09-23 Secr Defence Polymer production
GB9928621D0 (en) * 1999-12-04 2000-02-02 Secr Defence Brit Composition for use in stereolithography
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US6798806B1 (en) * 2002-09-03 2004-09-28 Finisar Corporation Hybrid mirror VCSELs
US7166491B2 (en) 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US7026376B2 (en) * 2003-06-30 2006-04-11 Intel Corporation Fluxing agent for underfill materials
US7037447B1 (en) 2003-07-23 2006-05-02 Henkel Corporation Conductive ink compositions
CN100528848C (zh) * 2004-01-16 2009-08-19 国家淀粉及化学投资控股公司 带氰尿酸酯核的顺丁烯二酰亚胺树脂
US7160946B2 (en) * 2004-04-01 2007-01-09 National Starch And Chemical Investment Holding Corporation Method to improve high temperature cohesive strength with adhesive having multi-phase system
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
JP2013083958A (ja) * 2011-09-26 2013-05-09 Nippon Steel & Sumikin Chemical Co Ltd 感光性樹脂組成物、それを用いた硬化物及び半導体素子
US9431274B2 (en) * 2012-12-20 2016-08-30 Intel Corporation Method for reducing underfill filler settling in integrated circuit packages
CN109735280B (zh) * 2019-01-04 2020-06-09 中国科学技术大学 紫外光响应性聚合物粘合剂及其制备方法和用途

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403172A (en) 1964-01-03 1968-09-24 Agriculture Usa Hard, high-melting waxes from longchain n-allylamides
DE2853992A1 (de) 1978-12-14 1980-07-03 Basf Ag Selbstverloeschende thermoplastische formmassen und formteile aus diesen
FR2469421A1 (fr) 1979-11-09 1981-05-22 Rhone Poulenc Ind Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable
US4336311A (en) 1980-08-25 1982-06-22 Sprague Electric Company Humidity- and salt-resistant electronic component
EP0051165A1 (en) 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4485218A (en) 1982-02-18 1984-11-27 General Electric Company Encapsulating composition for inductive devices containing elastomeric polybutadiene having predominate trans-1,4 configuration
US4519929A (en) * 1982-02-19 1985-05-28 Edwin Cooper, Inc. Lubricating oil composition containing N-allyl amide graft copolymers
DE3233912A1 (de) 1982-09-13 1984-03-15 Merck Patent Gmbh, 6100 Darmstadt Fotolacke zur ausbildung von reliefstrukturen aus hochwaermebestaendigen polymeren
US4450650A (en) 1982-09-20 1984-05-29 Holden John E Action play toy
US4613637A (en) 1983-12-27 1986-09-23 Hughes Aircraft Company Copolymers utilizing isoimides and method of preparing same
US4533975A (en) 1983-12-27 1985-08-06 North American Philips Corporation Radiation hardenable coating and electronic components coated therewith
DE3443090A1 (de) 1984-11-27 1986-05-28 Bayer Ag, 5090 Leverkusen Aromatische polyester mit dimethylmaleinimid-endgruppen, ihre herstellung und verwendung
DE3665453D1 (en) * 1985-07-01 1989-10-12 Rhone Poulenc Chimie Maleimides and thermohardening compositions containing them
US4623559A (en) 1985-07-12 1986-11-18 Westinghouse Electric Corp. U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating
US4720445A (en) 1986-02-18 1988-01-19 Allied Corporation Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist
JPS62207320A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 熱硬化性樹脂組成物で封止してなる半導体装置
US4808717A (en) 1986-09-17 1989-02-28 Sumitomo Chemical Company, Limited Thermosetting resin composition
US4826995A (en) 1987-11-25 1989-05-02 Texaco Inc. Bismaleimide derivatives of higher molecular weight polyoxyalkyleneamines
US4876358A (en) 1987-11-25 1989-10-24 Texaco Inc. Oxyethylene bismaleimide derivatives
JPH0637599B2 (ja) 1987-12-08 1994-05-18 ハニー化成株式会社 電着塗装方法
EP0357110A1 (en) 1988-08-05 1990-03-07 Akzo N.V. Two component coating curable at ambient temperature via a Diels-Alder reaction
US4999136A (en) 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5017406A (en) 1988-12-08 1991-05-21 Dow Corning Corporation UV curable compositions cured with polysilane and peroxide initiators
JP2642470B2 (ja) 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
JP2718156B2 (ja) * 1989-03-20 1998-02-25 日立化成工業株式会社 耐熱性接着剤組成物
EP0390565A3 (en) * 1989-03-31 1992-02-26 Mitsui Petrochemical Industries, Ltd. Imide prepolymers, cured products, method for making the same, laminate preparation, and encapsulating compositions
JP2679849B2 (ja) 1989-07-26 1997-11-19 松下電器産業株式会社 電子部品の実装方法およびこの方法に用いる接着剤
CA2040619A1 (en) 1990-04-19 1991-10-20 Yoshichi Hagiwara Photocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereof
US5082735A (en) * 1990-05-04 1992-01-21 Dow Corning Corporation Process of curing methylhydrosiloxanes
JPH04115407A (ja) 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3118246B2 (ja) 1990-10-11 2000-12-18 綜研化学株式会社 熱硬化型接着剤
JP3128291B2 (ja) 1990-10-31 2001-01-29 株式会社東芝 マレイミド樹脂組成物およびこれを用いた樹脂封止型半導体装置
US5532296A (en) 1991-07-30 1996-07-02 Cytec Technology Corp. Bismaleimide resin systems toughened by addition of preformed functionalized low Tg elastomer particles
DE69232851T2 (de) 1991-07-30 2003-09-04 Cytec Tech Corp Gehärtete, faserverstärkte härtbare Harzmatrixprepregs und Verbundstoffe daraus
US5187006A (en) * 1991-09-24 1993-02-16 National Starch And Chemical Investment Holding Corporation N-allyl-N-dialkoxyethyl amide or amine emulsion binders for nonwoven fabrics
JP2669247B2 (ja) * 1992-02-13 1997-10-27 信越化学工業株式会社 熱硬化性樹脂組成物
US5314950A (en) 1993-01-22 1994-05-24 Cytec Technology Corp. Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides
US5602205A (en) 1993-01-22 1997-02-11 Cytec Technology Corp. N-(substituted) maleimides and compositions incorporating the same
US5347258A (en) 1993-04-07 1994-09-13 Zycon Corporation Annular resistor coupled with printed circuit board through-hole
US5744557A (en) 1993-06-16 1998-04-28 Minnesota Mining And Manufacturing Company Energy-curable cyanate/ethylenically unsaturated compositions
JPH0855940A (ja) * 1994-08-12 1996-02-27 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物
EP1344789A3 (en) 1994-09-02 2004-01-02 Quantum Materials, Inc. Thermosetting resin composition containing malemide and/or vinyl compounds
DK0861281T3 (da) 1995-11-13 2002-09-16 Cytec Tech Corp Varmehærdelig bismaleimidpolymer til anvendelse i kompositter og adhæsiver
JPH10101796A (ja) * 1996-09-30 1998-04-21 Matsushita Electric Works Ltd イミド樹脂組成物
JPH10168413A (ja) 1996-12-16 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
US5726391A (en) 1996-12-16 1998-03-10 Shell Oil Company Thermosetting Encapsulants for electronics packaging
US5760337A (en) 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
KR20000011446A (ko) * 1998-07-02 2000-02-25 쉬한 존 엠. 알릴화아미드화합물로제조되는회로부품용조성물

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103773391A (zh) * 2012-10-17 2014-05-07 Jsr株式会社 液晶取向剂、液晶取向膜、液晶显示元件、聚合物及化合物
CN103773391B (zh) * 2012-10-17 2016-11-02 Jsr株式会社 液晶取向剂、液晶取向膜、液晶显示元件、聚合物及化合物

Also Published As

Publication number Publication date
TW499439B (en) 2002-08-21
EP0969061A3 (en) 2000-02-23
SG85119A1 (en) 2001-12-19
US6350841B1 (en) 2002-02-26
EP0969061A2 (en) 2000-01-05
KR20000011444A (ko) 2000-02-25
JP2000095828A (ja) 2000-04-04
KR100591976B1 (ko) 2006-06-20
US6350840B1 (en) 2002-02-26

Similar Documents

Publication Publication Date Title
CN1225956C (zh) 用可再加工封装密封剂制造密封电子元件的方法
CN1245194A (zh) 用烯丙基化酰胺化合物制备的底层填充密封剂
CN1140603C (zh) 电子装置用的封装密封组合物
CN1245181A (zh) 用于制造电路元件和印刷电路板的组合物
CN1248603A (zh) 微电子装置用的小片粘附粘合剂
CN1252144C (zh) 用于微电子器件的模片固定粘合剂
CN1100806C (zh) 有机硼烷多胺加成物引发剂体系和由其制得的可聚合组合物
JP2000053728A (ja) 硬化可能なアンダ―フィル封入剤組成物
CN1249302A (zh) 烯丙基化的酰胺化合物和由其制备的塑料主板粘合剂
CN1769353A (zh) 热塑性弹性体
CN1175044C (zh) 环氧树脂组合物和半导体设备
CN1673242A (zh) 用于环烯烃的聚合和共聚的催化剂配合物
EP1620488B1 (en) Adhesive compositions containing hybrid oxetane compounds
CN1200113A (zh) 包含苯酚基团和芳香胺基团的抗氧化剂
CN1254182A (zh) 用可再加工缝隙填料密封剂制造电子元件的方法
CN1198750A (zh) 通过在稳定的自由基存在下进行1,3－二烯的控制的自由基聚合制备1,3－二烯的遥爪低聚物的方法
CN1175016C (zh) 芳香族聚碳化二亚胺及其片材
CN1209425C (zh) 塑料溶胶组合物、凝胶化膜及物品
CN1253969A (zh) 由烯丙基化酰胺化合物制备的电路元件
CN1252425A (zh) 由烯丙基化酰胺化合物制备的包装密封剂
CN1817890A (zh) 卤素取代的硅杂环戊二烯及其制备方法
CN1243141A (zh) 使用可再加工粘合剂制造电子元件的方法
CN1886431A (zh) 新型的多支链高分子
CN1241605A (zh) 用于电子装置的缝隙填料密封剂组合物
CN1007987B (zh) 可固化的高分子组合物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1025787

Country of ref document: HK