CN1242496C - 用于发光二极管的基片 - Google Patents

用于发光二极管的基片 Download PDF

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CN1242496C
CN1242496C CNB031104924A CN03110492A CN1242496C CN 1242496 C CN1242496 C CN 1242496C CN B031104924 A CNB031104924 A CN B031104924A CN 03110492 A CN03110492 A CN 03110492A CN 1242496 C CN1242496 C CN 1242496C
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metallic substrates
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isolation layer
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CN1452255A (zh
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磯田宽人
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Citizen Electronics Co Ltd
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Abstract

本发明揭示了一种基片，它包括：一对金属基底，在该对金属基底之间形成有第一间隔；一设置在介于两个金属基底之间的第一间隔内的第一隔绝层；一安装在两个金属基底上的第二隔绝层；以及设置在第二隔绝层上、用来在基片上安装发光二极管的安装装置，该安装装置包括设置在第二隔绝层上的一对电路图案以及设置在电路图案上的上电极；设置在金属基底的下侧上的下电极；其中，设有贯穿金属基底以电连接上电极和下电极的通孔。

Description

用于发光二极管的基片
技术领域
本发明涉及用于诸如便携式电话之类的电子设备中的发光二极管(LED)的基片。
背景技术
近年来，随着电子设备的高性能、多功能、小型化的趋势，要求用于LED的基片具有高热辐射性能、耐热性能以及高机械强度。
图15是示出一传统的用于LED的基片的立体图。该基片包括一铜或铝制的金属基底51、粘附在金属基底51上的一预浸渍材料的隔绝层、用铜箔制成并在其上镀金的电路图案53和54。一LED70装在电路图案53上，并通过一导线71连接到电路图案54上。
金属基底51具有高热辐射性能。
图16是另一传统的双面基片的立体图。该基片包括一对铜制的金属基底61、在金属基底61之间的一隔绝件63、粘附在金属基底61两侧上的预浸渍材料的隔绝层62、用铜箔制成并在其上镀金的电路图案64a和64b。一LED72装在电路图案64a上，并且通过一导线连接到电路图案64b。
在图15的基片中，电路图案无法设置在金属基底51的下侧上。在图16所示的基片中，由于隔绝层62设置在金属基片61的下侧，所以热辐射性能不能满足要求。
发明内容
本发明的目的在于提供具有高热辐射性能的基片。
为了实现上述目的，根据本发明的第一个方面，提供了一种基片，它包括：
一对金属基底，在所述金属基底之间形成有第一间隔；
一设置在介于所述两金属基底之间的所述第一间隔内的第一隔绝层；
一安装在所述两金属基底上的第二隔绝层；以及
设置在所述第二隔绝层上、用来在所述基片上安装发光二极管的安装装置，所述安装装置包括设置在所述第二隔绝层上的一对电路图案以及设置在所述电路图案上的上电极；
设置在所述金属基底的下侧上的下电极；
其特点在于，设有贯穿所述金属基底以电连接所述上电极和所述下电极的通孔。
较佳地，在所述第二隔绝层上，在所述电路图案之间和所述上电极之间形成有第二间隔，并且所述发光二极管安装在所述两个上电极上、所述第二间隔之上。
较佳地，所述金属基底的其中之一的截面形状的尺寸不同于另一金属基底的截面形状的尺寸。
根据本发明的第二个方面，提供了一种基片，它包括：
一对金属基底，在所述金属基底之间形成有第一间隔；
一设置在介于所述两金属基底之间的所述第一间隔内的第一隔绝层；
一安装在所述两金属基底上的第二隔绝层，所述第二隔绝层具有露出金属基底的、其上安装有发光二极管的表面的一孔。
本发明的这些和其它目的与特征会从下面参照附图的详细描述中变得清晰。
附图说明
图1是根据本发明第一实施例的一基片的立体图；
图2和3是示出金属基底的制备的立体图；
图4是至9是示出用来制造基片的方法的立体图；
图10是示出根据第二实施例的一基片的立体图；
图11至13是示出第二实施例的基片的制造方法的立体图；
图14是示出根据第三实施例的一基片的立体图；
图15是示出用于LED的一传统基片的立体图；以及
图16是示出另一基片的立体图。
具体实施方式
图1是根据本发明第一实施例的一基片的立体图。
基片包括一对铜制的金属基底1a和1b，每一基底为立方体形；在金属基底1a与1b之间的一预浸渍材料的第一隔绝层2；粘附在金属基底1a和1b上的一预浸渍材料的第二隔绝层3；设置在第二隔绝层3上的用铜箔制成的一对电路图案4a和4b。在电路图案4a和4b上，通过镀金形成端电极6a，并且在金属基底的下侧上形成端电极6b。一LED 40通过端电极6a和6b安装在电路图案4a和4b两者上。
在电路图案4a和4b上的LED 40通过穿透金属基底1a和1b的孔5连接到端电极6a和6b。
基片的尺寸例如可如图1所示。
由于金属基底由具有高热传导性的铜制成，并且在金属基底的下侧上不设置隔绝层，所以基片的热辐射性尤佳。因此，使用该基片的一LED装置适用于要求大电流的LED中。
图2和3是示出金属基底的制备的立体图。准备了多个金属基底的集合体101和第一隔绝层的集合体102。如图3所示，一对金属基底集合体101和隔绝层集合体通过热压粘合在一起，从而形成一组合板(set plate)105。
请参见图4，在导向板106之间布置多块组合板105，并且在相邻的组合板105之间隔开一个间隙105a。接着，沿着切割线107切割组合板105和导向板106，以获得如图5所示的一组合板集合体108。
请参见图6，将一第二隔绝层集合体103和一电路图案层集合体104装在该组合板集合体108上，并通过热压将其粘附，以形成一集合体109。
接着，如图7所示，电路图案层集合体104通过蚀刻进行切割，以形成多个凹槽104a，从而将集合体104分离成第一和第二电路图案集合体104F和104S。此外，切割集合体104以形成与间隙105a相对应的凹槽104b。此外，在集合体104F和104S两者中形成多个通孔5。
如图8所示，通过镀金来覆盖集合体109的基底层，以形成端电极6a和6b。此时，金进入通孔以连接上和下电极6a和6b。
最后，如图9所示，切去导向板106，并且集合体109被分离成诸单元基片。
图10是示出根据第二实施例的一基片的立体图。
该基片包括一对铜制的金属基底11a和11b、在金属基底11a与11b之间的一预浸渍材料的第一隔绝层12、粘附在金属基底11a和11b上的一预浸渍材料的第二隔绝层13。隔绝层13有一中心孔13a。一LED在中心孔13a中装于金属基底11a和11b两者上。
由于LED20直接装在金属基底11a和11b上，所以热辐射性能高。
其制造方法与第一实施例的图2至5的步骤相同。
请参见图11，将具有多个中心孔13a的一第二隔绝层集合体203装在组合板集合体108上，并且通过热压将其粘附，以形成一集合体209。
接着，如图12所示，通过切割在间隙105a处将第二隔绝层集合体203切开，以形成多个凹槽，从而分离集合体203。
如图13所示，切去导向板106，并且被集合体209被分离成诸单元基片。
图14是示出根据本发明的第三实施例的一基片的立体图。
该基片包括一对铜制的金属基底30a和30b、在金属基底30a与30b之间的一预浸渍材料的第一隔绝层31、粘附在金属基底30a和30b上的一预浸渍材料的第二隔绝层32、设置在第二隔绝层32上的用铜箔制成的一对电路图案33a和33b。一LED装于电路图案33a和33b两者上。
在电路图案33a和33b上的LED35通过通孔36连接到金属基底30a和30b上。
在第三实施例的基片中，金属基底30a与30b的截面形状的尺寸是不同的，因此，第一隔绝层的位置就偏离中心线。
第一隔绝层31在厚度方向上的热膨胀系数较大，所以金属基底30a和30b的位置就偏移，这可在LED35中产生应力。
但是，由于第二隔绝层32在平面方向的热膨胀系数较小，所以就防止金属基底发生偏移，从而防止在LED中产生应力。
此外，由于第一隔绝层31是偏心的，所以降低了第一隔绝层的热膨胀的影响。
根据本发明，可以获得热辐射性能、隔绝性能优秀的基片。
尽管本发明是结合其较佳的特殊实施例进行描述的，但人们会理解，这种描述是用于进行说明，而不是限制本发明的保护范围，本发明的保护范围由下面的权利要求书来定义。

Claims (4)

1.一种基片，它包括：
一对金属基底，在所述金属基底之间形成有第一间隔；
一设置在介于所述两金属基底之间的所述第一间隔内的第一隔绝层；
一安装在所述两金属基底上的第二隔绝层；以及
设置在所述第二隔绝层上、用来在所述基片上安装发光二极管的安装装置，所述安装装置包括设置在所述第二隔绝层上的一对电路图案以及设置在所述电路图案上的上电极；
设置在所述金属基底的下侧上的下电极；
其特征在于，设有贯穿所述金属基底以电连接所述上电极和所述下电极的通孔。
2.如权利要求1所述的基片，其特征在于，在所述第二隔绝层上，在所述电路图案之间和所述上电极之间形成有第二间隔，并且所述发光二极管安装在所述两个上电极上、所述第二间隔之上。
3.如权利要求1所述的基片，其特征在于，所述金属基底的其中之一的截面形状的尺寸不同于另一金属基底的截面形状的尺寸。
4.一种基片，它包括：
一对金属基底，在所述金属基底之间形成有第一间隔；
一设置在介于所述两金属基底之间的所述第一间隔内的第一隔绝层；
一安装在所述两金属基底上的第二隔绝层，所述第二隔绝层具有露出金属基底的、其上安装有发光二极管的表面的一孔。
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