CN1233521C - 制造金属层压制品的方法 - Google Patents
制造金属层压制品的方法 Download PDFInfo
- Publication number
- CN1233521C CN1233521C CNB021068631A CN02106863A CN1233521C CN 1233521 C CN1233521 C CN 1233521C CN B021068631 A CNB021068631 A CN B021068631A CN 02106863 A CN02106863 A CN 02106863A CN 1233521 C CN1233521 C CN 1233521C
- Authority
- CN
- China
- Prior art keywords
- film
- heat
- liquid crystal
- crystal polymer
- thermoplastic liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001063382 | 2001-03-07 | ||
JP063382/01 | 2001-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1374192A CN1374192A (zh) | 2002-10-16 |
CN1233521C true CN1233521C (zh) | 2005-12-28 |
Family
ID=18922383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021068631A Expired - Lifetime CN1233521C (zh) | 2001-03-07 | 2002-03-07 | 制造金属层压制品的方法 |
Country Status (6)
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004358677A (ja) * | 2003-06-02 | 2004-12-24 | Nippon Steel Chem Co Ltd | 積層体の製造方法 |
JP3968068B2 (ja) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | 液晶ポリマーフィルムの製造方法 |
JP4718197B2 (ja) * | 2004-03-23 | 2011-07-06 | 宇部日東化成株式会社 | フレキシブル金属箔積層体製造装置と該装置を用いた製造方法 |
DE112005000716T5 (de) * | 2004-03-30 | 2007-02-15 | Noritsu Koki Co., Ltd. | Laminiergerät und Laminierverfahren |
CN101223835B (zh) * | 2005-07-27 | 2012-07-04 | 株式会社可乐丽 | 热塑性液晶聚合物薄膜覆盖的线路板的制造方法 |
US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
JP6316178B2 (ja) * | 2014-12-05 | 2018-04-25 | 株式会社クラレ | 片面金属張積層板およびその製造方法 |
WO2016170779A1 (ja) * | 2015-04-20 | 2016-10-27 | 株式会社クラレ | 金属張積層板の製造方法およびこれを用いた金属張積層板 |
KR102304510B1 (ko) * | 2016-03-03 | 2021-09-23 | 주식회사 쿠라레 | 금속 클래드 적층판 및 그 제조방법 |
CN113580690B (zh) * | 2016-03-08 | 2023-12-08 | 株式会社可乐丽 | 覆金属层叠板 |
CN109334202B (zh) * | 2018-11-05 | 2024-02-06 | 江苏坤泰机械有限公司 | 大宽幅墙体增强材料热熔复合机 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5410922B2 (US07052574-20060530-C00008.png) * | 1972-12-19 | 1979-05-10 | ||
CA1298451C (en) * | 1985-08-02 | 1992-04-07 | Hiromi Shigemoto | Surface-roughened film and sheet, and process for production and use thereof |
WO1987005919A1 (en) * | 1986-04-01 | 1987-10-08 | Toray Industries, Inc. | Biaxially oriented polyester film |
DE3884546T3 (de) | 1987-10-02 | 2000-03-23 | Polyplastics Co | Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz. |
JPH0630296Y2 (ja) * | 1987-11-30 | 1994-08-17 | 大日本スクリーン製造株式会社 | ロールコーティング装置 |
JP3245437B2 (ja) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
JP3090706B2 (ja) * | 1991-04-08 | 2000-09-25 | 株式会社クラレ | 液晶高分子よりなるフィルムの製造方法 |
US5843562A (en) | 1992-12-22 | 1998-12-01 | Hoechst Celanese Corporation | LCP films having roughened surface and process therefor |
DE69431243T2 (de) | 1994-06-30 | 2003-04-10 | Cna Holdings Inc N D Ges Des S | Folien aus flüssigkristallinen Polymeren mit einer rauhen Oberfläche und Verfahren zu deren Herstellung |
US5719354A (en) | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
US5529740A (en) | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
US5759674A (en) | 1995-03-31 | 1998-06-02 | Sumitomo Chemical Company, Limited | Laminate of liquid crystal polyester resin composition film and metallic foil, and printed-wiring board using the same |
US6159412A (en) * | 1996-09-11 | 2000-12-12 | Dupont Canada Inc. | Method for manufacture of liquid crystalline polymer films |
JP2000044797A (ja) | 1998-04-06 | 2000-02-15 | Kuraray Co Ltd | 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板 |
CN1116164C (zh) | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | 使用聚合物薄膜的涂层方法和由此得到的涂层体 |
JP4184529B2 (ja) | 1999-03-25 | 2008-11-19 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムとその改質方法 |
JP4216433B2 (ja) | 1999-03-29 | 2009-01-28 | 株式会社クラレ | 回路基板用金属張積層板の製造方法 |
-
2002
- 2002-03-05 TW TW091103985A patent/TW528676B/zh not_active IP Right Cessation
- 2002-03-06 US US10/090,747 patent/US7052574B2/en not_active Expired - Lifetime
- 2002-03-07 EP EP02005223A patent/EP1238800B1/en not_active Expired - Lifetime
- 2002-03-07 DE DE60220107T patent/DE60220107T2/de not_active Expired - Lifetime
- 2002-03-07 KR KR1020020012164A patent/KR100855925B1/ko active IP Right Grant
- 2002-03-07 CN CNB021068631A patent/CN1233521C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20020170939A1 (en) | 2002-11-21 |
DE60220107T2 (de) | 2007-11-22 |
DE60220107D1 (de) | 2007-06-28 |
CN1374192A (zh) | 2002-10-16 |
EP1238800A2 (en) | 2002-09-11 |
US7052574B2 (en) | 2006-05-30 |
TW528676B (en) | 2003-04-21 |
EP1238800B1 (en) | 2007-05-16 |
KR20020071784A (ko) | 2002-09-13 |
EP1238800A3 (en) | 2003-12-03 |
KR100855925B1 (ko) | 2008-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20051228 |