CN1232513A - 具有与带非接触的液体调节装置的电解设备 - Google Patents

具有与带非接触的液体调节装置的电解设备 Download PDF

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Publication number
CN1232513A
CN1232513A CN97198402A CN97198402A CN1232513A CN 1232513 A CN1232513 A CN 1232513A CN 97198402 A CN97198402 A CN 97198402A CN 97198402 A CN97198402 A CN 97198402A CN 1232513 A CN1232513 A CN 1232513A
Authority
CN
China
Prior art keywords
liquid
belt
band
squeezer
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN97198402A
Other languages
English (en)
Chinese (zh)
Inventor
嶋村美智广
真田雅治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of CN1232513A publication Critical patent/CN1232513A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0685—Spraying of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0628—In vertical cells

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
CN97198402A 1996-09-30 1997-09-25 具有与带非接触的液体调节装置的电解设备 Pending CN1232513A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP280273/96 1996-09-30
JP28027396A JP3299451B2 (ja) 1996-09-30 1996-09-30 竪型電解装置

Publications (1)

Publication Number Publication Date
CN1232513A true CN1232513A (zh) 1999-10-20

Family

ID=17622702

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97198402A Pending CN1232513A (zh) 1996-09-30 1997-09-25 具有与带非接触的液体调节装置的电解设备

Country Status (11)

Country Link
US (1) US6589399B1 (cg-RX-API-DMAC7.html)
EP (1) EP0964080B1 (cg-RX-API-DMAC7.html)
JP (1) JP3299451B2 (cg-RX-API-DMAC7.html)
KR (1) KR100387662B1 (cg-RX-API-DMAC7.html)
CN (1) CN1232513A (cg-RX-API-DMAC7.html)
AU (1) AU709640B2 (cg-RX-API-DMAC7.html)
BR (1) BR9713238A (cg-RX-API-DMAC7.html)
DE (1) DE69731849T2 (cg-RX-API-DMAC7.html)
ID (1) ID21222A (cg-RX-API-DMAC7.html)
TW (1) TW448246B (cg-RX-API-DMAC7.html)
WO (1) WO1998014642A1 (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100439568C (zh) * 2002-04-05 2008-12-03 3M创新有限公司 网布处理方法及装置
CN101310046B (zh) * 2005-08-03 2011-03-30 吉布尔·施密德有限责任公司 基板的处理设备，尤指基板的电镀设备
CN109689945A (zh) * 2016-08-23 2019-04-26 株式会社Posco 竖向电解装置
CN111945211A (zh) * 2019-05-15 2020-11-17 昆山东威科技股份有限公司 一种工件的处理装置
CN122082077A (zh) * 2026-04-21 2026-05-26 宁波卓尔汽车零部件有限公司 汽车零部件的电镀设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550067B2 (en) * 2004-06-25 2009-06-23 Guardian Industries Corp. Coated article with ion treated underlayer and corresponding method
KR101419739B1 (ko) * 2007-09-06 2014-07-16 도레이 필름 카코우 가부시키가이샤 웹의 처리 방법, 처리조, 연속 전해 도금 장치 및 도금막이 부착된 플라스틱 필름의 제조 방법
ITMI20130497A1 (it) * 2013-03-29 2014-09-30 Tenova Spa Apparato per il trattamento elettrolitico superficiale in continuo di semilavorati metallici, in particolare semilavorati metallici piatti.
US11674235B2 (en) 2018-04-11 2023-06-13 Hutchinson Technology Incorporated Plating method to reduce or eliminate voids in solder applied without flux

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4162955A (en) * 1978-10-10 1979-07-31 Midland-Ross Corporation Electrodeposition coating apparatus
DE4116643C2 (de) * 1991-05-22 1994-06-09 Klaus Joergens Verfahren zum anodischen oder kathodischen Elektrolackieren von Band- oder Profilmaterial
JP2588454B2 (ja) * 1991-12-20 1997-03-05 新日本製鐵株式会社 竪型噴流メッキ装置
US5236566A (en) * 1991-09-24 1993-08-17 Nippon Steel Corporation Vertical type stream plating apparatus
JP2500965B2 (ja) * 1991-09-24 1996-05-29 新日本製鐵株式会社 竪型タンクの排液装置
JPH05331686A (ja) * 1992-06-01 1993-12-14 Kawasaki Steel Corp 金属帯の高速電解処理装置
SE501561C2 (sv) * 1993-05-09 1995-03-13 Swedish Pickling Ab Förfarande och anordning vid betning av rostfritt stål varvid strömmen leds igenom stålbandet i dess tjockleksriktning
JPH0720749A (ja) * 1993-07-05 1995-01-24 Canon Inc 画像形成装置
JPH07207492A (ja) * 1994-01-20 1995-08-08 Nippon Steel Corp 液切り装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100439568C (zh) * 2002-04-05 2008-12-03 3M创新有限公司 网布处理方法及装置
CN101310046B (zh) * 2005-08-03 2011-03-30 吉布尔·施密德有限责任公司 基板的处理设备，尤指基板的电镀设备
CN109689945A (zh) * 2016-08-23 2019-04-26 株式会社Posco 竖向电解装置
CN111945211A (zh) * 2019-05-15 2020-11-17 昆山东威科技股份有限公司 一种工件的处理装置
CN122082077A (zh) * 2026-04-21 2026-05-26 宁波卓尔汽车零部件有限公司 汽车零部件的电镀设备

Also Published As

Publication number Publication date
BR9713238A (pt) 2000-04-04
KR100387662B1 (ko) 2003-06-18
JPH10102287A (ja) 1998-04-21
EP0964080A4 (cg-RX-API-DMAC7.html) 1999-12-15
EP0964080B1 (en) 2004-12-01
JP3299451B2 (ja) 2002-07-08
KR20000048773A (ko) 2000-07-25
DE69731849D1 (de) 2005-01-05
AU4321097A (en) 1998-04-24
TW448246B (en) 2001-08-01
ID21222A (id) 1999-05-06
DE69731849T2 (de) 2005-12-01
WO1998014642A1 (fr) 1998-04-09
AU709640B2 (en) 1999-09-02
US6589399B1 (en) 2003-07-08
EP0964080A1 (en) 1999-12-15

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