GB2529445A - Method of making graphene LED bulb - Google Patents
Method of making graphene LED bulb Download PDFInfo
- Publication number
- GB2529445A GB2529445A GB1414792.0A GB201414792A GB2529445A GB 2529445 A GB2529445 A GB 2529445A GB 201414792 A GB201414792 A GB 201414792A GB 2529445 A GB2529445 A GB 2529445A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- glass substrate
- flexible substrate
- flexible
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 239000011521 glass Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 8
- 238000003698 laser cutting Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 5
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- 238000001039 wet etching Methods 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Led Device Packages (AREA)
Abstract
A method of making a graphene LED bulb contains steps of: providing a glass substrate or other flexible substrate; sputtering and plating copper material on the glass substrate or other flexible substrate; coating photo resist, drying, and wet etching the substrate on which the copper material is plated; forming a printed circuit board (PCB) on the substrate; forming a graphene layer on the substrate or other flexible substrate by using a CVD (chemical vapor deposition) machine; bonding a flip chip on the substrate; molding or spraying a phosphor layer on the flip chip; laser cutting the substrate to form a graphene LED filament; and fixing the graphene LED filaments either rigid or flexible into a light bulb.
Description
METHOD OF MAKING GRAPHENE LED BULB
FIELD OF THE INVENTION
The present invention relates to a method of making a graphene LED bulb which increases the thermal conductivity of the graphene LED bulb by 20%.
BACKGROUND OF THE INVENTION
An LED bulb is a light-emitting diode (LED) product that is assembled into the light bulb for use in lighting fixtures. LED bulbs have a lifespan and electrical efficiency that is several times better than incandescent lamps, and significantly better than most fluorescent lamps, with some chips able to emit more than 100 lumens per watt. LED's are highly efficient emitting far more light than even fluorescent tubes or incandescent lamps. LED bulbs do not generate as much heat as incandescent bulbs, however if heat is not properly disbursed a LED bulb will burn out much faster.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
SUMMARY OF THE INVENTION
The primaiy object of the present invention is to provide a method of making a graphene LED bulb which increases the thermal conductivity of the graphene LED bulb by 20%.
A method of making a graphene LED bulb provided by the present invention contains steps of: A. providing a glass substrate or other flexible substrate; B. sputtering and plating copper material on the glass substrate or other flexible substrate; C. coating photo resist, drying, and wet etching the glass substrate or other flexible substrate on which the copper material is plated; D. forming a printed circuit board (PCB) on the glass substrate, wherein after fonning the printed circuit board (PCB) on the glass substrate or other flexible substrate, the glass substrate or other flexible substrate is post-treated by the cleaning machine E. forming a graphene layer on the glass substrate or other flexible substrate by using a CVD (chemical vapor deposition) machine; F. bonding a flip chip on the glass substrate or other flexible substrate, wherein the flip chip is bonded on the glass substrate or other flexible substrate by a bonder; G. molding or spraying a phosphor layer on the flip chip, wherein phosphor material is coated on the flip chip which is bonded on the glass substrate or other flexible substrate; H. laser cutting the glass substrate or other flexible substrate to form a graphene LED filament; I. fixing the graphene LED filaments either rigid or flexible into a light btdb.
BRIEF DESCRIPTION OF THE DRAWINGS
These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description and accompanying drawings where: FIG. 1 is a flow chart of a method of making a graphene LED bulb according a preferred embodiment of the present invention.
FIG. 2 is a schematic view showing plating copper material on the glass substrate or other flexible substrate according to the preferred embodiment of the present invention.
FIG. 3 is a schematic view showing forming a graphene layer on the glass substrate or other flexible substrate according to the preferred embodiment of the present invention.
FIG. 4 is a schematic view showing bonding a flip chip on the glass substrate or other flexible substrate according to the preferred embodiment of the present invention.
FIG. 5 is a schematic view showing molding or spraying a phosphor layer on the flip chip according to the preferred embodiment of the present invention.
FIG. 6 is a schematic view showing laser cutting the glass substrate or other flexible substrate to form a graphene LED filament according to the preferred embodiment of the present invention.
FIG. 7 is a schematic view showing graphene LED filament being formed according to the preferred embodiment of the present invention.
FIG. 8 is a schematic view showing graphene LED filament light bulb being made according to the preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described with reference to the preferred embodiment. No limitations with respect to the specific embodiment described herein are intended or should be inferred.
With reference to FIGS. 1 to 8, a method of making a graphene LED bulb according to a preferred embodiment of the present invention comprises steps of: A. providing a glass substrate or other flexible substrate; B. sputtering and plating copper material on the glass substrate or other flexible substrate; C. coating photo resist, drying, and wet etching the glass substrate or other flexible substrate on which the copper material is plated; D. forming a printed circuit board (PCB) on the glass substrate, wherein after fonning the printed circuit board (PCB) on the glass substrate or other flexible substrate, the glass substrate or other flexible substrate is post-treated by the cleaning machine E. forming a graphene layer on the glass substrate or other flexible substrate by using a CVD (chemical vapor deposition) machine; F. bonding a flip chip on the glass substrate or other flexible substrate, wherein the flip chip is bonded on the glass substrate or other flexible substrate by a bonder; G molding or spraying a phosphor layer on the flip chip, wherern phosphor material is coated on the flip chip which is bonded on the glass substrate or other flexible substrate; H. laser cutting the glass substrate or other flexible substrate to form a graphene LED filament; I. fixing the graphene LED filaments either rigid or flexible into a light bulb.
After forming the printed circuit board (PCB) on the glass substrate or other flexible substrate, the glass substrate or other flexible substrate is post-treated by a cleming machine.
The flip chip may be bonded on the glass substrate or other flexible substrate by a bonder.
Thereby, the graphene LED bulb has a thermal conductivity which is increased by 20%.
Claims (3)
- WHAT IS CLAIMED IS: 1. A method of making a graphene LED bulb comprising steps of: A. providing a glass substrate or other flexible substrate; B. sputtering and plating copper material on the glass substrate or other flexible substrate; C. coating photo resist, drying, and wet etching the glass substrate or other flexible substrate on which the copper material is plated; D. forming a printed circuit board (PCB) on the glass substrate, wherein after fonning the printed circuit board (PCB) on the glass substrate or other flexible substrate, the glass substrate or other flexible substrate is post-treated by the cleaning machine E. forming a aphene layer on the glass substrate or other flexible substrate by using a CVD (chemical vapor deposition) machine; R bonding a flip chip on the glass substrate or other flexible substrate, wherein the flip chip is bonded on the glass substrate or other flexible substrate by a bonder; 0. molding or spraying a phosphor layer on the flip chip, wherein phosphor material is coated on the flip chip which is bonded on the glass substrate or other flexible substrate; H. laser cutting the glass substrate or other flexible substrate to form a graphene LED filament; and I. fixing the graphene LED filaments either rigid or flexible into a light bulb.
- 2. The method of making the graphene LED bulb as claimed in claim 1, wherein after forming the printed circuit board (PCB) on the glass substrate or other flexible substrate, the glass substrate or other flexible substrate is post-treated by the cleaning machine.
- 3. The method of making the graphene LED buffi as claimed in claim 1, wherein the flip chip is bonded on the glass substrate or other flexible substrate by a bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1414792.0A GB2529445A (en) | 2014-08-20 | 2014-08-20 | Method of making graphene LED bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1414792.0A GB2529445A (en) | 2014-08-20 | 2014-08-20 | Method of making graphene LED bulb |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201414792D0 GB201414792D0 (en) | 2014-10-01 |
| GB2529445A true GB2529445A (en) | 2016-02-24 |
Family
ID=51662709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1414792.0A Withdrawn GB2529445A (en) | 2014-08-20 | 2014-08-20 | Method of making graphene LED bulb |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2529445A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411440A (en) * | 2018-12-11 | 2019-03-01 | 杰群电子科技（东莞）有限公司 | A kind of power module and power module processing method |
| EP3514440A1 (en) * | 2018-01-18 | 2019-07-24 | BGT Materials Limited | Method of making led light bulb with thermal radiation filaments |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109140264A (en) * | 2017-06-18 | 2019-01-04 | 长沙恒凯电子科技有限公司 | A kind of LED bulb |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046136A (en) * | 2001-07-27 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting element |
| US20030193083A1 (en) * | 2002-04-15 | 2003-10-16 | Citizen Electronics Co., Ltd. | Substrate for light emitting diodes |
| US20110123776A1 (en) * | 2009-11-13 | 2011-05-26 | Samsung Electronics Co., Ltd. | Graphene laminate and method of preparing the same |
| US20130001633A1 (en) * | 2011-06-29 | 2013-01-03 | Hitachi Cable, Ltd. | Light-emitting element mounting substrate and led package |
| US20130248229A1 (en) * | 2012-03-21 | 2013-09-26 | Tyco Electronics Corporation | Electrical conductors and methods of manufacturing electrical conductors |
-
2014
- 2014-08-20 GB GB1414792.0A patent/GB2529445A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046136A (en) * | 2001-07-27 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting element |
| US20030193083A1 (en) * | 2002-04-15 | 2003-10-16 | Citizen Electronics Co., Ltd. | Substrate for light emitting diodes |
| US20110123776A1 (en) * | 2009-11-13 | 2011-05-26 | Samsung Electronics Co., Ltd. | Graphene laminate and method of preparing the same |
| US20130001633A1 (en) * | 2011-06-29 | 2013-01-03 | Hitachi Cable, Ltd. | Light-emitting element mounting substrate and led package |
| US20130248229A1 (en) * | 2012-03-21 | 2013-09-26 | Tyco Electronics Corporation | Electrical conductors and methods of manufacturing electrical conductors |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3514440A1 (en) * | 2018-01-18 | 2019-07-24 | BGT Materials Limited | Method of making led light bulb with thermal radiation filaments |
| WO2019141155A1 (en) * | 2018-01-18 | 2019-07-25 | Bgt Materials Limited | Method of making led light bulb with thermal radiation filaments |
| CN109411440A (en) * | 2018-12-11 | 2019-03-01 | 杰群电子科技（东莞）有限公司 | A kind of power module and power module processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201414792D0 (en) | 2014-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| COOA | Change in applicant's name or ownership of the application |
Owner name: CHUNG PING LAI Free format text: FORMER OWNER: BGT MATERIALS LIMITED |
|
| COOA | Change in applicant's name or ownership of the application |
Owner name: GRAPHENE LIGHTING PLC Free format text: FORMER OWNER: CHUNG PING LAI |
|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |